CN203197518U - Single crystal diamond tool - Google Patents

Abstract

The utility model relates to a single crystal diamond tool, which includes: a metal holding body including a groove provided on the top; a cutting part accommodated in the groove, and the cutting part is composed of a It consists of single crystal diamond and a metal bonding layer, wherein the metal bonding layer forms carbide with the surface of the single crystal diamond; and a solder alloy layer is welded between the inner section of the groove and the metal bonding layer. . Accordingly, the single crystal diamond tool prepared by the present invention using single crystal diamond with smaller particle size can solve the known problem of poor gloss of the workpiece being processed due to the known polycrystalline diamond containing chromium.

Description

Single Crystal Diamond Tools

technical field

The utility model relates to a diamond cutting tool, in particular to a single crystal diamond cutting tool. the

Background technique

In recent years, due to the vigorous development of the semiconductor industry, various tools using superabrasives, such as grinding tools and cutting tools, have been widely used in the semiconductor industry because they meet the fineness requirements of semiconductor products. the

Among the known superabrasives, polycrystalline diamond is most commonly used in the above-mentioned tools because of its relatively large particle size, which makes it easy to adhere to tools in various ways. However, because polycrystalline diamond often contains chromium (Cr), using tools made of it to process workpieces often leads to poor gloss of the processed workpieces, making the workpieces need to be re-polished after grinding, cutting and other processes; In addition, the general artificial polycrystalline diamond particles are mainly formed by growing the seed crystal, catalyst and carbon raw material layer under high temperature and high pressure equipment (HTHP) after a long period of grain growth. The preparation time is long and the cost is high. Therefore, it is an urgent development direction to use artificial single crystal diamond with shorter preparation time and lower production cost to manufacture the required cutting tools. Although it can be considered to manufacture the required cutting tools with chromium-free single crystal diamond, however, Limited by the size of single crystal diamond, the service life of cutting tools made of single crystal diamond is often lower than that of tools made of polycrystalline diamond, which is not in line with the consideration of manufacturing cost. Therefore, it is necessary to develop a cutting tool made of single crystal diamond, which can overcome the above-mentioned shortcoming of service life. the

Accordingly, in the present utility model, the applicant utilizes a method that can improve the gripping force of the diamond, so that the single crystal diamond with a smaller particle size can be firmly fixed on the tool, and manufactures a superabrasive with single crystal diamond cutting tools, thereby overcoming the above-mentioned problems derived from the use of tools made of polycrystalline diamond. the

Utility model content

The main purpose of the utility model is to provide a single crystal diamond tool, which is to manufacture a cutting tool with single crystal diamond as a super abrasive by firmly fixing the single crystal diamond on the tool, so as to overcome the problem caused by polycrystalline diamond. Chromium leads to poor gloss of the processed workpiece and its derivative problems. the

In order to achieve the above object, the utility model provides a single crystal diamond tool, comprising: a metal holding body with a groove at the top; a cutting part is accommodated in the groove, and the cutting part is formed by a Composed of single crystal diamond and a metal bonding layer, wherein the metal bonding layer forms carbides with the surface of the single crystal diamond; and a solder alloy layer is welded between the inner section of the groove and the metal bonding layer . the

Wherein, the groove includes an accommodating portion and an opening, and the cross-sectional area of the opening is smaller than that of the accommodating portion. the

Wherein, the opening portion further includes a clamping portion for engaging and fixing the cutting portion in the groove. the

Wherein, the maximum side length of the single crystal diamond is 1 mm to 5 mm. the

Wherein, the metal holding body is a mold steel, tungsten steel, high hardness alloy steel, stainless steel or high carbon steel. the

Wherein, the metal bonding layer is at least one selected from the group consisting of titanium, vanadium, silicon, manganese, tungsten, molybdenum, zirconium, hafnium, vanadium, niobium, tantalum, protactinium and chromium. the

Wherein, the thickness of the metal bonding layer is 0.1 micron to 2 micron. the

Wherein, the metal bonding layer is formed on the surface of the single crystal diamond by physical deposition, chemical deposition, electroplating, sintering or spraying. the

