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CN202852485U - led light bulb - Google Patents

led light bulb Download PDF

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CN202852485U
CN202852485U CN2012204273945U CN201220427394U CN202852485U CN 202852485 U CN202852485 U CN 202852485U CN 2012204273945 U CN2012204273945 U CN 2012204273945U CN 201220427394 U CN201220427394 U CN 201220427394U CN 202852485 U CN202852485 U CN 202852485U
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substrate
strip
light source
heat conduction
shaped substrate
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程敬远
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Abstract

The utility model discloses a LED bulb, which comprises a lamp body and a luminous component arranged in the lamp body, wherein the luminous component comprises a substrate frame and LED lamp beads, the substrate frame comprises a bottom substrate and a light source substrate, and the LED lamp beads are arranged on the light source substrate; the lamp body is made of copper or aluminum materials, the heat conduction structure which is integrally formed and manufactured is arranged in the lamp body, the heat conduction structure is provided with a clamping groove, the light source substrate is fixed in the clamping groove, the bottom substrate is completely attached to the bottom of the heat conduction structure, and the contact area between the bottom substrate and the lamp body is increased; the back or the lower tip of light source base plate and draw-in groove are laminated completely, have increased the area of contact of light source base plate and lamp body to very big improvement the heat conduction area of base plate frame and lamp body, make the heat conduction speed between base plate frame and the lamp body accelerate, thereby the radiating rate of whole lamp accelerates, can more effectual reduction LED junction temperature, prevent that LED lamp pearl is overheated, slow down the light decay, prolong the life of LED lamp pearl.

Description

LED灯泡led light bulb

技术领域 technical field

本实用新型涉及LED照明领域,特别涉及一种散热效果好的LED灯泡。 The utility model relates to the field of LED lighting, in particular to an LED light bulb with good heat dissipation effect.

背景技术 Background technique

目前,LED光源以寿命长、无污染、光效高等特点正逐步替代白炽灯和荧光灯光源,故而出现了用LED作为光源的LED灯泡。LED灯泡一般包括灯头、灯体、灯罩和固定在灯体内的LED光源,如果LED光源发光产生的热量不能及时散去,会使得灯体内部温度越来越高,不但会加速LED老化,缩短其使用寿命,严重时会导致LED烧毁,故现有的LED灯泡均采用导热系数高的灯体来进行散热,但是现有LED光源一般包括基板和LED灯珠,而基板与灯体的接触面积非常少,导致了基板与灯体之间的导热缓慢,从而散热效果不佳,严重影响LED的使用寿命和使用质量。 At present, LED light sources are gradually replacing incandescent and fluorescent light sources with the characteristics of long life, no pollution, and high luminous efficiency. Therefore, LED bulbs using LEDs as light sources have appeared. LED bulbs generally include a lamp cap, a lamp body, a lampshade and an LED light source fixed in the lamp body. If the heat generated by the LED light source cannot be dissipated in time, the internal temperature of the lamp body will become higher and higher, which will not only accelerate the aging of the LED, but also shorten its life. The service life will cause the LED to burn out in severe cases. Therefore, the existing LED bulbs use the lamp body with high thermal conductivity to dissipate heat. However, the existing LED light source generally includes a substrate and LED lamp beads, and the contact area between the substrate and the lamp body is very small. Less, resulting in slow heat conduction between the substrate and the lamp body, resulting in poor heat dissipation, seriously affecting the service life and quality of use of the LED.

因此,如何增大基板与灯体的接触面积,提高LED灯泡的散热速度是业内亟待解决的技术问题。 Therefore, how to increase the contact area between the substrate and the lamp body and improve the heat dissipation rate of the LED bulb is a technical problem to be solved urgently in the industry.

发明内容 Contents of the invention

本实用新型的主要目的是提供一种LED灯泡,旨在增大基板与灯体的接触面积,提高LED灯泡的散热速度,防止LED灯珠过热,延长LED灯珠的使用寿命。 The main purpose of the utility model is to provide an LED light bulb, which aims to increase the contact area between the substrate and the lamp body, improve the heat dissipation speed of the LED light bulb, prevent the LED light beads from overheating, and prolong the service life of the LED light beads.

本实用新型提出一种LED灯泡,包括依次连接的灯头、灯头座、灯体、灯罩和设置在灯体内的发光部件,所述灯体为导热材料制成的壳体,所述发光部件包括LED灯珠和基板架,所述基板架由底部基板和设置在所述底部基板上的若干个光源基板组成,所述LED灯珠分别安装在所述光源基板上,所述灯体内设有向上凸起的导热结构,所述导热结构与所述灯体一体化制作成型;所述导热结构上设有与所述光源基板匹配的卡槽,所述卡槽从所述导热结构的下端向上端贯穿设置,所述光源基板贴合固定在所述卡槽中,所述底部基板与所述导热结构的底部贴合固定;所述LED灯珠置于所述导热结构的外部。 The utility model proposes an LED light bulb, which comprises a sequentially connected lamp cap, a lamp base, a lamp body, a lampshade and a light-emitting part arranged in the lamp body. The lamp body is a shell made of a heat-conducting material, and the light-emitting part includes an LED Lamp beads and a substrate frame, the substrate frame is composed of a bottom substrate and several light source substrates arranged on the bottom substrate, the LED lamp beads are respectively installed on the light source substrate, and the lamp body is provided with an upward convex The heat conduction structure is integrally formed with the lamp body; the heat conduction structure is provided with a card slot matching the light source substrate, and the card slot penetrates from the lower end of the heat conduction structure to the upper end It is provided that the light source substrate is bonded and fixed in the slot, the bottom substrate is bonded and fixed with the bottom of the heat conduction structure; the LED lamp bead is placed outside the heat conduction structure.

优选地,所述导热结构包括上端部分和下端部分,所述下端部分为与所述灯体内径适配的导热板,所述上端部分为导热块,所述导热块为柱体、锥体、或台体;所述卡槽的下端部分设置在所述导热板上,所述卡槽的上端部分设置在所述导热块上。 Preferably, the heat conduction structure includes an upper end part and a lower end part, the lower end part is a heat conduction plate adapted to the inner diameter of the lamp, the upper end part is a heat conduction block, and the heat conduction block is a cylinder, a cone, or a table body; the lower end of the slot is set on the heat conducting plate, and the upper end of the slot is set on the heat conducting block.

优选地,所述卡槽的上端部分设置在所述导热块的外侧。 Preferably, the upper end portion of the card slot is disposed outside the heat conduction block.

优选地,所述光源基板为一条形基板,所述光源基板从所述卡槽的下端部分卡入至所述卡槽的上端部分,所述LED灯珠安装在所述光源基板相对所述卡槽上端部分的背对面上。 Preferably, the light source substrate is a strip-shaped substrate, the light source substrate is snapped into the upper end part of the card slot from the lower end part of the card slot, and the LED lamp beads are installed on the light source substrate opposite to the card slot. On the opposite side of the upper part of the slot.

优选地,所述光源基板由两个形状、大小相同的条形基板:第一条形基板、第二条形基板背对贴合连接组成,所述LED灯珠分别设置在所述第一条形基板和所述第二条形基板的背对面上;所述第一条形基板的高度高于所述导热结构,所述第一条形基板的下端部分与所述卡槽贴合,所述第一条形基板的上端部分从所述卡槽上端穿出,安装在所述第一条形基板上的LED灯珠置于所述第一条形基板的上端部分;安装在所述第二条形基板上的LED灯珠置于所述第二条形基板相对所述卡槽上端部分的背对面上。 Preferably, the light source substrate is composed of two strip-shaped substrates with the same shape and size: the first strip-shaped substrate and the second strip-shaped substrate are connected back to back, and the LED lamp beads are respectively arranged on the first strip-shaped substrate. shaped substrate and the back surface of the second strip-shaped substrate; the height of the first strip-shaped substrate is higher than the heat conduction structure, and the lower end part of the first strip-shaped substrate is attached to the slot, so The upper end of the first strip-shaped substrate passes through the upper end of the card slot, and the LED lamp beads installed on the first strip-shaped substrate are placed on the upper end of the first strip-shaped substrate; The LED lamp beads on the two strip-shaped substrates are placed on the opposite surface of the second strip-shaped substrate to the upper end of the slot.

优选地,所述卡槽的上端部分设置在所述导热结构的内部。 Preferably, the upper end portion of the card slot is disposed inside the heat conducting structure.

优选地,所述光源基板为一条形基板,所述光源基板高于所述导热结构,所述光源基板的下端部分卡入所述卡槽中,所述光源基板的上端部分从所述卡槽上端穿出,所述LED灯珠安装在所述光源基板的上端部分。 Preferably, the light source substrate is a strip-shaped substrate, the light source substrate is higher than the heat conducting structure, the lower end of the light source substrate is inserted into the slot, and the upper end of the light source substrate is inserted into the slot. The upper end passes through, and the LED lamp bead is installed on the upper end portion of the light source substrate.

优选地,所述光源基板由两个条形基板:第一条形基板、第二条形基板背对贴合组成,所述第一条形基板和所述第二条形基板均高于所述导热结构,所述第一条形基板和所述第二条形基板的下端部分卡入所述卡槽中,第一条形基板和所述第二条形基板的上端部分从所述卡槽上端穿出,所述LED灯珠分别设置在所述第一条形基板和所述第二条形基板的上端部分的背对面上,所述第一条形基板与所述第二条形基板的形状、大小相同或不同。 Preferably, the light source substrate is composed of two strip-shaped substrates: the first strip-shaped substrate and the second strip-shaped substrate are bonded back to back, and the first strip-shaped substrate and the second strip-shaped substrate are both higher than the In the heat conduction structure, the lower end parts of the first strip-shaped substrate and the second strip-shaped substrate are snapped into the slot, and the upper end parts of the first strip-shaped substrate and the second strip-shaped substrate are pulled out from the card slot. The upper end of the groove passes through, and the LED lamp beads are respectively arranged on the back-facing surfaces of the upper end parts of the first strip-shaped substrate and the second strip-shaped substrate, and the first strip-shaped substrate and the second strip-shaped substrate The shapes and sizes of the substrates are the same or different.

