CN203665729U - Wafer cutting device with double-layer wafer supplying and collecting mechanism - Google Patents
Wafer cutting device with double-layer wafer supplying and collecting mechanism Download PDFInfo
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- CN203665729U CN203665729U CN201420006280.2U CN201420006280U CN203665729U CN 203665729 U CN203665729 U CN 203665729U CN 201420006280 U CN201420006280 U CN 201420006280U CN 203665729 U CN203665729 U CN 203665729U
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- 238000005520 cutting process Methods 0.000 title claims abstract description 168
- 239000000463 material Substances 0.000 claims description 33
- 238000002360 preparation method Methods 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 227
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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Abstract
Disclosed is a wafer cutting device with a double-layer wafer supplying and collecting mechanism. A carrying mechanism of the wafer cutting device is at least provided with a first sliding seat and a second sliding seat which are arranged in parallel, and the first sliding seat and the second sliding seat are respectively provided with at least one rotating bearing table so as to carry wafers to a picture capturing mechanism for picture capturing and aligning and to carry wafers to a cutting mechanism for cutting. Furthermore, the wafer supplying and collecting mechanism of the wafer cutting device is provided with a double-layer frame base so as to bear a first wafer box and a second wafer box respectively, the double-layer frame base is connected to a lifter, and the lifter is used for driving the first wafer box or the second wafer box in the frame base to be placed at the wafer supplying and collecting height position. Hence, the stand-by time of the cutting mechanism during picture capture and alignment of the picture capturing mechanism can be saved, the stand-by time of the cutting mechanism during exchange of the wafer boxes by the wafer supplying and collecting mechanism can be effectively saved, and therefore cutting capacity benefits can be effectively improved.
Description
Technical field
The utility model provides a kind of operation that is applied to overloading platform and replaces cutting crystal wafer, so effectively promote cutting production capacity there is the wafer cutting device of two-layer equation for, receiving mechanism.
Background technology
Refer to Fig. 1, generally speaking, on wafer 10, transverse and longitudinal is drawn the graticule that is provided with many, wafer 10 attaches on a mucous layer 11, and mucous layer 11 is fixed on a metal framework 12 again, and can move wafer 10 by framework 12, in the time of cutting, control the depth of cut of cutter, do not cutting under the situation of mucous layer 11, wafer 10 is being cut out to multiple wafers according to drawing the graticule transverse and longitudinal of establishing, and continue to move to next operation post with framework 12.
Refer to Fig. 2, it is No. 87110593 " precision cutting device and cutting process " Patent Case of TaiWan, China patent application, it is to be provided with the confession for bearing single wafer box 30 in board 20, receiving mechanism (accompanying drawing does not show), supply, receiving mechanism system can drive wafer cassette 30 liftings, so that the wafer of interior each layer of wafer cassette 30 respectively correspondence be positioned at confession, the height and position of rewinding, Material moving device includes and is written into, go out arm 21, first moves material arm 22 and second moves material arm 23, this is written into, go out arm 21 and wafer can be written into and set out wafer cassette 30, this first moves 21 of arms of material and is responsible for the wafer to be cut 31 shifting out from wafer cassette 30 to be transferred to and to carry mechanism, this carries mechanism and is provided with single slide 24, and be provided with in these single slide 24 tops for carrying on the rotation microscope carrier 25 of wafer 31 to be cut, while making slide 24 drive the rotation microscope carrier 25 of top to move as X axis, wafer 31 to be cut can be carried to corresponding to camera mechanism 26 belows, and this wafer 31 to be cut is carried out to capture contraposition operation, complete after capture contraposition, slide 24 then continues to drive the rotation microscope carrier 25 of top to move as X axis, wafer 31 to be cut is carried to the below corresponding to the first cutting mechanism 27 and the second cutting mechanism 28, to carry out cutting operation, the sliced wafer 31 completing after cutting will drive the position of shifting out the first cutting mechanism 27 and the second cutting mechanism 28 by slide 24, move material arm 23 by second of Material moving device again and be transferred to wiper mechanism 29, to clean air-dry operation, last move material arm 22 by first again and clean air-dry sliced wafer 31 and be transferred to and be written into completing, go out arm 21 positions, and by being written into, going out arm 21 returns to sliced wafer 31 in wafer cassette 30.This topping machanism has following scarce fraud in cutting production capacity:
1., in during camera mechanism capture contraposition, cutting mechanism is in holding state:
This topping machanism is only provided with single slide 24 because it carries mechanism, therefore cut and be transferred to after wiper mechanism 29 when wafer completes, next wafer in wafer cassette 30 just can be positioned on the rotation microscope carrier 25 of slide 24 tops, and then completed after capture contraposition operation by camera mechanism 26, the first cutting mechanism 27 and the second cutting mechanism 28 just start to continue and carry out cutting operation, therefore in during this section of camera mechanism 26 capture contrapositions, the first cutting mechanism 27 and the second cutting mechanism 28 are all in holding state, do not carry out any cutting operation, especially the time of camera mechanism 26 capture contrapositions is long again, and have a strong impact on cutting production capacity.
