CN202773178U

CN202773178U - Composite type ultra-thin double-sided copper foil substrate

Info

Publication number: CN202773178U
Application number: CN201220428639.6U
Authority: CN
Inventors: 林志铭; 李建辉; 臧表
Original assignee: Asia Electronic Material Co Ltd
Current assignee: Asia Electronic Material Co Ltd
Priority date: 2012-08-28
Filing date: 2012-08-28
Publication date: 2013-03-06
Anticipated expiration: 2022-08-28

Abstract

The utility model discloses a composite ultra-thin double-sided copper foil substrate. The composite ultra-thin double-sided copper foil substrate of the utility model consists of a first copper foil layer, a polyimide layer, an adhesive layer and a second copper foil The polyimide layer is sandwiched between the adhesive layer and the first copper foil layer, and the adhesive layer is sandwiched between the second copper foil layer and the polyimide layer Among them, the sum of the thicknesses of the polyimide layer and the adhesive layer is 8-25 microns. The composite ultra-thin double-sided copper foil substrate of the present invention is not only light and thin, but also has high dimensional stability, High buckling performance, low rebound force, and the composite ultra-thin double-sided copper foil substrate of the present invention is made by coating or transfer printing and a lower temperature pressing process, so the manufacturing method is simple, the yield is high, and the cost is low .

Description

Combined type ultrathin double-face copper clad laminate

Technical field

The utility model relates to a kind of Double-sided copper clad laminate, especially a kind of combined type ultrathin double-face copper clad laminate with high dimensional stability, high flexural property, low bounce for making flexible print wiring board.

Background technology

At present electronic system is towards compact, high-fire resistance, multifunctionality, densification, high reliability and future development cheaply, so selecting of substrate just becomes very important influencing factor.And good substrate must possess high thermal conductivity, high dimensional stability, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.

The Double-sided copper clad laminate of prior art is divided into glue and glue-free.Prior art have the glue Double-sided copper clad laminate since size thicker, often can't adapt to the lightening demand of electronic product, therefore must use the glue-free Double-sided copper clad laminate of prior art in many occasions, and the processing procedure of the glue-free Double-sided copper clad laminate of prior art is: produce finished product after two-sided Copper Foil pressing thermoplastic polyimide (TPI) is complete through high-temperature laminating baking processing procedure curing reaction.This production technology not only expends the energy, and uses the higher TPI raw material of relative cost, and yield is on the low side in process of production.Therefore, usually there is the restriction that needs the processing procedure controls such as high-temperature process, long-time high-temperature baking when producing at the glue-free Double-sided copper clad laminate that uses at present, not only need higher production cost, waste energy and the production time, and can't guarantee yield and the efficient of producing to have limited production capacity.

In view of defects, be necessary to develop superior performance, be convenient to volume production and cost is low, yield is high Double-sided copper clad laminate and manufacturing process.

The utility model content

In order to overcome defects, the utility model provides a kind of combined type ultrathin double-face copper clad laminate, and combined type ultrathin double-face copper clad laminate of the present utility model is not only frivolous, has high dimensional stability, high flexural property, low bounce.

The utility model for the technical scheme that solves its technical problem and adopt is:

A kind of combined type ultrathin double-face copper clad laminate, consisted of by the first copper foil layer, polyimide layer, adhesion layer and the second copper foil layer, described polyimide layer is folded between described adhesion layer and described the first copper foil layer, described adhesion layer is folded between described the second copper foil layer and the described polyimide layer, wherein, the thickness summation of described polyimide layer and described adhesion layer is 8～25 microns.

The thickness of described adhesion layer is 3～12 microns, is preferably 9～12 microns.

The thickness of described polyimide layer is 5～13 microns, is preferably 9～13 microns.

The thickness of described the first copper foil layer is 1～9 micron.

The thickness of described the second copper foil layer is 3～8 microns.

The first copper foil layer is rolled copper foil or electrolytic copper foil.

Described the first copper foil layer and the second copper foil layer are all carrier copper foil.

Described adhesion layer is epoxy resin layer, acrylic resin layer, amido formate resin, silicon rubber resin, poly-to ring dimethylbenzene resin, bismaleimides resin or polyimide resin layer.