Wherein, the metal holding body and the cutting part are combined by brazing at high temperature through a solder alloy layer, and the solder alloy layer is a nickel-based metal component. the

Wherein, a metallurgical bond or a chemical bond is formed between the single crystal diamond and the metal bonding layer, or a metallurgical bond or a chemical bond is formed between the solder alloy layer and the metal bonding layer. the

Wherein, the solder alloy layer is at least one selected from the group consisting of silver, iron, cobalt, nickel, copper, tin, zinc, titanium, chromium, manganese or aluminum, or alloys thereof. the

Wherein, the solder alloy layer further includes silicon, phosphorus or boron. the

Wherein, the thickness of the solder alloy layer is 1 micron to 20 microns. the

Among them, it also includes forming a carbide or titanium oxide on the contact surface between the single crystal diamond and the solder alloy layer. the

The beneficial effect of the utility model is that it can overcome the problem of poor luster of processed workpieces and its derivatives caused by polycrystalline diamond containing chromium. the

Description of drawings

In order to enable examiners to further understand the structure, features and purpose of the utility model, the following will be described in detail in conjunction with the accompanying drawings and preferred specific embodiments, where: 

Fig. 1A is a schematic diagram of a single crystal diamond tool according to the first embodiment of the present invention. the

Fig. 1B is a schematic perspective view of the top of the single crystal diamond tool in the first embodiment of the present invention. the

Fig. 2A is a schematic diagram of a single crystal diamond tool according to the second embodiment of the present invention. the

Fig. 2B is a cross-sectional view of the top of the single crystal diamond tool of the second embodiment of the present invention

Fig. 3A is a schematic perspective view of the top of the single crystal diamond tool according to the second embodiment of the present invention. the

Fig. 3B is a schematic perspective view of the top of the single crystal diamond tool according to the third embodiment of the present invention. the

4A to 4D are schematic diagrams of the manufacturing process of the single crystal diamond tool according to the second embodiment of the present invention. the

Detailed ways

In the known technology, although the cutting tool made of chromium-free single crystal diamond can maintain the glossiness of the workpiece compared with the cutting tool made of polycrystalline diamond. However, limited by the size of single crystal diamond, it is known that the service life of cutting tools made of single crystal diamond is often lower than that of tools made of polycrystalline diamond. Accordingly, the applicant proposes a single crystal diamond tool, through effective Improve the gripping force of the diamond, increase its service life, and then solve the problem of poor gloss of the processed workpiece in the known technology. the

In order to achieve the above object, the utility model provides a single crystal diamond tool, comprising: a metal holding body with a groove at the top; a cutting part is accommodated in the groove, and the cutting part is formed by a Composed of single crystal diamond and a metal bonding layer, wherein the metal bonding layer forms carbides with the surface of the single crystal diamond; and a solder alloy layer is welded between the inner section of the groove and the metal bonding layer . the

In the above-mentioned single crystal diamond tool of the present invention, the groove may include a housing portion and an opening, and the cross-sectional area of the opening is smaller than the cross-sectional area of the housing portion, and, in order to make the single crystal diamond In order to be firmly fixed in the groove, in an aspect of the present invention, the opening portion may further include a locking portion, so that the cutting portion can be engaged and fixed in the groove. the

In the above-mentioned single crystal diamond tool of the present invention, the size of the single crystal diamond is not particularly limited, as long as it can be properly accommodated in the above-mentioned groove, for example, the maximum side length of the single crystal diamond can be 1 mm to 5 mm. In addition, the material of the substrate is not particularly limited, any substrate material known in the art can be used, for example, the substrate can be a mold steel, tungsten steel, high hardness alloy steel, stainless steel or high carbon steel. the

Generally speaking, due to the high chemical inertness of diamond, it will appear to be quite stable when used in cutting tools. However, the contact angle between the general metal solder and diamond is very large, so that the diamond and the solder cannot be effectively attached, and the diamond cannot be wetted. Although the known technology tries various methods to make the solder effectively adhere to the polycrystalline diamond, however, single Crystalline diamond is limited by its small size and is not suitable in the manner used by known techniques. the