2. in, receiving mechanism is during exchange wafer cassette, cutting mechanism is in holding state:
This topping machanism is because it supplies, receiving mechanism only supplies single wafer cassette 30 of bearing, therefore when the wafer of wafer cassette 30 interior last a slices complete cutting clean and return to wafer cassette 30 interior after, this wafer cassette 30 could be confessed, receiving mechanism place takes away, and again insert again a new wafer cassette to be cut, just start feed by new wafer cassette to be cut again, for the first cutting mechanism 27 and the second cutting mechanism 28, cut and be transferred to after wiper mechanism 29 when the wafer of wafer cassette 30 interior last a slices completes, the first cutting mechanism 27 and the second cutting mechanism 28 are just initially located in holding state, until new wafer cassette to be cut starts feed, and completed after capture contraposition operation by camera mechanism 26, the first cutting mechanism 27 and the second cutting mechanism 28 just finish holding state and start to carry out cutting operation, that is complete and cut and be transferred to wiper mechanism 29 from the wafer of wafer cassette 30 interior last a slices, until new its first wafer of wafer cassette to be cut complete capture contraposition operation this section during in, the first cutting mechanism 27 and the second cutting mechanism 28 are all in holding state, do not carry out any cutting operation, especially the time of camera mechanism 26 capture contrapositions is long again, more cause the first cutting mechanism 27 and the second cutting mechanism 28 during this holding state in without any the cutting output of wafer, and have a strong impact on cutting production capacity.
In view of this, the inventor is engaged in research and development and the making experience of relevant industries then for many years with it, for current faced problem further investigation, pass through the research of long-term endeavour and study, eventually grind and create a kind of wafer cutting device with two-layer equation confession, receiving mechanism, effectively to promote cutting production capacity, this is design aim of the present utility model.
Utility model content
The purpose of this utility model one, be to provide one and there is two-layer equation confession, the wafer cutting device of receiving mechanism, in the time that the wafer on the rotation microscope carrier of the first slide carries out cutting operation, Material moving device can will supply, next wafer in the wafer cassette of receiving mechanism is transferred on the rotation microscope carrier of the second slide, this next wafer is carried to the place's capture contraposition of capture mechanism, and complete in advance the preparation work before cutting, when the wafer on the rotation microscope carrier of the first slide completes after cutting operation, cutting mechanism is removable and exchange continues to next wafer on the rotation microscope carrier of the second slide and carries out cutting operation, and then eliminate the stand-by time of cutting mechanism in during the capture contraposition of capture mechanism, reach the benefit of effective lifting cutting production capacity.
The purpose of this utility model two, be to provide one and there is two-layer equation confession, the wafer cutting device of receiving mechanism, in the time that the wafer of last a slice in the first wafer cassette carries out cutting operation, this confession, the lifter of receiving mechanism can be positioned at confession by the second wafer cassette lifting, the height and position of rewinding, and the first wafer in the second wafer cassette is transferred on the rotation microscope carrier of the second slide by Material moving device, the first wafer in this second wafer cassette is carried to the place's capture contraposition of capture mechanism, and complete in advance the preparation work before cutting, when the wafer of last a slice in the first wafer cassette completes after cutting operation, cutting mechanism is removable and exchange continues to the first wafer in the second wafer cassette on the rotation microscope carrier of the second slide and carries out cutting operation, and after in the first wafer cassette, the wafer of last a slice completes and cleans and dry up, this confession, the lifter of receiving mechanism can be positioned at confession by the first wafer cassette lifting, the height and position of rewinding, and by Material moving device, the wafer of last a slice in the first wafer cassette is sent back in the first wafer cassette, and then eliminate cutting mechanism in confession, stand-by time in during receiving mechanism exchange wafer cassette, reach the benefit of effective lifting cutting production capacity.
