CN202837785U - Micro Optical Imaging Device - Google Patents

Abstract

The utility model provides a micro optical imaging device, which includes an optical engine and a heat dissipation module, and the heat dissipation module has a first heat dissipation means and a second heat dissipation means; wherein the first heat dissipation means and the second heat dissipation means respectively include a first heat pipe and a heat dissipation module. the second heat pipe, and the first heat pipe and the second heat pipe are staggered up and down and arranged crosswise with each other in the vertical direction. The utility model enables the heat energy of each heat source to be efficiently discharged outward through at least two heat dissipation means, and makes the spatial arrangement and design of each element in the micro optical imaging device more flexible.

Description

Micro Optical Imaging Device

technical field

The utility model relates to a miniature optical imaging device, in particular to a miniature optical imaging device with a heat dissipation module. the

Background technique

In daily life, projection devices are often used to project and magnify graphic or image data on the projection surface, so that users can enjoy visual comfort when watching, and easily achieve the effect of entertainment. the

In the past, the light source used in the projection device was produced based on the principle of high-voltage discharge, which not only consumes power but also has a large volume, which has always been a bottleneck in the design of the projection device. However, in recent years, the light-emitting diode (LED, Light-Emitting Diode) luminous power and lumen value have been greatly improved. Therefore, it has become a major trend to use light-emitting diodes as light sources for projection devices. However, as the power and lumens of the light source increase day by day, the heat energy generated during its operation also increases, causing the temperature inside the projection device to rise significantly, which will easily affect the service life of the relevant electronic components in the projection device. and reliability; therefore, the heat dissipation design of the projection device is one of the key factors affecting its imaging quality. the

Please refer to FIG. 1 , which is a schematic structural diagram of a conventional projection device. The projection device 9 has a casing 91, an optical lens 92 for projecting an image picture outward, and a plurality of electronic components (not shown) inside the casing 91; wherein, the side of the casing 91 has a port 911, Furthermore, a fan 93 perpendicular to the bottom surface of the casing 91 is provided at the opening 911 to discharge heat energy in the casing 91 to the outside. In addition, in the traditional heat dissipation technology, a heat sink (not shown in the figure) is attached to the heat source of the projection device 9 (such as the light source, not shown in the figure) to improve the heat dissipation efficiency. the

However, today's electronic devices are trending toward light, thin, and short designs to meet human needs. Therefore, projection devices are no exception tending to be miniaturized, so that they can be used in electronic products such as 3G mobile phones and PDAs, or become a The utility model relates to a portable miniature projection device. However, due to the small internal space of the micro-projection device, the internal heat flux density is extremely increased. Therefore, the traditional heat dissipation technology that only uses fans and heat sinks as heat dissipation methods cannot meet the current heat dissipation requirements. the

Therefore, the heat dissipation design of the existing miniature projection device still needs to be improved urgently. the

Utility model content

The main technical problem to be solved by the utility model is to provide a micro-optical imaging device with at least two heat pipes which are staggered up and down and arranged crosswise. the

The technical solution adopted by the utility model to solve the technical problem is to provide a micro optical imaging device, which includes an optical engine and a heat dissipation module, the optical engine has a first heat source and a second heat source; the heat dissipation module includes a first heat dissipation means and a heat dissipation module. The second heat dissipation means, the first heat dissipation means is arranged in the vicinity of the first heat source, so that at least part of the heat energy generated by the first heat source is discharged outside through the first heat dissipation means, and the second heat dissipation means It is arranged in the vicinity of the second heat source, so that at least part of the heat energy generated by the second heat source is discharged outward through the second heat dissipation means; wherein, the first heat dissipation means and the second heat dissipation means respectively include the first A heat pipe and a second heat pipe, and the first heat pipe and the second heat pipe are staggered up and down and arranged crosswise. the

Preferably, the first heat pipe and the second heat pipe are arranged orthogonally. the

Preferably, the first heat dissipation means includes the first heat pipe, the first heat dissipation fin group and the first fan, and a first end of the first heat pipe is arranged near the first heat source, and the first A second end of the heat pipe is in contact with the first heat dissipation fin set; wherein, the first fan discharges heat energy concentrated on the first heat dissipation fin set and its vicinity to the outside. the

