CN202759740U - Apparatus for mounting electronic components - Google Patents

Abstract

An electronic component mounting apparatus capable of improving both the approximation accuracy of the working height and the productivity in a method of calibrating the working height by approximating the warping deformation of the substrate with a curved surface model. For a rectangular substrate (3) whose positions are restricted in the vertical direction by a clamping mechanism, the working height is corrected by approximating the warping deformation of the substrate (3) with a curved surface model, Obtain height measurement data based on the measurement of the height of the predetermined measurement point (Pm) set on the substrate (3), and the fixed data that is stored as the fixed data that calculates the height of the position regulation surface of the pressing member (2b) in advance, that is, the regulation surface height data (Hf1~10) to operate the quartic surface model. Accordingly, the approximation accuracy can be improved, and the time required for height measurement can be shortened by reducing the number of necessary height measurement points.

Description

Devices for Mounting Electronic Components

technical field

The utility model relates to an electronic component mounting device which uses a substrate as an object to perform electronic component mounting operations.

Background technique

An electronic component mounting line that mounts electronic components on a substrate to produce a mounted substrate is connected to a coating device that applies a viscous material such as solder paste or adhesive for bonding electronic components to the substrate, and mounts the electronic component on the substrate after coating. A substrate component mounting device or the like is configured by having a plurality of electronic component mounting devices with different work functions. The above-mentioned electronic component mounting equipment conveys the substrate from the upstream side to the downstream side, and at the same time, the component mounting operation and the coating operation of the viscous body are performed on the substrate by the component mounting head, the coating head and other operation heads included in each device. Scheduled work for the installation of electronic components.

In recent years, along with progress in miniaturization and high functionality of electronic equipment, mounting substrates assembled in electronic equipment have been miniaturized and thinned in pursuit of high-density and high-precision mounting methods, and warping deformation of the substrate is likely to occur. For example, in a thin resin substrate lacking in rigidity, the state of local deformation on the surface of the substrate may show different complicated warping deformation. Therefore, in the coating device that coats the resin for bonding electronic components on the substrate surface, the coating height between the coating nozzle and the substrate surface varies according to the working position due to the warping deformation of the substrate, so normal coating cannot be ensured. The amount of cloth and the shape of the application become the cause of poor installation in the next process. In addition, in a component mounting device for assembling electronic components, if the electronic components formed with solder bumps are directly mounted on a substrate with complex warping deformation, the solder bumps cannot be normally welded to the electrodes of the substrate, and lead-off is likely to occur. poor connection, insufficient joint strength, etc.

As a countermeasure to prevent as much as possible the disadvantages caused by the above-mentioned warping deformation of the substrate, a technique is known in which a mathematical expression is prepared for the shape of the substrate surface in advance based on the results of height measurement at a plurality of measurement positions set on the substrate surface. The approximate curved surface model is used to obtain and correct the working height at the working position when the work is performed (for example, refer to Patent Document 1). In the prior art example shown in this patent document, by setting an auxiliary measurement position other than the normal measurement position on the substrate surface, local displacement due to discontinuity of the substrate surface, such as when the measurement position is located at a notch, is prevented. The effect of the increase or decrease on the hypothetical surface model.

prior art literature

patent documents

Patent Document 1: International Publication No. 2007/063763

However, including the examples shown in the above-mentioned patent documents, in the prior art that approximates the warping deformation of the substrate surface with a curved surface model represented by a mathematical expression, there is a problem that the accuracy of the approximate expression used in the curved surface model is Sometimes it cannot be approximated with the accuracy required for the warpage deformation of the substrate in the actual working state. That is, in the actual working state, the side ends of the opposite sides of the substrate are clamped by the clamping mechanism, and the upper and lower positions of the substrate are restricted in the above-mentioned two side ends, which is different from the warping deformation in the free state. shape.

In the case of the above-mentioned fixed state where the positions of both ends are restricted, the warping deformation of the substrate has an inflection point due to the restricted positions of both ends, and in the approximation of the quadratic surface used in the prior art, the approximation accuracy of the curved surface shape is improved. Getting to the necessary level is difficult. Also, if a higher-order curved surface model is used in order to improve the approximation accuracy, the number of necessary height measurement points will increase, and the time required for height measurement will be delayed, resulting in decreased productivity. Therefore, in the method of correcting the working height by approximating the warping deformation of the substrate with a curved surface model in the conventional electronic component mounting device and the work execution method in the electronic component mounting device, it is difficult to increase the working height at the same time. Problems of approximation accuracy and productivity.

Utility model content

Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of improving the approximation accuracy of the working height and improving the productivity in a method of calibrating the working height by approximating the warping deformation of the substrate with a curved surface model.

The device for mounting electronic components according to claim 1 of the present invention is aimed at a rectangular substrate whose position is restricted in the vertical direction by the side ends of opposite sides by a clamping mechanism, and executes a predetermined operation for mounting electronic components. The above-mentioned electronic component mounting device is characterized in that it has: a working operation mechanism for performing the above-mentioned work by raising and lowering the work head relative to the work position on the above-mentioned substrate where the above-mentioned work is performed; The height data of the restriction surface of the height position of the position restriction surface; the height measurement unit measures the height position of the predetermined measurement point set on the upper surface of the substrate at the restricted position to obtain the height measurement data; the warpage shape calculation part is based on The height data of the restriction surface and the height measurement data obtain a curved surface model that approximates the warped shape of the substrate in the state of the restricted position by a mathematical expression; The height position of the above-mentioned operation position is used to control the above-mentioned operation mechanism, so that the above-mentioned operation head performs the above-mentioned operation.

Claim 2 relates to the device for mounting electronic components according to Claim 1, wherein the curved surface model is formed by passing the Z coordinate representing the height position of an arbitrary point on the surface of the substrate through the horizontal direction position of the arbitrary point. The quartic surface model obtained by the quartic formula of X coordinate and Y coordinate.

According to the present invention, the work height is corrected by approximating the warping deformation of the substrate with a curved surface model for a rectangular substrate whose positions are restricted in the vertical direction by the clamping mechanism. The curved surface model can be calculated based on the height measurement data obtained by measuring the height of a predetermined measurement point set on the upper surface of the substrate and the height data of the restriction surface obtained by obtaining the height of the position restriction surface of the clamp mechanism in advance and stored. Using a high-order curved surface model improves the approximation accuracy, reduces the number of required height measurement points, shortens the time required for height measurement, and improves both the approximation accuracy and productivity of the working height.

Description of drawings

FIG. 1 is a plan view showing the structure of a component mounting device according to one embodiment of the present invention.

FIG. 2 is a structural explanatory diagram of a board transfer mechanism and a clamping mechanism in the component mounting device according to the embodiment of the present invention.

3( a ) and 3 ( b ) are functional explanatory diagrams of the clamping mechanism in the component mounting device according to one embodiment of the present invention.

FIG. 4 is a configuration explanatory diagram of a mounting head and a height measuring unit in the component mounting device according to the embodiment of the present invention.

5 is an explanatory diagram of a component mounting operation performed by a mounting head in the component mounting device according to the embodiment of the present invention.

6 is an explanatory diagram of a curved surface model used for approximating warping deformation of the substrate in the component mounting device according to the embodiment of the present invention.

7( a ) and 7 ( b ) are explanatory diagrams illustrating the arrangement of measurement points for height measurement set on the substrate in the component mounting device according to the embodiment of the present invention.

FIG. 8 is a block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention.

FIG. 9 is a processing flowchart showing a job execution method in the electronic component mounting device according to the embodiment of the present invention.

Detailed ways

Next, embodiments of the present utility model will be described with reference to the drawings. First, the overall structure of the component mounting apparatus 1 will be described with reference to FIGS. 1 to 4 . The component mounting device 1 is an electronic component mounting device used for mounting electronic components on a substrate to manufacture an electronic component mounting line for mounting the substrate. The rectangular substrate 3 serves as a target, and has a function of performing component mounting work, which is a predetermined work for mounting electronic components.

