CN203232772U - Inductive element - Google Patents

Abstract

An inductance element comprises a magnetic induction piece, a circuit substrate, a plurality of leads, a shell and a medium; the circuit substrate comprises an insulating layer, a plurality of wires and a plurality of connecting pads, wherein the insulating layer is provided with a plane, and the magnetic sensing piece is arranged on the plane; the routing lines and the connecting pads are formed between the plane and the magnetic sensing piece, wherein each routing line passes through the magnetic sensing piece to be connected with two connecting pads; each conducting wire strides over the magnetic induction piece to be connected with two connecting pads, wherein the routing wires, the connecting pads and the conducting wires form a coil loop wound on the magnetic induction piece; the shell is arranged on the plane and covers the magnetic induction piece and the leads, wherein a cavity is formed between the shell and the circuit substrate; the medium is sealed in the cavity and covers the magnetic induction piece and the leads. The leads and the circuit substrate can form a coil loop wound on the magnetic induction piece, so that the inductance element of the invention can generate induced electromotive force to operate.

Description

Inductive element

technical field

The utility model relates to a passive electronic component, and in particular to an inductor.

Background technique

Some inductive components today include a magnetic core and a plurality of windings wound around the magnetic core. Most of these windings are wound on the magnetic core by hand to form a coil loop. (coil circuit). However, this manual method is not only time-consuming, but also easy to make wrong windings, such as insufficient or too many turns of the windings, or wrong winding directions of the windings, thus producing defective inductors. In addition, for a small inductance element, since the small inductance element has a magnetic core with a small volume, it is difficult to wind a plurality of winding wires on the magnetic core by the above-mentioned manual method.

Utility model content

The utility model provides an inductance element, the coil loop of which is formed by connecting a circuit substrate with a plurality of wires.

One embodiment of the present invention provides an inductance element, which includes a magnetic sensing element, a circuit substrate, a plurality of wires, a housing, and a medium. The circuit substrate includes an insulating layer, a plurality of traces and a plurality of connection pads, wherein the insulating layer has a plane, and the magnetic sensing element is arranged on the plane. The traces and the connection pads are formed between the plane and the magnetic sensing element, wherein each trace passes through the magnetic sensing element and connects two of the connection pads. Each wire crosses the magnetic sensing element and connects two of the connection pads, wherein the traces, the connection pads and the wires form a coil loop wound around the magnetic sensing element. The casing is arranged on a plane and covers the magnetic sensing element and the wires, wherein a cavity is formed between the casing and the circuit substrate. The medium is sealed in the chamber and covers the magnetic sensing element and the wires.

In other words, the utility model provides an inductive element, the inductive element includes: a magnetic sensing part; a circuit substrate, including an insulating layer, a plurality of wiring lines and a plurality of connection pads, wherein the insulating layer has a plane, and the magnetic sensing part Arranged on the plane, the plurality of wires and the plurality of connecting pads are formed between the plane and the magnetic sensing element, wherein each of the routing lines passes through the magnetic sensing element to connect two of the connecting pads; a plurality of wires , each of the wires straddles the magnetic sensing part and connects two of the connection pads, wherein the plurality of traces, the plurality of connection pads and the plurality of wires form a coil loop wound around the magnetic sensing part; the casing, arranged on the plane, and covering the magnetic sensing element and the plurality of wires, wherein a chamber is formed between the housing and the circuit substrate; and a medium, sealed in the chamber, and covering the magnetic sensing element and the plurality of wires. The multiple wires.

Preferably, the medium is elastic glue, insulating oil or filling gas.

Preferably, the medium comprises at least two filler materials, wherein one filler material is in a different state of matter than the other filler material.

Preferably, one of the at least two filling materials is elastic glue, insulating oil or filling gas.

Preferably, the inductor element further includes at least one sealing body, and the casing has at least one opening, wherein the at least one sealing body fills the at least one opening.

Preferably, the casing is a metal casing, a plastic casing, a ceramic casing or a fiber material casing.

Preferably, the housing includes a shell and a conductive film, wherein the conductive film is attached to the shell.

Preferably, the inductance element further includes an insulating bonding layer connected to the magnetic sensing element, and the insulating bonding layer is located between the magnetic sensing element and the plurality of wires.