Preferably, the second heat dissipation means includes the second heat pipe, the second heat dissipation fin group and the second fan, and a first end of the second heat pipe is arranged near the second heat source, and the second A second end of the heat pipe is in contact with the second heat dissipation fin set; wherein, the second fan discharges heat concentrated on the second heat dissipation fin set and its vicinity to the outside. the

Preferably, the first fan and the second fan are respectively arranged inside different surfaces of the micro-optical imaging device, so that the heat energy concentrated on the first heat dissipation fin group and its vicinity and concentrated on the second heat dissipation fin The heat energy of the group and its vicinity is discharged outwards from different surfaces of the micro-optical imaging device; The heat energy of the heat dissipation fin group and its vicinity and the heat energy concentrated on the second heat dissipation fin group and its vicinity are all discharged from the same surface of the micro optical imaging device. the

Preferably, the first fan is disposed between a bottom inner side of the micro-optical imaging device and the first cooling fin group, and the second fan is disposed between a side surface of the micro-optical imaging device and the second Between the heat dissipation fin groups; or the first fan is arranged between the inner side of a side of the micro optical imaging device and the first heat dissipation fin group, and the second fan is arranged on the side of the micro optical imaging device Between the inner side and the second cooling fin group. the

Preferably, the micro optical imaging device further includes at least one air inlet, and a plurality of airflow paths are formed between the at least one air inlet and the first fan and between the at least one air inlet and the second fan, and The airflow paths at least pass through the first heat source and the second heat source. the

Preferably, the first heat pipe passes through the first heat dissipation fin group, and the first heat pipe is located at or near a center line of the first heat dissipation fin group, and/or the second heat pipe passes through the A second heat dissipation fin set, and the second heat pipe is located at a center line of the second heat dissipation fin set or its vicinity. the

Preferably, at least one of the first heat source or the second heat source is a light emitting unit or an inductor. the

Preferably, the micro-optical imaging device is a micro-projection device, and the optical engine also has a display element and an optical lens for presenting an image frame; wherein, the light-emitting unit provides a light source to the display element, and the optical lens is located at Between a projection surface and the display element, it is used for projecting the image frame onto the projection surface so that the image frame is displayed on the projection surface. the

Preferably, the micro optical imaging device is a digital optical processing (DLP) projection device, or a reflective liquid crystal (LCOS) projection device, or a transmissive liquid crystal (LCD) projection device; wherein, when the micro optical imaging device When it is the digital light processing (DLP) projection device, the micro optical imaging device is a single-chip digital light processing (DLP) projection device, or a three-chip digital light processing (DLP) projection device, and the display element is a digital Micromirror (DMD) elements. the

Preferably, the light emitting unit includes at least one light emitting diode unit. the

Preferably, the light emitting unit includes at least one LED unit for outputting red beams, one LED unit for outputting green beams and one LED unit for outputting blue beams. the

The utility model also provides a miniature optical imaging device, which includes a housing, a display element for presenting an image picture, a plurality of light emitting units for providing light sources to the display element, an optical engine circuit board, an optical lens, and a plurality of light emitting units. A heat pipe and a plurality of fans for discharging the heat energy concentrated on the plurality of cooling fin groups and its vicinity, at least one inductor is arranged on the optical engine circuit board; the optical lens is located on a projection surface and the display Between the elements, it is used to project the image frame to the projection surface, so that the image frame is displayed on the projection surface; a first end of each of the heat pipes in the plurality of heat pipes is arranged in the plurality of light emitting units At least one of them is adjacent to or disposed adjacent to the at least one inductor, and a second end of each heat pipe is provided with a heat dissipation fin group; wherein, at least two of the plurality of heat pipes are staggered up and down and cross each other arrangement. the

Preferably, at least two heat pipes in the plurality of heat pipes are arranged in an orthogonal manner. the

Preferably, at least two of the plurality of fans are disposed inside different surfaces of the casing. the

