CN203219623U - Lamination stack plate structure of multilayer PCB (printed circuit board) - Google Patents
Lamination stack plate structure of multilayer PCB (printed circuit board) Download PDFInfo
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- CN203219623U CN203219623U CN 201320190681 CN201320190681U CN203219623U CN 203219623 U CN203219623 U CN 203219623U CN 201320190681 CN201320190681 CN 201320190681 CN 201320190681 U CN201320190681 U CN 201320190681U CN 203219623 U CN203219623 U CN 203219623U
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- thickness
- limit
- printed board
- multilayer printed
- multilayer
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- 238000003475 lamination Methods 0.000 title abstract 4
- 229910001018 Cast iron Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims 1
- 239000011162 core material Substances 0.000 claims 1
- 230000009970 fire resistant effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- -1 prepreg Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract 4
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000012797 qualification Methods 0.000 abstract 1
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Provided is a lamination stack plate structure of a multilayer PCB. The lamination stack plate structure comprises an upper separation plate, a lower separation plate and four thickness-limiting edge strips, wherein the four thickness-limiting edge strips are arranged at a front position, a back position, a left position and a right position on the lower separation plate respectively so that a thickness-limiting quadrangle is formed; a multilayer stack body for producing a multilayer PCB is arranged in the middle of the thickness-limiting quadrangle; and the upper separation plate is arranged on the multilayer stack body and the thickness-limiting quadrangle. With the lamination stack plate structure, the uniformity of the thickness of a laminated multilayer PCB is substantially improved, the qualification rate of products is enhanced, and problems are solved that in the prior art the thickness of a multilayer PCB is abnormal due to the effect of an out-of-flatness and horizontally inclined heat disc.
Description
Technical field
The utility model relates to the manufacturing field of printed board, is specially a kind of pressing laminate structure of multilayer printed board.
Background technology
Along with development of electronic technology, at a high speed, multi-functional, big capacity and portable low consumption be the developing direction of electronic product, the application of multilayer printed board more and more widely, its number of plies and density are also more and more higher, corresponding structure also becomes increasingly complex.
So-called multilayer printed board be by the conductive pattern layer more than three layers with the alternately and printed board that form bonding through pressing of insulation material layer, and the interlayer conductive pattern that reaches the designing requirement defined interconnects.It has characteristics such as packaging density height, volume are little, in light weight, reliability height, is output value class printed board (PCB) product high, the most with the fastest developing speed.
The pressing technology of so-called multilayer printed board, be that (prepreg is by after the glass cloth epoxy resin-impregnated to the characteristic of utilizing prepreg, dry by the fire a kind of flaky material that removes solvent wherein and make), melt at a certain temperature, become liquid and place, pattern filling space, form insulating barrier, further heating is progressively solidified it then, form stable insulating material, simultaneously each each layer of circuit is connected into the multilayer printed board of an integral body.
The quality control of multilayer printed board, comprise thickness of slab uniformity, plate warpage, Copper Foil fold, foreign matter, internal layer bubble, the protruding dew of weavy grain and internal layer skew etc., wherein the thickness of slab uniformity is the major defect that causes the multi-layer sheet product rejection, its ratio of scrapping that causes downstream encapsulation client is the main cause that causes product percent of pass lower up to more than 20%.The thickness of slab uniformity is because multilayer printed board enclose pattern design is inhomogeneous and press apparatus levelness and evenness are bad, causes plate pressing thickness to exceed 10% of design load.