Accordingly, in the above-mentioned single crystal diamond tool of the present invention, the substrate and the cutting portion are brazed at high temperature through a solder alloy layer, and the solder alloy layer is a nickel-based metal component; in addition, in the single crystal A metallurgical bond or a chemical bond can be formed between the diamond and the metal bonding layer, or a metallurgical bond or a chemical bond can be formed between the solder alloy layer and the metal bonding layer, so that the cutting portion and the substrate are obtained The strong bond makes the cutting part firmly attached to the substrate. the

In the above-mentioned single crystal diamond tool of the present invention, the present invention does not particularly limit the composition of the metal bonding layer. However, considering that it needs to form a metallurgical bond or a chemical bond with the surface of single crystal diamond, the composition of the metal bonding layer can be at least one selected from titanium, vanadium, silicon, manganese, tungsten, molybdenum, zirconium, hafnium, vanadium, niobium , tantalum, protactinium, and chromium group. Similarly, the present invention does not particularly limit the composition of the solder alloy layer, as long as it can form a metallurgical bond or a chemical bond with the metal bonding layer by melting. For example, in one aspect of the present invention, at least one of the solder alloy layers can be selected from silver, iron, cobalt, nickel, copper, tin, zinc, titanium, chromium, manganese, aluminum, and alloys thereof group to better combine with the metal alloy layer. Furthermore, considering the convenience of the process, the composition of the solder alloy layer may further include silicon, phosphorus, boron, or similar components, so that the high temperature soldering process can melt the solder alloy layer at a lower temperature. More specifically, in a specific aspect of the present utility model, the solder alloy layer is nickel-chromium alloy (Ni-Cr), nickel-chromium-silicon-boron alloy (Ni-Cr-Si-B), or chromium-manganese-silicon-aluminum alloy (Cr-Mn-Si-Al). the

In addition, in an aspect of the present invention, the above-mentioned high-temperature brazing bonding of the substrate and the cutting portion can be heated to 900-1200° C. in a vacuum environment to make the solder alloy layer into a molten state, thereby achieving A metallurgical bond or a chemical bond is formed between the single crystal diamond and the metal bonding layer, and a metallurgical bond or a chemical bond is formed between the solder alloy layer and the metal bonding layer. Therefore, in the single crystal diamond tool of the present invention, according to the composition of the selected metal alloy layer and the solder alloy layer, it also includes forming a carbide or titanium oxide on the contact surface between the single crystal diamond and the solder alloy layer. , to improve the diamond holding force, to achieve the effect of fixing single crystal diamond. Specifically, in one aspect of the present utility model, the formed carbide or titanium compound can be titanium vanadium alloy (TiV), titanium chromium alloy (TiCr), titanium carbide (TiC), or titanium boride (TiB ). the

In the above-mentioned single crystal diamond tool of the present invention, the thickness of the metal bonding layer is not particularly limited, preferably, the thickness of the metal bonding layer may be 0.1 μm to 2 μm. In a specific aspect of the present invention, the thickness of the metal bonding layer can be 2 micrometers, so that the single crystal diamond can be firmly attached to the groove. In addition, the present invention does not particularly limit the method of coating the metal bonding layer. For example, the metal bonding layer can be formed on the single crystal by physical deposition, chemical deposition, electroplating, sintering, or spraying. diamond surface. In a specific aspect of the invention, the metal bonding layer is formed on the surface of the single crystal diamond by physical deposition. the

In the above-mentioned single crystal diamond tool of the present invention, the thickness of the solder alloy layer is not particularly limited, as long as it can be fully filled between the cutting part and the inner section of the groove, so as to fix the cutting part in the groove . For example, in one aspect of the present utility model, the thickness of the solder alloy layer can be 1 micron to 20 microns. Preferably, in a specific aspect of the present utility model, the thickness of the solder alloy layer can be to 10 microns. the

In the present invention, the term "wetting" means that the molten metal adheres to the superabrasive grains due to its surface tension, and can cause a chemical bond between the superabrasive grains and the molten metal. the

