A kind of Denso structure of flat-panel monitor
Technical field
The utility model relates to electronic product production and encapsulation technology, relates in particular to a kind of Denso structure of flat-panel monitor.
Background technology
The connected mode of present flat-panel monitor and external devices mainly contains following several mode:
By covering brilliant film (COF, Chip On Flex), the connection of adhesive tape carrier encapsulation (TCP, Tape Carrier Package) chip.Under this kind connected mode, the packaged type of display driver chip is generally COF or TCP, and an end of chip is connected on the display base plate, and the other end is connected on printed circuit board (PCB) (PCB) or other external devices.
Connect by flexible PCB (FPC).For there being glass to cover the chip of encapsulation (COG, Chip On Glass) or the situation of chipless on the display base plate, be fit to be connected with printed circuit board (PCB) (PCB) or other external devices by FPC.
But above-mentioned connected mode can not solve the Denso structure problem of flat-panel monitor of the present utility model, and it is existing by zebra bus ways of connecting, there is difficulty of location during Denso, and because the irregular resistance that causes easily on the circuit of pressure is inhomogeneous, influences the defective of display effect.
The utility model content
In view of this, fundamental purpose of the present utility model is to provide a kind of Denso structure of flat-panel monitor, solves under the zebra bus connected mode, causes the inhomogeneous not good defective of display effect that causes of resistance on the circuit owing to pressure is irregular.
For achieving the above object, the technical solution of the utility model is achieved in that
A kind of Denso structure of flat-panel monitor mainly comprises peripheral components printed circuit board (PCB) (PCB) 1 and monitor body 2; Wherein, described monitor body 2 comprises folded mutually big sheet glass 22 and small pieces glass 21, the top of described big sheet glass 22 and small pieces glass 21 side one end in the same way is provided with the corresponding electrode in some positions, forms two-layer electrode, is respectively lead-in wire electrode 221 and is connected electrode 211; Described lead-in wire electrode 221 passes through lead 23 corresponding connections with connection electrode 211; Tie point 11 on described connection electrode 211 and the described peripheral components PCB1 is by 4 bonding linking to each other of conducting resinl.
Wherein: the lead 23 of the two-layer electrode of described connection is aluminum steel or alloy material.
The back side of described big sheet glass 22 is display surface.
Zone outside the connection electrode 211 of described small pieces glass 21 scribbles bonding agent 5.
The position of the tie point 11 on the described electrode area that scribbles conducting resinl 4 and the peripheral components PCB1 is corresponding one by one.
Be filled with protection glue 3 in described lead-in wire electrode 221 and the space that is connected between the electrode 211.
The Denso structure of flat-panel monitor provided by the utility model has the following advantages:
Adopt Denso structure of the present utility model, by binding lead at display, it is inhomogeneous and cause the not good problem of display effect to have solved circuitous resistance.Owing to be provided with the two-layer electrode by wire interconnects between the big sheet glass of display interior and the little sheet glass, utilize small pieces lead-in wire electrode on glass, be connected with external devices by the bonding realization display of conducting resinl, also have the encapsulation volume that reduces display and the packaging effect that is conducive to realize specific use.
Description of drawings
Fig. 1 is the packaging effect figure of the utility model flat-panel monitor;
Fig. 2 is the electrode synoptic diagram of the utility model flat-panel monitor;
Fig. 3 is the connection lead synoptic diagram of the utility model flat-panel monitor;
The display synoptic diagram that Fig. 4 makes for the utility model;
Fig. 5 is the mounting structure of the utility model flat-panel monitor.
[primary clustering/component symbol explanation]
1: peripheral components PCB
11: tie point
2: display
21: little sheet glass (cap)
211: connect electrode
22: big sheet glass
221: the lead-in wire electrode
222: display surface
23: lead
3: protection glue
4: conducting resinl
5: bonding agent.
Embodiment
Below in conjunction with accompanying drawing and embodiment of the present utility model this novel Denso structure is described in further detail.
Fig. 1 is the packaging effect figure of the utility model flat-panel monitor.As shown in Figure 1, this flat-panel monitor is guided to outside display by binding aluminum steel at display 2 with the internal connection line of display 2, and by conducting resinl 4 display 3 is linked to each other with peripheral components printed circuit board (PCB) (PCB) 1.By this connected mode, not only can solve and cause the not good problem of display effect because circuitous resistance is inhomogeneous.Also have the encapsulation volume that reduces display and the effect that realizes the encapsulation of specific use.
Fig. 2 is the electrode synoptic diagram of the utility model flat-panel monitor.As shown in Figure 2, realize encapsulating structure shown in Figure 1, must do same electrode at the small pieces glass 21 of display and namely connect electrode 211 that it is corresponding with the lead-in wire electrode 222 on the big sheet glass 22, and like this, described electrode will be divided into upper and lower two-layer.Its making step such as Fig. 3~shown in Figure 5, specific as follows:
Step 1: with the lead 23 described up and down two-layer electrode that connects one to one, namely connect electrode 211 and lead-in wire electrode 221, and utilize ultrasound wave to weld two-layer electrode up and down successively.Wherein, the lower floor that area is big slightly is big sheet glass 22, and the plane at its place is display surface 222, because upper electrode 211 on small pieces glass 21, can play encapsulation effect, therefore be called cap again, as shown in Figure 3, the described lead 23 that passes through between the two-layer electrode up and down welds.Described lead is made by aluminum steel or alloy material etc.
Step 2: the place is coated with conducting resinl 4 at described upper electrode, and all the other positions scribble bonding agent 5.Like this, save the PCB layer, greatly improved device architecture, as shown in Figure 4.
Step 3: behind the flip displays device 2, described display is installed in the ad-hoc location that peripheral supporting body is peripheral components PCB1, makes electrode corresponding with tie point 11 positions on the described PCB.As shown in Figure 5.
Step 4: mounted display lead-in wire place is filled with the moderate protection glue 3 of hardness.Its final installation effect as shown in Figure 1.
The above is preferred embodiment of the present utility model only, is not in order to limit protection domain of the present utility model.