For reaching above-mentioned purpose, the utility model provides a kind of wafer cutting device with two-layer equation confession, receiving mechanism, and it includes:
Board;
For, receiving mechanism, be provided with the skeleton frame of two-layer equation, with bearing the first wafer cassette and the second wafer cassette respectively, the skeleton frame of this two-layer equation is connected in a lifter, and drives the first wafer cassette and the second wafer cassette lifting moving in skeleton frame by this lifter;
Carry mechanism, be arranged with at least two the first slide and the second slides of doing the first axial feeding in parallel, this first slide is provided with at least one the first rotation microscope carrier, is provided with at least one the second rotation microscope carrier, to carry respectively wafer on this second slide;
Capture mechanism, is provided with view-finder, and this view-finder is done the second axial movement, and to carrying the first rotation microscope carrier or the second wafer capture contraposition of rotating on microscope carrier of mechanism;
Cutting mechanism, is provided with axially movable the first cutting mechanism of at least one work second, so that the wafer on the first rotation microscope carrier that carries mechanism or the second rotation microscope carrier is carried out to cutting operation;
Material moving device, is provided with and is at least onely displaced into confession, receiving mechanism and carries the inter-agency material arm that moves, to transfer wafer.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, the lower floor of the two-layer equation skeleton frame of this confession, receiving mechanism is provided with drawer, and for bearing the second wafer cassette, the upper strata of this two-layer equation skeleton frame is open space, and bearing the first wafer cassette.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, this cutting mechanism is more provided with the first cutting mechanism and is the second cutting mechanism that subtend arranges, and this second cutting mechanism can be done the second axial movement.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, this Material moving device is provided with and is written into, goes out arm and moves material arm.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, this is written into, goes out arm is that the wafer in the first wafer cassette or second wafer cassette of confession, receiving mechanism is set out, or wafer is written in the first wafer cassette or the second wafer cassette, this moves material arm is in being written into, going out arm and carrying inter-agency handover wafer.
Described have the wafer cutting device of two-layer equation for, receiving mechanism, wherein, more comprises and be provided with the wafer to completing cutting and clean the wiper mechanism that dries up operation.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, when this does the first axial feeding cutting for the wafer in the first wafer cassette of, receiving mechanism by the first rotation microscope carrier carrying of the first slide, next wafer in the first wafer cassette can be carried to the place's capture contraposition of capture mechanism by the second rotation microscope carrier of the second slide, and completes in advance the preparation work of the front capture contraposition of next wafer cutting.
The described wafer cutting device with two-layer equation confession, receiving mechanism, wherein, when this does the first axial feeding cutting for last wafer in the first wafer cassette of, receiving mechanism by the first rotation microscope carrier carrying of the first slide, first wafer in the second wafer cassette can be carried to the place's capture contraposition of capture mechanism by the second rotation microscope carrier of the second slide, and completes in advance the preparation work of the front capture contraposition of first wafer cutting in the second wafer cassette.
The beneficial effects of the utility model are:
1, in the time that the wafer on the rotation microscope carrier of the first slide carries out cutting operation, Material moving device can will supply, next wafer in the wafer cassette of receiving mechanism is transferred on the rotation microscope carrier of the second slide, this next wafer is carried to the place's capture contraposition of capture mechanism, and complete in advance the preparation work before cutting, when the wafer on the rotation microscope carrier of the first slide completes after cutting operation, cutting mechanism is removable and exchange continues to next wafer on the rotation microscope carrier of the second slide and carries out cutting operation, and then eliminate the stand-by time of cutting mechanism in during the capture contraposition of capture mechanism, reach the benefit of effective lifting cutting production capacity,
2, in the time that the wafer of last a slice in the first wafer cassette carries out cutting operation, this confession, the lifter of receiving mechanism can be positioned at confession by the second wafer cassette lifting, the height and position of rewinding, and the first wafer in the second wafer cassette is transferred on the rotation microscope carrier of the second slide by Material moving device, the first wafer in this second wafer cassette is carried to the place's capture contraposition of capture mechanism, and complete in advance the preparation work before cutting, when the wafer of last a slice in the first wafer cassette completes after cutting operation, cutting mechanism is removable and exchange continues to the first wafer in the second wafer cassette on the rotation microscope carrier of the second slide and carries out cutting operation, and after in the first wafer cassette, the wafer of last a slice completes and cleans and dry up, this confession, the lifter of receiving mechanism can be positioned at confession by the first wafer cassette lifting, the height and position of rewinding, and by Material moving device, the wafer of last a slice in the first wafer cassette is sent back in the first wafer cassette, and then eliminate cutting mechanism in confession, stand-by time in during receiving mechanism exchange wafer cassette, reach the benefit of effective lifting cutting production capacity.
Accompanying drawing explanation
Fig. 1 is that wafer is incorporated into the schematic diagram on framework;
Fig. 2 is the schematic diagram of No. 87110593 topping machanism of TaiWan, China application;
Fig. 3 is configuration diagram of the present utility model;
Fig. 4 is that the utility model supplies, the schematic diagram of receiving mechanism;
Fig. 5 is action schematic diagram of the present utility model ();
Fig. 6 is action schematic diagram of the present utility model (two);
Fig. 7 is that the utility model supplies, the action schematic diagram () of receiving mechanism;
Fig. 8 is action schematic diagram of the present utility model (three);
Fig. 9 is that the utility model supplies, the action schematic diagram (two) of receiving mechanism;
Figure 10 is action schematic diagram of the present utility model (four).
Description of reference numerals:
Background technology: 10-wafer; 11-mucous layer; 12-framework; 20-board; 21-is written into, goes out arm; 22-first moves material arm; 23-second moves material arm; 24-slide; 25-rotates microscope carrier; 26-camera mechanism; 27-the first cutting mechanism; 28-the second cutting mechanism; 29-wiper mechanism; 30-wafer cassette; 31-wafer;
The utility model: 30-board; 31-supplies, receiving mechanism; 311-skeleton frame; 312-lifter; 313-drawer; 32-is written into, goes out arm; 33-moves material arm; 34-the first slide; 341-first rotates microscope carrier; 35-the second slide; 351-second rotates microscope carrier; 36-view-finder; 37-the first cutting mechanism; 38-the second cutting mechanism; 39-wiper mechanism; 40-the first wafer cassette; 41-the second wafer cassette; A-wafer; B-wafer; C-wafer; D-wafer.
The specific embodiment
For making your auditor do further to understand to the utility model, hereby lift preferred embodiment and coordinate accompanying drawing, describe in detail as rear:
Refer to Fig. 3, wafer cutting device of the present utility model, it is to be provided with confession in board 30, receiving mechanism 31, this confession, receiving mechanism 31 is for bearing the first wafer cassette 40 and the second wafer cassette 41, one Material moving device is that the wafer in the first wafer cassette 40 or the second wafer cassette 41 is transferred to and carries mechanism, in the present embodiment, this Material moving device includes and is written into, go out arm 32 and move material arm 33, this is written into, going out arm 32 can set out wafer in the first wafer cassette 40 or the second wafer cassette 41, or wafer is written in the first wafer cassette 40 or the second wafer cassette 41, because this is written into, go out arm 32 for existing technology, therefore it will not go into details, this moves 33 of arms of material and will be written into, going out wafer on arm 32 is transferred to and carries mechanism, this carries mechanism and is provided with at least two the first slide 34 be arrangeding in parallel and the second slides 35, and can do the feeding of first axial (X axis), and be provided with at least one the first rotation microscope carrier 341 in this first slide 34, on this second slide 35, be also provided with at least one the second rotation microscope carrier 351, to carry respectively wafer, and the capture mechanism that is fed to of carrying wafer work first axial (X axis) locates capture contraposition, and be carried to cutting mechanism place and carry out cutting operation, this capture mechanism is provided with view-finder 36, this view-finder 36 also can be done the movement of second axial (Y-axis), and to the wafer capture contraposition on the first rotation microscope carrier 341 and the second rotation microscope carrier 351, another this cutting mechanism includes two and is the first cutting mechanism 37 and the second cutting mechanism 38 that subtend arranges, this first cutting mechanism 37 and the second cutting mechanism 38 also can be done respectively the movement of second axial (Y-axis), and by means of the first slide 34 or the second slide 35, do the feeding of first axial (X axis), carry out cutting operation with the wafer on the wafer to the first rotation microscope carrier 341 or the second rotation microscope carrier 351, when completing after the cutting operation of wafer, the first slide 34 or the second slide 35, to do exiting of first axial (X axis), and by moving material arm 33, the wafer that completes cutting is transferred to wiper mechanism 39, to clean the operation drying up, finally again by being written into, going out arm 32 is written into wafer in the first wafer cassette 40 or the second wafer cassette 41, and complete the operation of rewinding.
Refer to Fig. 4, confession of the present utility model, receiving mechanism 31 is provided with the skeleton frame 311 of a pair of laminar, for difference bearing the first wafer cassette 40 and the second wafer cassette 41, the skeleton frame 311 of this two-layer equation is connected in a lifter 312, and drive the first wafer cassette 40 or the second wafer cassette 41 liftings in skeleton frame 311 to be positioned at confession by this lifter 312, the height and position of rewinding is (corresponding to being written into shown in Fig. 3, go out the height and position of arm 32), in the present embodiment, the lower floor of this two-layer equation skeleton frame 311 is for bearing the second wafer cassette 41, for the ease of picking and placeing the second wafer cassette 41, the lower floor of this two-layer equation skeleton frame 311 and be provided with can pull slippage drawer 313, the second 41 of wafer cassette are placed in this drawer 313, and can rely on this drawer 313 of pull slippage, so that pick and place the second wafer cassette 41, the upper strata of another this two-layer equation skeleton frame 311 is open space, and conveniently pick and place bearing the first wafer cassette 40.
Refer to Fig. 3, Fig. 5, work as confession, first wafer A in the first wafer cassette 40 of receiving mechanism 31 carries by the first rotation microscope carrier 341 of the first slide 34 feeding of making first axial (X axis), and complete after capture contraposition, and while carrying out cutting operation by the first cutting mechanism 37 and the second cutting mechanism 38 simultaneously, being written into of Material moving device, go out arm 32 and move and expect that arm 33 can set out the second wafer B in the first wafer cassette 40 be transferred on the second rotation microscope carrier 351 of the second slide 35, and rely on the second slide 35 to do the feeding of first axial (X axis), and make the second wafer B on the second rotation microscope carrier 351 be carried to the view-finder 36 places capture contraposition of capture mechanism, this view-finder 36 also can be done the movement of second axial (Y-axis), and to the second wafer B capture on the second rotation microscope carrier 351, and via the comparison of controller, can find out the second wafer B first axial (X axis) on cutting path, the offset error at second axial (Y-axis) and θ angle, the offset error of Y-axis can be done by the first cutting mechanism 37 and the second cutting mechanism 38 compensation of Y-direction displacement when the time comes, the compensation that the offset error at θ angle is done to rotate by the second rotation microscope carrier 351, as for the offset error of X axis, because the second rotation microscope carrier 351 is done first axial (X axis) feeding, therefore can be done by the second rotation microscope carrier 351 compensation of first axial (X axis) amount of feeding, and complete in advance the preparation work of capture contraposition before the second wafer B cutting.
Refer to Fig. 6, the time of being longer than the second wafer B capture contraposition due to the time of the first wafer A cutting of the first wafer cassette, therefore in the time that the first wafer A on the first rotation microscope carrier 341 completes cutting operation, the second wafer B on the second rotation microscope carrier 351 has completed the operation of capture contraposition, and be retracted into initial point, now the first cutting mechanism 37 and the second cutting mechanism 38 can be made fast second axial (Y-axis) and move to the corresponding second position that rotates microscope carrier 351, and rotating the second wafer B of microscope carrier 351, transfer pair second carries out cutting operation, first wafer A on the first rotation microscope carrier 341 exits, and transfer and carry out follow-up cleaning and dry up operation, this 341 of microscope carrier of the first rotation can continue again and carry next wafer, and then can alternately carry the wafer of the first wafer cassette by the first rotation microscope carrier 341 and the second rotation microscope carrier 351, and make the first cutting mechanism 37 and the second cutting mechanism 38 alternately carry out continuously cutting operation, and then eliminate the first cutting mechanism 37 and the second cutting mechanism 38 stand-by time in during the capture contraposition of capture mechanism, reach the benefit of effective lifting cutting production capacity.
Refer to Fig. 7, Fig. 8, work as confession, last wafer C in the first wafer cassette 40 of receiving mechanism 31 carries by the first rotation microscope carrier 341 of the first slide 34 feeding of making first axial (X axis), and while carrying out cutting operation by the first cutting mechanism 37 and the second cutting mechanism 38 simultaneously, supply, the lifter 312 of receiving mechanism 31 will drive the skeleton frame 311 of two-layer equation to rise, be positioned at confession and make the second wafer cassette 41 increase, the height and position of rewinding is (corresponding to being written into, go out the height and position of arm 32), being written into of this Material moving device, go out arm 32 and move and expect that arm 33 can set out the first wafer D in the second wafer cassette 41 be transferred on the second rotation microscope carrier 351 of the second slide 35, and rely on the second slide 35 to do the feeding of first axial (X axis), and make first wafer D on the second rotation microscope carrier 351 be carried to the view-finder 36 places capture contraposition of capture mechanism, this view-finder 36 also can be done the movement of second axial (Y-axis), and to the first wafer D capture on the second rotation microscope carrier 351, and via the comparison of controller, can find out the offset error of first wafer D on cutting path and carry out contraposition, and the first wafer D that completes in advance the second wafer cassette 41 cuts the preparation work of front capture contraposition.
Refer to Fig. 9, Figure 10, the time of being longer than the first wafer D capture contraposition of the second wafer cassette 41 due to the time of last wafer C cutting of the first wafer cassette 40, therefore in the time that last wafer C on the first rotation microscope carrier 341 completes cutting operation, first wafer D on the second rotation microscope carrier 351 has completed the operation of capture contraposition, and be retracted into initial point, now the first cutting mechanism 37 and the second cutting mechanism 38 can be made fast second axial (Y-axis) and move to the corresponding second position that rotates microscope carrier 351, and rotating the first wafer D of microscope carrier 351, transfer pair second carries out cutting operation, last wafer C on the first rotation microscope carrier 341 exits, and transfer and carry out follow-up cleaning and dry up operation, this 341 of microscope carrier of the first rotation can continue again and carry next wafer of the second wafer cassette 41, and last wafer C of the first wafer cassette 40 complete clean dry up after operation, supply, the lifter 312 of receiving mechanism 31 will drive the skeleton frame 311 of two-layer equation to decline, and being declined, the first wafer cassette 40 is positioned at confession, the height and position of rewinding is (corresponding to being written into, go out the height and position of arm 32), and last wafer C is sent back in the first wafer cassette 40, and then can alternately carry the wafer of the first wafer cassette 40 and the second wafer cassette 41 by the first rotation microscope carrier 341 and the second rotation microscope carrier 351, and make the first cutting mechanism 37 and the second cutting mechanism 38 alternately carry out continuously cutting operation, and then eliminate the first cutting mechanism 37 and the second cutting mechanism 38 in confession, stand-by time in during receiving mechanism exchange wafer cassette, reach the benefit of effective lifting cutting production capacity.
Claims (8)
1. a wafer cutting device with two-layer equation confession, receiving mechanism, is characterized in that, includes:
Board;
For, receiving mechanism, be provided with the skeleton frame of two-layer equation, with bearing the first wafer cassette and the second wafer cassette respectively, the skeleton frame of this two-layer equation is connected in a lifter, and drives the first wafer cassette and the second wafer cassette lifting moving in skeleton frame by this lifter;
Carry mechanism, be arranged with at least two the first slide and the second slides of doing the first axial feeding in parallel, this first slide is provided with at least one the first rotation microscope carrier, is provided with at least one the second rotation microscope carrier, to carry respectively wafer on this second slide;
Capture mechanism, is provided with view-finder, and this view-finder is done the second axial movement, and to carrying the first rotation microscope carrier or the second wafer capture contraposition of rotating on microscope carrier of mechanism;
Cutting mechanism, is provided with axially movable the first cutting mechanism of at least one work second, so that the wafer on the first rotation microscope carrier that carries mechanism or the second rotation microscope carrier is carried out to cutting operation;
Material moving device, is provided with and is at least onely displaced into confession, receiving mechanism and carries the inter-agency material arm that moves, to transfer wafer.
2. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 1, it is characterized in that, the lower floor of the two-layer equation skeleton frame of this confession, receiving mechanism is provided with drawer, for bearing the second wafer cassette, the upper strata of this two-layer equation skeleton frame is open space, and bearing the first wafer cassette.
3. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 1, it is characterized in that, this cutting mechanism is more provided with the first cutting mechanism and is the second cutting mechanism that subtend arranges, and this second cutting mechanism can be done the second axial movement.
4. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 1, is characterized in that, this Material moving device is provided with and is written into, goes out arm and moves material arm.
5. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 4, it is characterized in that, this is written into, goes out arm is that the wafer in the first wafer cassette or second wafer cassette of confession, receiving mechanism is set out, or wafer is written in the first wafer cassette or the second wafer cassette, this moves material arm is in being written into, going out arm and carrying inter-agency handover wafer.
6. according to claim 1 have the wafer cutting device of two-layer equation for, receiving mechanism, it is characterized in that, more comprises to be provided with the wafer to completing cutting and to clean the wiper mechanism that dries up operation.
7. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 1, it is characterized in that, when this does the first axial feeding cutting for the wafer in the first wafer cassette of, receiving mechanism by the first rotation microscope carrier carrying of the first slide, next wafer in the first wafer cassette can be carried to the place's capture contraposition of capture mechanism by the second rotation microscope carrier of the second slide, and completes in advance the preparation work of the front capture contraposition of next wafer cutting.
8. the wafer cutting device with two-layer equation confession, receiving mechanism according to claim 1, it is characterized in that, when this does the first axial feeding cutting for last wafer in the first wafer cassette of, receiving mechanism by the first rotation microscope carrier carrying of the first slide, first wafer in the second wafer cassette can be carried to the place's capture contraposition of capture mechanism by the second rotation microscope carrier of the second slide, and completes in advance the preparation work of the front capture contraposition of first wafer cutting in the second wafer cassette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420006280.2U CN203665729U (en) | 2014-01-06 | 2014-01-06 | Wafer cutting device with double-layer wafer supplying and collecting mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420006280.2U CN203665729U (en) | 2014-01-06 | 2014-01-06 | Wafer cutting device with double-layer wafer supplying and collecting mechanism |
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| CN203665729U true CN203665729U (en) | 2014-06-25 |
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| CN201420006280.2U Expired - Fee Related CN203665729U (en) | 2014-01-06 | 2014-01-06 | Wafer cutting device with double-layer wafer supplying and collecting mechanism |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104118068A (en) * | 2014-07-22 | 2014-10-29 | 上海日进机床有限公司 | Multi-wire cutting equipment and cutting method applied by same |
| CN106169421A (en) * | 2016-08-26 | 2016-11-30 | 振图科技股份有限公司 | Automatic wafer protective layer removing equipment |
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| CN112917033A (en) * | 2021-02-23 | 2021-06-08 | 古英芳 | Equipment capable of automatically rotating and correcting position in laser cutting wafer processing |
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2014
- 2014-01-06 CN CN201420006280.2U patent/CN203665729U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104118068A (en) * | 2014-07-22 | 2014-10-29 | 上海日进机床有限公司 | Multi-wire cutting equipment and cutting method applied by same |
| CN104118068B (en) * | 2014-07-22 | 2016-12-14 | 上海日进机床有限公司 | Multi-wire saw equipment and the cutting method applied thereof |
| CN106169421A (en) * | 2016-08-26 | 2016-11-30 | 振图科技股份有限公司 | Automatic wafer protective layer removing equipment |
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| CN109119369B (en) * | 2017-06-23 | 2020-07-14 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and automatic wafer transfer system |
| CN112917033A (en) * | 2021-02-23 | 2021-06-08 | 古英芳 | Equipment capable of automatically rotating and correcting position in laser cutting wafer processing |
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