CN202772291U - Electrical connector structure - Google Patents
Electrical connector structure Download PDFInfo
- Publication number
- CN202772291U CN202772291U CN 201220453903 CN201220453903U CN202772291U CN 202772291 U CN202772291 U CN 202772291U CN 201220453903 CN201220453903 CN 201220453903 CN 201220453903 U CN201220453903 U CN 201220453903U CN 202772291 U CN202772291 U CN 202772291U
- Authority
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- China
- Prior art keywords
- area
- pin
- tin layer
- soldering
- connector body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 8
- 239000003292 glue Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract 6
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000048 melt cooling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
An electrical connector structure. The electrical connector structure includes: a connector body and a substrate; the connector body is provided with a plurality of pins; the substrate includes: a plurality of first connection regions and at least one second connection region; each first connecting area is provided with a plurality of first connecting parts, each first connecting part is covered with a first soldering tin layer, the first connecting parts are respectively bonded with the corresponding pins through the first soldering tin layers and are electrically connected, and the area of each first soldering tin layer is larger than that of each pin; each second connecting area is provided with a plurality of second connecting parts, each second connecting part is covered with a second soldering tin layer, the second connecting parts are respectively bonded with the corresponding pins through the second soldering tin layers and are electrically connected, and the area of each second soldering tin layer is equal to the area of each pin. The utility model discloses can not produce the phenomenon that the pin foot position drifted, and can avoid connector body and base plate to drop, still have more usage space to reduce the cost.
Description
Technical field
The utility model relates to a kind of electric connector structure, and is particularly a kind of for the electric connector structure of plate to plate (Board to Board) connector.
Background technology
At present, usually can use electric connector with the electric connection as two electronic building bricks (for example circuit board and another circuit board).Yet the characteristic of various electric connector is different, and its applicable situation is also different.
For instance, wish connects two circuit boards, can directly use Board-to-Board Electrical Connector (Board to Board connector), also be about to Board-to-Board Electrical Connector respectively with welding circuit board be electrically connected so that two circuit boards form.
Generally speaking, electric connector can pass through surface mount (Surface Mounted technology, SMT) technique and be welded on the circuit board, no matter is to take automatic piece or manually put part, and part structure dress shift phenomenon all is difficult to avoid.Moreover the assembling tolerance that increases between the circuit board module of two ends will be further tired out in the skew of part structure dress.Cause at present various electronic installation is taked the driving fit assembling design usually all towards the miniaturization development between casing and internal circuit board, the assembling tolerance of circuit board module will form adverse effect to product structure dress.If the offset error between two circuit board modules is excessive, will so will very easily cause printed circuit to damage so that circuit board extruding casing produces deformation, affect device performance.Even product did not lose efficacy during technique, deteriorated circuit is lost device useful life at last, affects consumers' rights and interests.
Therefore for addressing the above problem, traditional settling mode as shown in Figure 1, Fig. 1 illustrates a kind of vertical view of known electric connector structure.When the connector body 110 of electric connector 100 is fastened on the substrate 120 in the surface mount technology mode, because pin 112 and substrate 120 are that pin 112 is positioned on the bonding pad 122 of coating soldering-tin layer 124, utilize soldering-tin layer heat to melt cooling and fix and produce electric connection with mutual bonding.But when carrying out reflow process, soldering-tin layer 124 is in a liquid state under hot environment, so that pin 112 easily produces the skew of sliding, and produces the problem of part structure dress offset error.Therefore, utilize fixture 130 that connector body is fixed on the substrate 120 to solve the problem of aforementioned slip skew.
If but use the aforesaid settling mode that utilizes fixture 130 fixed connector bodies 110, meeting and then causes on the substrate and can reduce for the area of cabling so that substrate 120 spendable areas must be sacrificed a part plugs fixingly for fixture 130.In addition, increasing fixture 130 at electric connector also is an extra cost, so that the cost of electric connector 100 improves, and reduces competitiveness on its price.
Therefore, need to provide a kind of electric connector structure to solve the problems referred to above.
The utility model content
In view of the problem that prior art causes, the problem that the utility model provides a kind of electric connector structure to be caused to overcome prior art.
According to an execution mode of the present utility model, a kind of electric connector structure comprises connector body and substrate.Connector body has a plurality of pins.Substrate comprises a plurality of the first bonding pads and a plurality of the second bonding pad.Each first bonding pad has a plurality of the first connecting portions.Cover the first soldering-tin layer on each first connecting portion, the first connecting portion is electrically connected with corresponding pin respectively by the first soldering-tin layer, and wherein the area of each the first soldering-tin layer is greater than the area of each pin.Each second bonding pad has a plurality of the second connecting portions.Cover the second soldering-tin layer on each second connecting portion, the second connecting portion is electrically connected with corresponding pin respectively, and wherein the area of each the second soldering-tin layer equals the area of each pin.
The present invention also discloses a kind of electric connector structure, and this electric connector structure comprises: a connector body, and this connector body has a plurality of pins; An and substrate, this substrate comprises: a plurality of the first bonding pads, each this first bonding pad has a plurality of the first connecting portions, cover one first soldering-tin layer on each this first connecting portion, those first connecting portions bind with corresponding those pins respectively by those first soldering-tin layers and are electrically connected, and wherein the area of each this first soldering-tin layer is greater than the area of each this pin; And at least one the second bonding pad, each this second bonding pad has a plurality of the second connecting portions, cover one second soldering-tin layer on each this second connecting portion, those second connecting portions bind with corresponding those pins respectively by those second soldering-tin layers and are electrically connected, and wherein the area of each this second soldering-tin layer equals the area of each this pin.
In an execution mode of the present utility model, the area of each the first soldering-tin layer equals the area of each the first connecting portion.
In an execution mode of the present utility model, the area of each the second soldering-tin layer equals the area of each the second connecting portion.
In an execution mode of the present utility model, pin lays respectively at the two side of connector body.
In an execution mode of the present utility model, pin equally spaced is arranged in the two side of connector body.
In an execution mode of the present utility model, two two opposite ends that lay respectively at connector body wherein, the first bonding pad.
In an execution mode of the present utility model, substrate is printed circuit board (PCB).
In an execution mode of the present utility model, connector body is the board to board connector body.
In an execution mode of the present utility model, the end face of each the first connecting portion is goldleaf layer or tinfoil paper layer surface.
In an execution mode of the present utility model, the end face of each the second connecting portion is goldleaf layer or tinfoil paper layer surface.
Electric connector structure of the present utility model because of the second connecting portion with after pin is connected, can be so that connector body be connected and can not produces the phenomenon of pin pin position drift when reflow process with substrate.In addition, because of the area of the first soldering-tin layer of the first connecting portion greater than pin, therefore after the first soldering-tin layer and pin were connected and fixed, electric connector structure of the present utility model can keep certain plug intensity.Therefore connector body can not cause connector body and substrate to come off because carrying out Plug Action.
In addition, electric connector structure of the present utility model is not because using fixture fixed connector body, so do not need to reserve for the fixing space of fixture, so that substrate can have more usage space so that cabling to be provided at substrate.In addition, because electric connector structure of the present utility model does not need to use fixture, therefore the cost in the time of can reducing the electric connector structure making.
Description of drawings
For above and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 illustrates a kind of vertical view of known electric connector structure.
Fig. 2 illustrates the vertical view according to a kind of electric connector structure of an execution mode of the present utility model.
Fig. 3 illustrates the three-dimensional exploded view according to the electric connector structure of Fig. 2.
The primary clustering symbol description:
100 electric connectors, 212 pins
110 connector bodies 214 plug together mouth
112 pins, 220 substrates
120 substrate 221a the first bonding pad
122 bonding pad 221b the second bonding pad
124 soldering-tin layer 222a the first connecting portion
130 fixture 222b the second connecting portion
200 electric connector 224a the first soldering-tin layer
210 connector body 224b the second soldering-tin layer
Embodiment
Below will spirit of the present utility model clearly be described with accompanying drawing and detail specifications, those of ordinary skill under any in the technical field is after understanding preferred embodiment of the present utility model, should be by the technology of the utility model institute teaching, change and modification, it does not break away from spirit of the present utility model and scope.
Please refer to Fig. 2, it illustrates the vertical view according to a kind of electric connector 200 structures of an execution mode of the present utility model.As shown in Figure 2, electric connector 200 structures comprise connector body 210 and substrate 220.Connector body 210 forms an electric connector 200 structures in conjunction with substrate 220 and after being electrically connected, and this electric connector 200 can utilize plugging together of arranging on the connector body 210 214 to plug together fixing with other electronic building bricks and be electrically connected.
On the other hand, each second bonding pad 221b has a plurality of the second connecting portion 222b.The upper second soldering-tin layer 224b that covers of each second connecting portion 222b, the second connecting portion 222b is electrically connected with corresponding pin 212 respectively by the second soldering-tin layer 224b.Wherein, the area of each the second soldering-tin layer 224b equals the area of each pin 212 haply.In addition, respectively and electric connection fixing with corresponding pin 212 bondings of the second soldering-tin layer 224b.When pin 212 was connected via surface mount technology with the second soldering-tin layer 224b, the second soldering-tin layer 224b under hot environment was in a liquid state and engages with pin 212.The area of cause the second soldering-tin layer 224b and pin 212 is roughly the same, therefore pin 212 and the second soldering-tin layer 224b can not produce the state of drift, can be orientation and substrate 220 be connected and fixed accurately so that pin 212 can not produce offset error when being fixed on the substrate 220 via the second soldering-tin layer 224b.In the present embodiment, the area of the area of the second soldering-tin layer 224b and the second connecting portion 222b is roughly the same.And in other embodiments, the area of the second connecting portion 222b also can be designed to the area greater than the second soldering-tin layer 224b.
In the present embodiment, the opposite end on two long limits of connector body 210 is set to respectively the first bonding pad 221a, and the second bonding pad 221b is set between the two first bonding pad 221a.In other embodiments, a plurality of the first bonding pad 221a and the second bonding pad 221b also can be set simultaneously between the two first bonding pad 221a.Therefore, when the second soldering-tin layer 224b on the second connecting portion 222b of the second bonding pad 221b was connected with pin 212, connector body 210 can be connected with substrate 220 exactly and can not produce the phenomenon of pin 212 pin position drifts.The first soldering-tin layer 224a on the first connecting portion 222a of both sides the first bonding pad 221a is connected with pin 212, so that electric connector of the present utility model 200 structures have higher plug intensity.Therefore, electric connector 200 can not cause connector body 210 and substrate 220 to come off because carrying out Plug Action.
In the present embodiment, substrate 220 is that printed circuit board (PCB) and connector body 210 are the board to board connector body.In other embodiments, connector body 210 also can be the connector body of other types of attachment, for example the wire pair board connector body.
Please refer to Fig. 3, it illustrates the three-dimensional exploded view according to electric connector 200 structures of Fig. 2.As shown in Figure 3, substrate 220 has goldleaf layer or tinfoil paper layer surface so that the end face of the first connecting portion 222a and the second connecting portion 222b exposes after processing.And then when carrying out surface mount technology, the end face of the first connecting portion 222a and the second connecting portion 222b utilizes respectively screen-printing machine to spread the first soldering-tin layer 224a and the second soldering-tin layer 224b.In addition, it is upper and carry out the technique of piece that the pin 212 of connector body 210 is put into respectively the first soldering-tin layer 224a and the second soldering-tin layer 224b.Afterwards, substrate 220 and connector body 210 are put into the reflow stove to carry out reflow process.The reflow stove utilizes hot blast it to be melted the first soldering-tin layer 224a and the second soldering-tin layer 224b heating, and the first soldering-tin layer 224a after the fusing and the second soldering-tin layer 224b can present liquid state and mutually bind fixing with the goldleaf layer of the first connecting portion 222a and the second connecting portion 222b or tinfoil paper layer the pin 212 of connector body 210 respectively and so that pin 212 can pass through the first soldering-tin layer 224a and the second soldering-tin layer 224b and substrate 220 electric connections.
By above-mentioned the utility model execution mode as can be known, application the utlity model has following advantage:
(1) electric connector structure of the present utility model because of the second connecting portion with after pin is connected, can be so that connector body be connected and can not produces the phenomenon of pin pin position drift when reflow process with substrate.In addition, because of the area of the first soldering-tin layer of the first connecting portion greater than pin, therefore after the first soldering-tin layer and pin were connected and fixed, electric connector structure of the present utility model can keep certain plug intensity.Therefore connector body can not cause connector body and substrate to come off because carrying out Plug Action.
(2) electric connector structure of the present utility model is not because using fixture fixed connector body, so do not need to reserve for the fixing space of fixture, so that substrate can have more usage space so that cabling to be provided at substrate.In addition, because electric connector structure of the present utility model does not need to use fixture, therefore the cost in the time of can reducing the electric connector structure making.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220453903 CN202772291U (en) | 2012-09-06 | 2012-09-06 | Electrical connector structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220453903 CN202772291U (en) | 2012-09-06 | 2012-09-06 | Electrical connector structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202772291U true CN202772291U (en) | 2013-03-06 |
Family
ID=47778840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220453903 Expired - Fee Related CN202772291U (en) | 2012-09-06 | 2012-09-06 | Electrical connector structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202772291U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105634401A (en) * | 2015-08-30 | 2016-06-01 | 苏州快可光伏电子股份有限公司 | Integrated photovoltaic power station combiner box control module |
-
2012
- 2012-09-06 CN CN 201220453903 patent/CN202772291U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105634401A (en) * | 2015-08-30 | 2016-06-01 | 苏州快可光伏电子股份有限公司 | Integrated photovoltaic power station combiner box control module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20190906 |