CN203760453U - Liquid-cooling radiator system for electronic components - Google Patents
Liquid-cooling radiator system for electronic components Download PDFInfo
- Publication number
- CN203760453U CN203760453U CN201420182342.5U CN201420182342U CN203760453U CN 203760453 U CN203760453 U CN 203760453U CN 201420182342 U CN201420182342 U CN 201420182342U CN 203760453 U CN203760453 U CN 203760453U
- Authority
- CN
- China
- Prior art keywords
- liquid
- heat
- cooling
- working medium
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 63
- 239000007788 liquid Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 4
- 239000007924 injection Substances 0.000 claims 4
- 230000005855 radiation Effects 0.000 description 16
- 230000000149 penetrating effect Effects 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了一种电子元器件液冷散热系统，其特征是：设置液冷散热器，液冷散热器由横隔在其内腔中的射液板分隔成进液腔和出液腔，出液腔的底板为导热基板，导热基板与电子元器件的散热基座相贴合；在导热基板的内侧表面设置圆锥体，在射液板上设置射液孔，圆锥体与射液孔以及散热基座上的热源的位置一一对应；在液冷散热器中充注的液态冷却工质通过管道与微型泵和冷凝器相连接形成液态冷却工质循环系统。本实用新型能够对电子元器件的多个分散热源进行同等程度的迅速散热，从而保证电子元器件温度的一致性。
The utility model discloses a liquid-cooling heat dissipation system for electronic components, which is characterized in that: a liquid-cooling radiator is provided, and the liquid-cooling radiator is divided into a liquid inlet chamber and a liquid outlet chamber by a liquid ejection plate transversely separated in its inner cavity , the bottom plate of the liquid outlet chamber is a thermally conductive substrate, and the thermally conductive substrate is attached to the heat dissipation base of the electronic components; a cone is set on the inner surface of the thermally conductive substrate, and a shooting hole is set on the shooting plate, and the cone and the shooting hole And the positions of the heat sources on the heat dissipation base are in one-to-one correspondence; the liquid cooling working medium filled in the liquid cooling radiator is connected with the micro pump and the condenser through the pipeline to form a liquid cooling working medium circulation system. The utility model can quickly dissipate heat to the same degree for multiple scattered heat sources of the electronic components, thereby ensuring the consistency of the temperature of the electronic components.
Description
Technical field
The utility model relates to the heat dissipation technology field of electronic devices and components, is specifically related to a kind of electronic devices and components liquid cooling heat radiation system.
Background technology
Along with the development of electronic product packaging technology, the application of power component is more and more, add the development of semiconductor fabrication, more transistor is incorporated in one chip, various large electric currents, high-speed, high power density electronic devices and components are as resistor, transistor, high-power integrated circuit etc., all obtain application widely in the various aspects of control field, cause electronic component overall power consumption and caloric value to increase, cause electronic component temperature constantly to rise, if dispel the heat and will cause inefficacy or the damage of electronic component not in time.
At present under technical conditions, conventional IGBT radiating mode mainly contains three kinds: Fin, heat pipe heat radiation and liquid-cooling heat radiation, wherein Fin and heat pipe heat radiation mainly adopt the mode of forced air cooling, and liquid-cooling heat radiation mainly adopts liquid (mixture of water and the ethylene glycol) circulatory system cooling.Finned radiator compact conformation, volume is moderate, heat conduction is stable, but needs subsidiary auxiliary air channel, fan performance is had relatively high expectations, and blower fan easily produces serious noise pollution in the time of operation; Heat-pipe radiator volume is large, structure is heavy, installation and removal are difficult, but heat-sinking capability will be got well compared with finned radiator.By contrast, the heat-sinking capability of liquid cooling heat radiator is for the strongest.
Chinese Patent Application No. CN200920297561.7 has proposed a kind of " automobile motor controller water cooler ", its cooler by cooler base plate, with groove and cooler water inlet pipe and water outlet pipe form, wherein cooler base plate and cooler welding, cooler and the welding of controller body bottom surface, cooler water inlet pipe and water outlet pipe is connected with cooler.This technical scheme, mainly by cooling water flow subcooler base plate, is taken away power model and is produced heat.Because cooling water is to be flowed into by one end of base plate, flowed out by the other end, along with cooling water flows through base plate, temperature rises gradually, easily cause the power device heat radiation of coolant outlet end insufficient, power device non-uniform temperature, cooling water inlet end is low and the port of export is high, causes the unbalanced of electronic power components performance.