In this utility model, the term "metallurgical bond" refers to the bond between two or more metals, which can be simple mechanical locking or bonding between metals, such as: liquid metal or solid metal bonds formed between them; or, a chemical property such as ionic bonds that typically occur in metallic bonds. the

In the present utility model, the term "chemical bond" refers to the formation of molecular bonding force between atoms, so that a strong bond is formed between atoms. The chemical bond described in the present utility model, when occurring in diamond, is basically for carbon bonds. the

Hereinafter, the single crystal diamond tool of the present invention will be described in detail through various embodiments. the

Please refer to FIG. 1A , which is a schematic diagram of a single crystal diamond tool 1 according to the first embodiment of the present invention. The single crystal diamond tool 1 includes a metal holding body 11 ; and a cutting part 12 . Please also refer to FIG. 1B , which is an enlarged view of part A of FIG. 1A , showing a perspective view of the single crystal diamond tool 1 at the cutting portion 12 of the first embodiment. Therefore, as shown in FIGS. 1A and 1B, the single crystal diamond tool 1 of the first embodiment of the present invention includes a metal holding body 11 with a groove 111 at its top; a cutting portion 12 is accommodated in the groove. groove 111, and the cutting portion 12 is composed of a single crystal diamond 121 and a metal bonding layer 122, wherein the metal bonding layer 122 forms carbides with the surface of the single crystal diamond 121; and a solder alloy layer 13 is It is welded between the inner section 1111 of the groove 111 and the metal bonding layer 122 . In the first embodiment of the present utility model, the maximum side length of the single crystal diamond is 1 millimeter; the metal bonding layer 122 is titanium and its thickness is 0.1 micron; the solder alloy layer 13 is nickel-chromium alloy (Ni -Cr) solder powder, accordingly, at 1000°C, after high-temperature soldering treatment, the metal bonding layer 122 forms titanium carbide (TiC) with the surface of the single crystal diamond, and the metal bonding layer 122 and the solder alloy layer 13 is the formation of titanium chromium alloy (TiCr). Accordingly, the cutting part 12 composed of the single crystal diamond 121 can be firmly fixed on the metal holding body 11, and the single crystal diamond tool 1 of the first embodiment of the present invention is completed. the

Please refer to FIG. 2A , which is a schematic diagram of a single crystal diamond tool 2 according to the second embodiment of the present invention. The single crystal diamond tool 2 includes a metal holding body 2 ; and a cutting part 22 . Please also refer to FIG. 2B , which is an enlarged view of part B of FIG. 2A , showing a cross-sectional view of the single crystal diamond tool 2 at the cutting portion 22 of the second embodiment. As shown in Figures 2A and 2B, the single crystal diamond tool 2 of the second embodiment of the present invention includes a metal holding body 21 with a groove 211 at the top; a cutting portion 22 is accommodated in the groove 211, And the cutting part 22 is made up of a single crystal diamond 221 and a metal bonding layer 222, wherein, the metal bonding layer 222 forms carbide with the surface of the single crystal diamond 221; and a solder alloy layer 23 is welded on the Between the inner section 2111 of the groove 211 and the metal bonding layer 222 . the

Please refer to FIG. 3A , which is a perspective view of the top of the single crystal diamond tool 2 according to the second embodiment, more specifically showing that the cutting portion 22 is disposed in the groove 211 on the top of the substrate 21 . Please refer to FIGS. 4A to 4D , which are the manufacturing flowchart of the single crystal diamond tool according to the second embodiment of the present invention. First, as shown in FIGS. 4A and 4B, a metal bonding layer 222 is coated on the surface of a single crystal diamond 221 by physical deposition (for example, sputtering) to form a cutting portion 22. Here, the The metal bonding layer 222 is composed of titanium and has a thickness of about 2 microns. Then, please refer to FIG. 3A and FIG. 4C, a metal holding body 21 is provided, and the cutting portion 22 prepared above is arranged in the groove 211 at the top of the metal holding body 21, then, please refer to FIG. 4D, it is Fill the gap between the cutting portion 22 and the inner section 2111 of the groove 211 with nickel-chromium-silicon-boron alloy (Ni-Cr-Si-B) solder powder as the solder alloy layer 23, and then, in a vacuum environment, use a high-temperature soldering method Heating to 1000°C makes the solder alloy layer 23 form a molten state, and forms a chemical bond of titanium carbide (TiC) between the single crystal diamond 221 and the metal alloy layer 222, and the metal alloy layer 222 and the solder alloy layer 23 Form chemical bonds or metallurgical bonds between them, such as titanium chromium alloy (TiCr) or titanium boride (TiB). the

