CN203205541U - Dual-mode single-feed antenna - Google Patents

Abstract

The utility model discloses a bimodulus list is presented antenna, include: a chip antenna and a substrate. The chip antenna comprises a carrier, a first radiator, a second radiator, an electrode part, an electric connection part and a pattern layer, wherein the first radiator, the second radiator, the electrode part, the electric connection part and the pattern layer are arranged inside and outside the carrier. The first radiator is adjusted to control the impedance, resonance frequency, bandwidth and radiation effect of the 5GHZ frequency band. And, the coupling area and the coupling distance of the coupling relation between the first radiator and the second radiator form two coupling capacitors which are mutually matched and adjusted to control the 2.45GHZ frequency band, thereby achieving the preset target impedance, resonance frequency, frequency width and radiation effect and effectively reducing the size of the antenna.

Description

Dual Mode Single Feed Antenna

technical field

The utility model relates to an antenna, especially a dual-mode single-feed antenna for IEEE 802.11a/b/g/n/ac (2.4~2.5GHz & 5.15~5.85GHZ) frequency bands.

Background technique

It is known that current personal portable electronic devices, such as smart phones, tablet computers, notebook computers, personal mobile assistant devices, digital music players and navigation devices, all have wireless area network antennas (wifi or bluetooth), GPS And FM antenna, to provide users with wireless base stations in public places, companies or homes, through the wireless area network antenna to connect to the wireless base station to use or transmit data on the Internet, navigate or use the FM antenna to receive FM radio programs .

Since the wireless area network antennas, GPS and FM antennas used on portable electronic devices are all designed as a single body or integrated with other antennas, these antennas all have a given volume. When the antenna is installed inside the portable electronic device, it will occupy the installation space inside the portable electronic device, so that the appearance and shape of the portable electronic device cannot be reduced.

At present, when many portable electronic devices are designed to be thin, light and small, antennas of various frequency bands will be integrated together to form a multi-frequency antenna or broadband antenna. This multi-frequency antenna or broadband antenna is installed on a When the portable electronic device is inside, although it will not occupy the internal space of the portable electronic device, there are multiple signal feed-in terminals on the multi-frequency antenna or broadband antenna, and each signal feed-in terminal must be electrically connected to a coaxial cable. As a result, if the number of coaxial cables is too large, it will cause difficulty in the internal wiring of the portable electronic device, and will also affect the heat dissipation of the internal electronic components, resulting in difficulties in the installation of the portable electronic device and the antenna.

Utility model content

Therefore, the main purpose of this utility model is to solve the traditional deficiencies. After the utility model integrates antennas of different frequency bands, when antennas of different frequency bands are used, a single signal feed-in line is shared, so that the antenna can be installed and wired Better easy and simple. Moreover, different frequency bands are controlled by the coupling relationship between the two radiators to achieve predetermined target impedance, resonant frequency, bandwidth and radiation effect, and the size of the antenna can be effectively reduced.

In order to achieve the above purpose, the utility model provides a dual-mode single-feed antenna, including a chip antenna and a substrate,

The chip antenna includes:

A carrier having at least one top surface, one bottom surface and two side surfaces;

a first radiator, located inside the left side of the carrier;

A second radiator, located inside the right side of the carrier, above the first radiator and adjacent to the top surface of the carrier, the first radiator and the second radiator are in a parallel overlapping coupling relationship;

an electrical connection part electrically connected with the first radiator and the second radiator;

An electrode part is arranged on the bottom surface of the carrier and electrically connected with the electrical connection part;

The substrate is electrically connected to the chip antenna, and the front surface of the substrate has a ground metal layer and a first hollow part, and a second hollow part extends from one side of the first hollow part, and a first contact is provided on the first hollow part There is a signal feed-in line segment adjacent to the first contact, and the signal feed-in line segment extends in the second hollow portion, and a second contact electrically connected to the ground metal layer is adjacent to the signal feed-in line segment.

Wherein, the carrier is a rectangle formed of multilayer ceramic substrates or glass fiber plates.

Wherein, the first radiator and the second radiator are made of sheet metal, the first radiator has a first end and a second end, and the second radiator has a third end and a fourth end.

Wherein, the first radiator and the second radiator are partially parallel and overlappingly coupled, so that the third end of the second radiator is opposite to the first end of the first radiator.

Wherein, the electrode part includes a first electrode part, a second electrode part and a third electrode part, so that the chip antenna can be surface-bonded on the substrate.

Wherein, the electrical connection portion includes a first electrical connection portion, a second electrical connection portion and a third electrical connection portion; the first electrical connection portion and the second electrical connection portion are electrically connected to the first radiator And the first electrode part and the second electrode part, the third electrical connection part electrically connects the second radiator and the third electrode part.

Wherein, a pattern layer is also included, which is arranged on the top surface of the carrier.

Wherein, the signal feeding line segment has a first metal line segment and a second metal line segment extending in the second hollow part, and the distance between the first metal line segment and the second metal line segment forms a first matching circuit.

Wherein, the second metal wire segment of the signal feed-in wire segment is electrically connected with a coaxial cable.