Preferably, the plurality of fans include a first fan and a second fan, and the plurality of heat dissipation fin groups include a first heat dissipation fin group and a second heat dissipation fin group; wherein, the first fan is disposed on the housing between the inner side of a bottom surface of the body and the first cooling fin group, and the second fan is arranged between a side inner side of the housing and the second cooling fin group; or the first fan is arranged at the The inner side of a side of the casing is between the first cooling fin set, and the second fan is arranged between the inner side of the casing and the second cooling fin set. the

Preferably, the micro optical imaging device further includes at least one air inlet, and a plurality of airflow paths are formed between the at least one air inlet and the plurality of fans, and the airflow paths at least pass through the plurality of light emitting units and the plurality of airflow paths. at least one inductor. the

Preferably, at least one heat pipe of the plurality of heat pipes passes through the corresponding heat dissipation fin set, and the at least one heat pipe is located at or near a central line of the heat dissipation fin set. the

Preferably, the micro optical imaging device is a digital optical processing (DLP) projection device, or a reflective liquid crystal (LCOS) projection device, or a transmissive liquid crystal (LCD) projection device; wherein, when the micro optical imaging device When it is the digital light processing (DLP) projection device, the micro optical imaging device is a single-chip digital light processing (DLP) projection device, or a three-chip digital light processing (DLP) projection device, and the display element is a digital Micromirror (DMD) elements. the

Preferably, the light emitting unit includes at least one light emitting diode unit. the

Preferably, the light emitting unit includes at least one LED unit for outputting red beams, one LED unit for outputting green beams and one LED unit for outputting blue beams. the

The utility model enables the heat energy of each heat source to be efficiently discharged outward through at least two heat dissipation means, and through the angle between the heat pipe and its turning point, the heat energy of the heat source can be transferred and conducted to an appropriate heat sink. Centralized place, and since at least two heat pipes are set up and down in a staggered and cross-arranged manner, the spatial configuration and design of each element in the micro-optical imaging device will be more flexible, thereby making the micro-optical imaging device lighter, thinner, and more flexible. short. the

Description of drawings

Fig. 1: It is a schematic structural diagram of an existing projection device. the

FIG. 2 is a structural schematic view of the first preferred embodiment of the micro-optical imaging device of the present invention. the

FIG. 3 is a partial structural schematic diagram of the micro-optical imaging device shown in FIG. 2 . the

FIG. 4 is a bottom view of part of the structure of the micro-optical imaging device shown in FIG. 2 . the

FIG. 5 is an exploded three-dimensional view of part of the structure of the micro-optical imaging device shown in FIG. 2 including the upper cover. the

FIG. 6 is a schematic diagram of the airflow path of the micro-optical imaging device shown in FIG. 2 . the

FIG. 7 is a schematic structural view of the second preferred embodiment of the micro-optical imaging device of the present invention. the

FIG. 8 is a structural schematic diagram of the micro-optical imaging device shown in FIG. 7 at another viewing angle. the

FIG. 9 is a schematic diagram of the air flow path of the micro-optical imaging device shown in FIG. 7 . the

Detailed ways

First of all, the micro-optical imaging device of the present utility model generally refers to various micro-imaging devices with light-emitting units and high heat flux density during operation, such as lighting devices, monitoring devices, etc. The following will take micro-projection devices as examples The creative spirit of the utility model is illustrated, but the scope of application of the utility model is not limited by this. Among them, the micro projection device can be a single-chip digital optical processing (DLP) projection device, a three-chip digital optical processing (DLP) projection device, a reflective liquid crystal (LCOS) projection device, or a transmissive liquid crystal projection device. (LCD) projection device, but the projection technology of the above-mentioned various projection devices should be known to those of ordinary skill in the art, so it will not be repeated here. the

Please refer to Fig. 2~Fig. 6, Fig. 2 is a structural schematic diagram of the first preferred embodiment of the micro-optical imaging device of the present invention (in order to more clearly illustrate the internal structure of the micro-optical imaging device, the casing is not shown in Fig. 2 The upper cover of the housing, and the upper cover of the housing is also shown in Figure 5), Figure 3 is a partial structural schematic diagram of the micro-optical imaging device shown in Figure 2, and Figure 4 is a partial structural bottom view of the micro-optical imaging device shown in Figure 2 , FIG. 5 is a three-dimensional exploded view of the partial structure of the micro-optical imaging device shown in FIG. 2 including the upper cover, and FIG. 6 is a schematic diagram of the airflow path of the micro-optical imaging device shown in FIG. 2 . the

