CN202905705U - High-density-arrangement low-power integrated circuit lead frame member - Google Patents
High-density-arrangement low-power integrated circuit lead frame member Download PDFInfo
- Publication number
- CN202905705U CN202905705U CN2012206789741U CN201220678974U CN202905705U CN 202905705 U CN202905705 U CN 202905705U CN 2012206789741 U CN2012206789741 U CN 2012206789741U CN 201220678974 U CN201220678974 U CN 201220678974U CN 202905705 U CN202905705 U CN 202905705U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- frame assembly
- integrated circuit
- density
- power integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims abstract description 9
- 238000000429 assembly Methods 0.000 claims abstract description 9
- 239000003351 stiffener Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005452 bending Methods 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000002929 anti-fatigue Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a high-density-arrangement low-power integrated circuit lead frame member. With the high-density-arrangement low-power integrated circuit lead frame member adopted, the defects such as poor bending-resistant performance, and adverseness in high-speed stamping production existing in similar products in the prior can be eliminated. The high-density-arrangement low-power integrated circuit lead frame member includes a plurality of identical lead frame assemblies which are horizontally and continuously arranged, and longitudinal connecting sheets used for connecting adjacent lead frame assemblies; upper and lower sides of each lead frame assembly are provided with an upper edge strip and a lower edge strip respectively, wherein the upper edge strips of the lead frame assemblies are transversely connected with each other, and the lower edge strips of the lead frame assemblies are transversely connected with each other; each lead frame assembly is provided with two columns of lead frames along the longitudinal direction of the lead frame assembly; a transverse middle portion of each lead frame assembly is provided with a reinforcing bar; six rows of lead frames are respectively and transversely arranged inside the areas among the reinforcing bar and the upper and lower edge strips of each lead frame assembly; each lead frame comprises a chip island and a plurality of pins around the chip island; and circular arc grooves are arranged between head portion welding areas of the pins and pin bodies. The high-density-arrangement low-power integrated circuit lead frame member of the utility model can not only assist in improving production efficiency, but also better assist in follow-up packaging production, and enhancing mechanical-shock-resistant performance of finished products.
Description
Technical field
The utility model relates to a kind of semi-conductor discrete device manufacturing technology field, especially refers to the lead frame spare manufacturing technology of the high density arrangement that the small-power integrated circuit fields is used.
Background technology
The small-power circuit lead frame is a kind of extremely common semi-conductor discrete device, be widely used in cell phone type consumer electronics, computer and peripheral hardware, network service, a plurality of fields such as Electronic Special Equipment and instrument and meter, automotive electronics, LED display and electrical lighting; Based on range of application extensively, also different at lead frame profile and performance requirement that different field is used, the lead frame product of for example using in the small-power integrated circuit fields is compared with common lead frame of triode, have that profile is little, pin is many, the characteristic of thin thickness, and after the encapsulation envelope material and matrix require higher in conjunction with firmness; In addition, because market demand quantity is huge, manufacturer generally adopts the mode that increases the lead frame arranging density in the stamped process, to improve stamping production efficiency, also laid efficient basis for follow-up encapsulation production simultaneously.This type of comparatively typical product such as State Intellectual Property Office are that the ZL200920244613.4 name is called the utility model patent of " a kind of transistor integrated circuit lead frame spare " in the patent No. of Granted publication on the 15th September in 2010, and " it laterally is consecutively arranged to form through brace by the cell cube that comprises a plurality of same lead frame for it; Described cell cube is provided with totally 16 lead frames of vertical two row, horizontal eight row's settings, the up and down both sides of described cell cube are established sideband and laterally are connected to each other ... the anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity obviously promote, thereby have greatly improved the transistor integrated circuit reliability of operation." but this product lead frame of vertically connecting arrangement only is to rely on tiny reinforcement to link to each other up and down; along with the increase of number of the arrangement; whole lead frame spare is crooked easily; both be unfavorable for the raising of drawing velocity; also can reduce the qualification rate of finished product after the encapsulation, have a strong impact on the ic component reliability of operation.
The utility model content
The technical problems to be solved in the utility model is to overcome defective and the deficiency that existing like product bending resistance is poor, be unfavorable for punching production and impact encapsulation product qualified rate, a kind of whole intensity height is provided, is suitable for high speed stamping production and encapsulates the small-power circuit lead frame spare product that the high high density of product qualified rate is arranged to society.
The technical scheme that its technical problem that solves the utility model adopts is: the small-power circuit lead frame spare that high density is arranged, comprise that laterally continuously arranged a plurality of same lead frame assemblies reach for the vertical brace that connects between the adjacent leadframe assemblies, upper sideband is established respectively in the up and down both sides of described lead frame assembly, lower sideband laterally is connected to each other; Described lead frame assembly vertically be provided with two row lead frames, the lateral middle of described lead frame assembly is provided with stiffener, the described upper sideband of described stiffener and described lead frame assembly, and the described lower sideband of described lead frame assembly between laterally respectively be provided with six row lead frames; Described lead frame comprises chip island and is located at a plurality of pins of its periphery, is provided with arc groove in the outside away from described chip island between described pin head welding zone and the described pin body.
Be provided with between the adjacent described pin root and connect bar and be connected to a fixed, coating is all established on paster surface and the described pin head welding zone surface of described chip island.
The small-power circuit lead frame spare that the utility model high density is arranged, because the lateral middle of described lead frame assembly is provided with stiffener, so can greatly strengthen the bending resistance of this product, thereby be conducive to improve drawing velocity, reach the target of enhancing productivity; Include 24 lead frames in each lead frame assembly, not only be beneficial to and enhance productivity, more be conducive to follow-up encapsulation production.Envelope material after the encapsulation is filled in the arc groove between described pin welding zone and its body, greatly strengthened the adhesion of envelope material with the chip island matrix, can prevent effectively that the envelope material from producing up and down slippage with respect to chip island, pin, the anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity obviously promote, thereby greatly improved the integrated circuit reliability of operation, this product is widely used in small-power integrated circuit Application in manufacture.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the utility model product lead frame assembly structure for amplifying schematic diagram.
Fig. 3 is the A section structure for amplifying schematic diagram of Fig. 2.
Embodiment
As depicted in figs. 1 and 2, the small-power circuit lead frame spare that the utility model high density is arranged, comprise that laterally continuously arranged a plurality of same lead frame assembly 1 reaches the vertical brace 5 that is used for connection between the adjacent leadframe assemblies 1, upper sideband 10 is established respectively in the up and down both sides of described lead frame assembly 1, lower sideband 9 laterally is connected to each other; Described lead frame assembly 1 vertically be provided with the two row lead frames 4 that linked to each other by muscle sheet 11, described muscle sheet 11 vertically be provided with a plurality of slotted eyes 7; The lateral middle of described lead frame assembly 1 is provided with stiffener 12, the described upper sideband 10 of described stiffener 12 and described lead frame assembly 1, and the described lower sideband 9 of described lead frame assembly 1 between laterally respectively be provided with six row lead frames 4; After adopting structure like this, each described lead frame assembly 1 has included 24 lead frames 4.
As shown in Figure 3, described lead frame 4 comprises chip island 6 and is located at a plurality of pins 2 of its periphery, is provided with between adjacent described pin 2 roots to connect bar 3 and be connected to a fixed, and to guarantee this product each pin 2 when the continuous punching buckling deformation do not occur; The coating protection is all established on paster surface and described pin 2 head welding zones 8 surfaces of described chip island 6, to improve the bonding welding performance; Be provided with arc groove 10 in the outside away from described chip island 6 between described pin 2 head welding zones 8 and described pin 2 bodies.
The below continues by reference to the accompanying drawings, the operation principle of summary the utility model product.According to the designing requirement of encapsulation factory, in being equipped with the stamping machine of corresponding mould, process the small-power circuit lead frame spare that qualified high density is arranged; Because the lateral middle of described lead frame assembly 1 is provided with stiffener 12, thus the bending resistance of this product can greatly be strengthened, thus be conducive to improve drawing velocity, reach the target of enhancing productivity; Include 24 lead frames 4 in each lead frame assembly 1, not only be beneficial to and enhance productivity, more be conducive to follow-up encapsulation production.Envelope material after the encapsulation is filled in the arc groove 10 between described pin 2 welding zones 8 and its body, greatly strengthened the adhesion of envelope material with chip island 6 matrixes, can prevent effectively that the envelope material from producing up and down slippage with respect to chip island 6, pin 2, the anti-mechanical shock of finished product and heat-resistant anti-fatigue intensity obviously promote, thereby greatly improved the integrated circuit reliability of operation, this product is widely used in small-power integrated circuit Application in manufacture.
Claims (2)
1. the small-power circuit lead frame spare arranged of a high density, comprise that laterally continuously arranged a plurality of same lead frame assemblies (1) reach the vertical brace (5) that is used for connection between the adjacent leadframe assemblies (1), upper sideband (10) is established respectively in the up and down both sides of described lead frame assembly (1), lower sideband (9) laterally is connected to each other; It is characterized in that: described lead frame assembly (1) vertically be provided with two row lead frames (4), the lateral middle of described lead frame assembly (1) is provided with stiffener (12), the described upper sideband (10) of described stiffener (12) and described lead frame assembly (1), and the described lower sideband (9) of described lead frame assembly (1) between laterally respectively be provided with six row lead frames (4); Described lead frame (4) comprises chip island (6) and is located at a plurality of pins (2) of its periphery, is provided with arc groove (10) in the outside away from described chip island (6) between described pin (2) head welding zone (8) and described pin (2) body.
2. the small-power circuit lead frame spare arranged of high density as claimed in claim 1, it is characterized in that: be provided with between adjacent described pin (2) root and connect bar (3) and be connected to a fixed, coating is all established on paster surface and described pin (2) head welding zone (8) surface of described chip island (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206789741U CN202905705U (en) | 2012-11-26 | 2012-11-26 | High-density-arrangement low-power integrated circuit lead frame member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206789741U CN202905705U (en) | 2012-11-26 | 2012-11-26 | High-density-arrangement low-power integrated circuit lead frame member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905705U true CN202905705U (en) | 2013-04-24 |
Family
ID=48126337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206789741U Expired - Lifetime CN202905705U (en) | 2012-11-26 | 2012-11-26 | High-density-arrangement low-power integrated circuit lead frame member |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905705U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method for high-density separation device lead frame design |
| CN107768341A (en) * | 2017-11-24 | 2018-03-06 | 中山复盛机电有限公司 | Lead frame |
-
2012
- 2012-11-26 CN CN2012206789741U patent/CN202905705U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474409A (en) * | 2013-09-11 | 2013-12-25 | 杰群电子科技（东莞）有限公司 | Arrangement method for high-density separation device lead frame design |
| CN107768341A (en) * | 2017-11-24 | 2018-03-06 | 中山复盛机电有限公司 | Lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130424 |