CN203040098U - Vapor structure - Google Patents

Abstract

A temperature equalizing plate structure comprises: a first body, a second body, and a working fluid; the first body has a plurality of first channels and a plurality of second channels, wherein the first and second channels are interconnected; the second body has a third channel, the first and second bodies and the first, second, and third channels are interconnected and have a capillary structure and are filled with a working fluid. Through the design of the utility model, the first body can not only have uniform temperature heat transfer, but also can perform remote heat dissipation through the second body, thereby greatly improving the overall heat dissipation efficiency.

Description

Vapor structure

technical field

A vapor chamber structure, especially a vapor chamber structure with large-area uniform temperature conduction heat source and remote heat dissipation.

Background technique

As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Despite the ever-shrinking dimensions of the semiconductors forming electronic components, there is a continuing demand for increased performance.

As semiconductors shrink in size, the resulting heat flux increases. The heat flux increase creates challenges in cooling the product beyond just the overall heat increase, because the heat flux increase causes overheating at different times and at different length dimensions, which can lead to electronic failure or damage.

Therefore, in order to solve the problem of the above-mentioned known technology due to the narrow heat dissipation space, a VC (Vapor chamber) heat dissipation device (structure) is arranged above the chip (chip/body) for heat dissipation. In order to increase the capillary limit in the VC, Capillary structures such as copper columns, coating sintering, sintering columns, foaming columns, and supports with holes (gaps) are used to support as return channels, and the design of the above supports is mainly due to the thicker walls on the micro-uniform temperature plate and the lower wall. Thin (applied below 1.5mm), if there is no supporting body connecting the upper and lower walls, it may cause thermal expansion and cause failure.

The well-known vapor chamber is a kind of uniform heat conduction between surfaces. It mainly transfers heat evenly from the heating surface in contact with the heat source on one side to the condensation surface on the other side. It has a large area of heat conduction and fast heat conduction speed. and other advantages, but its disadvantage is that it cannot transfer heat to the remote side for heat dissipation. If the heat cannot be dissipated in a timely manner, it is easy to accumulate heat near the heat source. Therefore, this disadvantage is still the biggest disadvantage of the vapor chamber.

Utility model content

Therefore, in order to solve the shortcomings of the above-mentioned known technologies, the main purpose of the present utility model is to provide a vapor chamber structure that can improve heat dissipation efficiency.

To achieve the above purpose, the utility model provides a vapor chamber structure, the vapor chamber structure includes: a first body, a second body, and a working fluid;

The first body has a plurality of first channels and a plurality of second channels, the first and second channels communicate with each other, the second body has a third channel, the second body is connected to the first body, and The third channel communicates with the first and second channels, and the walls of the first, second and third channels have a capillary structure, and the working fluid is filled in the first and second bodies.

Specifically, the utility model provides a vapor chamber structure, comprising:

A first body has a plurality of first passages and a plurality of second passages, the first and second passages communicate with each other; a second body has a third passage, the second body is connected to the first body, so that The third channel communicates with the first and second channels, and the walls of the first, second and third channels have a capillary structure; a working fluid is filled in the first and second bodies.

Preferably, in the vapor chamber structure, the capillary structure is selected from any one of mesh body, fiber body, sintered powder body, and groove.

Preferably, in the vapor chamber structure, the first and second channels are connected vertically and alternately.

Preferably, in the vapor chamber structure, the first body is formed by extrusion.

Preferably, in the vapor chamber structure, the second body is a heat pipe.

Preferably, in the vapor chamber structure, the first body further has a first closed side and a second closed side, which are used to respectively close the two ends of the first channel.

Preferably, in the vapor chamber structure, the second body also has a first end and a second end, the first end is connected to the first body, and the second end is opposite to the first end. end direction extension.

Preferably, the vapor chamber structure further has a radiator connected to an end of the first body opposite to the second body.

Preferably, in the above vapor chamber structure, the second body also has a first end and a second end, and the first end and the second end are connected to the first body at the same time, and the first end There is also a conduction part between the first end and the second end of the two bodies, and the conduction part is connected with a radiator.

Through the utility model, the vapor chamber not only has a large-area heat transfer effect, but also has a remote heat transfer function, thereby greatly improving the overall heat dissipation effect of the vapor chamber.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the first embodiment of the structure of the uniform temperature plate of the present invention;

Fig. 2 is a combined sectional view of the first embodiment of the structure of the uniform temperature plate of the present invention;

Fig. 3 is a three-dimensional combination diagram of the second embodiment of the structure of the uniform temperature plate of the present invention;

Fig. 4 is a three-dimensional assembled view of the third embodiment of the structure of the uniform temperature plate of the present invention.

Description of main component symbols

First Body 11

First Channel 111

Second channel 112

first closed side 113

second closed side 114

Second body 12

The third channel 121

first end 122

second end 123

Conductor 124

working fluid 2

capillary structure 3

Radiator 4

Detailed ways

The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Fig. 1 and Fig. 2, which are the three-dimensional exploded view and combined sectional view of the first embodiment of the chamber structure of the utility model. As shown in the figure, the chamber structure of this embodiment includes: a first body 11, A second body 12, a working fluid 2;

The first body 11 has a plurality of first passages 111 and a plurality of second passages 112, and the first and second passages 111, 112 communicate with each other.

The first and second passages 111 , 112 are connected vertically and alternately. The first body 11 has a first closed side 113 and a second closed side 114 respectively disposed at two ends of the first passage 111 .

The second body 12 has a third channel 121, the second body 12 is connected to the first body 11, and makes the third channel 121 communicate with the aforementioned first and second channels 111, 112, and the first, second channels 111, 112 communicate with each other. The walls of the second and third passages 111, 112, 121 have a capillary structure 3, the second body 12 is a heat pipe, and the second body 12 also has a first end 122 and a second end 123, the second body 12 has a first end 122 and a second end 123. One end 122 is connected to the first body 11, the second end 123 extends in the direction opposite to the first end 122, and the capillary structure 3 is selected as any one of a mesh body, a fiber body, a sintered powder body, and a groove. , this embodiment uses grooves as an illustrative example, but it is not limited thereto. The working fluid 2 is filled in the aforementioned first and second bodies 11 and 12 .

The first body 11 can be formed by extrusion, and when the first body 11 is extruded, the first channel 111 inside the first body 11 is formed at the same time, and the wall of the first channel 111 is opened A plurality of grooves 1111 are then machined into the first body 11 to open a second channel 112 perpendicular to and connected to the first channel 111, and finally the first channel 111 is open. The two ends of the body are closed, and the second body 12 is connected with the first body 12, and the first, second, and third channels 111, 112, 121 are communicated with each other, and finally the first body 11, the second body 12 Carry out vacuuming and fill in the working fluid 2 .

Please refer to Fig. 3, which is a three-dimensional combination diagram of the second embodiment of the uniform temperature plate structure of the present invention. As shown in the figure, this embodiment has the same structure as the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that it also has a radiator 4, which is connected to one end of the first body 11 opposite to the second body 12, and the adsorbed The heat is guided to the place connected to the radiator 4 through the internal working fluid, and then cooled by the radiator 4 .

Please refer to Fig. 4, which is a three-dimensional combined view of the third embodiment of the structure of the uniform temperature plate of the present invention. The difference between this embodiment and the aforementioned first embodiment is that the first end 122 and the second end 123 of the second body 12 are connected to the first body 11 at the same time, and the first end 122 of the second body 12 is connected to the There is also a conduction portion 124 between the second ends 123 , and the conduction portion 124 is connected to a heat sink 4 .

Through the first to third embodiments of the present invention, the lack of conventional heat vaporization panels excessively accumulating heat near the heat source can be improved, and the effect of heat transfer to the remote end for heat dissipation can be effectively achieved.

Claims (9)

1. A vapor chamber structure, characterized in that it comprises: A first body having a plurality of first passages and a plurality of second passages, and the first and second passages communicate with each other; A second body has a third channel, the second body is connected to the first body, so that the third channel communicates with the aforementioned first and second channels, and the walls of the first, second and third channels have a capillary structure ; A working fluid is filled in the aforementioned first and second bodies. 2 . The vapor chamber structure according to claim 1 , wherein the capillary structure is selected from any one of mesh body, fiber body, sintered powder body, and groove. 3 . 3. The vapor chamber structure according to claim 1, characterized in that, the first and second channels communicate vertically and alternately. 4. The vapor chamber structure according to claim 1, wherein the first body is formed by extrusion. 5. The vapor chamber structure according to claim 1, wherein the second body is a heat pipe. 6 . The chamber structure according to claim 1 , wherein the first body further has a first closed side and a second closed side for closing two ends of the first channel respectively. 7. The vapor chamber structure according to claim 1, wherein the second body further has a first end and a second end, the first end is connected to the first body, and the second The ends extend in a direction opposite to the first end. 8 . The vapor chamber structure according to claim 1 , further comprising a radiator connected to an end of the first body opposite to the second body. 9. The chamber structure according to claim 1, wherein the second body further has a first end and a second end, and the first end and the second end are simultaneously connected with the first end The body is connected, and there is a conduction part between the first end and the second end of the second body, and the conduction part is connected with a radiator.

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