The utility model can control the first frequency band impedance, resonant frequency, bandwidth and radiation effect by adjusting the first radiator. And use the coupling area and coupling distance of the coupling relationship between the first radiator and the second radiator to form two coupling capacitances that are coordinated and modulated to control the second frequency band to achieve the predetermined target impedance, resonant frequency, frequency Width and radiation effect, and can effectively reduce the size of the antenna.

Description of drawings

FIG. 1 is a three-dimensional schematic diagram of the appearance of the dual-mode single-feed antenna of the present invention.

Fig. 2 is a schematic side sectional view of the dual-mode single-feed antenna of the present invention.

FIG. 3 is a schematic front view of the substrate of the present invention.

FIG. 4 is a schematic diagram of the combination of the substrate and the chip antenna of the present invention.

Fig. 5 is a partially enlarged schematic diagram of the utility model.

6 is a schematic diagram of the reflected power ratio curve of the 2.45GHZ and 5GHZ dual-mode single-feed antenna of the present invention when the signal feed line end of the chip antenna is not grounded.

7 is a schematic diagram of the reflected power ratio curve of the 2.45GHZ and 5GHZ dual-mode single-feed antenna of the present invention when the signal feed line of the chip antenna is not grounded and the signal feed line has a coupling capacitance.

Symbol Description:

Chip Antenna 10 Carrier 1

Top 11 Bottom 12

Side 13 First Radiator 2

First end 21 Second end 22

Second Radiator 3 Third End 31

The fourth end part 32 electrode part 4

First electrode part 41 Second electrode part 42

The third electrode part 43 Electrical connection part 5

First electrical connection part 51 Second electrical connection part 52

The third electrical connection part 53 pattern layer 6

Substrate 7 Ground metal layer 71

The first hollow part 72 The second hollow part 73

The first contact 74 Signal feed line segment 75

The first metal line segment 751 The second metal line segment 752

Matching circuit 76 pitch 761

The second contact 77.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the utility model and implement it, but the examples given are not intended to limit the utility model.

Please refer to FIG. 1 and FIG. 2 , which are three-dimensional and side-sectional diagrams of the dual-mode single-feed antenna of the present invention, respectively. As shown in the figure: the chip antenna 10 of the dual-mode single-feed antenna of the present invention includes: a carrier 1, a first radiator 2, a second radiator 3, an electrode part 4, and an electrical connection part 5 and a pattern layer 6 .

The carrier 1 is a rectangular semiconductor chip antenna composed of multi-layer ceramic substrates or glass fiber boards, and at least has a top surface 11 , a bottom surface 12 and two side surfaces 13 .

The first radiator 2 is made of a sheet metal material and is disposed inside the left side of the carrier 1 . The first radiator 2 has a first end 21 and a second end 22 .

The second radiator 3 is made of a sheet metal material and is located inside the right side of the carrier 1 above the first radiator 2 and adjacent to the top surface 11 of the carrier 1 . The second radiator 3 has a third end portion 31 and a fourth end portion 32 . The first radiator 2 and the second radiator 3 are partly in a parallel overlapping coupling relationship, so that the third end 31 of the second radiator 3 is opposite to the first end 21 of the first radiator 2 .

The electrode portion 4 is made of metal and is disposed on the bottom surface 12 of the carrier 1 . The electrode portion 4 includes a first electrode portion 41 , a second electrode portion 42 and a third electrode portion 43 . The first electrode portion 41 , the second electrode portion 42 and the third electrode portion 43 allow the chip antenna 10 to be surface-bonded on a substrate (not shown).

The electrical connection portion 5 is made of metal and is disposed inside the carrier 1 . The electrical connection portion 5 includes a first electrical connection portion 51 , a second electrical connection portion 52 and a third electrical connection portion 53 . The first electrical connection part 51 and the second electrical connection part 52 are electrically connected to the first radiator 2 and the first electrode part 41 and the second electrode part 42 . The third electrical connection portion 53 is electrically connected to the second radiator 3 and the third electrode portion 43 .

The pattern layer 6 is arranged on the top surface 11 of the carrier 1 , and the pattern layer 6 can be printed with patterns of antenna models and company trademarks.

A 2.45GHZ and 5GHZ dual-mode single-feed antenna is formed by using the above-mentioned first radiator 2 and the second radiator 3 . By adjusting the first radiator 2, the impedance, resonance frequency, bandwidth and radiation effect of the 5GHZ frequency band are controlled. And with the coupling area and coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3, two coupling capacitors are formed to cooperate and modulate each other to control the 2.45GHz frequency band to achieve the predetermined target impedance and resonance Frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.

Please refer to FIG. 3 to FIG. 5 , which are the front side of the substrate, the combination of the substrate and the chip antenna, and partially enlarged schematic diagrams of the present invention, respectively. As shown in the figure: when the chip antenna 10 of the present invention is in use, the chip antenna 10 is electrically connected to a substrate 7 with a clearance area for illustration.

The front surface of the substrate 7 has a ground metal layer 71 and a first hollow portion 72 , and a second hollow portion 73 extends from one side of the first hollow portion 72 . The first hollow part 72 has a first contact point 74 adjacent to the first contact point 74 is a signal feed line segment 75 , and the signal feed line segment 75 has a first metal line segment 751 extending from the second hollow part 73 and a second metal line segment 752 , the distance 761 between the first metal line segment 751 and the second metal line segment 752 forms a first matching circuit 76 . In addition, adjacent to the signal feed line segment 75 is a second contact 77 electrically connected to the ground metal layer 71 .

When the chip antenna 10 is electrically connected to the substrate 7, the first electrode portion 41 of the electrode portion 4 is electrically connected to the first contact point 74 in an ungrounded state, and the second electrode portion 42 is electrically connected to the The signal is fed into the line segment 75 , and the third electrode portion 43 is electrically connected to the second contact 77 .

And the second metal line segment 752 of the signal feed-in line segment 75 is electrically connected with a coaxial cable (not shown in the figure), and when the antenna receives or transmits a signal, the coaxial cable transmits the signal to the signal feed-in line. The line segment 75, or the signal feed line segment 75 is passed to the coaxial cable.

By adjusting the first radiator 2, the impedance, resonance frequency, bandwidth and radiation effect of the 5GHZ frequency band are controlled. And with the coupling area and coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3, two coupling capacitors are formed to cooperate and modulate each other to control the 2.45GHz frequency band to achieve the predetermined target impedance and resonance Frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.

Please refer to FIG. 6 , which is a schematic diagram of the reflected power ratio curve of the 2.45GHZ and 5GHZ dual-mode single-feed antenna of the present invention when the signal feed line end of the chip antenna is not grounded. As shown in the figure: Δ1 frequency is -5.0054dB at 2.4999GHZ, Δ2 frequency is -9.7014dB at 4.3563GHZ, and Δ3 frequency is -9.8376dB at 6.2751GHZ.

Please refer to Figure 7, which is a schematic diagram of the reflected power ratio curve of the 2.45GHZ and 5GHZ dual-mode single-feed antenna of the present invention under the condition that the signal feed-in line section of the chip antenna is not grounded and the signal signal feed-in line section has a coupling capacitor. . As shown in the figure: Δ1 frequency is -14.721dB at 2.6271GHZ, Δ2 frequency is -7.1994dB at 5.014GHZ, and Δ3 frequency is -8.0845dB at 6.3509GHZ.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims.

Claims (9)

1. a bimodulus list feed antenna comprises a wafer antenna and a substrate,

This wafer antenna comprises:

One carrier has an end face, a bottom surface and two side faces at least on it;

One first radiant body, the left side of being located at this carrier is inner;

One second radiant body is located at this inside, carrier right side and is positioned at above this first radiant body and the end face of this carrier of neighbour, and this first radiant body is parallel overlapping coupled relation with this second radiant body;

One electrical connection section is electrically connected with this first radiant body and this second radiant body;

One electrode part is located on the bottom surface of this carrier and is electrically connected with this electrical connection section;

This substrate and wafer antenna are electrically connected, have a ground metal layer and one first hollow-out parts on the substrate front side, one side of this first hollow-out parts is extended with one second hollow-out parts, has one first contact on this first hollow-out parts, this first contact is adjacent a signal feed-in line segment, this signal feed-in line segment lies along in this second hollow-out parts, in addition in this signal feed-in line segment is adjacent second contact that is electrically connected with this ground metal layer is arranged.

2. bimodulus list feed antenna as claimed in claim 1 is characterized in that, this carrier is the ceramic substrate of multilayer or the rectangle that glass mat consists of.

3. bimodulus list feed antenna as claimed in claim 2, it is characterized in that, this first radiant body and the second radiant body are the metal material of plates, have a first end and a second end on this first radiant body, have one the 3rd end and one the 4th end on this second radiant body.

4. bimodulus list feed antenna as claimed in claim 3 is characterized in that, this first radiant body and this second radiant body make the 3rd end of this second radiant body and the first end of this first radiant body be setting in the other direction with the overlapping coupling of partial parallel.

5. bimodulus list feed antenna as claimed in claim 4 is characterized in that, this electrode part comprises one first electrode part, one second electrode part and a third electrode section, for wafer antenna can surface mount on this substrate.

6. bimodulus list feed antenna as claimed in claim 5 is characterized in that, this electrical connection section includes one first electrical connection section, one second electrical connection section and one the 3rd electrical connection section; This first electrical connection section and this second electrical connection section are electrically connected this first radiant body and this first electrode part and this second electrode part, and the 3rd electrical connection section is electrically connected this second radiant body and this third electrode section.

7. bimodulus list feed antenna as claimed in claim 6 is characterized in that, also includes a patterned layer, is located on the end face of this carrier.

8. bimodulus list feed antenna as claimed in claim 7, it is characterized in that, this signal feed-in line segment has one first metal wire sections and one second metal wire sections that extends this second hollow-out parts, and the spacing between this first metal wire sections and this second metal wire sections forms one first match circuit.

9. bimodulus list feed antenna as claimed in claim 8 is characterized in that, the second metal wire sections of this signal feed-in line segment is electrically connected with a coaxial cable line.

Images