Preferably, the circuit substrate further includes a protection layer, the protection layer covers the plurality of wires and exposes the plurality of connection pads, and the magnetic sensing element is fixed on the protection layer.

Preferably, the circuit substrate further includes at least two external pads and at least two conductive pillars, each of which is connected to one of the external pads and one of the connection pads.

Preferably, the shape of the magnetic sensing part is a ring, and the magnetic sensing part surrounds the ring opening, some of the connection pads are located inside the ring opening, and other connection pads are located outside the ring opening, and each of the wires passes through the magnetic sensing part And connect one of the connection pads located in the ring opening and one of the connection pads located outside the ring opening, and each of the traces passes through the magnetic sensing part to connect one of the connection pads located in the ring opening and one of them outside the ring opening connection pads to form the coil loop.

Preferably, the plurality of connection pads are arranged in double concentric circles along the magnetic sensing element. Alternatively, the annular body is a square frame or an annular body.

Based on the above, in the inductive element of the present invention, the wires and the circuit substrate can form a coil loop wound around the magnetic sensing element, so that the inductive element of the present invention can generate induced electromotive force to operate.

In order to make the features and beneficial effects of the present invention more comprehensible, the following specific examples are given together with the accompanying drawings and described in detail as follows.

Description of drawings

Fig. 1A is a schematic cross-sectional view of an inductance element according to an embodiment of the present invention;

FIG. 1B is a schematic top view of the inductance element in FIG. 1A after removing the housing and the medium;

Fig. 1C is a three-dimensional schematic diagram of the inductance element in Fig. 1B;

Fig. 2A is another embodiment of the utility model; a three-dimensional schematic diagram of a magnetically sensitive part of an inductance element;

Fig. 2B is another embodiment of the present invention; a three-dimensional schematic diagram of a magnetically sensitive part of an inductance element;

Fig. 3A is another embodiment of the utility model; a schematic cross-sectional view of an inductance element.

[Description of reference signs of main components]

100, 300: Inductive element

110a, 110b, 110c, 310: magnetic sensing parts

120, 320: circuit substrate

122: insulation layer

122b: bottom surface

122s: plane

124p: connection pad

124t: wiring

126: External pad

128: Conductive column

129: protective layer

129h, 152h: opening

130: wire

142, 144: filling material

150, 250: Shell

154: bonding layer

156: sealing body

160: insulating bonding layer

140, 240: Medium

251: shell

252: Conductive film

C1: chamber

H1: ring mouth

Detailed ways

FIG. 1A is a schematic cross-sectional view of an inductance element according to an embodiment of the present invention. Please refer to FIG. 1A , the inductance element 100 of this embodiment includes a magnetic sensing element 110 a , a circuit substrate 120 , a plurality of wires 130 , a medium 140 and a casing 150 . The magnetic sensing element 110 a , the wires 130 and the casing 150 are all disposed on the circuit substrate 120 , and the casing 150 covers the magnetic sensing element 110 a and the wires 130 . A cavity C1 is formed between the casing 150 and the circuit substrate 120 , and the medium 140 is located in the casing 150 and sealed in the cavity C1 , wherein the medium 140 covers the magnetic sensing element 110 a and the wires 130 .

The circuit substrate 120 includes an insulating layer 122 , a plurality of wires 124t and a plurality of connection pads 124p , wherein the insulating layer 122 has a plane 122s , and the magnetic sensing element 110a and the casing 150 are both disposed on the plane 122s . The traces 124t and the connection pads 124p are formed on the plane 122s, and further formed between the plane 122s and the magnetic sensing element 110a, and the traces 124t are connected to the connection pads 124p.

The circuit substrate 120 may further include at least two external pads 126 and at least two conductive pillars 128 (only one is shown). In detail, the insulating layer 122 also has a bottom surface 122 b opposite to the plane 122 s, wherein the conductive posts 128 are located in the insulating layer 122 , and the external pads 126 are located on the bottom surface 122 b. Therefore, the external pads 126 and the traces 124t are respectively located on two opposite surfaces of the insulating layer 122 . 1A, the circuit substrate 120 is essentially a double-sided wiring board (double-sided wiring board), that is, the circuit substrate 120 has two circuit layers: one layer includes wiring 124t and connection pad 124p, and the other layer includes external wiring. Pad 126. In addition, each conductive pillar 128 is connected to one of the external pads 126 and one of the connection pads 124p, as shown in FIG. 1A .

However, it should be noted that in other embodiments, the circuit substrate 120 may have only one circuit layer, or three or more circuit layers. That is to say, the circuit substrate 120 can be a single-sided wiring board (single-sided wiring board) or a multilayer wiring board (multilayer wiring board) in essence, wherein the above-mentioned multilayer wiring board can also be a High Density Interconnect (High Density Interconnect) )circuit board. Therefore, the number of circuit layers of the circuit substrate 120 is not limited. In addition, in the embodiment where the circuit substrate 120 is a single-sided circuit board, the circuit substrate 120 may not have any conductive pillars 128, and the external pads 126, traces 124t, and connection pads 124p may all be located on the plane 122s, wherein these external The pads 126 are located outside the housing 150 and can be electrically connected to some connection pads 124p via some traces 124t.

The inductor element 100 may further include an insulating bonding layer 160 . The insulating bonding layer 160 connects the magnetic sensing element 110 a and is located between the magnetic sensing element 110 a and the traces 124 t. The insulating bonding layer 160 can fix the inductor element 100 on the plane 122s. In detail, the insulating bonding layer 160 may be an adhesive, such as a solid adhesive (such as double-sided tape) or a hardened glue, wherein the hardened glue is, for example, a thermosetting hardened glue or an ultraviolet light hardened glue. Therefore, the inductance element 100 can be fixed on the circuit substrate 120 by means of sticking. However, in addition to the insulating bonding layer 160 , the inductor element 100 can also be fixed on the circuit substrate 120 in other ways. For example, the inductance element 100 can be fixed on the circuit substrate 120 by using screws. Alternatively, the inductance element 100 can also be fixed on the circuit substrate 120 by using rivets or buckles.

The housing 150 may be fixed on the flat surface 122s by using the bonding layer 154 . In detail, the bonding layer 154 can be an adhesive material, and both the bonding layer 154 and the insulating bonding layer 160 can be of the same type of adhesive material, so the bonding layer 154 can bond the casing 150 to the circuit substrate 120 . However, it should be noted that the bonding layer 154 and the insulating bonding layer 160 may also be of different types of adhesive materials. For example, the joint layer 154 may be hardened glue (such as thermosetting hardened glue or ultraviolet light hardened glue), and the insulating joint layer 160 may be solid glue (such as double-sided glue). In addition, the housing 150 can also be fixed on the circuit substrate 120 in other ways. For example, the housing 150 can be fixed on the circuit substrate 120 by using screws, rivets or buckles.

There are many kinds of materials constituting the housing 150 . For example, the casing 150 can be made of metal, ceramics, glass, plastic or fiber material, wherein the plastic can be polymethylmethacrylate (PMMA for short, commonly known as acrylic, Acrylic) or ABS ( Acrylonitrile Butadiene Styrene (abbreviated as ABS) resin and other hard plastic materials, and fiber materials such as wood (wood), paper (such as cardboard), carbon fiber or glass fiber. Therefore, the housing 150 may be a metal shell, a plastic shell, a ceramic shell, a paper shell, a wooden shell, a glass shell, or a carbon fiber shell.

The casing 150 covers the magnetic sensing element 110a and the wires 130 so that the casing 150 can protect the magnetic sensing element 110a and the wires 130 and reduce the probability of damage to the magnetic sensing element 110a or the wires 130 due to impact. In addition, when the shell 150 is a metal shell or a conductive carbon fiber shell, the shell 150 can have the ability to resist electromagnetic waves (Electromagnetic Radiation, EMR), so as to reduce the influence of electromagnetic interference (Electromagnetic Interference, EMI) on the operation of the inductance element 100. Influence. In addition, the material constituting the shell 150 can be a material with low magnetic susceptibility, that is, the shell 150 can be made of materials other than ferromagnetic material and ferrimagnetic material, so as to avoid During the operation of the inductive element 100 , the casing 150 induces a large magnetic field. In this way, the interference of the external magnetic field on the inductance element 100 can be weakened.

The medium 140 is filled in the chamber C1 and includes two filling materials 142 and 144 . In the embodiment of FIG. 1A, the filling material 142 can completely cover the magnetic sensing part 110a and the wire 130, but in other embodiments, the filling material 142 can partially cover the magnetic sensing part 110a and the wire 130, that is, the magnetic sensing part 110a A portion of both the wire 130 is not covered by the filling material 142 . The states of matter of the two filling materials 142 and 144 may be different from each other. For example, in this embodiment, the filling material 142 can be a liquid material, such as insulating oil such as vegetable oil or mineral oil (such as silicone oil), and the filling material 144 can be a gas material, such as air, an inert gas ( noble gas) or nitrogen (nitrogen) and other filling gases.

In addition to the liquid material and the gas material, at least one of the two filling materials 142 and 144 may be a solid material. In detail, the filling material 142 may be elastic rubber, such as two-part room temperature curing rubber with room temperature curing properties. This elastic glue can be formed by mixing two or more materials, and after hardening, the hardness of this elastic glue is lower than 70 degrees under the standard of Japanese Industrial Standards A (JIS-A), among which the above The material forming the elastic glue can be a liquid material or a gel-like material (such as Bingham fluid, Bingham plastic). Therefore, the hardened elastic glue still has elasticity. In addition, the elastic glue can be transparent after hardening.

It should be noted that, although in the embodiment shown in FIG. 1A , the medium 140 includes two filling materials 142 and 144, in other embodiments, the medium 140 may include three or more filling materials, wherein One fill material state of matter can be different from other fill materials. For example, one of the filling materials can be the elastic glue mentioned above, and the other two can be insulating oil and filling gas respectively. In addition, the state of matter of at least two filling materials of the medium 140 may be the same as each other, and in this embodiment, the states of matter of the filling materials 142 and 144 may be the same as each other. For example, both the filler material 142 and the filler material 144 may be insulating oil, wherein the filler material 142 is mineral oil, and the filler material 144 is vegetable oil.

The inductance element 100 may further include two sealing bodies 156, and the housing 150 may have two openings 152h. The sealing bodies 156 are respectively filled in the openings 152 h , and the openings 152 h can be used as inlets of filling materials (eg, filling materials 142 and 144 ) filled in the medium 140 . Since the above-mentioned filling material can be liquid material (such as insulating oil) or elastic glue, wherein the material forming the elastic glue can be liquid material or gel-like material, so the magnetic sensing part 110a, the wire 130 and the housing 150 are all arranged on the plane 122s After filling, the above-mentioned filling material or a material forming the filling material (such as a material forming elastic glue) can be filled into the cavity C1 through the opening 152h to form the medium 140 . Afterwards, a sealing body 156 is formed in the opening 152h to seal the opening 152h and prevent the medium 140 in the chamber C1 from leaking out of the opening 152h. In addition, the sealing body 156 can be hardened glue (such as thermosetting hardened glue or ultraviolet light hardened glue), and can be formed by a glue dispenser.

In this embodiment, the inductance element 100 includes at least two sealing bodies 156 , and the casing 150 has at least two openings 152h, wherein the sealing bodies 156 fill the openings 152h individually. Since the housing 150 has at least two openings 152h, during the process of filling the filling material of the medium 140, at least one opening 152h can be used to discharge the fluid (such as air) in the chamber C1, so that the filling material (such as the filling material 142, 144) can be successfully filled in the chamber C1.

However, it should be noted that, in other embodiments, the housing 150 may have only one opening 152h, and the inductor element 100 may also have only one sealing body 156 . Therefore, the numbers of the openings 152h and the sealing bodies 156 shown in FIG. 1A are only for illustration, and the numbers of the openings 152h and the sealing bodies 156 are not limited.

Fig. 1B is a schematic top view of the inductive element in Fig. 1A after removing the housing and the medium, and Fig. 1C is a schematic perspective view of the inductive element in Fig. 1B, wherein Fig. 1A is a cross-sectional view from line A-A in Fig. 1B . Referring to FIG. 1A to FIG. 1C , the shape of the magnetic sensing element 110 a may be a ring, such as a toroid, so the magnetic sensing element 110 a surrounds the ring H1 . Some connection pads 124p are located inside the ring opening H1, while other connection pads 124p are located outside the ring opening H1, so the connection pads 124p are arranged in two concentric rings along the magnetic sensing element 110a. In addition, from FIG. 1A and FIG. 1C , it can be seen that the cross-sectional shape of the magnetic sensing element 110 a is a rectangle, as shown in FIG. 1A .

The magnetic sensing element 110a can be made of ferromagnetic material or ferromagnetic material. When the magnetic sensing element 110a is made of ferromagnetic material, the magnetic sensing element 110a may be a metal block, and its material is ferromagnetic metal such as iron, cobalt, nickel or nickel-iron alloy. When the magnetic sensing element 110a is made of a ferromagnetic material, the magnetic sensing element 110a may be a ceramic block, which for example contains a ferromagnetic material such as iron oxide. In addition, in this embodiment, the shape of the magnetic sensing part 110a is a ring, but in other embodiments, the magnetic sensing part 110a can also have other shapes, such as a strip, a plate or an E-shaped body, so The shape of the magnetic sensing element 110a is not necessarily limited to a ring.

Each wire 130 connects two connection pads 124p across the magnetic sensing element 110a, and each trace 124t connects two connection pads 124p through the magnetic sensing element 110a. In detail, each wire 130 is connected to one of the connection pads 124p located inside the ring H1 and one of the connection pads 124p located outside the ring H1, and each trace 124t is connected to one of the connection pads 124p located outside the ring H1 through the magnetic sensing element 110a. The connection pad 124p inside the ring H1 and one of the connection pads 124p outside the ring H1. In this way, the traces 124t, the connection pads 124p and the wires 130 can form a coil loop wound around the magnetic sensing element 110a. In addition, the wires 130 can be formed by wire bonding, so that the inductance element 100 is suitable for making small discrete components, such as electronic components suitable for Surface Mount Technology (SMT).

The external pads 126 can be electrically connected to the connection pads 124p via the conductive pillars 128, and the external pads 126 can be used as pads for soldering. Using the external pads 126 , the inductive element 100 can be soldered on a circuit board (such as a motherboard), and electrical signals can be transmitted between the aforementioned circuit board and the inductive element 100 through the external pads 126 . In addition, the connection pad 124p connected to the conductive post 128 is not connected to both the wire 130 and the trace 124t. Taking the embodiment shown in FIG. 1A and FIG. 1B as an example, the connection pads 124p connected to the conductive pillars 128 are only connected to the wire 130 without connecting to any trace 124t.

Based on the above, using the circuit substrate 120 and the wires 130 connecting the traces 124t and the connection pads 124p, a coil loop wound around the magnetic sensing element 110a can be formed to generate an induced electromotive force. Compared with the known inductance element in which coil loops are manufactured manually, the inductance element 100 of the above embodiment can shorten the manufacturing time and improve the yield. In addition, since the wire 130 can be formed by wire bonding, and the wire bonding is suitable for manufacturing small-sized electronic components (such as packaged chips), the inductance element 100 can also be applied to the manufacture of small inductance elements.

In particular, in the medium 140 mentioned above, the filling material (such as the two filling materials 142 and 144 ) can be a liquid material or a gaseous material. Alternatively, the filling material may be elastic glue with a hardness lower than 70 degrees (under the standard of JIS-A). Therefore, when the inductive element 100 operates, the medium 140 can allow the volume of the magnetic sensing element 110a to change due to the magnetostrictive effect. In this way, the inductance value of the inductance element 100 will not be affected by excessive suppression of the volume change of the magnetic sensing element 110a.

FIG. 2A is a three-dimensional schematic diagram of a magnetic sensing part of an inductance element according to another embodiment of the present invention. Please refer to FIG. 2A , the shape of the magnetic sensing element 110 b is a ring, and it is also a ring, but different from the magnetic sensing element 110 a in FIG. 1A and FIG. 1C , the shape of the magnetic sensing element 110 b is like a doughnut. That is to say, the cross-sectional shape of the magnetic sensing element 110b is circular or oval (as shown in FIG. 2A ). In addition, the magnetic sensing element 110b can be replaced with the magnetic sensing element 110a in the foregoing embodiments.

FIG. 2B is a three-dimensional schematic diagram of a magnetic sensing part of an inductance element according to another embodiment of the present invention. Please refer to FIG. 2B , the shape of the magnetic sensing element 110c is a square frame. That is to say, the cross-sectional shape of the magnetic sensing element 110c is a rectangle (as shown in FIG. 2B ). In addition, the magnetic sensing element 110c can also be replaced with the magnetic sensing element 110a in the foregoing embodiment, so the magnetic sensing element of the inductive element 100 can be selected from one of the above magnetic sensing elements 110a, 110b, and 110c.