At present, vacuum pressing-combining machine is all adopted in the pressing of multilayer printed board, and its structure is two parallel heat dishes (flat boards), generally adopts the conduction oil media, gives multilayer printed board with heat by padded coaming (as brown paper etc.) conduction.And because the fluctuation of the levelness of the heat dish of vacuum pressing-combining machine and evenness directly have influence on the quality of pressing, existing technology adopts the method for regularly carrying out horizontal alignment and mechanical grinding to solve this influence that unusually product pressing quality is caused.Though above-mentioned this method can satisfy general requirement, but all can't satisfy for top grade, the weak point of high-precision multilayer printed board, little, light, thin quality requirements, the thickness deviation that a lot of assembling producer has all required multilayer printed board is in 5% scope, and particularly electronic product such as intelligent touch-screen mobile phone is having strict requirement aspect the thickness evenness of wiring board, the planarization.Therefore, existing pressing technology can't satisfy the technical development demand that changes day by day on this problem.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of pressing laminate structure of multilayer printed board, utilize this pressing laminate structure can accurately control multi-layer sheet pressing thickness, improve the qualification rate of product, quality problem such as unusual, protruding dew of internal glass fibers of gummosis in the time of can also solving lamination, that can avoid that subsequent handling causes because panel thickness is inhomogeneous scraps, and does not bore as blind hole etc.
The technical problem that the utility model solves realizes by the following technical solutions:
A kind of pressing laminate structure of multilayer printed board comprises separating plate, following separating plate and four limit webbing bars, and described four limit webbing bars form the thick quadrangle of limit by being placed on down up and down on the separating plate; Multilayer stack for the preparation of multilayer printed board is placed on the thick tetragonal centre of limit, and last separating plate is arranged on multilayer stack and the thick quadrangle of limit top.
As preferred version of the present utility model, described multilayer stack is undertaken by many core materials, prepreg, Copper Foil that contraposition is stacked to be formed.
As the further preferred version of the utility model, described limit webbing bar is the cuboid that circular arc chamfering design is all done at six angles, avoids causing behind each corner impact the variation of thickness; The thickness of limit webbing bar is identical with the pressing thickness of multilayer printed board, and limit webbing bar is provided with plurality of specifications, and the thickness of all size increases progressively according to 10 μ m, can satisfy the requirement of the thickness deviation 5% of multilayer printed board, and limit webbing bar can repeatedly recycle.
As the utility model preferred version further, the making material of described limit webbing bar is fire resistant resin or cast iron.
Compared with prior art, the utlity model has following advantage:
The utility model is by arranging four limit webbing bars, it is fashionable to carry out high-temperature high-pressure in multilayer printed board, originally do not bear press pressure, when multilayer stack thickness is filled into when consistent with the thickness edge strip by gummosis, limit webbing bar begins to bear press pressure, and play restriction multilayer stack and continue gummosis, reach the thick effect of limit to the multilayer stack.Therefore, this multilayer printed board compression method increases substantially the thickness evenness after the multilayer printed board pressing, improve the qualification rate of product, and solved the out-of-flatness of prior art medium heat disk own and horizontal tilt, and influence the problem of multilayer printed board thickness abnormity.
Description of drawings
Fig. 1 is multilayer printed board lamination lamination schematic cross-section;
Fig. 2 is multilayer printed board lamination lamination vertical view.
Embodiment
Be described further below in conjunction with accompanying drawing and preferred implementation of the present utility model.
As shown in Figure 1, 2, a kind of pressing laminate structure of multilayer printed board comprises separating plate 2, following separating plate 3 and four limit webbing bars 4, and described four limit webbing bars 4 form the thick quadrangle of limit by being placed on down up and down on the separating plate 3; Multilayer stack 1 for the preparation of multilayer printed board is placed on the thick tetragonal centre of limit, and last separating plate 2 is arranged on multilayer stack and the thick quadrangle of limit top.
Described multilayer stack 1 is undertaken by many core materials, prepreg, Copper Foil that contraposition is stacked to be formed.Described limit webbing bar 4 is the cuboid that circular arc chamfering design is all done at six angles, avoids causing behind each corner impact the variation of thickness; The thickness of limit webbing bar 4 is identical with the pressing thickness of multilayer printed board, and limit webbing bar is provided with plurality of specifications, and the thickness of all size increases progressively according to 10 μ m, can satisfy the requirement of the thickness deviation 5% of multilayer printed board, and limit webbing bar can repeatedly recycle.The making material of described limit webbing bar 4 is fire resistant resin or cast iron.
The utility model is by arranging four limit webbing bars, it is fashionable to carry out high-temperature high-pressure in multilayer printed board, originally do not bear press pressure, when multilayer stack thickness is filled into when consistent with the thickness edge strip by gummosis, limit webbing bar begins to bear press pressure, and play restriction multilayer stack and continue gummosis, play the thick effect of limit to the multilayer stack, after cooling annealing, its thickness of formed multilayer printed board is all uniformly, and be consistent with limit webbing bar thickness, and with batch multilayered printed plate thickness also all identical.Therefore, this multilayer printed board compression method increases substantially the thickness evenness after the multilayer printed board pressing, improve the qualification rate of product, and solved the out-of-flatness of prior art medium heat disk own and horizontal tilt, and influence the problem of multilayer printed board thickness abnormity.
In addition; need to prove, the specific embodiment described in this specification, its each several part titles etc. can be different; allly conceive equivalence or the simple change that described structure, feature and principle are done according to the utility model patent, be included in the protection range of the utility model patent.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment; only otherwise depart from structure of the present utility model or surmount the defined scope of these claims, all should belong to protection range of the present utility model.
Claims (4)
1. the pressing laminate structure of a multilayer printed board is characterized in that: comprise separating plate, following separating plate and four limit webbing bars, limit the webbing bars by being placed on down up and down on the separating plate, form the thick quadrangle of limit for described four; Multilayer stack for the preparation of multilayer printed board is placed on the thick tetragonal centre of limit, and last separating plate is arranged on multilayer stack and the thick quadrangle of limit top.
2. the pressing laminate structure of multilayer printed board according to claim 1 is characterized in that: described multilayer stack is undertaken by many core materials, prepreg, Copper Foil that contraposition is stacked to be formed.
3. the pressing laminate structure of multilayer printed board according to claim 1 is characterized in that: described limit webbing bar is the cuboid that the circular arc chamfering design is all done at six angles; The thickness of limit webbing bar is identical with the pressing thickness of multilayer printed board, and limit webbing bar is provided with plurality of specifications, and the thickness of all size increases progressively according to 10 μ m.
4. according to the pressing laminate structure of claim 1 or 3 described multilayer printed boards, it is characterized in that: the making material of described limit webbing bar is fire resistant resin or cast iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320190681 CN203219623U (en) | 2013-04-16 | 2013-04-16 | Lamination stack plate structure of multilayer PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320190681 CN203219623U (en) | 2013-04-16 | 2013-04-16 | Lamination stack plate structure of multilayer PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203219623U true CN203219623U (en) | 2013-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320190681 Expired - Fee Related CN203219623U (en) | 2013-04-16 | 2013-04-16 | Lamination stack plate structure of multilayer PCB (printed circuit board) |
Country Status (1)
| Country | Link |
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| CN (1) | CN203219623U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN106984478A (en) * | 2017-03-29 | 2017-07-28 | 王文潮 | A kind of production technology and corollary equipment for being used to control copper-clad plate gummosis |
| CN113795093A (en) * | 2021-08-31 | 2021-12-14 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode and anode copper plates |
-
2013
- 2013-04-16 CN CN 201320190681 patent/CN203219623U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN103209550B (en) * | 2013-04-16 | 2015-10-21 | 汕头超声印制板（二厂）有限公司 | A kind of pressing laminate structure of multilayer printed board and the control method of pressing thickness |
| CN106984478A (en) * | 2017-03-29 | 2017-07-28 | 王文潮 | A kind of production technology and corollary equipment for being used to control copper-clad plate gummosis |
| CN106984478B (en) * | 2017-03-29 | 2022-12-06 | 王文潮 | Production process and matched equipment for controlling glue flowing of copper-clad plate |
| CN113795093A (en) * | 2021-08-31 | 2021-12-14 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode and anode copper plates |
| CN113795093B (en) * | 2021-08-31 | 2023-08-04 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode-anode copper plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20150416 |
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| EXPY | Termination of patent right or utility model |