The beneficial effects of the utility model are: combined type ultrathin double-face copper clad laminate of the present utility model, by the first copper foil layer that superposes successively, polyimide layer, adhesion layer and the second copper foil layer consist of, wherein, the thickness summation of described polyimide layer and described adhesion layer is 8～25 microns, combined type ultrathin double-face copper clad laminate of the present utility model is not only frivolous, has high dimensional stability, high flexural property, low bounce, and the pressure programming of combined type ultrathin double-face copper clad laminate of the present utility model by coating or transfer printing and lower temperature make, so manufacture method is simple, yield is high, cost is low.

Description of drawings

Fig. 1 is combined type ultrathin double-face copper clad laminate cross-sectional view of the present utility model;

Fig. 2 is carrier copper foil of the present utility model and carrier layer cross-sectional view.

Embodiment

By particular specific embodiment execution mode of the present utility model is described below in conjunction with accompanying drawing, those of ordinary skills can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented by other different mode, namely under the category that does not disclose departing from this creation, can carry out different modifications and change.

Embodiment: a kind of combined type ultrathin double-face copper clad laminate, as shown in Figure 1, consisted of by the first copper foil layer 103, polyimide layer 102, adhesion layer 101 and the second copper foil layer 104, described polyimide layer 102 is folded between described adhesion layer 101 and described the first copper foil layer 103, described adhesion layer 101 is folded between described the second copper foil layer 104 and the described polyimide layer 102, wherein, both thickness summations of described polyimide layer 102 and described adhesion layer 101 are 8～25 microns.

The first copper foil layer 103 and the second copper foil layer 104 are 9um and following ultra-thin carrier copper foil, and the relatively difficulty because easy fold is taken need to have carrier layer to support (as shown in Figure 2, take the first copper foil layer 103 as example, 105 is carrier layer among Fig. 2).

Described the first copper foil layer 103 employed carrier copper foils are a kind of in rolled copper foil (RA carrier copper foil) and the high flexing Copper Foil of high temperature (electrolysis carrier copper foil), preferably 1～9 micron of the thickness of the first copper foil layer; The second copper foil layer 104 employed Copper Foils there is no particular restriction, can use general electrolysis carrier copper foil, preferably 3～8 microns of the thickness of the second copper foil layer.

For the flexible printed wiring board that this combined type ultrathin double-face copper clad laminate is manufactured reduces the quality problems such as plate prying, plate bursting, combined type ultrathin double-face copper clad laminate of the present utility model can be adjusted composition and the thickness of the adhesion layer in the Double-sided copper clad laminate as required.In addition in order to improve the thermal endurance of the utility model combined type ultrathin double-face copper clad laminate, this adhesion layer is to have greater than 170 ℃ glass transition temperature as good.The material of this adhesion layer generally is to be selected from epoxy resin, acrylic resin, amido formate is resin, silicon rubber is resin, poly-to ring diformazan benzene series resin, bismaleimides is one or more mixture of resin (Bimaleimide resin) and group that polyimide resin forms, wherein, this polyimide resin can be thermoplasticity polyimides (Thermal Plastic Polyimide, TPI), preferably, with epoxy resin be selected from bismaleimides (Bimaleimide resin) resin, the mixed type adhesion layer that acrylic resin (acrylic resin) or thermoplasticity polyimides are used in combination.The thickness of adhesion layer of the present utility model is 3 to 12 microns.Therefore, the copper clad laminate of excellent performance can be provided under the condition of effectively controlling cost.

In this combined type ultrathin double-face copper clad laminate, there is no particular restriction for the material of employed polyimide layer, preferably use not halogen-containing Thermocurable polyimide material, more preferably use to have from stickiness and not halogen-containing Thermocurable polyimide material.The thickness of this polyimide layer is 5 to 13 microns, and preferably, when the thickness of adhesion layer was between 9 to 12 microns, the thickness of polyimide layer was chosen between 9 to 13 microns.

The manufacture method of this combined type ultrathin double-face copper clad laminate is as follows:

Step 1: at arbitrary surface-coated polyimides of the first copper foil layer, and obtain a single face copper clad laminate after being dried the formation polyimide layer;

Step 2: with rubbing method or transfer printing adhesion layer is formed on the polyimide layer surface of single face copper clad laminate, and makes adhesion layer be in half polymerization semi-cured state;

Step 3: get the second copper foil layer, the second copper foil layer is covered on the adhesion layer, and give pressing and make the tight gluing of the second copper foil layer, obtain Double-sided copper clad laminate;

Step 4: the baking Double-sided copper clad laminate obtains the Double-sided copper clad laminate finished product.

Step 5: peel off the carrier layer on the first copper foil layer and the second copper foil layer surface, obtain combined type ultrathin double-face copper clad laminate finished product of the present utility model.

Stick the adhesion layer of 12 micron thick and the polyimide layer of 13 micron thick at the first copper foil layer described in the utility model, in order to testing:

The slide test condition of test of slide unit: sample is cut into the test piece of 10mm * 30mm, setting slide unit test fillet is 0.65 mm, and sliding frequency is that 60 beats/mins and sliding stroke are 35mm.The standard of test passes is flexing 100,000 times, and in the resistance change rate 10%, test result is recorded in table 1.

The test condition of bounce test: sample is cut into the test piece of 10mm * 30mm, and the second copper foil layer etching of the utility model combined type ultrathin double-face copper clad laminate removed, and to set the test fillet be 2.35 mm, and every group of test piece measured 5 times, is embedded in table 1 behind the calculating mean value.

Table 1

	Experimental group 1	Experimental group 2	Comparison group 1	Comparison group 2
					The first copper foil layer thickness (μ m)	5	5	12	12
Polyimides thickness (μ m)	8	13	20	25
					Adhesion layer thickness (μ m)	8	12	-	-
Thickness after the single face etching (um)	22	31	32	38
					Bounce (g)	3.2	4.8	8.5	10.5
Slip flexing number of times	100000	130000	Defective	Defective
					Resistance change rate	7.4%	4.92%	Defective	Defective

By the result shown in the table 1 as can be known, the utlity model has extremely low bounce, and can satisfy the slip testing time requirement when low flexing fillet is 0.65mm, and resistance change rate is also less than 10%.In addition, experimental group 2 is preferred embodiment of the present utility model, and the first copper foil layer of experimental group 2 adopts the high flexing carrier copper foil of high temperature, and its slip flexing number of times is more up to 130000 times, resistance change rate only 4.92%.

Above-described embodiment only is illustrative the utility model principle and effect thereof, but not is used for restriction the utility model.Rights protection scope of the present utility model should be listed such as claims.

Claims

1. combined type ultrathin double-face copper clad laminate, it is characterized in that: consisted of by the first copper foil layer, polyimide layer, adhesion layer and the second copper foil layer, described polyimide layer is folded between described adhesion layer and described the first copper foil layer, described adhesion layer is folded between described the second copper foil layer and the described polyimide layer, wherein, the thickness summation of described polyimide layer and described adhesion layer is 8～25 microns.

2. combined type ultrathin double-face copper clad laminate as claimed in claim 1, it is characterized in that: the thickness of described adhesion layer is 3～12 microns.

3. combined type ultrathin double-face copper clad laminate as claimed in claim 1, it is characterized in that: the thickness of described polyimide layer is 5～13 microns.

4. combined type ultrathin double-face copper clad laminate as claimed in claim 1, it is characterized in that: the thickness of described the first copper foil layer is 1～9 micron.

5. combined type ultrathin double-face copper clad laminate as claimed in claim 1, it is characterized in that: the thickness of described the second copper foil layer is 3～8 microns.

6. combined type ultrathin double-face copper clad laminate as claimed in claim 4, it is characterized in that: the first copper foil layer is rolled copper foil or electrolytic copper foil.

7. combined type ultrathin double-face copper clad laminate as claimed in claim 1, it is characterized in that: described the first copper foil layer and the second copper foil layer are all carrier copper foil.

8. combined type ultrathin double-face copper clad laminate as claimed in claim 1 is characterized in that: described adhesion layer is epoxy resin layer, acrylic resin layer, amido formate resin, silicon rubber resin, poly-to ring dimethylbenzene resin, bismaleimides resin or polyimide resin layer.