Accordingly, the cutting part 22 composed of the single crystal diamond 221 can be firmly fixed on the metal holding body 21, and the single crystal diamond tool 2 of the first embodiment of the present invention is completed. the

As mentioned above, the single crystal diamond tool of the present invention may further include a clamping portion at the opening of the groove to engage and fix the cutting portion. Please refer to FIG. 3B , which is a schematic perspective view of the top of the single crystal diamond tool 3 according to the third embodiment of the present invention. It is roughly the same as the second embodiment, except that the groove 311 on the top of the metal holding body 31 of the third embodiment also includes a clamping portion 313 at the opening 312 to engage and fix the cutting portion 32, Accordingly, during high-temperature welding and use, the cutting portion 32 of the third embodiment can be more firmly fixed in the groove 311 and not easy to fall off. In addition, in the third embodiment, the composition of the metal bonding layer 322 is titanium and vanadium, and is coated on the surface of the single crystal diamond 321 by arc deposition; and the composition of the solder alloy layer (not shown) is chromium Manganese-silicon-aluminum alloy (Cr-Mn-Si-Al), therefore, when the single crystal diamond tool 3 of this embodiment is welded at high temperature, the chemical bond of titanium carbide formed between the single crystal diamond 321 and the metal alloy layer 322 and Metallurgical bonding of titanium vanadium alloy (TiV); metallurgical bonding such as titanium chromium alloy (TiCr) is formed between the metal alloy layer 322 and the solder alloy layer. the

Accordingly, the cutting portion 32 composed of the single crystal diamond 321 can be firmly fixed on the metal holding body 31, and the single crystal diamond tool 3 of the third embodiment of the present invention is completed. the

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the utility model should be determined by the scope of the claims, rather than being limited to the above-mentioned embodiments. the

Claims (10)

1. a MONOCRYSTAL DIAMOND TOOLS is characterized in that, comprising:

One metal holder, a groove is arranged at its top;

A cutting part is placed in this groove, and this cutting portion is made up of a single-crystal diamond and a metal bonding layer, and wherein, the surface of this metal bonding layer and this single-crystal diamond forms carbide; And

One solder alloy layer is welded between the interior cross section and this metal bonding layer of this groove.

2. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, this groove comprises a holding part and a peristome, and the sectional area of this peristome is less than the sectional area of this holding part.

3. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 2, wherein, this peristome also comprises a holding section, it is to make this cutting portion be fastened on this groove.

4. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, the maximal side of this single-crystal diamond is 1 millimeter to 5 millimeters.

5. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, this metal holder is a die steel, wolfram steel, high hardness alloy steel, stainless steel or high-carbon steel.

6. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, the thickness of this metal bonding layer is 0.1 micron to 2 microns.

7. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, this metal bonding layer is to be formed at this single-crystal diamond surface by physical deposition method, chemical deposition, galvanoplastic, sintering process or spraying.

8. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1 wherein, forms a metallurgical bond or a chemical bonded refractory between this single-crystal diamond and this metal bonding layer, or forms a metallurgical bond or a chemical bonded refractory between this solder alloy layer and this metal bonding layer.

9. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1, wherein, the thickness of this solder alloy layer is 1 micron to 20 microns.

10. MONOCRYSTAL DIAMOND TOOLS as claimed in claim 1 wherein, also is included in contact-making surface formation monocarbide or the titaniferous compound of this single-crystal diamond and this solder alloy interlayer.

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