优选地,所述灯体外壁面上纵向设有若干散热凹槽,所述灯体为铜制或铝制的金属壳体,所述底部基板与所述光源基板均为高导热铝基板。 Preferably, several heat dissipation grooves are longitudinally provided on the outer wall of the lamp, the lamp body is a metal shell made of copper or aluminum, and both the bottom substrate and the light source substrate are aluminum substrates with high thermal conductivity.

优选地,一LED驱动器连接固定在所述底部基板的下端面上,所述光源基板垂直或倾斜固定在所述底部基板上,所述底部基板与所述光源基板之间通过焊接或卡接方式相互连接。 Preferably, an LED driver is connected and fixed on the lower surface of the bottom substrate, the light source substrate is fixed vertically or obliquely on the bottom substrate, and the bottom substrate and the light source substrate are welded or clamped. interconnected.

本实用新型的LED灯泡的基板架包括底部基板和设置在底部基板上的光源基板,LED灯珠安装在光源基板上,底部基板和光源基板均为高导热铝基板,LED灯珠发光产生的热量快速传导到底部基板和光源基板上。在灯体内设有一体化成型制造的导热结构,灯体为铜或铝材料制成,导热率非常高;导热结构上设有与光源基板匹配的卡槽,光源基板从导热结构的底部卡入卡槽中,光源基板固定在卡槽中,底部基板与导热结构的底部完全贴合,增大了底部基板与灯体的接触面积;光源基板的背面或下端部分与卡槽完全贴合,增大了光源基板与灯体的接触面积,使基板架与灯体的接触面积比传统的LED灯泡的基板与灯体的接触面积增加了8倍,从而极大的提高了基板架与灯体的导热面积,使基板架与灯体之间的导热速度加快,从而整灯的散热速度加快,可更有效的降低LED结温,防止LED灯珠过热,减慢光衰,延长LED灯珠的使用寿命。 The substrate frame of the LED light bulb of the utility model includes a bottom substrate and a light source substrate arranged on the bottom substrate. The LED lamp beads are installed on the light source substrate. Fast conduction to the base substrate and source substrate. There is an integrated heat conduction structure in the lamp body, the lamp body is made of copper or aluminum material, the thermal conductivity is very high; the heat conduction structure is provided with a card slot matching the light source substrate, and the light source substrate is snapped in from the bottom of the heat conduction structure In the card slot, the light source substrate is fixed in the card slot, and the bottom substrate is completely attached to the bottom of the heat conduction structure, which increases the contact area between the bottom substrate and the lamp body; the back or lower end of the light source substrate is completely attached to the card slot, increasing The contact area between the light source substrate and the lamp body is enlarged, and the contact area between the substrate frame and the lamp body is increased by 8 times compared with the contact area between the substrate and the lamp body of the traditional LED bulb, thus greatly improving the contact area between the substrate frame and the lamp body The heat conduction area accelerates the heat conduction speed between the substrate frame and the lamp body, thereby accelerating the heat dissipation of the whole lamp, which can more effectively reduce the LED junction temperature, prevent the LED lamp beads from overheating, slow down the light decay, and prolong the use of the LED lamp beads life.

附图说明 Description of drawings

图1为本实用新型LED灯泡的一实施例的结构分解示意图; Fig. 1 is the structural exploded schematic diagram of an embodiment of the utility model LED light bulb;

图2为本实用新型LED灯泡的一实施例中发光部件的立体图; Fig. 2 is a perspective view of a light-emitting component in an embodiment of the LED light bulb of the present invention;

图3为本实用新型LED灯泡的一实施例中灯体的立体图; Fig. 3 is a perspective view of the lamp body in an embodiment of the LED light bulb of the present invention;

图4为本实用新型LED灯泡的一实施例中灯体的主视图; Fig. 4 is the front view of the lamp body in an embodiment of the LED light bulb of the present invention;

图5本实用新型LED灯泡的一实施例中灯体的正面剖视图; Fig. 5 is a front sectional view of the lamp body in an embodiment of the utility model LED light bulb;

图6本实用新型LED灯泡的一实施例中灯体的俯视图。 Fig. 6 is a top view of the lamp body in an embodiment of the LED light bulb of the present invention.

本实用新型目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。 The realization of the purpose of the utility model, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

具体实施方式 Detailed ways

应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。 It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

参照图1至图6,提出本实用新型的LED灯泡的一实施例,包括依次连接的灯头10、灯头座100、灯体40、灯罩50和设置在灯体40内的发光部件20、LED驱动器30,灯头座100为塑料制成,灯头座100通过螺纹连接方式与灯头10连接;灯体40为圆台形,灯罩50为烛形,灯头座100与灯体40的一端通过螺纹连接方式连接固定,灯罩50与灯体40的另一端通过螺纹连接方式连接,螺纹连接方式可方便灯头10、灯头座100、灯体40和灯罩50之间的重复安装和拆卸,从而方便对整灯的内部元器件进行维修。发光部件20包括LED灯珠201和用于安装LED灯珠201的基板架,基板架由底部基板210和设置在底部基板210上的三个光源基板200组成,底部基板210形状为圆形,其直径小于灯体40的内径,底部基板210可从灯体40内通过;光源基板200垂直设置在底部基板210上,光源基板200还可相对底部基板210倾斜设置;三块光源基板200绕底部基板210的中心均匀排列,底部基板210与光源基板200之间通过焊接方式相互连接固定;底部基板210与条形基板均为高导热铝基板,导热系数高,导热快速。LED灯珠201分别安装在光源基板200上,LED驱动器30连接固定在底部基板210的下端面上,灯罩50罩在发光部件20的外部,LED驱动器30驱动LED灯珠201发光,LED灯珠201发出的光线经灯罩50射出,光线柔和;LED灯珠201发光产生的热量快速传导到底部基板210和光源基板200上。 Referring to Fig. 1 to Fig. 6, an embodiment of the LED light bulb of the present invention is proposed, including a lamp cap 10, a lamp cap holder 100, a lamp body 40, a lampshade 50 and a light-emitting component 20 and an LED driver arranged in the lamp body 40 connected in sequence 30. The lamp base 100 is made of plastic, and the lamp base 100 is connected with the lamp base 10 through a threaded connection; the lamp body 40 is in the shape of a circular table, the lampshade 50 is in the shape of a candle, and one end of the lamp base 100 and the lamp body 40 is connected and fixed through a threaded connection The lampshade 50 is connected to the other end of the lamp body 40 through a threaded connection, which can facilitate the repeated installation and disassembly of the lamp cap 10, the lamp cap holder 100, the lamp body 40 and the lamp shade 50, thereby facilitating the internal components of the whole lamp The device is repaired. The light-emitting component 20 includes an LED lamp bead 201 and a substrate frame for installing the LED lamp bead 201. The substrate frame is composed of a bottom substrate 210 and three light source substrates 200 arranged on the bottom substrate 210. The bottom substrate 210 is circular in shape. The diameter is smaller than the inner diameter of the lamp body 40, and the bottom substrate 210 can pass through the lamp body 40; the light source substrate 200 is vertically arranged on the bottom substrate 210, and the light source substrate 200 can also be arranged obliquely relative to the bottom substrate 210; three light source substrates 200 surround the bottom substrate The center of 210 is evenly arranged, and the bottom substrate 210 and the light source substrate 200 are connected and fixed by welding; the bottom substrate 210 and the bar-shaped substrate are both high thermal conductivity aluminum substrates, with high thermal conductivity and fast heat conduction. The LED lamp beads 201 are respectively installed on the light source substrate 200, the LED driver 30 is connected and fixed on the lower end surface of the bottom substrate 210, the lampshade 50 is covered outside the light-emitting part 20, the LED driver 30 drives the LED lamp beads 201 to emit light, and the LED lamp beads 201 The emitted light is emitted through the lampshade 50 , and the light is soft; the heat generated by the LED lamp bead 201 is quickly transferred to the bottom substrate 210 and the light source substrate 200 .

为散热,灯体40采用导热系数高的铜材或铝材制成,在灯体40内设有向上凸起的导热结构400,该导热结构400与灯体40一体化制作成型。导热结构400包括上端部分和下端部分,下端部分为与灯体40内径适配的导热板402,上端部分为导热块401,导热块401可设为柱体、锥体、或台体;导热结构400上设有与光源基板200匹配的卡槽403,卡槽403从导热结构400的下端向上端贯穿设置,卡槽403的下端部分设置在导热板402上;卡槽403的上端部分设置在导热块401上,且设置在导热块401的外侧。光源基板200从卡槽403的下端部分滑入卡槽403的上端部分,光源基板200卡固的卡槽403中,底部基板210与导热板402的底面贴合固定,使底部基板210与导热结构400充分接触,增大了底部基板210与导热结构400的接触面积,从而使底部基板210与导热结构400之间的导热速度增加。 In order to dissipate heat, the lamp body 40 is made of copper or aluminum with high thermal conductivity, and an upwardly protruding heat conduction structure 400 is provided inside the lamp body 40 . The heat conduction structure 400 includes an upper end part and a lower end part, the lower end part is a heat conduction plate 402 adapted to the inner diameter of the lamp body 40, the upper end part is a heat conduction block 401, and the heat conduction block 401 can be set as a cylinder, a cone, or a platform; the heat conduction structure 400 is provided with a card slot 403 that matches the light source substrate 200, and the card slot 403 is set through from the lower end of the heat conduction structure 400 to the upper end, and the lower end part of the card slot 403 is set on the heat conduction plate 402; block 401 and arranged outside the heat conduction block 401 . The light source substrate 200 slides from the lower end of the slot 403 into the upper end of the slot 403, and the light source substrate 200 is locked in the slot 403, and the bottom substrate 210 is fixed to the bottom surface of the heat conducting plate 402, so that the bottom substrate 210 and the heat conducting structure 400 are fully in contact, increasing the contact area between the bottom substrate 210 and the heat conduction structure 400 , thereby increasing the heat conduction speed between the bottom substrate 210 and the heat conduction structure 400 .

光源基板200由两个条形基板:第一条形基板202、第二条形基板203背对贴合连接组成,LED灯珠201分别设置在第一条形基板202和第二条形基板203的背对面上,光源基板200的前、后两面发光,使LED灯泡的照明度增强。第一条形基板202的高度高于导热结构400,第一条形基板202的下端部分与卡槽403贴合,使第一条形基板202与导热结构400充分接触,增大了光源基板200与导热结构400的接触面积,从而使光源基板200与导热结构400之间的导热速度加快;第一条形基板202的上端部分从卡槽403上端穿出,安装在第一条形基板202上的LED灯珠201置于第一条形基板202的上端部分,使LED灯珠201置于导热结构400的外部,便于出光。第二条形基板203朝向导热块401的外侧,安装在第二条形基板203上的LED灯珠201置于第二条形基板203相对卡槽403上端部分的背对面上,使LED灯珠201置于导热结构400的外部,便于出光;第二条形基板203与第一条形基板202的形状、大小相同,第二条形基板203与第一条形基板202完全贴合连接,使第一条形基板202与第二条形基板203之间的接触面积最大化,从而加快第一条形基板202与第二条形基板203之间的导热速度。而且第二条形基板203的下端卡在卡槽403的下端部分,与卡槽403的下端部分接触,这样第二条形基板203上的LED灯珠201发光产生的热量可由第二条形基板203快速的传导给第一条形基板202和导热板402,第一条形基板202上的热量快速传导给导热结构400,这样使整个光源基板200与导热结构400之间的导热速度增大,而且底部基板210与导热结构400之间的导热速度增大,这样整个基板架与导热结构400之间的接触面积增大,导热速度增大。而导热结构400与灯体40是一体化成型,从而增大了基板架与灯体40的接触面积,使基板架与灯体40的接触面积比传统的LED灯泡的基板与灯体40的接触面积增加了8倍,从而极大的提高了基板架与灯体40的导热面积,使基板架与灯体40之间的导热速度加快;另外灯体40为铜或铝材料制成,导热率非常高,灯体40外壁面上纵向设有若干散热凹槽410,散热凹槽410使灯体40为外部空气的接触面积增大,可加快灯体40的散热速度,从而整灯的散热速度加快,可更有效的降低LED结温,防止LED灯珠201过热,减慢光衰,延长LED灯珠201的使用寿命。 The light source substrate 200 is composed of two strip-shaped substrates: the first strip-shaped substrate 202 and the second strip-shaped substrate 203 are connected back to back, and the LED lamp beads 201 are respectively arranged on the first strip-shaped substrate 202 and the second strip-shaped substrate 203 On the opposite side, the front and rear sides of the light source substrate 200 emit light, which enhances the illuminance of the LED light bulb. The height of the first strip-shaped substrate 202 is higher than that of the heat-conducting structure 400, and the lower end of the first strip-shaped substrate 202 is attached to the slot 403, so that the first strip-shaped substrate 202 is fully in contact with the heat-conducting structure 400, thereby increasing the size of the light source substrate 200. contact area with the heat conduction structure 400, so that the heat conduction speed between the light source substrate 200 and the heat conduction structure 400 is accelerated; The LED lamp bead 201 is placed on the upper end portion of the first bar-shaped substrate 202, so that the LED lamp bead 201 is placed outside the heat conduction structure 400 to facilitate light emission. The second strip-shaped substrate 203 faces the outside of the heat conduction block 401, and the LED lamp beads 201 installed on the second strip-shaped substrate 203 are placed on the back-facing surface of the second strip-shaped substrate 203 relative to the upper end of the slot 403, so that the LED lamp beads 201 is placed outside the heat conduction structure 400 to facilitate light emission; the second strip-shaped substrate 203 has the same shape and size as the first strip-shaped substrate 202, and the second strip-shaped substrate 203 and the first strip-shaped substrate 202 are completely attached and connected, so that The contact area between the first strip-shaped substrate 202 and the second strip-shaped substrate 203 is maximized, thereby accelerating the heat conduction speed between the first strip-shaped substrate 202 and the second strip-shaped substrate 203 . Moreover, the lower end of the second strip-shaped substrate 203 is stuck in the lower end portion of the slot 403 and is in contact with the lower end portion of the slot 403, so that the heat generated by the LED light beads 201 on the second strip-shaped substrate 203 can be absorbed by the second strip-shaped substrate. 203 quickly conducts to the first strip-shaped substrate 202 and the heat-conducting plate 402, and the heat on the first strip-shaped substrate 202 quickly conducts to the heat-conducting structure 400, thus increasing the heat conduction speed between the entire light source substrate 200 and the heat-conducting structure 400, Moreover, the heat conduction speed between the bottom substrate 210 and the heat conduction structure 400 increases, so that the contact area between the entire substrate frame and the heat conduction structure 400 increases, and the heat conduction speed increases. The heat conduction structure 400 and the lamp body 40 are integrally formed, thereby increasing the contact area between the substrate frame and the lamp body 40, making the contact area between the substrate frame and the lamp body 40 smaller than that of the substrate of the traditional LED light bulb and the lamp body 40. The area is increased by 8 times, thereby greatly improving the heat conduction area of the substrate frame and the lamp body 40, and accelerating the heat conduction speed between the substrate frame and the lamp body 40; in addition, the lamp body 40 is made of copper or aluminum material, and the thermal conductivity Very high, a number of heat dissipation grooves 410 are longitudinally arranged on the outer wall of the lamp body 40. The heat dissipation grooves 410 increase the contact area of the lamp body 40 with the external air, which can accelerate the heat dissipation speed of the lamp body 40, thereby improving the heat dissipation speed of the whole lamp. Speeding up can reduce the LED junction temperature more effectively, prevent the LED lamp bead 201 from overheating, slow down the light decay, and prolong the service life of the LED lamp bead 201.