In FIG. 1 , a substrate transfer mechanism 2 is disposed along the X direction (substrate transfer direction) at the central portion of a susceptor 1 a. The substrate conveying mechanism 2 conveys the rectangular substrate 3 fed from the upstream side, has a function of positioning the substrate 3 at the mounting operation position of the component mounting mechanism described below, and has two conveying rails 2 a arranged in parallel. In the central portion of the substrate conveying mechanism 2, there is a substrate lower support mechanism 2c for lowering the substrate 3 that is carried in, and the sides that press and clamp the opposite sides of the substrate 3 lifted up by the substrate lower support mechanism 2c from above. The pressing member 2b at the end.

Component supply units 4 for supplying electronic components to be mounted are arranged on both sides of the substrate conveyance mechanism 2 . A plurality of tape feeders 5 are arranged in parallel in the component supply unit 4 , and the tape feeders 5 have a function of delivering components held on the conveyor belt to a take-out position of a component mounting mechanism described below at intervals. A Y-axis moving table 6 is disposed on one end portion of the upper surface of the base 1 a in the X direction, and two X-axis moving tables 7 are connected to the Y-axis moving table 6 , which can slide freely along the Y direction. Mounting heads 8 that are slidable along the X direction and that move integrally with the laser displacement gauge 10 are attached to the X-axis moving tables 7 .

The mounting head 8 is a multi-connected head composed of a plurality of unit holding heads 9, and holds the electronics to be mounted by vacuum suction from the tape feeder 5 through the suction nozzle 9a (refer to FIG. 4 ) installed at the lower end of the unit holding head 9. Part 14. The Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism for moving the mounting head 8 . By driving the head moving mechanism, the mounting head 8 moves between the component supply unit 4 and the substrate 3 positioned on the substrate transfer mechanism 2 , and the electronic component 14 held is mounted on the substrate 3 by lifting the mounting head 8 on the substrate 3 .

The head moving mechanism that moves the mounting head 8 and the mounting head 8 constitutes a component mounting mechanism that takes out components from the component supply unit 4 and mounts them on the substrate 3 . In addition, in the electronic component mounting device, the component mounting mechanism and the substrate conveying mechanism 2 serve as a working operation mechanism, and the mounting head 8, which is the working head, is raised and lowered relative to the working position on the substrate 3 where the work is performed, so that the component mounting is performed. Scheduled jobs.

Board recognition cameras 11 that move integrally with the mounting heads 8 are mounted on the lower surfaces of the X-axis moving tables 7 . The substrate recognition camera 11 is moved above the substrate 3 held by the substrate conveyance mechanism 2 by driving the head moving mechanism, and the substrate recognition camera 11 takes an image of the recognition mark formed on the substrate 3 . A component recognition camera 12 and a suction nozzle accommodating portion 13 are arranged on a moving path of the mounting head 8 between the component supply unit 4 and the substrate transfer mechanism 2 . The component recognition camera 12 takes an image of the component held by the mounting head 8 by performing a scanning operation in which the mounting head 8 that has taken out the component from the component supply unit 4 passes above the component recognition camera 12 in a predetermined direction. A plurality of suction nozzles 9 a attached to the unit holding head 9 are housed and held in the suction nozzle housing portion 13 corresponding to the type of components. When the mounting head 8 enters the nozzle accommodating portion 13 to perform a nozzle exchange operation, the nozzles 9a mounted on the unit holding head 9 can be exchanged according to the type of parts.

The configuration and function of the substrate transfer mechanism 2 will be described with reference to FIG. 2 , and FIGS. 3( a ) and 3 ( b ). As shown in FIG. 2 , the substrate transfer mechanism 2 is composed of two transfer rails 2 a arranged in parallel, and a conveyor mechanism 20 is provided inside the transfer rails 2 a along the transfer direction. By driving the conveyor mechanism 20 in a state where both end portions of the substrate 3 are in contact with the upper surface of the conveyor mechanism 20 , the substrate 3 is conveyed along the substrate conveyance direction. In the central portion of the substrate transfer mechanism 2, a substrate lower support mechanism 2c is arranged corresponding to the working position of the component mounting mechanism.

The substrate lower support mechanism 2c is configured to raise and lower the horizontal plate-shaped base part 21 (arrow a) by the elevating mechanism 23, and a lower support frame for supporting the substrate 3 from the lower side, a lower support pin, etc. are mounted on the upper surface of the base part 21. Lower support member (illustration omitted). Clamping members 22 are vertically provided on both side ends of the base portion 21 , and the clamping members 22 are raised and lowered by driving the elevating mechanism 23 to advance and retreat relative to the lower position regulating surface 2 d of the pressing member 2 b. Thereby, the side end parts of the two opposing sides of the board|substrate 3 are sandwiched and clamped and fixed, and positional regulation can be performed in an up-down direction. Therefore, the elevating mechanism 23 , the base portion 21 , the clamp member 22 , and the pressing member 2 b constitute a clamp mechanism that restricts the position of the side ends of the opposite sides of the substrate 3 in the vertical direction.

3( a ) shows a state where the substrate 3 delivered to the substrate transfer mechanism 2 from the upstream side is conveyed to the substrate lower support mechanism 2 c by supporting the side ends of opposite sides by the conveyor mechanism 20 . In this state, the substrate 3 maintains the warped deformation state caused by the heat history, processing external force, etc. before the process, and in the example shown, becomes a simple upward warped deformation that is convex upward. FIG. 3( b ) shows a state in which the substrate lower support mechanism 2 c is operated to clamp both side ends of the substrate 3 . That is, by driving the elevating mechanism 23, the base part 21 is raised (arrow b), and rises together with the clamping member 22 (arrow c), so that both side ends of the substrate 3 are sandwiched by the upper end surface of the clamping member 22 and positionally restricted. It is clamped and fixed between the faces 2d.

Furthermore, due to this clamping and fixing, the warped deformation state of the substrate 3 changes. That is, since both end portions of the substrate 3 are pressed against the planar position regulating surface 2d by the clamp member 22, the substrate 3 becomes a planar state without plane displacement within this range. In addition, a curve PI representing the boundary between the upwardly concave upper curvature surface R1 and the upwardly convex lower curvature surface R2 appears in the portion where the planar range transitions to the original upward warping deformation range of the substrate 3 . This curve PI appears on both sides of the substrate 3, and the warping deformation of the substrate 3 in the clamped and fixed state shown in FIG. up-warped shape.

Next, the configuration and functions of the mounting head 8 will be described with reference to FIGS. 4 and 5 . As shown in FIG. 4 , mounting head 8 has a plurality of (here, four) unit holding heads 9 , and suction nozzles 9 a are detachably attached to the lower ends of each unit holding heads 9 . The electronic component 14 is sucked and held by the suction nozzle 9 a by vacuum suction from the suction nozzle 9 a by operating the vacuum suction system included in the mounting head 8 . The mounting head 8 holding the electronic component 14 by the suction nozzle 9 a moves on the substrate 3 to move the suction nozzle 9 a up and down to mount the electronic component 14 on the component mounting point of the substrate 3 .

In this component mounting operation, since the substrate 3 is warped and deformed, as shown in FIG. The height position H0 differs by the height error ΔH caused by warping deformation. If this height error ΔH is neglected and the normal height position H0 is used as the mounting reference height to carry out component mounting operation by the unit holding head 9, when the suction nozzle 9a holding the electronic component 14 is lowered relative to the upper surface 3a, the height error ΔH will be increased. The electronic component 14 is damaged by pressing into the substrate 3 and receiving an excessive pressure load.

In addition, conversely, when the height position H1 is lower than the regular height position H0 and the height error ΔH is a negative value, the electronic component 14 stops the descent of the suction nozzle 9a before landing on the upper surface 3a during the component mounting operation. Since the suction and holding of the lower suction nozzle 9a is released, positional deviation of the mounting position due to the falling of the electronic component 14 is likely to occur. In order to prevent the failure of the component mounting work due to the above-mentioned warping deformation of the substrate 3, in this embodiment, the state of the warping deformation of the substrate 3 is measured before the component mounting operation, and the component mounting height, that is, the height of the component mounting point is corrected. Location.

The measurement of this warpage deformation state is performed using the laser displacement meter 10 installed so that it can move integrally with the mounting head 8 . That is, as shown in FIG. 4 , the laser displacement gauge 10 is provided on the mounting head 8 so that the measurement direction faces the lower side, and by moving the mounting head 8, the laser displacement gauge 10 can be positioned on the substrate positioned by the substrate conveying mechanism 2. 3 above any measurement point Pm. The measurement signal acquired by the laser displacement gauge 10 is received by the height measurement part 34 (refer FIG. 8), and the measurement height position Hm with respect to the measurement point Pm is calculated|required. Then, based on the data of a plurality of measurement height positions Hm obtained for a plurality of preset measurement points Pm, a curved surface model is generated that approximates the curved surface shape of the upper surface 3a of the substrate 3 in a state of warping deformation using a mathematical expression. , in the actual component mounting work, the component mounting height is calculated using the surface model for each target component mounting point.

A curved surface model used for the above purpose will be described with reference to FIG. 6 . FIG. 6 shows a curved surface model 3 * for approximating the three-dimensional shape of the upper surface of the substrate 3 . The curved surface model 3* is a quartic surface model represented by the quartic equation (1) shown below and shown in FIG. Z-coordinate indicating the height position of an arbitrary working position 3*a on the surface of the substrate 3 . That is, by specifying the fifteen coefficients a~o in the quartic equation (1), the quartic surface model is determined. z=ax ⁴ +bx ³ y+cx ² y ² +dxy ³ +ey ⁴ +fx ³ +gx ² y+hxy ² +iy ³ +jx ² +kxy+ly ² +mx+ny+o... (1)

As mentioned above, the warping shape of the substrate 3 in the state where both ends are clamped and fixed and the position is restricted is an upwardly convex warping shape in the middle range sandwiched by the two curves PI, so it is a curved surface. It is appropriate for the model to adopt the quartic surface model represented by the above quartic formula. Then, when obtaining the component mounting height, the z-coordinate value corresponding to the position coordinates (x, y) of each component mounting point is obtained from the quaternary equation (1) as the component mounting height of the component mounting point. Thereby, the shape change in the vicinity of the inflection point, which was neglected in the approximation method of the quadric surface model used in the prior art, is also taken into consideration, and the component mounting height with higher approximation accuracy can be calculated.

Next, altitude data used to define the fifteen coefficients a to o in the quartic equation (1) will be described with reference to FIGS. 7( a ) and 7 ( b ). As shown in FIG. 7(a), the substrate 3 conveyed by the substrate conveying mechanism 2 and positioned and held by the substrate lower support mechanism 2c is divided into the following ranges for consideration: Indicates that the substrate 3 is pressed by the clamping member 22 to the position of the two pressing members 2b A position restriction range 3f in which the position is restricted by the restriction surface 2d (see FIGS. 3( a ) and 3 ( b )), and a warping deformation range 3 c sandwiched between the position restriction range 3 f and causing warping deformation.

In this embodiment, five fixed height data points Pf(i) (i=1~5, i=6~10) are respectively set in the position limitation range 3f on both sides, and within the warping deformation range 3c Measurement points Pm(i, j) (i=1 to 5, j=1 to 3) arranged in a lattice form of 3 rows and 5 columns are set. Among the above points, the fixed height data point Pf(i) is set on the position limiting surface 2d of the fixed pressing member 2b, so it is always considered to be fixed regardless of the inherent warping deformation of the substrate 3 itself. altitude data. Therefore, if this height position is given as the first fixed data, it is not necessary to perform measurement thereafter. That is, in order to determine the curved surface model shown in FIG. 6 , it is only necessary to measure the height of the laser displacement gauge 10 on each substrate 3 only at the measurement point Pm(i,j) belonging to the warpage deformation range 3c.

Thus, as shown in Figure 7(b), the fixed height position Hf(i) (i=1~5, i=6 ~10) and the measurement height position Hm(i, j) (i=1~5, j=1~3) representing the height position of the measurement point Pm(i, j) within the warpage deformation range 3c. The fixed height position Hf(i) is the height data indicating the height position of the position limiting surface 2d of the clamping mechanism, and the measured height position Hm(i, j) is a predetermined value set by measuring the upper surface 3a of the substrate 3 at the restricted position. Height data obtained by measuring the height position of the point Pm.

Here, although a total of twenty-five points of height data are obtained, for ten of the fixed height positions Hf(i), data acquisition is performed without actual height measurement by the laser displacement meter 10, so the height can be greatly shortened. Measure the time required. In addition, in order to determine the fifteen unknown coefficients of the quartic equation (1), not all of the height data of twenty-five points is required, so the above-mentioned height data is appropriately selected and used.

Moreover, there are discontinuous parts such as notches and openings in the position restriction range 3f corresponding to the side end on the substrate 3, and if the height measurement is actually performed by the laser displacement meter 10, it may not be possible to obtain a height position that accurately represents the upper surface 3a. The case of height data. Even in the above case, as in the present embodiment, by using the fixed height position Hf(i) provided as fixed data in advance, it is possible to obtain appropriate height data for obtaining the curved surface shape of the upper surface 3a at all times, and it is possible to exclude Approximation error that is the object of height measurement due to discontinuity error.

Next, the configuration of the control system will be described with reference to FIG. 8 . The work control unit 30 controls the mechanism drive unit 32 based on various programs and data stored in the storage unit 31 to execute predetermined work operations. That is, when the mechanism driving unit 32 is controlled by the operation control unit 30 to drive the operation operation mechanism 33 , that is, the aforementioned component mounting mechanism and the substrate transfer mechanism 2 , a predetermined operation, that is, the component mounting operation is performed.

The storage unit 31 stores a work operation program 31a, regulation surface height data 31b, height measurement data 31c, and curved surface model data 31d. The work operation program 31a is an operation program for executing component mounting work. The regulation surface height data 31b is fixed height position Hf(i) shown in FIG. That is, the storage unit 31 stores the regulating surface height data 31b indicated by the height position of the position regulating surface 2d of the clamp mechanism. The height measurement data 31 c is the measured height position Hm(i, j) shown in FIG. 7 , and data measured for each substrate 3 is stored. The curved surface model data 31d is data of a curved surface model approximately representing the warped shape of the substrate 3 obtained by calculation based on the restriction surface height data 31b and the height measurement data 31c.

The height measurement unit 34 performs a process of obtaining height measurement data 31c indicating the height position of each measurement point Pm based on the height measurement results performed by the laser displacement gauge 10 for each substrate 3 . Therefore, the height measurement unit 34 and the laser displacement gauge 10 constitute a height measurement unit, and measure the height position of a predetermined measurement point Pm set on the upper surface of the substrate 3 whose position is restricted to obtain height measurement data. The obtained height measurement results are stored in the storage unit 31 as height measurement data 31c.

The warpage calculation unit 35 performs calculation processing to obtain a curved surface model approximately represented by a mathematical expression (here, a quartic surface expression) on both sides based on the restriction surface height data 31b and the height measurement data 31c. The warped shape of the substrate 3 in a state where the portion is clamped and fixed and the position is restricted. The obtained curved surface model is stored in the storage unit 31 as curved surface model data 31d. Furthermore, when causing the work head (here, the mounting head 8) to perform a predetermined work (here, the component mounting work), the work control unit 30 controls the work movement based on the height position of the work position derived using the curved surface model data 31d. agency33.

Next, the flow of FIG. 9 will describe the job execution method in the electronic component mounting device that executes the scheduled job for electronic component mounting on the substrate 3 whose position is restricted in the component mounting device 1 . First, the regulation surface height data 31b indicating the height position of the position regulation surface of the clamp mechanism is stored in the storage unit 31 (ST1) (storage step). That is, the height position of the fixed height data point Pf(i) is measured on the position regulating surface 2d of the pressing member 2b to obtain the fixed height position Hf(i) as the regulating surface height data 31b.

Afterwards, if the operation has started, the mounting head 8 is moved above the substrate 3 conveyed by the substrate lower support mechanism 2c, and the upper surface of the substrate 3, which is limited by the clamping mechanism, is sequentially measured by the laser displacement meter 10. The predetermined height position of the point Pm is measured to obtain the height measurement data 31c (ST2) (height measurement step). At this time, since the fixed height position Hf(i) corresponding to the height position of the fixed height data point Pf(i) is already known as the regulation surface height data 31b, it is not necessary to perform measurement, and the height measurement can be efficiently performed.

Next, the warpage calculation unit 35 performs arithmetic processing based on the height data 31b of the control surface and the height measurement data 31c stored in the storage unit 31, and obtains the state of the substrate in the state of being restricted by the clamping mechanism by a mathematical expression. Curved surface model of 3 (ST3) (warped shape calculation step). As a result, the quartic surface model shown in FIG. 6 is obtained and stored in the storage unit 31 as curved surface model data 31d.

Next, the height position of the working position is derived from the quartic surface model ( ST4 ). That is, by substituting the x-coordinates and y-coordinates in an arbitrary work position 3*a of the curved surface model 3* shown in FIG. 6 into the quartic surface model, the z-coordinate in the work position 3*a is derived as the work The height position of the position. At this time, since a quartic surface model is used as the surface model for deriving the height position, a good curved surface can be ensured also for the vicinity of the inflection point in the substrate 3 in a state where both side ends are restricted by the position of the clamp mechanism. Approximate precision.

Then, the work head is caused to perform work by controlling the work operation mechanism based on the derived height position (ST5) (work control step). That is, the mounting head 8 holding the electronic component 14 by the suction nozzle 9a is moved above the substrate 3, and the suction nozzle 9a is lowered with respect to the upper surface 3a based on the derived height position, whereby the electronic component 14 is mounted on the component mounting point. Component installation work. Since the height position for mounting the electronic component 14 is approximately corrected with high precision in this component mounting, it is possible to prevent problems caused by a defect in the height position during the mounting operation.

As described above, the electronic component mounting device and the electronic component mounting device shown in the present embodiment have a work execution method as follows: a rectangular shape with side ends on both sides restricted in the vertical direction by a clamp mechanism In the method of correcting the working height by approximating the warping deformation of the substrate 3 with a curved surface model, based on the height measurement data obtained by measuring the height of the predetermined measurement point Pm set on the upper surface 3a of the substrate 3 31c and the regulating surface height data 31b stored in which the height of the position regulating surface 2d of the clamping mechanism is obtained in advance, and the curved surface model is calculated. Thereby, the approximation accuracy can be improved by using a high-order curved surface model, the number of required height measurement points can be reduced, the time required for height measurement can be shortened, and the approximation accuracy and productivity of the working height can be improved at the same time.

In addition, in the above-mentioned embodiment, the example of the component mounting apparatus 1 which mounts the electronic component 14 on the board|substrate 3 by the mounting head 8 was shown as the apparatus for electronic component mounting, but this invention is not limited to the component mounting apparatus 1, as long as it is A resin coating device, such as a resin coating device that lifts and lowers the coating head relative to the substrate to carry out the resin coating operation, has a structure in which the operation head is raised and lowered to perform a predetermined operation, and becomes an application object of the present invention.

Industrial availability

The electronic component mounting device of the present invention has the effect of improving the approximation accuracy and productivity of the work height at the same time, and is useful in the field of electronic component mounting in which work is performed by lifting and lowering the work head on the substrate.

Claims (2)

1. electronic unit apparatus for mounting, be limited the rectangular-shaped substrate of position as object take the side end that makes relative both sides by clamp system at above-below direction, carry out electronic unit the predetermined operation of usefulness is installed, above-mentioned electronic unit apparatus for mounting is characterised in that to have:

The operation actuating mechanism, thereby by making the operation head carry out above-mentioned operation with respect to the job position lifting that above-mentioned operation in the aforesaid substrate is performed;

Storage part, the restriction face altitude information of the height and position of the position limitation face of the above-mentioned clamp system of storage expression;

The elevation measurement unit, measure the above-mentioned substrate that is limited the position the predetermined measuring point that sets above height and position and obtain the elevation measurement data;

The warped shapes calculating part based on above-mentioned restriction face altitude information and above-mentioned elevation measurement data, is obtained the surface model by the warped shapes of the aforesaid substrate of mathematic(al) representation approximate representation under the above-mentioned state that is limited the position; And

The operation control part is controlled above-mentioned operation actuating mechanism based on the height and position of the above-mentioned job position of deriving by above-mentioned surface model, thereby is made above-mentioned operation head carry out above-mentioned operation.

2. electronic unit apparatus for mounting as claimed in claim 1 is characterized in that,

The quartic surface model that above-mentioned surface model is obtained for the quarternary quantic of the X coordinate of the position of the horizontal direction of Z coordinate by representing this arbitrfary point of the height and position that will represent the arbitrfary point in the aforesaid substrate surface and Y coordinate.

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