The micro-optical imaging device 1 includes a housing 11 (including an upper cover 115), at least a part of an optical engine 12 located in the housing 11, and at least a part of a heat dissipation module 13 located in the housing 11, and the optical engine 12 has a display element 121, multiple A light-emitting unit 122, an optical lens 123, and an optical engine circuit board 124; wherein, the display element 121 is used to present an image frame, and a plurality of light-emitting units 122 are used to provide light sources, and the light sources provided by them pass through a light processing program ( Such as light combination action and/or light mixing action) will be irradiated on the display element 121; and the optical lens 123 is located between a projection surface 8 and the display element 121, for projecting the image screen on the display element 121 to the projection surface 8, so that the image screen is enlarged and displayed on the projection surface 8; in addition, the optical engine circuit board 124 is used to provide a driving circuit so that the micro-optical imaging device 1 can start to operate after being powered on, and the optical engine circuit board 124 There are multiple electronic components on it, such as inductor 1241. the

In this preferred embodiment, the micro-optical imaging device 1 is a single-chip digital optical processing (DLP) projection device, and its display element 121 is a digital micro-mirror (DMD) element, and the plurality of light-emitting units 122 It includes a LED unit 1221 for outputting red beams, a LED unit 1222 for outputting green beams, and a LED unit 1223 for outputting blue beams. Also, any LED unit can be a combination of an LED chip and an LED circuit board, or a combination of an LED and an LED circuit board. the

Moreover, the heat dissipation module 13 of the miniature optical image device of the present invention at least includes a first heat dissipation means 131 and a second heat dissipation means 132, the first heat dissipation means 131 is used to dissipate part of the heat energy generated by the optical engine 12 from the casing 11 The air outlet 1111 at the first surface 111 of the housing 11 is discharged outwards, and the second heat dissipation means 132 is used to discharge another part of heat energy generated by the optical engine 12 through the air outlet 1121 at the second surface 112 of the casing 11 . the

In this preferred embodiment, the first surface 111 and the second surface 112 of the housing 11 are respectively the side (for example, a left side) and the bottom of the housing 11, and the first heat dissipation means 131 includes a first heat conduction part 1311, a first heat pipe 1312, a first cooling fin group 1313 and a first fan 1314; wherein, the first heat conducting part 1311 is arranged on the first heat source of the micro-optical imaging device 1 (taking this embodiment as an example, its between the light emitting diode unit 1222 outputting the green light beam and the light emitting diode unit 1223 outputting the blue light beam, and please refer to the subsequent detailed description) and the first heat pipe 1312, and respectively connected to the first heat source and the first heat pipe 1312 end contact, and the second end of the first heat pipe 1312 is in contact with the first heat dissipation fin group 1313; in addition, the first fan 1314 is arranged on the inner side of the first surface 111 of the housing 11 in a standing manner, and both are opposite to the first heat dissipation fin group 1313; A cooling fin set 1313 is disposed, that is, the first fan 1314 is located between the first surface 111 of the casing 11 and the first cooling fin set 1313 . the

Another preferred method (not shown in the figure), any person of ordinary skill in the art, after referring to the utility model, can obviously also propose including changing the arrangement of the first cooling fin group 1313 on the first fan 1314 and the first surface 111 including any other equivalent design or variation. the

In addition, the first heat conduction member 1311 is made of a material with high thermal conductivity (such as metal), or it is a heat sink, which is used for the heat energy of the first heat source to be conducted to the first heat conduction member 1311, and is connected with the first heat conduction member 1311. The first heat pipe 1312 contacted by the heat conducting element 1311 is a hollow metal pipe with both ends closed, and its first end and second end are respectively an evaporation part and a condensation part. the