另外,光源基板200还可为单一的条形基板,条形基板的上端高出卡槽403、低于卡槽403或与卡槽403上端齐平,条形基板从卡槽403的下端部分卡入至卡槽403的上端部分,条形基板贴合固定在卡槽403中, LED灯珠201安装在光源基板200相对卡槽403上端部分的背对面上,从而LED灯珠201置于导热块401外侧,利于出光。条形基板与卡槽403充分接触,增大了光源基板200与导热结构400之间的接触面积。 In addition, the light source substrate 200 can also be a single strip-shaped substrate. Inserted into the upper part of the card slot 403, the strip-shaped substrate is fitted and fixed in the card slot 403, and the LED lamp bead 201 is installed on the back surface of the light source substrate 200 relative to the upper end of the card slot 403, so that the LED lamp bead 201 is placed on the heat conduction block The outside of 401 is good for light emission. The strip-shaped substrate is fully in contact with the slot 403 , which increases the contact area between the light source substrate 200 and the heat conduction structure 400 .

 又提出本实用新型的LED灯泡的第二实施例,本实施例与第一实施例基本相同,其主要不同在于:卡槽的上端部分设置在导热结构的内部,光源基板由两个条形基板:第一条形基板、第二条形基板背对贴合组成,第一条形基板和第二条形基板均高于导热结构,第一条形基板和第二条形基板的下端部分卡入卡槽中,使第一条线基板、第二条线基板与导热结构之间的接触面积增大,从而使光源基板与导热结构之间导热速度增大;第一条形基板和第二条形基板的上端部分从卡槽上端穿出,LED灯珠分别设置在第一条形基板和第二条形基板的上端部分的背对面上,从而LED灯珠置于导热结构的外部,利于LED灯珠出光;底部基板与导热板底面贴合固定,使底部基板与导热结构充分接触,增大了底部基板与导热结构的接触面积,从而使底部基板与导热结构之间的导热速度增加。本实施例的效果与第一实施例的效果基本相同。 The second embodiment of the LED light bulb of the present invention is also proposed. This embodiment is basically the same as the first embodiment. The main difference is that the upper part of the card slot is arranged inside the heat conduction structure, and the light source substrate consists of two strip substrates. : The first strip-shaped substrate and the second strip-shaped substrate are back-to-back, the first strip-shaped substrate and the second strip-shaped substrate are higher than the heat conduction structure, and the lower ends of the first strip-shaped substrate and the second strip-shaped substrate are stuck into the card slot to increase the contact area between the first line substrate, the second line substrate and the heat conduction structure, thereby increasing the heat conduction speed between the light source substrate and the heat conduction structure; the first strip substrate and the second strip substrate The upper part of the strip-shaped substrate passes through the upper end of the card slot, and the LED lamp beads are respectively arranged on the back surfaces of the upper end parts of the first strip-shaped substrate and the second strip-shaped substrate, so that the LED lamp beads are placed outside the heat-conducting structure, which is beneficial to The LED lamp beads emit light; the bottom substrate and the bottom surface of the heat conduction plate are bonded and fixed, so that the bottom substrate and the heat conduction structure are fully in contact, and the contact area between the bottom substrate and the heat conduction structure is increased, thereby increasing the heat conduction speed between the bottom substrate and the heat conduction structure. The effect of this embodiment is basically the same as that of the first embodiment.

另外,光源基板还可为单一的条形基板,光源基板高于导热结构,光源基板的下端部分卡入卡槽中,光源基板的上端部分从卡槽上端穿出,LED灯珠安装在光源基板的上端部分。 In addition, the light source substrate can also be a single strip-shaped substrate, the light source substrate is higher than the heat conduction structure, the lower end of the light source substrate is inserted into the slot, the upper end of the light source substrate passes through the upper end of the slot, and the LED lamp beads are installed on the light source substrate the upper part of.