FIG. 3A is a schematic cross-sectional view of an inductor element according to another embodiment of the present invention. Please refer to FIG. 3A , the inductance element 300 of this embodiment is similar to the inductance element 100 shown in FIGS. 1A to 1C . For example, the inductance element 300 also includes a magnetic sensing element 310, and the magnetic sensing element 310 is one of the aforementioned magnetic sensing elements 110a, 110b, and 110c. However, there are some differences between the casing 250 , the medium 240 and the circuit substrate 320 of the inductance element 300 and the casing 150 , the medium 140 and the circuit substrate 120 of the foregoing embodiments, and these differences will be described in detail below. As for the same features of the inductance elements 300 and 100 , they will not be repeated in principle and are shown in FIG. 3A .

Different from the previous embodiment shown in FIG. 1A, in the inductance element 300, the medium 240 has only one filling material, and the medium 240 can be a gas material, a solid material or a liquid material, wherein the medium 240 can be the material shown in FIGS. 1A to 1C. Examples of elastic glue, insulating oil or filling gas. In addition, the medium 240 can fill the cavity (not shown in FIG. 3A ) formed between the housing 250 and the circuit substrate 320 , that is, one of elastic glue, insulating oil and filling gas can fill the cavity. In addition, the single-material dielectric 240 of this embodiment can be replaced with the dielectric 140 of the previous embodiment, that is, the dielectric 140 of the inductance element 100 can only have a single filling material.

The casing 250 includes a shell portion 251 and a conductive film 252 , wherein the conductive film 252 is attached to the shell portion 251 , and the shell portion 251 covers the magnetic sensing element 310 and the conductive wire 130 , and forms the cavity between the circuit board 320 and the circuit board 320 . In this embodiment, the conductive film 252 is coated on the outer surface of the shell portion 251 , as shown in FIG. 3A . The conductive film 252 can be a metal film, which can be formed by sputtering, sputtering, electroless plating or electroplating. By using the conductive film 252 , the casing 150 can resist electromagnetic waves (EMR), so as to reduce the influence of electromagnetic interference (EMI) on the operation of the inductance element 300 . In addition, in other embodiments, the conductive film 252 can cover the inner surface of the shell portion 251 , or cover both the inner and outer surfaces. In this way, the effect of reducing electromagnetic interference can also be achieved. In addition, both the shell portion 251 and the casing 150 can be made of the same material.

It should be noted that, in this embodiment, since the medium 240 only has a single filling material, that is, the medium 240 is formed by a single material, such as the above-mentioned elastic glue or filling gas, so the medium 240 is Under the condition of being formed by elastic glue or filling gas, the medium 240 can be filled in the housing 250 before the housing 250 is disposed on the circuit substrate 320 . For example, elastic glue is formed in the casing 250 first. Afterwards, the housing 250 is disposed on the circuit substrate 320 to seal the medium 240 in the housing 250 . Therefore, even though the housing 250 does not have any opening, the medium 240 can be filled in the cavity. Furthermore, housing 250 may be replaced with housing 150 in FIG. 1A .

The structure of the circuit substrate 320 is similar to that of the circuit substrate 120 . However, there is still a structural difference between the circuit substrate 320 and the circuit substrate 120 in that the circuit substrate 320 also includes the protection layer 129 . In detail, the protection layer 129 covers the wiring 124t and the plane 122s of the insulation layer 122 , and the magnetic sensing element 310 is fixed on the protection layer 129 . For example, the magnetic sensing element 310 can be fixed on the protective layer 129 by using the insulating bonding layer 160 or other methods, and the other methods mentioned above can be screw locking, buckle or rivet.

As mentioned above, the protection layer 129 may be a solder mask, and has openings 129h exposing the connection pads 124p. In this embodiment, the protection layer 129 may partially cover the connection pad 124p, so the structure between the protection layer 129 and the connection pad 124p may be a solder mask defined (Solder Mask Defined, SMD). However, in other embodiments. The protection layer 129 can completely expose the connection pad 124p without covering or touching the connection pad 124p, that is, the structure between the protection layer 129 and the connection pad 124p can be defined as a Non-Solder Mask Defined (NSMD).

It should be noted that the circuit substrate 320 of this embodiment can be applied to the inductance element 100 in FIG. 1A , that is, the circuit substrate 320 can be replaced with the circuit substrate 120 in FIG. 1A . In addition, in the circuit substrates 120 and 320 disclosed in the above figures, although the circuit structure of the circuit substrates 120 and 320 only shows the traces 124t, the conductive pillars 128, the connection pads 124p and the external pads 126, in other embodiments , the circuit structures of the circuit substrates 120 and 320 may further include other circuits. For example, the circuit substrate 120 or 320 may be a carrier for a System in Package (SiP), so the circuit substrate 120 or 320 may have other circuits than the coil loop. Therefore, the utility model can not only be used to manufacture discrete inductance components, but also can be used to manufacture package components containing inductors (such as system-in-package components).

The above descriptions are only preferred feasible embodiments of the present utility model, and all equivalent changes and modifications made according to the present utility model shall fall within the scope of the present utility model.

Claims (13)

1. an inductance element is characterized in that, this inductance element comprises:

Sense magnetic spare;

Circuit base plate, comprise insulating barrier, many cablings and a plurality of connection gasket, wherein this insulating barrier has the plane, this sense magnetic spare is configured on this plane, these many cablings and this a plurality of connection gaskets are formed between this plane and this sense magnetic spare, and wherein respectively this cabling connects wherein two connection gaskets through this sense magnetic spare;

Many leads, respectively this lead strides across this sense magnetic spare and connects wherein two connection gaskets, and wherein these many cablings, these a plurality of connection gaskets and this many leads form the wire loop that is wound in this sense magnetic spare;

Housing is configured on this plane, and cover cap this sense magnetic spare and these many leads, wherein forms chamber between this housing and this circuit base plate; And

Medium is sealed in this chamber, and coats this sense magnetic spare and these many leads.

2. inductance element as claimed in claim 1 is characterized in that, this medium is elastic gum, insulating oil or blanketing gas.

3. inductance element as claimed in claim 1 is characterized in that, this medium comprises at least two packing materials, and the state of matter of one of them packing material is different from the state of matter of another packing material.

4. inductance element as claimed in claim 3 is characterized in that, one of them of this at least two packing material is elastic gum, insulating oil or blanketing gas.

5. inductance element as claimed in claim 1 is characterized in that, this inductance element also comprises at least one seal, and this housing has at least one opening, and wherein this at least one seal is filled this at least one opening.

6. inductance element as claimed in claim 1 is characterized in that, this housing is metal-back, plastic housing, ceramic case or fiber material shell.

7. inductance element as claimed in claim 1 is characterized in that, this housing comprises shell portion and conducting film, and wherein this conducting film is attached to this shell portion.

8. inductance element as claimed in claim 1 is characterized in that, this inductance element also comprises the insulation knitting layer that connects this sense magnetic spare, and should feel between magnetic spare and this many cablings at this by the insulation knitting layer.

9. inductance element as claimed in claim 1 is characterized in that, this circuit base plate also comprises protective layer, and this protective layer covers these many cablings, and exposes these a plurality of connection gaskets, and this sense magnetic spare is fixed on this protective layer.

10. inductance element as claimed in claim 1 is characterized in that, this circuit base plate also comprises at least two external connecting pads and at least two conductive poles, and respectively this conductive pole connects one of them external connecting pads and one of them connection gasket.

11. inductance element as claimed in claim 1, it is characterized in that, this sense magnetic spare be shaped as annular solid, and should center on collar extension by sense magnetic spare, the some of them connection gasket is positioned at this collar extension, and other this a plurality of connection gaskets are positioned at outside this collar extension, respectively this lead strides across this sense magnetic spare and connects one of them connection gasket that is positioned at this collar extension and one of them and be positioned at the outer connection gasket of this collar extension, and respectively this cabling connects one of them connection gasket that is positioned at this collar extension and one of them is positioned at this collar extension connection gasket outward through this sense magnetic spare, to form this wire loop.

12. inductance element as claimed in claim 11 is characterized in that, these a plurality of connection gaskets are two concentric circles and arrange along this sense magnetic spare.

13. inductance element as claimed in claim 11 is characterized in that, this annular solid is square frame body or ring body.

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