CN203617269U - Cooling-fin-type heat dissipating device for power elements - Google Patents
Cooling-fin-type heat dissipating device for power elements Download PDFInfo
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- CN203617269U CN203617269U CN201320421643.4U CN201320421643U CN203617269U CN 203617269 U CN203617269 U CN 203617269U CN 201320421643 U CN201320421643 U CN 201320421643U CN 203617269 U CN203617269 U CN 203617269U
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- fin
- heat dissipating
- radiator
- air outlet
- heat
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- 239000000758 substrate Substances 0.000 claims description 32
- 230000005855 radiation Effects 0.000 claims description 13
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 208000011580 syndromic disease Diseases 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010063493 Premature ageing Diseases 0.000 description 1
- 208000032038 Premature aging Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Abstract
The utility model discloses a Cooling-fin-type heat dissipating device for power elements. The heat dissipating device includes a heat dissipating base plate and multiple heat dissipating fins. The heat dissipating base plate and the multiple heat dissipating fins are connected to each other; and the heat dissipating fins are arranged on one surface of the heat dissipating base plate. A plurality of power elements are installed on and attached to the other surface of the heat dissipating base plate. The device is characterized by that: by combining the multiple heat dissipating fins, the different spacings of the heat dissipating fins are formed in the direction from an air inlet of the heat dissipating device to the air outlet of the same. The heat dissipating fins are arranged in a manner that the spacing between the heat dissipating fins which are close to the position of the air inlet is wider than that between the heat dissipating fins which are close to the position of the air outlet. According to the different heat dissipating effects of different positions of the heat dissipating base plate, the heat dissipating fins are arranged in different spacing so that the heat dissipating areas of the different positions of the heat dissipating base plate are changed and the total heat dissipating capacities of the different positions of the heat dissipating base plate are uniform. The uniform heat dissipating effect of each power element is ensured. By adjusting the arrangement method for the heat dissipating fins, the influence of different air temperatures in the direction from the air inlet to the air outlet on temperature increase of the power elements is eliminated and temperature equalization of the power elements can be achieved.
Description
Technical field
The utility model relates to a kind of power device radiator, especially for the heat radiation type power device radiator that multiple power semiconductors are installed on a radiator, main application is for the above high-power thyristor of 200A, the above thyristor of 25A and rectification module, the above high-power IGBT of 50A.
Background technology
Large power semiconductor device can produce a large amount of heat in running, in order to be unlikely to burn out power device, all must help its heat radiation by radiator now; Wherein, finned radiator is a kind of conventional radiator, heat transfer and the heat sinking function of the main load power device of finned radiator.
Current finned radiator is substantially all by two unit combinations, fin and substrate, and fin mainly plays heat sinking function, and substrate plays heat transmission function.General finned radiator is in the time of processing and fabricating, all first to make respectively substrate and fin, again fin is inserted on substrate, then by welding, fin and substrate are welded, composition finned radiator, it is larger that this radiator has heat radiation power, and feature stable and reliable for performance, is therefore used widely.But along with the power density of power device is increasing, the density of heat flow rate of radiator is also more and more higher, the heat-sinking capability of the radiator of requirement is more and more stronger.For improving the heat-sinking capability of unit volume, only have the thermal conductivity by improving area of dissipation and material to realize.The main method of existing raising radiator area is mainly to adopt porous fin or corrugated plate to improve area of dissipation, but except existing, flow resistance is large, the poor defect such as large of air inlet power device radiator temperature successively, also there are following two defects: one along with the increasing of fin height, and the efficiency of fin is low; Second radiator cannot be used integral section moulding, can only adopt dummy slider or inserted technique; If but in order to increase area of dissipation, by the minimizing of inter fin space, dummy slider and inserted technique realize difficulty will be increased, cause quality unstable, therefore more than the minimum spacing 2.5mm of the fin of existing section bar, embedding (edge) sheet heat radiator, heat-sinking capability is limited, in the time that power density is larger, only has the radiator that adopts alternate manner.In addition, adopt existing dummy slider or inserted technique, in order to guarantee manufacture craft, fin is all generally the fin that adopts same thickness, arranges according to equally spaced mode; Though comparison is simple like this, but while being arranged on a radiator for multiple power devices simultaneously, while multiple power device being installed due to same radiator, the wind-warm syndrome of air inlet and air outlet may reach more than 20 ℃, the power device of air outlet can be higher more than 15 ℃ than the power device of air inlet, so just there will be the radiating effect of each power device different, cause each power non-uniform temperature, to cause like this Partial Power device premature aging to lose efficacy, to greatly affect the serviceability of power device, therefore necessary this is improved.