Generally speaking, the evaporating part is arranged to be installed in a higher temperature environment, and the heat energy in the environment is transferred to the first heat pipe 1312 through the evaporating part, and the working fluid in the first heat pipe 1312 absorbs the heat energy Evaporate into gas, and then diffuse from the evaporating part to the condensing part. Because the temperature of the condensing part is relatively low, the gas condenses back into a liquid. At the same time, the heat energy is dissipated from the condensing part, and the liquid flows back to the evaporating part through capillary action. , thus completing a heat transfer cycle. Therefore, the first heat pipe 1312 has the function of transferring heat energy from the evaporating part to the condensing part, and its detailed working principle should be known to those skilled in the art, so it will not be repeated here. the

It can be seen from the above description that the heat energy generated by the first heat source will be conducted to the first heat dissipation fin group 1313 and its vicinity after passing through the first heat conduction member 1311 and the first heat pipe 1312 in sequence. The heat energy at and near the fin set 1313 is discharged from the air outlet 1111 at the first surface 111 of the casing 11 through the action of the first fan 1314 . the

Preferably, the first heat pipe 1312 passes through the first heat dissipation fin group 1313 and is located at or near a center line L1 of the first heat dissipation fin group 1313, so that the heat dissipation efficiency of the first heat dissipation means 131 can be accelerated. . the

Furthermore, in this preferred embodiment, the second heat dissipation means 132 includes a second heat conducting element 1321, a second heat pipe 1322, a second heat dissipation fin set 1323, a second fan 1324 and a third fan 1325; The heat-conducting element 1321 is arranged between the second heat source of the micro-optical imaging device 1 (take this embodiment as an example, it is the light-emitting diode unit 1221 that outputs a red light beam, and please refer to the subsequent detailed description) and the second heat pipe 1322 , and are in contact with the second heat source and the first end of the second heat pipe 1322 respectively, and the second end of the second heat pipe 1322 is in contact with the second cooling fin group 1323; in addition, the second fan 1324 and the third fan 1325 are both The second fan 1324 and the third fan 1325 are located inside the second surface 112 of the housing 11 in a flat manner, and are located below the second cooling fin set 1323 And between the second cooling fin group 1323 . the

Moreover, the second heat conduction member 1321 is made of a material with high thermal conductivity (such as metal), or it is a heat sink, which is used for the heat energy of the second heat source to be conducted to the second heat conduction member 1321, and the second heat conduction member 1321 is connected with the second The second heat pipe 1322 contacted by the heat conducting element 1321 is also a hollow metal pipe with both ends closed, and its first end and second end are respectively an evaporation part and a condensation part; wherein, the working principle of the second heat pipe 1322 is the same The working principle of the first heat pipe 1312 will not be repeated here. the

Therefore, the heat energy generated by the second heat source will pass through the second heat conducting member 1321 and the second heat pipe 1322 in sequence and then conduct to the second heat dissipation fin group 1323 and its vicinity. The heat energy at and near the group 1323 is discharged from the air outlet 1121 at the second surface 112 of the housing 11 through the action of the second fan 1324 and the third fan 1325 . the

Preferably, the second heat pipe 1322 passes through the second heat dissipation fin set 1323 and is located at or near a central line L2 of the second heat dissipation fin set 1323 , so that the heat dissipation efficiency of the second heat dissipation means 132 can be accelerated. the

In particular, the first heat source in this embodiment is the LED unit 1222 that outputs green beams and the LED unit 1223 that outputs blue beams, and the second heat source is the LED unit 1221 that outputs red beams; in detail , when the micro optical imaging device 1 starts to work, the light emitting unit 122 will output the light source synchronously or separately, and generate heat energy while outputting the light source, especially the light emitting diode unit 1221 outputting the red light beam and the light emitting diode unit 1222 outputting the green light beam Because the required power consumption is relatively high, more heat energy is generated. Therefore, the primary function of the heat dissipation module is to dissipate the heat energy generated by the light emitting unit 122. the

Since current electronic equipments are all developed towards light, thin, and short design principles, the space in the casing 11 is quite limited, and in order to enable the first heat pipe 1312 to be arranged on a center line L1 of the first cooling fin group 1313 Or its vicinity and the second heat pipe 1322 can also be arranged on a centerline L2 of the second heat dissipation fin group 1323 or its vicinity. (for example, vertically staggered up and down each other), and arranged in a cross arrangement, which can effectively save the space occupied by the first heat dissipation means and the second heat dissipation means to achieve an excellent heat dissipation effect. Important creative features of utility models. the

In addition, the heat source of the micro-optical imaging device 1 may not be limited to the light-emitting unit 122. For example, the multiple inductors 1241 and the display element 121 on the optical engine circuit board 124 may also become heat sources due to considerable heat generated during the operation process. Therefore, According to the enlightenment obtained from the above embodiments, those skilled in the art can make any equivalent change design according to the actual application requirements, such as transferring the heat energy of the inductor 1241, the display element 121 or other heat sources through the heat pipe and conducting it to multiple Appropriate heat concentration points are discharged from different surfaces of the micro-optical imaging device 1 . the

Furthermore, in order to make the micro-optical imaging device 1 have better heat dissipation efficiency, in this embodiment, the casing 11 of the micro-optical imaging device 1 has a plurality of perforations used as the air inlet 113 of the micro-optical imaging device 1, so Under the actuation of the first fan 1314, the second fan 1324 and the third fan 1325, between the air inlets 113 and the air outlet 1111 on the first surface 111 of the housing 11 and between the air inlets 113 and the housing A plurality of airflow paths will be formed between the air outlets 1121 at the second surface 112; wherein, by properly arranging the positions of the air inlets 113 and the air outlets 1111, 1121, these airflow paths can pass through The vicinity of each heat source and/or its heat energy can be transferred to the heat concentration point, and then the air with heat energy is discharged to the outside of the housing 11; the relevant heat flow analysis results are shown in the dotted line in Figure 6 . the

Please refer to FIGS. 7 to 9. FIG. 7 is a schematic structural view of the second preferred embodiment of the micro-optical imaging device of the present invention (in order to more clearly illustrate the internal structure of the micro-optical imaging device, the upper cover of the housing is not shown), FIG. 8 is a schematic structural view of the micro-optical imaging device shown in FIG. 7 at another viewing angle, and FIG. 9 is a schematic view of the air flow path of the micro-optical imaging device shown in FIG. 7 . the

Wherein, the micro-optical imaging device 2 of this embodiment is roughly similar to that described in the first preferred embodiment of the present invention, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first preferred embodiment is that there is only a single fan 2324 in the second heat dissipation means 232, and the fan 2324 is arranged on the inside of the side 211 of the casing 21 and the second fan 2324 in a standing manner. Between the two cooling fin groups 2323 . In addition, according to the arrangement of the above-mentioned fan 2324, the included angle of the turning point of the second heat pipe 2322 is also changed to obtain better space allocation and heat dissipation efficiency. the

Similarly, the heat energy generated by the LED unit 2221 will pass through the second heat conducting member 2321 and the second heat pipe 2322 to the second heat dissipation fin group 2323 and its vicinity. The heat energy at and near the sheet group 2323 is discharged from the air outlet 2112 at the side surface 211 of the casing 21 through the action of the fan 2324 . In this preferred embodiment, the heat energy concentrated on the first heat dissipation fin set 2313 and its vicinity and the heat energy concentrated on the second heat dissipation fin set 2323 and its vicinity are discharged from the same surface of the housing 21 . the

Also, in this preferred embodiment, multiple airflow paths are formed between the air inlet 213 and the air outlets 2111, 2112 on the first surface 211 of the housing 21; Arranging the positions of these air inlets 213 and these air outlets 2111, 2121 can make these airflow paths pass through the vicinity of each heat source and/or the heat concentration place where its heat energy can be transferred to, so that The air with heat energy is discharged out of the casing 21 ; the related heat flow analysis results are shown at the dotted line in FIG. 9 . the

It is particularly noted that the first heat pipe 2312 and the second heat pipe 2322 in this embodiment are also staggered up and down (for example, staggered up and down in the vertical direction) and arranged in a crossed manner, so it can also effectively save The space occupied by the first heat dissipation means and the second heat dissipation means achieves an excellent heat dissipation effect. the

According to the above embodiments, the utility model enables the heat energy of each heat source to be efficiently discharged outward through at least two heat dissipation means, and the heat energy of the heat source can be dissipated through the angle between the heat pipe and its turning point. The transfer is conducted to an appropriate heat concentration place, and because at least two heat pipes are arranged in a staggered and cross-arranged manner, the spatial configuration and design of each element in the micro-optical imaging device will be more flexible, and then the micro-optical image The device is lighter, thinner and shorter. the

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of claims of the present utility model. Therefore, all other equivalent changes or modifications that do not deviate from the spirit disclosed in the present utility model shall be included in the scope of the present utility model. the

Claims (22)

1. a micro-optical device for image is characterized in that, comprising:

Light engine has the first thermal source and Secondary Heat Source; And

Radiating module, comprise the first heat dissipation and the second heat dissipation, this the first heat dissipation is arranged at the adjacent place of this first thermal source, so that at least part of heat energy that this first thermal source produces is discharged via this first heat dissipation, and this second heat dissipation is arranged at the adjacent place of this Secondary Heat Source, so that at least part of heat energy that this Secondary Heat Source produces is discharged via this second heat dissipation;

Wherein, this first heat dissipation and this second heat dissipation comprise respectively the first heat pipe and the second heat pipe, and this first heat pipe and this second heat pipe stagger up and down and cross arrangement mutually.

2. micro-optical device for image as claimed in claim 1 is characterized in that, this first heat pipe and this second heat pipe are orthogonal thereto arrangements.

3. micro-optical device for image as claimed in claim 1, it is characterized in that, this first heat dissipation comprises this first heat pipe, the first radiating fin group and the first fan, and a first end of this first heat pipe is arranged at the adjacent place of this first thermal source, and one second end in contact of this first heat pipe is in this first radiating fin group; Wherein, this first fan will concentrate on this first radiating fin group and near heat energy discharges.

4. micro-optical device for image as claimed in claim 3, it is characterized in that, this second heat dissipation comprises this second heat pipe, the second radiating fin group and the second fan, and a first end of this second heat pipe is arranged at the adjacent place of this Secondary Heat Source, and one second end in contact of this second heat pipe is in this second radiating fin group; Wherein, this second fan will concentrate on this second radiating fin group and near heat energy discharges.

5. micro-optical device for image as claimed in claim 4, it is characterized in that, it is inboard that this first fan and this second fan are arranged at respectively the different surfaces of this micro-optical device for image so that concentrate on this first radiating fin group with its near heat energy and concentrate on this second radiating fin group and near heat energy that it is is discharged by the different surfaces of this micro-optical device for image respectively; Or it is inboard to be that this first fan and this second fan are arranged at respectively the similar face of this micro-optical device for image so that concentrate on this first radiating fin group with its near heat energy and concentrate on this second radiating fin group and near heat energy that it is is all discharged by the similar face of this micro-optical device for image.

6. micro-optical device for image as claimed in claim 5, it is characterized in that, this first fan is arranged between the inboard, a bottom surface and this first radiating fin group of this micro-optical device for image, and this second fan is arranged between the inboard, a side and this second radiating fin group of this micro-optical device for image; Or be that this first fan is arranged between the inboard, a side and this first radiating fin group of this micro-optical device for image, and this second fan is arranged between this inboard, side and this second radiating fin group of this micro-optical device for image.

7. micro-optical device for image as claimed in claim 4, it is characterized in that, this micro-optical device for image also comprises at least one air inlet, and be formed with a plurality of air flow paths between this at least one air inlet and this first fan and between this at least one air inlet and this second fan, and those air flow paths are at least by this first thermal source and this Secondary Heat Source.

8. micro-optical device for image as claimed in claim 4, it is characterized in that, this first heat pipe passes this first radiating fin group, and this first heat pipe is positioned at a center line or its adjacent place of this first radiating fin group, and/or this second heat pipe passes this second radiating fin group, and this second heat pipe is positioned at a center line or its adjacent place of this second radiating fin group.

9. micro-optical device for image as claimed in claim 1 is characterized in that, at least one in this first thermal source or this Secondary Heat Source is luminescence unit or inductance.

10. micro-optical device for image as claimed in claim 9 is characterized in that, this micro-optical device for image is micro projector, and this light engine also has to present display element and the optical lens of an image frame; Wherein, this luminescence unit provides light source to give this display element, and this optical lens in order to throw this image frame to this projection surface, is shown on this projection surface this image frame between a projection surface and this display element.

11. micro-optical device for image as claimed in claim 10 is characterized in that, this micro-optical device for image is digital optical process projection device, or is reflective liquid crystal projecting apparatus, or is the penetration liquid crystal projection apparatus; Wherein, when this micro-optical device for image is this digital optical process projection device, this micro-optical device for image is the one chip digital optical process projection device, or is the three-chip type digital optical process projection device, and this display element is the digital minitype reflector element.

12. micro-optical device for image as claimed in claim 9 is characterized in that this luminescence unit comprises a light emitting diode at least.

13. micro-optical device for image as claimed in claim 12, it is characterized in that, this luminescence unit comprises light emitting diode and the light emitting diode in order to output blue light beam of a light emitting diode in order to the output red light beam, in order to export green beam at least.

14. a micro-optical device for image is characterized in that, comprising:

Housing;

In order to present the display element of an image frame;

A plurality of luminescence units give this display element in order to light source to be provided;

The light engine circuit board is provided with at least one inductance on it;

Optical lens between a projection surface and this display element, in order to throw this image frame to this projection surface, is shown on this projection surface this image frame;

A plurality of heat pipes, a first end of each this heat pipe be arranged in these a plurality of luminescence units at least one the adjacent place or be arranged at the adjacent place of this at least one inductance, and one second end of each this heat pipe is provided with a radiating fin group; And

The a plurality of fans that discharge in order to will concentrate on these a plurality of radiating fin groups and near heat energy thereof;

Wherein, at least two heat pipes in these a plurality of heat pipes stagger up and down and cross arrangement mutually.

15. micro-optical device for image as claimed in claim 14 is characterized in that, at least two heat pipes in these a plurality of heat pipes are orthogonal thereto arrangements.

16. micro-optical device for image as claimed in claim 14 is characterized in that, at least two fans in these a plurality of fans are arranged at the different surfaces inboard of this housing.

17. micro-optical device for image as claimed in claim 14 is characterized in that, these a plurality of fans comprise the first fan and the second fan, and these a plurality of radiating fin groups comprise the first radiating fin group and the second radiating fin group; Wherein, this first fan is arranged between the inboard, a bottom surface and this first radiating fin group of this housing, and this second fan is arranged between the inboard, a side and this second radiating fin group of this housing; Or be that this first fan is arranged between the inboard, a side and this first radiating fin group of this housing, and this second fan is arranged between this inboard, side and this second radiating fin group of this housing.

18. micro-optical device for image as claimed in claim 14, it is characterized in that, this micro-optical device for image also comprises at least one air inlet, and be formed with a plurality of air flow paths between this at least one air inlet and this a plurality of fans, and those air flow paths are at least by these a plurality of luminescence units and this at least one inductance.

19. micro-optical device for image as claimed in claim 14 is characterized in that, at least one heat pipe in these a plurality of heat pipes passes this corresponding radiating fin group, and this at least one heat pipe is positioned at a center line or its adjacent place of this radiating fin group.

20. micro-optical device for image as claimed in claim 14 is characterized in that, this micro-optical device for image is digital optical process projection device, or is reflective liquid crystal projecting apparatus, or is the penetration liquid crystal projection apparatus; Wherein, when this micro-optical device for image is this digital optical process projection device, this micro-optical device for image is the one chip digital optical process projection device, or is the three-chip type digital optical process projection device, and this display element is the digital minitype reflector element.

21. micro-optical device for image as claimed in claim 14 is characterized in that this luminescence unit comprises a light emitting diode at least.

22. micro-optical device for image as claimed in claim 21, it is characterized in that, this luminescence unit comprises light emitting diode and the light emitting diode in order to output blue light beam of a light emitting diode in order to the output red light beam, in order to export green beam at least.

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