以上所述仅为本实用新型的优选实施例,并非因此限制本实用新型的专利范围,凡是利用本实用新型说明书及附图内容所作的等效结构变换,或直接或间接运用在其他相关的技术领域,均同理包括在本实用新型的专利保护范围内。 The above are only preferred embodiments of the present utility model, and are not therefore limiting the patent scope of the present utility model. All equivalent structural transformations made by using the utility model specification and accompanying drawings are directly or indirectly used in other related technologies. Fields are all included in the scope of patent protection of the utility model in the same way.

Claims (10)

1.一种LED灯泡,包括依次连接的灯头、灯头座、灯体、灯罩和设置在灯体内的发光部件,所述灯体为导热材料制成的壳体,所述发光部件包括LED灯珠和基板架,所述基板架由底部基板和设置在所述底部基板上的若干个光源基板组成,所述LED灯珠分别安装在所述光源基板上,其特征在于,所述灯体内设有向上凸起的导热结构,所述导热结构与所述灯体一体化制作成型;所述导热结构上设有与所述光源基板匹配的卡槽,所述卡槽从所述导热结构的下端向上端贯穿设置,所述光源基板贴合固定在所述卡槽中,所述底部基板与所述导热结构的底部贴合固定;所述LED灯珠置于所述导热结构的外部。 1. An LED light bulb, comprising a sequentially connected lamp cap, a lamp cap holder, a lamp body, a lampshade and a light-emitting part arranged in the lamp body, the lamp body is a shell made of a heat-conducting material, and the light-emitting part includes an LED lamp bead and a substrate frame, the substrate frame is composed of a bottom substrate and several light source substrates arranged on the bottom substrate, the LED lamp beads are installed on the light source substrate respectively, and it is characterized in that, the lamp body is provided with An upwardly protruding heat conduction structure, the heat conduction structure is integrally formed with the lamp body; the heat conduction structure is provided with a card slot matching the light source substrate, and the card slot is upward from the lower end of the heat conduction structure The end is set through, the light source substrate is attached and fixed in the slot, the bottom substrate is attached and fixed to the bottom of the heat conduction structure; the LED lamp bead is placed outside the heat conduction structure. 2.根据权利要求1所述的LED灯泡,其特征在于,所述导热结构包括上端部分和下端部分,所述下端部分为与所述灯体内径适配的导热板,所述上端部分为导热块,所述导热块为柱体、锥体、或台体;所述卡槽的下端部分设置在所述导热板上,所述卡槽的上端部分设置在所述导热块上。 2. The LED light bulb according to claim 1, wherein the heat conduction structure comprises an upper end part and a lower end part, the lower end part is a heat conduction plate adapted to the inner diameter of the lamp, and the upper end part is a heat conduction plate The heat conduction block is a cylinder, a cone, or a platform; the lower end of the card slot is set on the heat conduction plate, and the upper end of the draw slot is set on the heat conduction block. 3.根据权利要求2所述的LED灯泡,其特征在于,所述卡槽的上端部分设置在所述导热块的外侧。 3. The LED bulb according to claim 2, characterized in that, the upper end of the slot is arranged outside the heat conducting block. 4.根据权利要求3所述的LED灯泡,其特征在于,所述光源基板为一条形基板,所述光源基板从所述卡槽的下端部分卡入至所述卡槽的上端部分,所述LED灯珠安装在所述光源基板相对所述卡槽上端部分的背对面上。 4. The LED light bulb according to claim 3, wherein the light source substrate is a strip-shaped substrate, and the light source substrate is snapped into the upper end portion of the slot from the lower end portion of the slot, the The LED lamp bead is installed on the back surface of the light source substrate opposite to the upper end portion of the slot. 5.根据权利要求3所述的LED灯泡,其特征在于,所述光源基板由两个形状、大小相同的条形基板:第一条形基板、第二条形基板背对贴合连接组成,所述LED灯珠分别设置在所述第一条形基板和所述第二条形基板的背对面上;所述第一条形基板的高度高于所述导热结构,所述第一条形基板的下端部分与所述卡槽贴合,所述第一条形基板的上端部分从所述卡槽上端穿出,安装在所述第一条形基板上的LED灯珠置于所述第一条形基板的上端部分;安装在所述第二条形基板上的LED灯珠置于所述第二条形基板相对所述卡槽上端部分的背对面上。 5. The LED light bulb according to claim 3, wherein the light source substrate is composed of two strip-shaped substrates with the same shape and size: the first strip-shaped substrate and the second strip-shaped substrate are connected back to back, The LED lamp beads are respectively arranged on the back surfaces of the first strip-shaped substrate and the second strip-shaped substrate; the height of the first strip-shaped substrate is higher than the heat conducting structure, and the first strip-shaped substrate The lower end of the substrate is attached to the slot, the upper end of the first strip-shaped substrate passes through the upper end of the slot, and the LED lamp beads installed on the first strip-shaped substrate are placed on the first strip-shaped substrate. The upper end portion of the strip-shaped substrate; the LED light beads installed on the second strip-shaped substrate are placed on the opposite surface of the second strip-shaped substrate to the upper end portion of the slot. 6.根据权利要求2所述的LED灯泡,其特征在于,所述卡槽的上端部分设置在所述导热结构的内部。 6 . The LED light bulb according to claim 2 , wherein the upper end of the slot is disposed inside the heat conducting structure. 7 . 7.根据权利要求6所述的LED灯泡,其特征在于,所述光源基板为一条形基板,所述光源基板高于所述导热结构,所述光源基板的下端部分卡入所述卡槽中,所述光源基板的上端部分从所述卡槽上端穿出,所述LED灯珠安装在所述光源基板的上端部分。 7. The LED light bulb according to claim 6, wherein the light source substrate is a strip-shaped substrate, the light source substrate is higher than the heat conduction structure, and the lower end of the light source substrate is snapped into the slot , the upper end of the light source substrate passes through the upper end of the slot, and the LED lamp bead is installed on the upper end of the light source substrate. 8.根据权利要求6所述的LED灯泡,其特征在于,所述光源基板由两个条形基板:第一条形基板、第二条形基板背对贴合组成,所述第一条形基板和所述第二条形基板均高于所述导热结构,所述第一条形基板和所述第二条形基板的下端部分卡入所述卡槽中,第一条形基板和所述第二条形基板的上端部分从所述卡槽上端穿出,所述LED灯珠分别设置在所述第一条形基板和所述第二条形基板的上端部分的背对面上;所述第一条形基板与所述第二条形基板的形状、大小相同或不同。 8. The LED light bulb according to claim 6, wherein the light source substrate is composed of two strip-shaped substrates: the first strip-shaped substrate and the second strip-shaped substrate are back-to-back bonded, and the first strip-shaped substrate Both the substrate and the second strip-shaped substrate are higher than the heat-conducting structure, the lower ends of the first strip-shaped substrate and the second strip-shaped substrate are snapped into the slots, and the first strip-shaped substrate and the second strip-shaped substrate are The upper end portion of the second strip-shaped substrate passes through the upper end of the card slot, and the LED lamp beads are respectively arranged on the opposite surfaces of the upper end portions of the first strip-shaped substrate and the second strip-shaped substrate; The shape and size of the first strip-shaped substrate and the second strip-shaped substrate are the same or different. 9.根据权利要求1至8中任一项所述的LED灯泡,其特征在于,所述灯体外壁面上纵向设有若干散热凹槽,所述灯体为铜制或铝制的金属壳体,所述底部基板与所述光源基板均为高导热铝基板。 9. The LED light bulb according to any one of claims 1 to 8, wherein a plurality of cooling grooves are longitudinally arranged on the outer wall of the lamp, and the lamp body is a metal shell made of copper or aluminum , both the bottom substrate and the light source substrate are aluminum substrates with high thermal conductivity. 10.根据权利要求1至8中任一项所述的LED灯泡,其特征在于,在所述底部基板的下端面上连接固定有一LED驱动器,所述光源基板垂直或倾斜固定在所述底部基板上,所述底部基板与所述光源基板之间通过焊接或卡接方式相互连接。 10. The LED light bulb according to any one of claims 1 to 8, wherein an LED driver is connected and fixed on the lower end surface of the bottom substrate, and the light source substrate is vertically or obliquely fixed on the bottom substrate On the other hand, the bottom substrate and the light source substrate are connected to each other by welding or clamping.
CN2012204273945U 2012-08-27 2012-08-27 led light bulb Expired - Fee Related CN202852485U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105757477A (en) * 2016-03-31 2016-07-13 中山市帝森电子科技有限公司 LED energy-saving lamp with air purification function
CN105822924A (en) * 2016-05-19 2016-08-03 周辉弟 LED light source module and high-light-radiation LED lamp
CN109611754A (en) * 2019-02-21 2019-04-12 蚌埠崧欣电子科技有限公司 A drive power built-in LED chandelier
CN109945103A (en) * 2019-04-01 2019-06-28 深圳市瑞丰光电子股份有限公司 An LED light source assembly and a backlight assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105757477A (en) * 2016-03-31 2016-07-13 中山市帝森电子科技有限公司 LED energy-saving lamp with air purification function
CN105822924A (en) * 2016-05-19 2016-08-03 周辉弟 LED light source module and high-light-radiation LED lamp
CN109611754A (en) * 2019-02-21 2019-04-12 蚌埠崧欣电子科技有限公司 A drive power built-in LED chandelier
CN109611754B (en) * 2019-02-21 2021-03-02 蚌埠崧欣电子科技有限公司 LED ceiling lamp with built-in driving power supply
CN109945103A (en) * 2019-04-01 2019-06-28 深圳市瑞丰光电子股份有限公司 An LED light source assembly and a backlight assembly

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