Arrive some patents about radiator aspect by patent retrieval, but do not find the patented technology identical with the utility model, the patent relevant to the utility model technology mainly contains following:
1, number of patent application is CN201010611031.2, utility model name is called " a kind of fin-inserted radiator and have the heat abstractor of fin-inserted radiator ", this patent discloses a kind of fin-inserted radiator and has had the heat abstractor of fin-inserted radiator, fin-inserted radiator is provided with substrate and is installed on the radiating fin of described substrate, described radiating fin carries out air blast by the air blast that is arranged at its underpart, described radiating fin is provided with arc notch, and described arc notch is corresponding with the position of described air blast.The heat abstractor of fin-inserted radiator, is provided with support, is installed on the fin-inserted radiator of described support and is arranged at the air blast of described support bottom; Fin-inserted radiator is provided with substrate and is installed on the radiating fin of described substrate, and described radiating fin is provided with arc notch, and described arc notch is positioned at described air blast upper position.
2, number of patent application is CN201110453400.4, utility model name is called " a kind of conduction refrigeration mode high-power semiconductor laser and preparation method thereof " this patent and discloses a kind of conduction cooling type high-power semiconductor laser and preparation method thereof, comprises radiator and one or more semiconductor laser element; Described semiconductor laser element is by chip, form with the substrate that plays radiation conductive effect of chips welding and with the insulating trip that plays insulating radiation effect that substrate welds, and semiconductor laser element is welded on radiator by insulating trip.
3, number of patent application is CN201210491876.1, utility model name be called "; utility model name is called " a kind of be interrupted dislocation air-cooled radiator "; this patent discloses a kind of interruption dislocation air-cooled radiator; comprise substrate, baffle plate and fins set, it is characterized in that: described fins set comprises wide tooth pitch fins set and narrow tooth pitch fins set; Described substrate two ends are fixed with described baffle plate, between described substrate and described baffle plate, form the spatial accommodation that can hold described wide tooth pitch fins set and described narrow tooth pitch fins set, described wide tooth pitch fins set and described narrow tooth pitch fins set are fixed in described spatial accommodation; Between described wide tooth pitch fins set and described narrow tooth pitch fins set, be provided with and be interrupted district.
Though above-mentioned these patents all relate to finned radiator, also mentioned the installation of fin, but all do not relate to the relevant fin arrangement method that how to improve, while making multiple power devices be arranged on same radiator simultaneously, the radiating effect of each power device is all the same,, therefore all still there are more said problems above in the uniformity of guaranteed output device heat radiation, so necessary, this is further improved.
Utility model content
Technical problem to be solved in the utility model is the existing some shortcomings of fin arrangement mode for existing radiator, a kind of new heat radiation type power device radiator is provided, this kind of radiator can effectively guarantee that each power device can have equal radiating effect, effectively the serviceability of guaranteed output device.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of heat radiation type power device radiator, comprise heat-radiating substrate and fin, described fin and heat-radiating substrate link together, be arranged in the one side of heat-radiating substrate, on the another side of heat-radiating substrate, be close to radiator base plate surface multiple power devices are installed, it is characterized in that, pass through radiating fin combination, make at radiator air inlet, to air outlet direction, to form the spacing of different fin; Described fin is to be wider than near the spacing between the fin of air outlet position and to arrange according to the spacing between the fin near air intake vent position.
Further, described fin is to be wider than near the spacing between the fin of air outlet position and to arrange according to the spacing between the fin near air intake vent position, by increasing the fin quantity of air outlet position, increase area of dissipation and the heat dissipation capacity of air outlet position, thereby make up the heat dissipation capacity of the air-flow air outlet that the temperature difference affects of air outlet position and air intake vent position.
Further, the spacing between the fin of described close air intake vent position is wider than near the spacing between the fin of air outlet position and distributes according to following rule:
Increase according to radiator from air intake vent to air outlet temperature gradient, determines the gradient that on radiator, between fin, distance is reduced, to guarantee that the fin heat that any position is taken away from substrate is basic equating.
Further, between described fin, the gradient of distance reduction is evenly successively decreased, and starts to be evenly decremented to air outlet from air intake vent, and the speed of the speed of successively decreasing air intake vent temperature rise relative to air outlet is corresponding.
Further, the distance reduction between described fin, realize air outlet inter fin space≤2.5mm by the adjustment of distance piece between fin.
The utility model is adjusted the arrangement mode of fin by utilization, by the aluminium sheet combination of varying number and thickness, can be at radiator air inlet to air outlet direction, form the spacing of different fin, by adjusting the spacing of fin, eliminate the impact of air inlet to the not identical temperature rise on power device of air outlet direction wind-warm syndrome, realize the samming of power device.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the B-B cross section view of accompanying drawing 1;
Fig. 3 is the A-A cross section view of accompanying drawing 1.
Wherein: 1, substrate, 2, the first fin, 3, the second fin, 4, the 3rd fin, 5, backings that scatter, 6, the first power device, 7, the second power device, 8, air intake vent, 9, air outlet.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
Shown in accompanying drawing, can know and find out that the utility model relates to a kind of power device radiator of fin arrangement mode, comprise heat-radiating substrate and fin, described fin and heat-radiating substrate link together, be arranged in the one side of heat-radiating substrate, on the another side of heat-radiating substrate, be close to radiator base plate surface multiple power devices are installed, it is characterized in that, fin is arranged according to different-thickness and different spacing, according to the difference of heat-radiating substrate diverse location radiating effect, take different arranged with intervals, change the area of dissipation of radiator base plate diverse location, make in the heat radiation total amount of radiator diverse location the same, guarantee that each power device can obtain uniform radiating effect.
Further, described fin is to be wider than near the spacing between the fin of air outlet position and to arrange according to the spacing between the fin near air intake vent position, by increasing the fin quantity of air outlet position, increase area of dissipation and the heat dissipation capacity of air outlet position, thereby make up the heat dissipation capacity of the air-flow air outlet that the temperature difference affects of air outlet position and air intake vent position.
Further, the spacing between the fin of described close air intake vent position is wider than near the spacing between the fin of air outlet position and distributes according to following rule:
Increase according to radiator from air intake vent to air outlet temperature gradient, determines the gradient that on radiator, between fin, distance is reduced, to guarantee that the fin heat that any position is taken away from substrate is basic equating.
Further, between described fin, the gradient of distance reduction is evenly successively decreased, and starts to be evenly decremented to air outlet from air intake vent, and the speed of the speed of successively decreasing air intake vent temperature rise relative to air outlet is corresponding.
Further, the distance reduction between described fin, realize air outlet inter fin space≤2.5mm by the adjustment of distance piece between fin.
Embodiment mono-
A kind of aluminum uniform-temperature radiator: radiator is made up of substrate, fin and top board, by the aluminium sheet combination of varying number and thickness, make at radiator air inlet to air outlet direction, form the spacing of different fin, by adjusting the spacing of fin, eliminate the impact of air inlet to the not identical temperature rise on power device of air outlet direction wind-warm syndrome, realize the samming of power device.The scheme of soldering Aluminium Radiator is described in detail as follows:
As shown in accompanying drawing 1-3, whole power device radiator, comprise substrate 1 and fin, fin is combined to form by different-thickness, different size, difform fine aluminium and fine aluminium clad material plate, and from every two fin in power device one 6 belows of air intake vent, the i.e. spacing of the first fin 2 and the second fin 3, is greater than every two fin in air outlet power device 47 belows, i.e. the 3rd fin 4 and spacing of backing 5 that scatters; Can realize the requirements such as different inter fin spaces by combination.
By the spacing between conversion part fin, the integral heat sink effect that can make is even; And the spacing of fin is the evenly reduction of spacing from air intake vent to air outlet fin, to guarantee that area of dissipation by increasing air outlet reduces the impact being brought that heats up of air outlet flowing gas.
The utility model is adjusted the arrangement mode of fin by utilization, by the aluminium sheet combination of varying number and thickness, can be at radiator air inlet to air outlet direction, form the spacing of different fin, by adjusting the spacing of fin, eliminate the impact of air inlet to the not identical temperature rise on power device of air outlet direction wind-warm syndrome, realize the samming of first power device to N power device.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within being all included in protection range of the present utility model.
Claims (4)
1. a heat radiation type power device radiator, comprise heat-radiating substrate and fin, described fin and heat-radiating substrate link together, be arranged in the one side of heat-radiating substrate, on the another side of heat-radiating substrate, be close to radiator base plate surface multiple power devices are installed, it is characterized in that, pass through radiating fin combination, make at radiator air inlet, to air outlet direction, to form the spacing of different fin; Described fin is to be wider than near the spacing between the fin of air outlet position and to arrange according to the spacing between the fin near air intake vent position.
2. heat radiation type power device radiator as claimed in claim 1, is characterized in that, the spacing between the fin of described close air intake vent position is distributed according to following rule:
Increase according to radiator from air intake vent to air outlet temperature gradient, determines the gradient that on radiator, between fin, distance is reduced.
3. heat radiation type power device radiator as claimed in claim 2, it is characterized in that, between described fin, the gradient of distance reduction is evenly successively decreased, and starts to be evenly decremented to air outlet from air intake vent, and the speed of the speed of successively decreasing air intake vent temperature rise relative to air outlet is corresponding.
4. heat radiation type power device radiator as claimed in claim 3, is characterized in that, the distance reduction between described fin, realize air outlet inter fin space≤2.5mm by the adjustment of distance piece between fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320421643.4U CN203617269U (en) | 2013-07-16 | 2013-07-16 | Cooling-fin-type heat dissipating device for power elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320421643.4U CN203617269U (en) | 2013-07-16 | 2013-07-16 | Cooling-fin-type heat dissipating device for power elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617269U true CN203617269U (en) | 2014-05-28 |
Family
ID=50769895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320421643.4U Expired - Fee Related CN203617269U (en) | 2013-07-16 | 2013-07-16 | Cooling-fin-type heat dissipating device for power elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617269U (en) |
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2013
- 2013-07-16 CN CN201320421643.4U patent/CN203617269U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160711 Address after: 411201, Hunan, Xiangtan, Xiangtan (Jiu Hua) 9 West legend Road, innovation and Entrepreneurship Center No. 10 Patentee after: Hunan Zhi hot technology Limited by Share Ltd Address before: 412007 Industrial Park, E Industrial Zone, Tianyuan, Hunan, China Patentee before: Zhuzhou Zhire Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20180716 |
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| CF01 | Termination of patent right due to non-payment of annual fee |