CN202720616U - Touch module signal transmission structure - Google Patents

Abstract

The utility model discloses a signal transmission structure of a touch module, in which an electrical connection area for transmitting signals is planned on the inner surface of a sensing film, a base layer is arranged on the inner surface of the sensing film, and a window or a switching element is located on the base layer and corresponds to the electrical connection area, so that the electrical connection area can be electrically connected to an external signal transmission element such as a flexible circuit board or an electrical connector through the window or the switching element, so that the sensing film can be externally connected to the circuit board through the signal transmission element.

Description

Touch module signal transmission structure

technical field

The utility model relates to a signal transmission structure in a touch module, which can be applied to a touch panel of an electronic product, or directly made into a top cover of the electronic product including the touch panel. the

Background technique

In recent years, touch panels have gradually replaced traditional physical buttons, and are widely used in electronic products such as mobile phones, digital cameras, and tablet computers, and are also used in control panels of many electrical appliances. As the production technology of touch panels matures, the touch sensitivity has been greatly improved, and the application of multi-touch makes it more convenient to use. The demand for touch panels in the market continues to rise. the

The above-mentioned touch panel is mainly a touch module formed by laminating a substrate and a sensing film. The substrate is located outside the touch panel for receiving touches from users. Layer touch sensing circuit, and an electrical connection area for output signal, when the touch sensing circuit senses the touch action from the user, it will output the signal to the circuit board of the electronic product through the electrical connection area to achieve touch control the goal of. the

Since the above-mentioned touch panel needs to be combined with electronic products in practical application, and the electrical connection area of the sensing film and the circuit board of the electronic product must be electrically connected through a flexible circuit board; however, the sensing film is exposed on the touch panel. Therefore, in the process of setting a flexible circuit board on the sensing film, or combining the touch panel with an electronic product, it is easy to touch the sensing film and increase the probability of damage. Covering a base layer, in addition to protecting the sensing film and improving the pass rate of the touch panel, the base layer can be designed with structures such as buckles, so that when it is installed in an electronic product, it can be directly buckled on the lower cover of the electronic product, so that the overall touch The control module can replace the upper cover of traditional electronic products. the

However, when the inner surface of the sensing film is coated with a base layer, an electrical connection area must still be reserved on the inner surface of the sensing film for the subsequent electrical connection between the sensing film and the circuit board of the electronic product. In view of this, the inventors further proposed the signal transmission structure of the touch module of the present invention, so as to overcome the aforementioned problems of the exposed inner surface of the sensing film and the electrical connection between the sensing film and the circuit board. the

In addition, there is already a curved capacitive touch panel technology in the industry, such as U.S. Patent No. US20100103138A1 and Taiwan Patent No. I 3200073, which can directly make the touch panel into the shell of an electronic product, thereby saving production costs ; However, these existing technologies do not have a base layer, nor do they provide a solution for electrical connection with the circuit board of an electronic product, and there is still room for improvement in practical application. the

Utility model content

The purpose of this utility model is to provide a signal transmission structure of a touch module, especially to set a base layer on the inner side of the circuit board of the touch module adjacent to the electronic product, and reserve a window for external connection of the circuit board or The transfer element is used to simplify the process and save the production cost. the

In order to achieve the above purpose, the utility model is a signal transmission structure of a touch module, comprising:

A sensing film has an outer surface for sensing external touch, and an inner surface opposite to the outer surface, and has an electrical connection area for sensing signals on the inner surface;

A protective cover is arranged on the electrical connection area on the inner surface of the sensing film;

A base layer, combined on the inner surface of the sensing film by injection molding, so that the electrical connection area is isolated in the protective cover and not covered by the base layer; and

A window is formed on the base layer by cutting and removing the protection cover, so that the electrical connection area is exposed. the

During implementation, the exposed electrical connection area through the window is electrically connected to an external signal transmission element. the

During implementation, the signal transmission element can use any electronic element that can be electrically connected to the electrical connection area of the aforementioned sensing film, so that the circuit board of an external electronic product can be electrically connected through the signal transmission element, For example: flexible circuit boards, electrical connectors, etc. Or, when implementing signal transmission components, more advanced laser (laser) can also be used to construct forming adapters, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating Connector), and then use conductive glue ( ACF, Anisotropic Conductive Film) is connected to the electrical connection area of the induction film; these electrical connectors belong to the prior art, and will not be described in detail here. the

During implementation, the protective cover includes a frame embedded on the base layer and attached to the inner surface, and a cover part located in the frame and covering the electrical connection area, with a gap between the cover part and the electrical connection area. There is a gap, and the covering part is cut and removed to form the window in the frame; at least one ring groove is provided around the periphery of the covering part and the inner wall of the frame to facilitate cutting. the

In addition, another embodiment of the signal transmission structure of the touch module of the present invention includes:

A sensing film has an outer surface for sensing external touch, and an inner surface opposite to the outer surface, and has an electrical connection area for sensing signals on the inner surface;

A transfer element, having a first connection circuit and a second connection circuit that conduct each other, the transfer element is arranged outside the electrical connection area on the inner surface of the sensing film, and the first connection circuit is electrically connected to the an electrical connection area, and a second connection circuit is exposed on the inner surface of the sensing film; and

A base layer, which is combined on the inner surface of the sensing film by injection molding so that the second connection circuit of the adapter element is exposed on the base layer, and is connected to a signal transmission element with power supply, so that the signal transmission element can pass through the signal transmission element very conveniently The ground is electrically connected to a circuit board of an external electronic product. the

With the above structure, the electrical connection area of the sensing film can be easily connected to the circuit board of the external electronic product through the signal transmission element through the first connection circuit of the transfer element and the second connection circuit exposed on the base layer. sexual connection. the

During implementation, the transition element described can be an electrical connector of general specifications, such as: flexible circuit board connector (FPC Connector), board-to-board connector (Board to Board, BTB Connector), etc., or Use more advanced laser (laser) to construct shaped connectors, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating Connector), and then use conductive glue (ACF, Anisotropic Conductive Film) and induction film The electrical connection areas are connected. the

In conjunction with this embodiment, the signal transmission element can be any electronic element that can be electrically connected to the aforementioned various transition elements, for example: a flexible circuit board, an electrical connector, or the aforementioned laser (laser ) to construct adapters corresponding to shaped connectors, etc. Alternatively, the adapter element is composed of a bracket and a flexible circuit board bent and attached to the bracket, wherein the flexible circuit board is preset with a first connection circuit and a second connection circuit that are electrically connected to each other. The connection circuits extend to the front and back sides of the bracket respectively, and the first connection circuit is attached to the electrical connection area to be electrically connected, and the second connection circuit is exposed on the base layer after the base layer is provided, so that the The second connection circuit is electrically connected with the circuit board of the electronic product through the signal transmission element. the

In addition, the utility model also includes:

The outer surface and the inner surface of the sensing film are flat or protruding outward, and the outer surface of the sensing film is superimposed and fixed on the inner surface of a substrate that is the same plane or protruding outward; the outer surface of the substrate and the sensing film are bonded to each other by an adhesive layer. the

The sensing film is a carbon nanotube film or an indium tin oxide film; among them, the carbon nanotube film has the advantages of good electrical conductivity, high temperature resistance, high tensile strength, high structural strength, light transmission, and easy manufacturing. Therefore, it is especially suitable for the process that after the sensing film is laminated and fixed on the inner surface of the substrate, it is then integrally pressed to protrude outward. the

The signal transmission element is a flexible circuit board, an electrical connector, or a laser-constructed molding adapter. the

One or more buckling parts are arranged at appropriate positions around the base layer, so that when the subsequent overall touch module is installed on the electronic product, it can be directly buckled on the lower cover of the electronic product. the

Compared with the prior art, the utility model has the following advantages:

1. Set a base layer on the inner side of the sensing film adjacent to the circuit board of the electronic product. If it is applied to the touch panel of the electronic product and the touch module is assembled above the liquid crystal display (LCD) of the electronic product, the base layer can Protecting the sensing film or the liquid crystal display can not only improve the yield rate of the overall touch module, but also support the pressure of the sensing film when it is touched and pressed in the future, and prevent the sensing film and the liquid crystal display from colliding with each other. damage if touched. the

2. When the outer surface of the sensing film is superimposed and fixed on the inner surface of a substrate, and the base layer is combined with the inner surface of the sensing film by injection molding, the base layer can be provided with structures such as buckles during integral molding for subsequent installation In the case of electronic products, it is directly buckled on the lower cover of the electronic product, so that the overall touch module can replace the upper cover of the traditional electronic product. the

3. When the subsequent touch module is assembled in an electronic product, the electrical connection area of the sensing film can be easily connected to an external circuit board through a signal transmission element to transmit signals through a window or an adapter element. the

Description of drawings

Fig. 1 is a perspective view of a touch module of the present utility model;

Fig. 2 is a perspective exploded view of a touch module of the present invention;

Fig. 3 is a schematic sectional view of Fig. 2 embodiment;

Fig. 4 is another cross-sectional schematic diagram of Fig. 2 embodiment;

Fig. 5 is a partially enlarged perspective view of the use state of Fig. 2;

Fig. 6 is a perspective view of another touch module of the present utility model;

Fig. 7 is a schematic cross-sectional view of an additional implementation type of Fig. 4 embodiment;

Fig. 8 is a perspective view of another touch module of the present utility model;

Fig. 9 is a schematic sectional view of another additional implementation type of Fig. 4 embodiment;

Figure 10 is a schematic cross-sectional view of another touch module of the present invention;

Figure 11 is a perspective view of the configuration steps of the adapter element of the embodiment of Figure 10;

Fig. 12 is a bottom perspective exploded view of the embodiment of Fig. 10;

Fig. 13 is a partially enlarged perspective view of the use state of Fig. 12;

Fig. 14 is a schematic cross-sectional view of an additional implementation type of the embodiment of Fig. 10;

Fig. 15 is a schematic cross-sectional view of another additional implementation type of the embodiment of Fig. 10;

FIG. 16 is a schematic cross-sectional view of yet another additional implementation of the embodiment of FIG. 10 . the

Explanation of reference signs:

100, 100a, 100b-touch module; 200-electronic product; 300-gap; 11, 11a, 11b-sensing film; 111, 111a, 111b-outer surface; 112, 112a, 112b-inner surface; 113-electrical connection 12, 12a, 12b-base layer; 121, 121a, 121b-joint surface; 122-bottom surface; 123-fastener; 13, 13a, 13b-substrate; Base surface; 14-adhesive layer; 20-protective cover; 21-window; 22-frame; 23-covering part; 24-ring groove; ; 33, 33a-first connection circuit; 34, 34a-second connection circuit; 35-insulation frame; 40-1 signal transmission element. the

Detailed ways

Please refer to FIG. 1, which reveals that the touch module 100 of the present invention can be arranged on an external electronic product 200 such as a mobile phone, and there is a circuit board (not drawn) between the touch module 100 and the electronic product 200. A liquid crystal display (LCD, not shown), and with reference to Fig. 2 to Fig. 5, illustrates a signal transmission structure of a touch module of the present invention, including a sensing film 11, a protective cover 20, a base layer 12 and a window 21; :

The sensing film 11 has an outer surface 111 for sensing external touch, and an inner surface 112 opposite to the outer surface 111 , and the inner surface 112 has an electrical connection area 113 for outputting touch sensing signals. the

The sensing film 11 is a light-transmitting conductive film, such as a carbon nanotube film, an indium tin oxide film or other films with similar properties. The carbon nanotube film has good electrical conductivity, high temperature resistance, and high tensile strength. Strength, high structural strength, light transmission, easy manufacture, etc., so it is suitable as the transparent conductive film in the touch module 100, and the touch sensing circuit pattern structure is provided on the sensing film 11. the

The protective cover 20 is disposed outside the electrical connection area 113 on the inner surface 112 of the sensing film 11 in an adhesive manner. the

The base layer 12 is combined with the inner surface 112 of the sensing film 11 by injection molding, so that the electrical connection area 113 is isolated in the protective cover 20 and is not covered by the base layer 12. The base layer 12 has a paste The bonding surface 121 of the inner surface 112 of the touch-sensitive film 11 , and a bottom surface 122 opposite to the bonding surface 121 and adjacent to the liquid crystal display and the circuit board of the electronic product 200 . the

The base layer 12 is made of a light-transmitting resin material, such as polycarbonate (polycarbonate, PC), and the base layer 12 is the supporting structure of the upper sensing film 11, as the support of the entire touch module 100 when it is touched and pressed. , can also protect the sensing film 11 at the same time, especially when the touch module 100 is installed on the electronic product 200, it can also protect the liquid crystal display installed under the sensing film 11, so that the liquid crystal display will not touch the sensing film 11, reducing the The probability of damage to the sensing film 11 or the liquid crystal display during use. the

The window 21 is formed on the bottom surface 122 of the base layer 12 by CNC numerical control cutting to remove the protective cover 20, so that the electrical connection area 113 of the sensing film 11 is exposed through the window 21, and the electrical connection area 113 can pass through the window 21 to The adhesive method is electrically connected to an external signal transmission element 40 . the

The signal transmission component 40 can be any electronic component that can be electrically connected to the aforementioned electrical connection area 113, such as a flexible circuit board, an electrical connector or an adapter, etc., and the other end of the signal transmission component 40 can be electrically connected The circuit board of the electronic product 200 enables the electrical connection area 113 to be electrically connected to the signal transmission element 40 through the window 21 , and to be electrically connected to the circuit board of the external electronic product 200 through the signal transmission element 40 . the

In addition, the signal transmission element 40 can also use more advanced laser (laser) to construct a molding adapter, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating Connector), and then use conductive glue (ACF , Anisotropic Conductive Film) is connected to the electrical connection area 113 of the induction film 11; these electrical connectors belong to the prior art, and will not be described in detail here. the

In a more specific implementation, the utility model also includes:

The outer surface 111 and the inner surface 112 of the sensing film 11 can be flat or protruding outward, and the outer surface 111 of the sensing film 11 is superimposed and fixed on the inner surface of the substrate 13 which is the same plane or protruding outward. the

The substrate 13 has a touch surface 131 for receiving human touch, and a base surface 132 opposite to the touch surface 131, between the base surface 132 of the substrate 13 and the outer surface 111 of the sensing film 11 via a The adhesive layers 14 are adhered to each other. the

The substrate 13 is made of a light-transmitting material, such as polyethylene terephthalate (PET), and the material of the substrate 13 is not particularly limited, as long as it is light-transmitting and can be molded after being heated. Yes; the material of the adhesive layer 14 can be optical glue (Optical Clear Adhesive, OCA glue). the

When the touch surface 131 of the substrate 13 is touched by a touch object (such as a user's finger or other touch objects), the touch position of the sensing film 11 will be sensed due to a change in capacitance value, thereby generating touch sensing. Signal. the

The injection molding method of the base layer 12 is to put the mutually bonded substrate 13 and the sensing film 11 into a mold (not drawn) with a predetermined shape, and then form the base layer in the mold by injection molding. The base layer 12 is formed so that the base layer 12 is integrally bonded to the inner surface 112 of the sensing film 11 . the

The protective cover 20 includes a rectangular frame 22 embedded on the bottom surface 122 of the base layer 12 and attached to the inner surface 112 of the sensing film 11, and a rectangular covering portion 23 located in the frame 22 and covering the electrical connection area 113. 22 can effectively space out the electrical connection area 113 , which is beneficial to forming the window 21 on the base layer 12 . the

There is a gap 300 between the covering part 23 and the electrical connection area 113, the design of the gap 300 can prevent the mold from crushing the touch sensing circuit pattern structure of the electrical connection area 113 during the injection molding process of the base layer 12 . the

Between the periphery of the cover part 23 and the inner wall of the frame 22, there is at least one ring groove 24 which is convenient for cutting. The cover part 23 can be removed by numerical control cutting along the ring groove 24 to form the window in the frame. The design of the groove 24 is beneficial for the cutting tool to cut off the cover portion 23 without damaging the electrical connection area 113 . the

Or, please refer to FIG. 6 and FIG. 7 together to illustrate that after the above-mentioned sensing film 11 and the substrate 13 are pasted and fixed by an adhesive layer 14, the substrate 13 and the substrate 13 bonded to each other by the adhesive layer 14 are then used. The induction film 11 is heated integrally, so that the substrate 13 and the induction film 11 are moderately softened to facilitate shaping, and the substrate 13 and the induction film 11 are integrated by using a high-pressure machine (not drawn) or a copper mold (not drawn). Pressing, so that the substrate 13a and the sensing film 11a are pressed into a plane or protruding to the outside of the electronic product 200 to form a three-dimensional touch module 100a; Carbon nanotubes with the advantages of high temperature, high tensile strength, high structural strength, light transmission, and easy fabrication are thin. the

Since the sensing film 11a protrudes toward the outside of the electronic product 200, after the injection molding of the base layer 12a, the bonding surface 121a of the base layer 12a also protrudes toward the outside of the electronic product 200 along with the sensing film 11a, and The outer surface 111a and the inner surface 112a of the sensing film 11a protrude outward. the

The touch surface 131a of the substrate 13a of the three-dimensional touch module 100a can be curved from the left and right sides and/or the front and rear ends to the center and gradually outward, so that the sensing film 11a and the base layer The joint surface 121a of the touch surface 12a is curved outwardly, and the central area of the touch surface 131a is curved. the

Alternatively, as shown in FIG. 8 and FIG. 9, the touch surface 131b of the substrate 13b of the three-dimensional touch module 100b can also gradually extend outward from the left and right sides and/or the front and rear ends toward the center to form a Straight-line bending type, so the bonding surface 121b of the sensing film 11b and the base layer 12b is a straight-line bending type extending outward, and the central area of the substrate 13b is in a planar state, and the outer surface 111b of the sensing film 11b and the The inner surface 112b protrudes outward. the

Please refer to Fig. 10 to Fig. 16 to illustrate another embodiment of the signal transmission structure of the touch module of the present invention, which includes a sensing film 11, a transition element 3 and a base layer 12; wherein:

The sensing film 11 has an outer surface 111 for sensing external touch, and an inner surface 112 opposite to the outer surface 111 , and has an electrical connection area 113 for sensing signals on the inner surface 112 . the

The transfer element 3 has a first connection circuit 33 and a second connection circuit 34 that are connected to each other. 33 is electrically connected to the electrical connection area 113 , and the second connection circuit 34 is exposed on the inner surface 112 of the sensing film 11 . the

The base layer 12 is bonded to the inner surface 112 of the sensing film 11 by injection molding, so that the second connection circuit 34 is exposed on the surface of the base layer 12, and the electrical connection area 113 of the sensing film 11 can pass through the first connection circuit 33 and the surface of the base layer 12. The second connection circuit 34 is electrically connected to an external signal transmission component 40 , and is electrically connected to a circuit board of an external electronic product 200 through the signal transmission component 40 . In practice, the adapter element 3 is composed of a bracket 31 and a flexible circuit board 32 bent and attached to the front and back sides of the bracket 31, wherein the bracket 31 is in the shape of a straight plate, and the cross section of the bracket 31 is in the shape of a ㄈ The flexible circuit board 32 is provided with the aforementioned first connection circuit 33 and a second connection circuit 34 , and an insulating frame 35 is combined with an injection molding method around the bracket 31 , so that the flexible circuit board 32 is fixed on the bracket 31 . the

The injection molding method of the insulating frame 35 is to put the support 31 attached to the flexible circuit board 32 into a mold (not drawn) with a predetermined shape, and then form the insulating frame 35 by injection molding in the mold. frame 35, so that the insulating frame 35 is integrally combined around the bracket 31. the

Alternatively, the transition element 3a may also be a general-standard electrical connector, such as: a flexible circuit board connector (FPC Connector), a board-to-board connector (Board to Board, BTB Connector), etc.; in addition , You can also use more advanced laser (laser) to build a shaped connector, such as: LDS connector (Laser Direct Structure Connector) and LSP connector (Laser selective plating Connector), and then use conductive glue (ACF, Anisotropic Conductive Film) to The first connection circuit 33 is fixed and electrically connected to the electrical connection area 113 of the sensing film 11 . the

Compared with this embodiment, the external signal transmission component 40 can be any electronic component that can be electrically connected to the second connection circuit 34 of the aforementioned transition component 3a, such as: a flexible circuit board, an electrical connector or adapters, etc. the

According to the above, the electrical connection area 113 of the sensing film 11, 11a, 11b can still be conveniently electrically connected to the external signal transmission element 40 through the transfer element 3, 3a after the base layer 12, 12a, 12b is injection-molded, and The circuit board of an external electronic product 200 is electrically connected through the signal transmission element 40 . the

In addition, as shown in FIG. 15 , one or more buckle parts 123 are provided at appropriate positions around the base layer 12b. The lower cover of the product (not shown) allows the overall touch module to replace the upper cover of traditional electronic products. The composition and implementation of the remaining components are the same as those of the above-mentioned embodiments, and will not be repeated here. the

The above description is only illustrative of the present utility model, rather than restrictive. Those of ordinary skill in the art understand that many modifications and changes can be made without departing from the spirit and scope defined by the following appended claims. , or equivalent, but all will fall within the protection scope of the present utility model. the

Claims (11)

1. touch-control module signal transmission structure comprises:

One sensor film has one in order to the extraneous outside surface that touches of sensing, and an inside surface in contrast to this outside surface, and has the electrical connection district of an induced signal on the inside surface;

One over cap is laid in the electrical connection district of this sensor film inside surface;

One basalis is combined in this sensor film inside surface with injection molding method, makes to be electrically connected to distinguish to be isolated in this over cap, is not coated by basalis; And

One window is removed this over cap mode with cutting and is formed on this basalis, makes this electrical connection district exposed.

2. touch-control module signal transmission structure as claimed in claim 1 is characterized in that, described exposed electrical connection district is electrically connected an external signal transmission component by this window.

3. touch-control module signal transmission structure as claimed in claim 1; it is characterized in that; this over cap comprises one and is embedded on this basalis and the frame of this inside surface of fitting; and one be positioned at this frame and hide the shielding part in this electrical connection district; described shielding part has a space with being electrically connected between the district, and shielding part is accepted cutting and removed and form the described window that is positioned at this frame.

4. touch-control module signal transmission structure as claimed in claim 3 is characterized in that, is equipped with at least one circular groove that is beneficial to cutting between described shielding part periphery and the frame inwall.

5. a touch-control module signal transmission structure is characterized in that, comprises:

One sensor film has one in order to the extraneous outside surface that touches of sensing, and an inside surface in contrast to this outside surface, and has the electrical connection district of an induced signal on the inside surface;

One switching element, one first connecting circuit and one second connecting circuit with mutual conduction, this switching element is arranged at the outside, electrical connection district of this sensor film inside surface, and this first connecting circuit is electrically connected the district and is electrically connected with this, the second connecting circuit then is revealed on this sensor film inside surface; And

One basalis is combined in this sensor film inside surface with injection molding method, and this second connecting circuit is revealed on this basalis, is electrically connected an external signal transmission component for the second connecting circuit.

6. touch-control module signal transmission structure as claimed in claim 5 is characterized in that, this switching element is public rule electric connector or laser structuring moulding connector.

7. touch-control module signal transmission structure as claimed in claim 5, it is characterized in that, this switching element is comprised of the flexible circuit board that a support and a bending are attached on this support, described flexible circuit board is provided with the first connecting circuit of aforementioned mutual conduction and the tow sides that the second connecting circuit extends to respectively this support, and the first connecting circuit is pasted to touch in this electrical connection district and is electrically connected, and the second connecting circuit then is revealed on this sensor film inside surface.

8. such as claim 1 or 5 described touch-control module signal transmission structures, it is characterized in that, the outside surface of described sensor film and inside surface are the plane or give prominence to outward kenel, and the outside surface of sensor film coincides and is fixed on a same level or gives prominence to outward the substrate inner face of kenel, and mutually cemented via an adhesive-layer between the outside surface of described substrate and sensor film.

9. such as claim 1 or 5 described touch-control module signal transmission structures, it is characterized in that this sensor film is carbon nanotube film or indium tin oxide films.

10. such as claim 2 or 5 described touch-control module signal transmission structures, it is characterized in that this signal transmission component is a flexible circuit board, electric connector, or laser structuring moulding adapter.

11. such as claim 1 or 5 described touch-control module signal transmission structures, it is characterized in that, be provided with one or more around the basalis for the fastener that is snapped in external electronic product lower cover.

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