CN202679892U - Terminal - Google Patents
Terminal Download PDFInfo
- Publication number
- CN202679892U CN202679892U CN 201220328959 CN201220328959U CN202679892U CN 202679892 U CN202679892 U CN 202679892U CN 201220328959 CN201220328959 CN 201220328959 CN 201220328959 U CN201220328959 U CN 201220328959U CN 202679892 U CN202679892 U CN 202679892U
- Authority
- CN
- China
- Prior art keywords
- heat
- veneer
- conductive pad
- terminal
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000005338 heat storage Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
- H05K5/0278—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of USB type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a terminal comprising a single plate and a shell. The single plate is arranged in the shell. The single plate has a non heat source region and a heat source region which is provided with a plurality of heat source devices. At least one of the heat source devices is covered by a heat-conducting piece which is covered by a metal piece. The terminal is provided with the heat-conducting piece and the metal piece which cover at least one of the heat source devices. The heat-conducting piece can transfer heat radiated by the heat source devices to the metal piece, metal has good heat conduction and heat storage performance, thus the metal piece can adsorb a part of heat energy of the single plate, which equals to that a heat dissipation space is increased, heat distribution is adjusted, heat is not centralized at a heat source position of the single plate, and thus the temperature of the outer surface of a terminal product is reduced.
Description
Technical field
The utility model relates to communication technical field, particularly a kind of terminal.
Background technology
Along with the progress of science and technology, a lot of end products are when disposal ability promotes, and volume is tending towards miniaturization.Take data card product as example, data card forward 4G future development, correspondingly, CPU disposal ability and the message transmission rate of data card promote gradually, and adapting to user's user demand, yet this also directly causes the data card Overall Power Consumption to strengthen.In addition, use for the ease of the user, also towards the miniaturization development, then the heat-dissipating space of data card product constantly dwindles data card product simultaneously.
This shows that the data card Overall Power Consumption strengthens gradually on the one hand, the data card heat-dissipating space dwindles gradually on the other hand, causes the data card product surface temperature rise to improve gradually, even has exceeded the scope that human body is stood, and user's experience sense also worse and worse.
In the prior art, relatively lack for the technology that reduces the data card product temperature rise, and planless heat sink conception.Traditional cooling method can't satisfy the cooling demand of small size data card product, and such as, fan for cooling mode, fan for cooling is only applicable to components in high volume products, and the fan for cooling mode belongs to active scheme, needs current sinking, and cost is also higher.
In view of this, the heat dissipation problem that how to solve end product is the technical problem that those skilled in the art need to be resolved hurrily.
The utility model content
For solving the problems of the technologies described above, the utility model provides a kind of terminal, and the heat-conducting piece of this terminal and metalwork can increase heat-dissipating space, and effectively adjusts heat distribution, thereby solves the heat dissipation problem of terminal.
The terminal that the utility model provides, comprise veneer and shell, described veneer is located in the described shell, has nonthermal source zone and the heat source region that some thermal source devices are set on the described veneer, be coated with heat-conducting piece at least one described thermal source device, and be coated with metalwork on the described heat-conducting piece.
Preferably, has the gap between described metalwork and the described shell.
Preferably, described metalwork is metal sleeve, and the described veneer of described metal sleeve overcoat is so that described metal sleeve covers the described thermal source device of described veneer top and bottom.
Preferably, the described heat-conducting piece of described thermal source device place's covering also extends to the described nonthermal source zone of described veneer.
Preferably, described heat-conducting piece is for covering the heat conductive pad of described thermal source device.
Preferably, comprise the top heat conductive pad that is covered in described veneer top, and the bottom heat conductive pad that is covered in described veneer bottom.
Preferably, described nonthermal source zone comprises the end regions be used to the described veneer that antenna is set, and described bottom heat conductive pad extends and be covered to the described end regions of described veneer.
Preferably, described terminal is specially data card.
Preferably, the part of the described metal sleeve corresponding with described veneer bottom is provided with some through holes.
This terminal is provided with heat-conducting piece and the metalwork that covers at least a thermal source device, the heat that heat conductive pad spare can distribute the thermal source device is passed to metalwork, metal has good heat conduction and thermal storage performance, then metalwork can absorb a part of heat energy on the veneer, be equivalent to increase heat-dissipating space, adjusted the heat distribution, heat is not concentrated in the heat source position of veneer, thereby reduces the temperature of end product outer surface.
Description of drawings
Fig. 1 provides the exploded perspective view of a kind of embodiment of data card for the utility model;
Fig. 2 is the data card assembling structural representation after complete among Fig. 1;
Fig. 3 is the structural representation of veneer among Fig. 1, and this figure mainly illustrates the top of veneer;
Fig. 4 is the structural representation at visual angle for veneer bottom in Fig. 3.
Among Fig. 1-4:
11 top covers, 12 upper casings, 13 drain pans, 20 veneers, 211 top heat conductive pads, 212 bottom heat conductive pads, 22 metal sleeves, 221 through holes, 23 embedding parts, 30 plug connectors.
Embodiment
The utility model embodiment provides a kind of terminal, and the heat-conducting piece of this terminal and metalwork can increase heat-dissipating space, and effectively adjusts heat distribution, thereby solves the heat dissipation problem of terminal.
In order to make those skilled in the art understand better the technical solution of the utility model, the utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Please refer to Fig. 1, Fig. 1 provides the exploded perspective view of a kind of embodiment of data card for the utility model; Fig. 2 is the data card assembling structural representation after complete among Fig. 1.
Data card comprises veneer 20 and shell, be provided with some thermal source devices on the veneer 20, be that such device in the course of the work can distribute heat, become the thermal source of data card, general thermal source device concentrated setting is in the subregion of veneer 20, then this subregion is heat source region, and accordingly, all the other zones are the nonthermal source zone.During installation, the veneer 20 that is provided with the thermal source device can be installed on the inside of shell.Among Fig. 1, shell can comprise drain pan 13, upper casing 12 and top cover 11, during assembling, veneer 20 is installed in drain pan 13 and the upper casing 12, and upper casing 12 leaves for the putting groove that plug connector 30 is installed, and plug connector 30 is used for connecting single board 20, after plug connector 30 can place putting groove, top cover 11 is installed, is got final product fixing plug-in connector 30, plug connector 30 rotates and namely can be used for pegging graft.
The heat source region of veneer 20 is provided with thermal source device (being blocked by metal sleeve 22 among Fig. 3,4), and except heat source region, veneer 20 also comprises the nonthermal source zone that the thermal source device is not set, and the zone, left part such as veneer among Fig. 3 20 is mainly used in settling antenna.Metal sleeve 22 cover is wrapped up in veneer 20 heat source region, and obviously, the use that metal sleeve 22 can not the interference data card is provided with embedding part 23 at the top of veneer 20 right-hand members among Fig. 3, and metal sleeve 22 can overlap the part of wrapping up in except embedding part 23.Be provided with bottom heat conductive pad 212 between metal sleeve 22 bottoms and veneer 20 bottoms, be provided with top heat conductive pad 211 between metal sleeve 22 tops and veneer 20 tops, heat conductive pad 21 is made by general Heat Conduction Material.
The heat that heat conductive pad 21 can distribute the thermal source device is passed to metal sleeve 22, metal has good heat conduction and thermal storage performance, after metal sleeve 22 and heat conductive pad 21 then are set, the heat of thermal source device can be diffused into metal sleeve 22 on the veneer 20, metal sleeve 22 absorbs a part of heat energy, has adjusted the heat distribution, is equivalent to increase heat-dissipating space, heat is not concentrated in the heat source position of veneer 20, thereby reduces the temperature of data card product outer surface.And, among this embodiment, metal sleeve 22 and heat conductive pad 21 have not only covered the thermal source device, can also cover the nonthermal source zone, the heat conductive pad 21 of being made by Heat Conduction Material has the characteristic that the heat at the concentrated place of heat is guided to nonthermal source zone or heat low area, therefore, the heat conductive pad 21 in while cover heating source region and nonthermal source zone, can guide to the heat of thermal source device concentrated position on the veneer 20 on the heat conductive pad 21 in nonthermal source zone from this regional heat conductive pad 21, and then be passed on the metal sleeve 22 in nonthermal source zone, absorb this heat by metal sleeve 22.This shows, under the normal prerequisite of using of metal sleeve 22 and heat conductive pad 21 parts more than interference data khaki not, can expand the coverage area as far as possible, thereby enlarge the heat-dissipating space of veneer 20.
In above-described embodiment, be used for the heat conductive pad 21 of heat-conducting piece for being made by Heat Conduction Material of heat conduction, heat conductive pad 21 is easy to be mounted in the data card of small size, and keeps good contacting in order to heat is derived with the thermal source device.Can expect that heat-conducting piece also is not limited to heat conductive pad 21, such as smearing heat-conducting glue, can realize heat-conducting effect equally, certainly, heat conductive pad 21 is separate parts with the thermal source device, is easy to separate, be convenient to installation and removal, also can not affect the thermal source performance of devices, be comparatively preferred scheme.
In addition, in above-described embodiment, in order to enlarge as far as possible heat-dissipating space, the metal sleeve 22 of setting and heat conductive pad 21 have covered at lower all thermal source devices that can cover of the normal operating position of interference data card not.Can expect, metal has heat conduction and heat storage function, so long as metalwork cooperates with Heat Conduction Material, all can play the purpose that enlarges heat-dissipating space, therefore, even the heat conductive pad 21 and the metalwork that cover a thermal source device only are set, also can reach to a certain extent the expansion heat-dissipating space, reduce the problem of data card product temperature rise.And according to concrete data card type and veneer 20 structures, those skilled in the art can under the prerequisite that the interference data card does not use, design metalwork and the heat conductive pad 21 of different structure.Certainly, for general veneer 20 structures, the metalwork that enlarges heat-dissipating space is designed to metal sleeve 22 structures, cover easily on the one hand more thermal source device, also be convenient on the other hand be mounted to veneer 20, and can locate preferably heat conductive pad 21, prevent in use heat conductive pad 21 displacements and the reduction heat-conducting effect.
Can find out that from Fig. 3,4 heat conductive pad 21 comprises the top heat conductive pad 211 that is covered in veneer 20 tops, and the bottom heat conductive pad 212 that is covered in veneer 20 bottoms, namely heat conductive pad 21 does not cover the both sides of veneer 20.During installation, metal sleeve 22 needs overcoat veneer 20, because lateral space is limited, then the design that do not cover heat conductive pad 21 of veneer 20 both sides is easy to the suit of metal sleeve 22, and lateralarea is less, top heat conductive pad 211 and bottom heat conductive pad 212 also can guide to heat the side of metal sleeve 22, and certainly, both sides all arrange heat conductive pad 21 and also are fine.
In above-described embodiment, the nonthermal source zone that heat conductive pad 21 extends and covers, metal sleeve 22 extends equally and covers this zone.In fact, heat conductive pad 21 also can the self-heat power region extension and is covered to the nonthermal source zone that is not suitable for arranging metalwork, such as, among Fig. 1, the left end zone of antenna is set on the veneer 20, for guaranteeing the normal performance of antenna function, this zone should not arrange can interference signal metalwork, so can only heat conductive pad 21 be extended to this zone, as shown in Figure 4, bottom heat conductive pad 212 extends to the left end zone, because the left end zone does not arrange the thermal source device, after bottom heat conductive pad 212 extends to the left end zone, and can have the gap between the left end zone, can between left end zone and bottom heat conductive pad 212 parts of extending, fill and set up heat conductive pad 213, in order to the heat of heat source region is conducted to this nonthermal source zone.Be actually and be convenient to heat conduction, also bottom heat conductive pad 212 can be extended to the part thickening in left end zone, certainly, the difficulty that this kind mode can increase processing and install, the preferred mode of setting up heat conductive pad 213 that arranges that adopts.Then heat conductive pad 21 can guide to the heat of heat source region this zone, and distributing of balanced heat avoids product external surfaces local temperature rise too high to a certain extent, affects the user and uses.
In addition, for the various embodiments described above, the metal component structure that the metal sleeve 22 of setting or other can enlarge heat-dissipating space all can and shell between have the gap.Metalwork has good heat accumulation and heat conductivility, thereby absorbed the part heat of veneer 20 heat source region, make between the shell of metalwork and data card to have the gap, the heat that can avoid absorbing on the metalwork is passed to shell, and the temperature rise of data card product shell is reduced to greatest extent.
All describe as an example of data card example in above-described embodiment, in fact, terminal generally includes single plate structure, so except data card, the terminal of other structures also can arrange metalwork and heat conductive pad 21 in the manner described above, and according to the concrete structure of terminal veneer 20, the structure of design metalwork and heat conductive pad 21, such as portable power source WIFI transceiver etc., do not give unnecessary details herein.
More than a kind of terminal provided by the utility model is described in detail.Used specific case herein principle of the present utility model and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (9)
1. terminal, comprise veneer (20) and shell, described veneer (20) is located in the described shell, have nonthermal source zone and the heat source region that some thermal source devices are set on the described veneer (20), it is characterized in that, be coated with heat-conducting piece at least one described thermal source device, and be coated with metalwork on the described heat-conducting piece.
2. terminal as claimed in claim 1 is characterized in that, has the gap between described metalwork and the described shell.
3. terminal as claimed in claim 1 or 2, it is characterized in that, described metalwork is metal sleeve (22), the described veneer of described metal sleeve (22) overcoat (20) is so that described metal sleeve (22) covers the described thermal source device of described veneer (20) top and bottom.
4. terminal as claimed in claim 3 is characterized in that, the described heat-conducting piece that described thermal source device place covers also extends to the described nonthermal source zone of described veneer (20).
5. terminal as claimed in claim 1 is characterized in that, described heat-conducting piece is for covering the heat conductive pad (21) of described thermal source device.
6. terminal as claimed in claim 5, it is characterized in that, described heat conductive pad (21) comprises the top heat conductive pad (211) that is covered in described veneer (20) top, and the bottom heat conductive pad (212) that is covered in described veneer (20) bottom.
7. terminal as claimed in claim 6, it is characterized in that, described nonthermal source zone comprises that described bottom heat conductive pad (212) extends and be covered to the described end regions of described veneer (20) be used to the end regions of the described veneer (20) that antenna is set.
8. terminal according to claim 7 is characterized in that, described bottom heat conductive pad (212) extends to be provided with between the part of described end regions and the described end regions sets up heat conductive pad (213).
9. terminal as claimed in claim 3 is characterized in that, described terminal is specially data card.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220328959 CN202679892U (en) | 2012-07-09 | 2012-07-09 | Terminal |
| PCT/CN2013/078629 WO2014008824A1 (en) | 2012-07-09 | 2013-07-02 | Terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220328959 CN202679892U (en) | 2012-07-09 | 2012-07-09 | Terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202679892U true CN202679892U (en) | 2013-01-16 |
Family
ID=47500758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220328959 Expired - Lifetime CN202679892U (en) | 2012-07-09 | 2012-07-09 | Terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202679892U (en) |
| WO (1) | WO2014008824A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014008824A1 (en) * | 2012-07-09 | 2014-01-16 | 华为终端有限公司 | Terminal |
| CN106028182A (en) * | 2016-07-25 | 2016-10-12 | 广东欧珀移动通信有限公司 | A closed active speaker |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11067831B2 (en) | 2017-10-30 | 2021-07-20 | Coopervision International Limited | Methods of manufacturing coated contact lenses |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202005109U (en) * | 2010-12-31 | 2011-10-05 | 深圳市恒扬科技有限公司 | Veneer and box type electronic product |
| CN202679892U (en) * | 2012-07-09 | 2013-01-16 | 华为终端有限公司 | Terminal |
-
2012
- 2012-07-09 CN CN 201220328959 patent/CN202679892U/en not_active Expired - Lifetime
-
2013
- 2013-07-02 WO PCT/CN2013/078629 patent/WO2014008824A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014008824A1 (en) * | 2012-07-09 | 2014-01-16 | 华为终端有限公司 | Terminal |
| CN106028182A (en) * | 2016-07-25 | 2016-10-12 | 广东欧珀移动通信有限公司 | A closed active speaker |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014008824A1 (en) | 2014-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181221 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210423 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee before: HUAWEI DEVICE Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |