CN202676354U

CN202676354U - Improved structure of pressure transmitter

Info

Publication number: CN202676354U
Application number: CN 201220308627
Authority: CN
Inventors: 张焱; 刘家捷; 徐才超
Original assignee: Zhejiang Dunan Artificial Environment Co Ltd
Current assignee: Zhejiang Dunan Artificial Environment Co Ltd
Priority date: 2012-06-27
Filing date: 2012-06-27
Publication date: 2013-01-16
Anticipated expiration: 2022-06-27

Abstract

The utility model discloses an improved structure of a pressure transmitter, which comprises a housing and a socket shell. A pressure sensing chip, an integrated circuit module and a flexible circuit board are arranged in the housing. The pressure sensing chip is connected with the integrated circuit module through pins. The integrated circuit module is connected with the socket shell through the flexible circuit board. The upper end of the housing is riveted to be necking, so as to be matched with the socket shell. A cavity is formed between the inner wall of the riveted part of the housing and the outer wall of the socket shell. Since a cavity is formed between the inner wall of the riveted part of the housing and the outer wall of the socket shell, the pressure transmitter is convenient and reliable to assemble. Meanwhile, the problem of difficult gluing operation is solved and the automation of sealant pouring operation is easy to realize at the same time. In addition, the appearance quality of products and the production efficiency are increased.

Description

A kind of improved pressure unit structure

Technical field:

The utility model relates to the air conditioner refrigerating technical field, especially relates to a kind of pressure unit structure.

Background technology:

The most pressure unit adopts following several structure: (1) uses first the mode assembling pressure induction chip of screw-threaded coupling, the transmitter integrated circuit modules is fixed in (or interior) on the screw-threaded coupling part again; (2) fixing in the enclosure the pressure sensitive chip by snap ring or circlip; (3) assembling seal in the shell, other parts such as pressure sensitive chip are fixing in the enclosure by the riveting fixed form, and the stitch by the pressure sensitive chip connects integrated circuit modules again.Above-mentioned several structure all relates to the housing socket or draws the moulding of wire and the connectivity problem of shell.

Chinese patent CN 201503327U discloses the pressure unit of another pattern, and it adopts and rolls envelope closing in type structure, at the position gluing that rolls the envelope closing in.This pressure unit need to carry out encapsulating to rolling the envelope place, and roll envelope close up after encapsulating very inconvenient, be pure manual operations, and glue is easy to flow on the shell, cause shell to pollute.

The utility model content:

The purpose of this utility model is the weak point that exists for prior art and a kind of improved pressure unit structure is provided, it have simple in structure, can realize encapsulating robotization, the characteristics that production efficiency is high.

For achieving the above object, improved pressure unit structure of the present utility model includes shell and Socket casing, be provided with pressure sensitive chip, integrated circuit modules, flexible PCB in the shell, wherein, the pressure sensitive chip links to each other with integrated circuit modules by stitch, integrated circuit modules then links to each other with Socket casing by flexible PCB, and described shell upper end riveting reducing and cooperating with Socket casing is formed with chamber between the inwall at shell riveting place and the outer wall of Socket casing.

Preferred as technique scheme, be provided with seal in the below of pressure sensitive chip in the described shell, the top of pressure sensitive chip is provided with bracing or strutting arrangement, insulating part and circlip, wherein, pressure sensitive chip and bracing or strutting arrangement are located by circlip, and insulating part is positioned at the bracing or strutting arrangement inboard.

Preferred as technique scheme, the upper plane of described integrated circuit modules is under the lower plane of circlip.

Preferred as above-mentioned technology law scheme, the inwall at described shell riveting place and the angle of surface level are 45 ° ~ 60 °.

The beneficial effects of the utility model are: owing to being formed with chamber between the outer wall of the inwall at shell riveting place and Socket casing, when realizing convenient and reliable assembly, improved the gluing hard problem, easily realize the robotization of encapsulating, presentation quality and the production efficiency of product also are improved.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is described further:

Fig. 1 is one-piece construction schematic diagram of the present utility model;

Fig. 2 is one of the partial enlarged drawing at A place among Fig. 1;

Fig. 3 is two (not encapsulatings) of the partial enlarged drawing at A place among Fig. 1.

Embodiment:

See that Fig. 1 is to shown in Figure 3: improved pressure unit structure of the present utility model includes shell 10 and Socket casing 20, is provided with pressure sensitive chip 31, integrated circuit modules 32, flexible PCB 33, seal 34, bracing or strutting arrangement 35, insulating part 36 and circlip 37 in the shell 10; Wherein, pressure sensitive chip 31 links to each other with integrated circuit modules 32 by stitch, and 32 of integrated circuit modules link to each other with Socket casing 20 by flexible PCB 33, and seal 34 is located in the locating slot of below, shell 10 bottoms of pressure sensitive chip 31; Bracing or strutting arrangement 35, insulating part 36 and circlip 37 are located at pressure sensitive chip 31 tops, and wherein, pressure sensitive chip 31 and bracing or strutting arrangement 35 are by circlip 37 location, and insulating part 36 is positioned at bracing or strutting arrangement 35 inboards.Circlip 37 compresses bracing or strutting arrangement 35, bracing or strutting arrangement 35 compaction

pressure induction chips

31,31 press seal spares 34 of pressure sensitive chip; The upper plane of integrated circuit modules 32 is under the lower plane of circlip 37.

Shell 10 upper end riveting reducings and cooperating with Socket casing 20 are formed with chamber 11 between the inwall at shell 10 riveting places and the outer wall of Socket casing 20, realize the operation of robotization encapsulating with convenient.As shown in Figure 3: the inwall at shell 10 riveting places and the angle of surface level are 45 ° ~ 60 °.

The above only is preferred embodiment of the present utility model, does not therefore limit protection domain of the present utility model, and every equalization of doing according to the utility model changes with modifying and all belongs in the claim that the utility model contains.

Claims

1. improved pressure unit structure, include shell (10) and Socket casing (20), be provided with pressure sensitive chip (31) in the shell (10), integrated circuit modules (32), flexible PCB (33), wherein, pressure sensitive chip (31) links to each other with integrated circuit modules (32) by stitch, integrated circuit modules (32) then links to each other with Socket casing (20) by flexible PCB (33), it is characterized in that: described shell (10) upper end riveting reducing and cooperating with Socket casing (20) is formed with chamber (11) between the inwall at shell (10) riveting place and the outer wall of Socket casing (20).

2. require 1 described improved pressure unit structure according to power, it is characterized in that: be provided with seal (34) in the below of pressure sensitive chip (31) in the described shell (10), the top of pressure sensitive chip (31) is provided with bracing or strutting arrangement (35), insulating part (36) and circlip (37), wherein, pressure sensitive chip (31) and bracing or strutting arrangement (35) are by circlip (37) location, and insulating part (36) is positioned at bracing or strutting arrangement (35) inboard.

3. require 2 described improved pressure unit structures according to power, it is characterized in that: the upper plane of described integrated circuit modules (32) is under the lower plane of circlip (37).

4. require each described improved pressure unit structure in 1 to 3 according to power, it is characterized in that: the inwall at described shell (10) riveting place and the angle of surface level are 45 ° ~ 60 °.