Utility model content
The purpose of this utility model is to overcome the lack of uniformity of the cooling degree of existing electronic devices and components, and a kind of electronic devices and components liquid cooling heat radiation system is provided, and in realizing electronic devices and components efficiently radiates heat, ensures the consistency of electronic devices and components temperature.
The utility model is that technical solution problem adopts following technical scheme:
The utility model electronic devices and components liquid cooling heat radiation system, be characterized in: liquid cooling heat radiator is set, described liquid cooling heat radiator be by tabula therein the liquid plate of penetrating in chamber be separated into admission chamber and go out sap cavity, described go out the base plate of sap cavity be heat-conducting substrate, the cooling base of described heat-conducting substrate and electronic devices and components fits; Inner surface at described heat-conducting substrate arranges cone, liquid shoot hole is set penetrating on liquid plate, and described cone is corresponding one by one with the position of the thermal source on liquid shoot hole and cooling base, described cone with; In described liquid cooling heat radiator, filled liquid cooled working medium is connected with condenser with micropump by pipeline and forms liquid cooled duplex matter system; In one end of described liquid cooling heat radiator, the side that is positioned at described admission chamber arranges cooling working medium entrance, a side that goes out sap cavity described in being positioned at arranges cooling working medium outlet, the flow direction of described liquid cooled working medium is enter admission chamber, liquid shoot hole directive cone in penetrating liquid plate and enter fluid chamber from cooling working medium entrance, until go out liquid cooling heat radiator at cooling working medium outlet guide.
The design feature of the utility model electronic devices and components liquid cooling heat radiation system is also:
The diameter of described liquid shoot hole is the bottom surface diameter of cone
Described liquid cooled working medium is water, liquid alcohol or liquid metal.
On the contact-making surface that described heat-conducting substrate and cooling base fit, be coated with heat-conducting cream.
Compared with prior art, the utility model beneficial effect is embodied in:
In the utility model, liquid cooled working medium penetrates by liquid shoot hole from admission chamber, impact each cone on heat-conducting substrate, can carry out effectively jet heat radiation rapidly to each thermal source of the corresponding electronic device of cone base plate simultaneously, and, because the cooling working medium temperature of each cone of flowing through is identical with flow, it is equal that this just makes each cone obtain degree of heat radiation, ensured the consistency of electronic devices and components temperature.
Brief description of the drawings
Fig. 1 is the utility model electronic devices and components liquid cooling heat radiation system schematic diagram.
Number in the figure: 1 admission chamber, 2 penetrate liquid plate, and 3 go out sap cavity, 4 heat-conducting substrates, 5 cooling bases, 6 electronic devices and components, 7 thermals source, 8 liquid cooling heat radiators, 9 cones, 10 liquid shoot holes, 11 cooling working medium entrances, 12 condensers, 13 blower fans, 14 micropumps, 15 cooling working medium outlets.
Embodiment
Referring to Fig. 1, in the present embodiment, the version of electronic devices and components liquid cooling heat radiation system is:
Liquid cooling heat radiator 8 is set, liquid cooling heat radiator 8 be by tabula therein the liquid plate 2 of penetrating in chamber be separated into admission chamber 1 and go out sap cavity 3, the base plate that goes out sap cavity 3 is heat-conducting substrate 4, heat-conducting substrate 4 fits with the cooling base 5 of electronic devices and components 6; At the inner surface of heat-conducting substrate 4, cone 9 is set, liquid shoot hole 10 is set penetrating on liquid plate 2, cone 9 is corresponding one by one with the position of the thermal source 7 on liquid shoot hole 10 and cooling base 5, cone 9 with; In liquid cooling heat radiator 8, filled liquid cooled working medium is connected with condenser 12 with micropump 14 by pipeline and forms liquid cooled duplex matter system, and heat cooling working medium being carried at the blower fan 13 of condenser 12 arranged outside is taken away.
; In one end of liquid cooling heat radiator 8, the side that is positioned at admission chamber 1 arranges cooling working medium entrance 11, a side that is positioned at sap cavity 3 arranges cooling working medium outlet 15, the flow direction of liquid cooled working medium is enter admission chamber 1, liquid shoot hole 10 directive cones 9 in penetrating liquid plate 2 and enter fluid chamber 3 from cooling working medium entrance 11, until derive liquid cooling heat radiators 8 in cooling working medium outlet 15.
In concrete enforcement, corresponding structure setting also comprises:
Diameter that liquid shoot hole 10 is set is the bottom surface diameter of cone 9
in the present embodiment, be taken as
liquid cooled working medium is water, liquid alcohol or liquid metal; On the contact-making surface that heat-conducting substrate 4 and cooling base 5 fit, be coated with heat-conducting cream, to increase heat conductivility.
In the present embodiment, because heat-conducting substrate 4 and cooling base 5 is generally all that copper or the aluminum high with heat conductivility made, this reaches rapidly on the cone 9 that it is corresponding the heat that in electronic devices and components 6, each thermal source 7 produces, the cooling working medium penetrating by liquid shoot hole 10 is again the taper seat shooting heat radiation to cone 9 rapidly, can each thermal source of powerful electronic devices and components 67 be carried out to the rapid heat radiation of equal extent simultaneously, ensure the temperature consistency of electronic devices and components 6.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420182342.5U CN203760453U (en) | 2014-04-15 | 2014-04-15 | Liquid-cooling radiator system for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420182342.5U CN203760453U (en) | 2014-04-15 | 2014-04-15 | Liquid-cooling radiator system for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760453U true CN203760453U (en) | 2014-08-06 |
Family
ID=51255696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420182342.5U Expired - Fee Related CN203760453U (en) | 2014-04-15 | 2014-04-15 | Liquid-cooling radiator system for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203760453U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928414A (en) * | 2014-04-15 | 2014-07-16 | 合肥工业大学 | A liquid cooling system for electronic components |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN109755199A (en) * | 2019-02-20 | 2019-05-14 | 合肥工业大学 | A micro-channel jet radiator |
-
2014
- 2014-04-15 CN CN201420182342.5U patent/CN203760453U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928414A (en) * | 2014-04-15 | 2014-07-16 | 合肥工业大学 | A liquid cooling system for electronic components |
| CN103928414B (en) * | 2014-04-15 | 2017-02-15 | 合肥工业大学 | A liquid cooling system for electronic components |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN107863330B (en) * | 2017-10-27 | 2019-03-01 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN109755199A (en) * | 2019-02-20 | 2019-05-14 | 合肥工业大学 | A micro-channel jet radiator |
| CN109755199B (en) * | 2019-02-20 | 2020-11-06 | 合肥工业大学 | Micro-channel jet radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103928414B (en) | A liquid cooling system for electronic components | |
| CN101056522B (en) | Liquid-cooled radiator and liquid-cooled heat dissipation device using the liquid-cooled radiator | |
| CN204836927U (en) | Liquid-cooled radiator and its cooling system | |
| CN100499089C (en) | Radiator | |
| CN102159058B (en) | Liquid-cooled radiation structure | |
| TWI438388B (en) | Liquid cooling device | |
| TW201616947A (en) | Heat dissipation device | |
| WO2018176535A1 (en) | Novel mechanical pump liquid-cooling heat-dissipation system | |
| CN101001514A (en) | Liquid-cooled radiating device and radiating unit | |
| CN105992498B (en) | Liquid cooling type heat dissipation structure and manufacturing method thereof | |
| CN204650415U (en) | Heat abstractor | |
| CN106255396A (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
| CN203760453U (en) | Liquid-cooling radiator system for electronic components | |
| CN107977064A (en) | The water-cooling heat radiating device and its heat dissipating method of a kind of server | |
| JP3152132U (en) | Microchannel heat sink device for liquid cooling radiator | |
| CN108598049B (en) | A kind of electronic component radiator | |
| CN1964610A (en) | A liquid cooling heat radiator | |
| CN114122872A (en) | A laser cooling system based on microscale heat transfer | |
| CN104600188A (en) | Combined effective cooling device | |
| CN104347546A (en) | Multiple-effect chip liquid cooling device | |
| CN204836912U (en) | Liquid cooling device and system | |
| CN106896883A (en) | A kind of electronic equipment cooling system | |
| CN111403358A (en) | Double-sided water-cooled radiator and power tube integrated unit | |
| CN205542899U (en) | Semiconductor refrigeration components | |
| CN206895114U (en) | A positioning radiator for communication equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 Termination date: 20160415 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |