CN202647225U

CN202647225U - LED (Light Emitting Diode) light source

Info

Publication number: CN202647225U
Application number: CN2011205600831U
Authority: CN
Inventors: 黎昌兴
Original assignee: Individual
Current assignee: Chongqing Shang Chuan Science And Technology Development Co Ltd
Priority date: 2011-12-28
Filing date: 2011-12-28
Publication date: 2013-01-02
Anticipated expiration: 2021-12-28
Also published as: CN103988015A; CN103988015B

Abstract

The utility model relates to the field of LED (Light Emitting Diode) illumination, in particular to an LED light source. The LED light source comprises a heat radiating base, and a circuit base is fixedly arranged on the surface of the heat radiating base; an LED capable of emitting light is fixedly arranged on the circuit base; a light distributing lens is connected outside the heat radiating base in a sealing manner; a casing is fixedly arranged outside the light distributing lens; the front end of the casing and the front end of the light distributing lens are respectively and fixedly connected with a lamp transmitting shade; the light transmitting shade is also connected with the heat radiating base in a sealing manner; the circuit base and the LED are positioned in a first sealed cavity consisting of the light distributing lens, the heat radiating base and the light transmitting shade; at least one channel is also arranged on the heat radiating base; no channel is communicated with the first cavity; and two opposite openings of each channel are respectively communicated with the outside. The LED light source has a favorable heat radiating effect and is especially suitable for illumination of high-power LEDs.

Description

LED light source

Technical Field

The utility model relates to a LED illumination field especially relates to a LED light source.

Background

With the development of electrical technology, heat dissipation has become an important factor that restricts the power increase of equipment and the life of products.

In particular, in the field of LED lighting, although the advantages of LEDs as novel green environmental protection light sources have become more and more obvious, heat dissipation of LED functional lighting strong light sources is a worldwide technical problem which has not been properly solved so far, so that the application of LED functional lighting as a strong light source is hindered. For example, the popularization of large-power LED light sources such as automobile lamps of power automobiles, large-scale LED lighting sources of ships, LED street lamps, searchlights and the like is increasingly restricted by the problem of heat dissipation.

SUMMERY OF THE UTILITY MODEL

A first object of the embodiments of the present invention is to provide an LED light source, which has a good heat dissipation effect and is particularly suitable for high-power LED lighting.

A second object of the present invention is to provide another LED light source, which has a good heat dissipation effect and is particularly suitable for high-power LED lighting.

The first LED light source provided by the embodiment of the utility model comprises a heat dissipation base,

a circuit base is fixed on the surface of the heat dissipation base, an LED capable of emitting light is fixed on the circuit base,

a lens is hermetically connected outside the heat dissipation base, a shell is fixed outside the lens, the front end of the shell and the front end of the lens are respectively and fixedly connected with the light-transmitting cover,

the light-transmitting cover is also connected with the heat dissipation base in a sealing way, the circuit base and the LED are positioned in a sealed first cavity formed by the lens, the heat dissipation base and the light-transmitting cover,

the heat dissipation base is further provided with at least one channel, each channel is not communicated with the first cavity, and two opposite openings of each channel are communicated with the outside.

Optionally, each of the channels is a conduit channel formed in the heat dissipation base; or,

a plurality of fins are formed on the surface of the heat dissipation base,

each channel is a groove-shaped channel between any two adjacent fins.

a plurality of fins are formed on the surface of the heat dissipation base,

each channel is a groove-shaped channel between any two adjacent fins.

Optionally, the rear end portion of the heat dissipation base protrudes outside the rear end of the housing,

an opening of each of the channels is located outside the rear end of the housing.

Optionally, the heat dissipation base is entirely located on one side of the light-transmitting cover,

at least one through hole is further formed in the periphery of the part, connected with the radiating base, of the light-transmitting cover, and each through hole is opposite to one opening of each channel in the radiating base.

Alternatively,

the embodiment of the utility model provides a second LED light source,

optionally, the heat dissipation base portion extends outside the light-transmissive cover,

at least through holes are arranged on the periphery of the part of the transparent cover connected with the heat dissipation base,

the part of the heat dissipation base penetrates through the light-transmitting cover through hole and extends out of the light-transmitting cover,

an opening of each channel on the heat dissipation base is positioned outside the light-transmitting cover.

Optionally, two opposite convex edges are further arranged at the position of the light-transmitting cover connected with the heat dissipation base,

the printing opacity cover still with heat dissipation base sealing connection specifically is:

the heat dissipation base and the part connected with the light-transmitting cover are fixed between the two convex edges in a limiting and sealing manner.

Optionally, a first convex edge is arranged on the connection part of the light-transmitting cover, the shell and the lens,

the front end of shell and the front end of lens respectively with printing opacity cover fixed connection specifically is:

the outer shell is hermetically fixed on the outer side of the first convex edge of the light-transmitting cover in a face-to-face mode,

the lens is fixed on the inner side of the first convex edge in a face-to-face sealing manner.

Optionally, the heat dissipation base includes: the circuit comprises a metal substrate, an insulating layer and a routing copper foil;

the LEDs are LED chips, each LED chip is fixed on the surface of the metal substrate,

the insulating layer on the bottom surface of each LED chip is in surface contact with the metal substrate,

one electrode pin of each LED wafer is respectively welded on the metal substrate, and the other electrode pin is respectively electrically connected with the routing copper foil;

the PCB insulating base material is laid on the top surface of the metal substrate except for the LED chip fixing position, and the routing copper foil is laid in the PCB insulating base material;

the metal substrate and the wiring copper foil can be respectively and electrically connected with the anode and the cathode of the external power supply circuit.

Optionally, a concave pit is further disposed on the top surface of the metal substrate,

each LED wafer is fixed on the surface of the metal substrate, and the LED wafer fixing method specifically comprises the following steps: each LED wafer is fixed on the surface of the concave pit,

the PCB insulation base material is paved on the top surface of the metal substrate except for the LED wafer fixing position, and the method specifically comprises the following steps: the insulating layer is specifically paved on the top surface area of the metal substrate except the pits;

the other electrode pin of each LED wafer is respectively and electrically connected with the wiring copper foil, and the method specifically comprises the following steps: the other electrode pin of each LED wafer is electrically connected with the routing copper foil through each conductive lead;

a silica gel filling part is also filled in the pit,

the silica gel filling part is filled in the pit, and all the LED wafers and the conductive leads are wrapped in the silica gel filling part together.

The embodiment of the utility model provides a pair of LED light source, include: comprises a heat dissipation base,

circuit bases are respectively fixed on the top surface and the bottom surface of the heat dissipation base, and LEDs capable of emitting light are respectively fixed on each circuit base;

the heat dissipation base is also hermetically sleeved with an optical lens, the optical lens is also sleeved with a shell, and the front end of the shell and the front end of the optical lens are respectively and fixedly connected with a light-transmitting cover;

the circuit base and the LED which are positioned on the top surface of the heat dissipation base are positioned in a first sealed cavity formed by the lens, the heat dissipation base and the light-transmitting cover,

the circuit base and the LED which are positioned on the bottom surface of the heat dissipation base are positioned in a second sealed cavity formed by the lens, the heat dissipation base and the light-transmitting cover,

at least one pipeline channel is further arranged in the heat dissipation base, and two opposite openings of each channel are communicated with the outside.

at least one through hole is further formed in the light-transmitting cover, and each through hole is opposite to an opening of each channel in the heat dissipation base.

a through hole is arranged at the periphery of the joint of the light-transmitting cover and the heat-radiating base,

the heat dissipation base part penetrates through the light-transmitting cover through hole and extends out of the light-transmitting cover,

Optionally, the light-transmitting cover go up with heat dissipation base interconnect's position still is provided with two relative chimbs, the light-transmitting cover still with heat dissipation base sealing connection specifically is:

the lens is fixed on the inner side of the first convex edge in a face-to-face sealing mode.

the LEDs are LED chips and are fixed on the surface of the metal substrate, the insulating layer on the bottom surface of each LED chip is in surface contact with the metal substrate,

a silica gel filling part is also filled in the pit,

It is from top to bottom visible, use the utility model discloses technical scheme, when putting through external power supply, external power supply passes through the circuit base to each LED power supply on the circuit base, and LED is lighted and is externally luminous under the electric drive. The heat that takes place in LED working process is transmitted to its heat dissipation base of connecting through the circuit base fast on, and be provided with at least one and outer passageway of intercommunication in the heat dissipation base, and the heat that gets into with an import of passageway or fluid such as liquid flows through from the heat dissipation base, and the heat that fully contacts with the heat dissipation base is taken away the heat on the heat dissipation base from another export of passageway fast, realizes the circulation of fluid heat dissipation, improves the radiating efficiency of LED high-intensity illuminator. Through the experiment of the inventor, the technical scheme of the embodiment can realize the LED strong light source with ultrahigh power, and the power of the LED light source can reach thousands of watts.

In addition, two openings of each channel are opposite respectively in this embodiment, so the fluid that flows through the channel enters from one end and then flows out from the other end fast, and the heat on the heat dissipation base is taken out fast, thereby realizing high-efficiency heat dissipation.

In addition, because each channel in the heat dissipation base is not communicated with the circuit base and the first cavity where the LED is located, fluid flowing through the channels cannot enter the electrical property of the main electrical and electronic device.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, do not constitute a limitation of the invention, and in which:

fig. 1 is a schematic view of a gazing structure of an LED light source with a heat dissipation device provided in embodiment 1 of the present invention;

fig. 2 is a schematic view of a cross-sectional structure a-a shown in fig. 1 according to embodiment 1 of the present invention;

fig. 3 is a schematic cross-sectional view of an LED light source provided in embodiment 1 of the present invention, in which a rear end portion of the base with heat dissipation extends out of a rear end of the housing;

fig. 4 is a schematic cross-sectional view of an LED light source provided in embodiment 1 of the present invention, in which a front end portion of the base with heat dissipation extends out of the transparent cover;

fig. 5 is a schematic view of a connection structure between a circuit base for fixing an LED and an LED thereon provided in embodiment 1 of the present invention;

fig. 6 is a schematic view of another connection structure of a circuit base for fixing an LED and an LED thereon provided in embodiment 1 of the present invention;

fig. 7 is a schematic cross-sectional view of an LED light source with a heat dissipation base according to embodiment 2 of the present invention;

fig. 8 is a schematic cross-sectional view of an LED light source with a heat dissipation base according to embodiment 3 of the present invention.

Detailed Description

The invention will be described in detail with reference to the drawings and specific embodiments, wherein the exemplary embodiments and descriptions are provided to explain the invention, but not to limit the invention.

Example 1:

please refer to fig. 1 and 2.

The LED light source provided in this embodiment mainly includes a housing 106, a heat dissipation base 101, a lens 102, a light-transmitting cover 103, a circuit base 104, and an LED 105.

The heat dissipation base 101 is a material with good heat dissipation performance, such as but not limited to a copper base, an aluminum base, or a copper-aluminum alloy base.

The circuit base 104 is tightly fixed on the surface of the heat dissipation base 101, a power supply circuit structure for supplying power to the LED 105 is fixed on the circuit base 104, and the LED 105 is fixed on the circuit base 104, wherein the LED 105 can be a pin LED or an LED chip. The LED 105 can be a single high-power LED or an LED cluster consisting of a plurality of LEDs, the shape of the LED cluster can be arranged according to specific needs, and if the LED cluster is arranged into a determined trademark pattern, the advertising projection and propaganda effect can be realized.

The light distribution lens 102 is fixed outside the heat dissipation base 101, and the type and shape of the light distribution lens 102 can be selected according to the application of the current high-power LED light source, for example, the light distribution lens 102 with a light condensation function can be used to realize high-power remote high-intensity illumination.

The rear end of the lens 102 is tightly connected with the heat dissipation base 101 in a sealing manner, and the front end of the lens 102 is tightly connected with the light-transmitting cover 103.

The circuit base 104 and the LEDs on the circuit base 104 are located in a sealed cavity formed by the heat dissipation base 101, the lens 102 and the light-transmissive cover 103, as shown in the first cavity 107 in fig. 1.

A protective shell 106 is fixed outside the lens 102, the front opening end of the shell 106 is fixedly connected with the light-transmitting cover 103, and the rear end of the shell 106 can be used for connecting and fixing an external connecting part to realize installation.

At least one channel 1011 not communicated with the first cavity 107 is further arranged on the heat dissipation base 101, and the channels 1011 can be arranged inside the heat dissipation base 101 or on the periphery of the part of the heat dissipation base 101 not in the first cavity 107.

Opposite ends 1012, 1013 of each channel 1011 communicate with each other.

The working principle of the LED light source of the embodiment is as follows:

and when the external power supply is switched on, the external power supply supplies power to the LEDs 105 on the circuit base 104 through the circuit base 104, and the LEDs 105 are lightened under the electric drive to emit light outwards. The heat generated in the working process of the LED 105 is quickly transferred to the heat dissipation base 101 connected with the LED 105 through the circuit base 104, the heat dissipation base 101 is provided with a channel 1011 which is externally communicated, fluid such as air or liquid enters from an inlet 1012 of the channel 1011 and flows through the heat dissipation base 101, and the heat fully contacted with the heat dissipation base 101 quickly brings the heat on the heat dissipation base 101 out from another outlet 1013 of the channel 1011, so that the fluid through heat dissipation is realized, and the heat dissipation efficiency of the LED high-intensity light source is improved.

Through the experiment of the inventor, the technical scheme of the embodiment can realize the LED strong light source with ultrahigh power, and the power of the LED light source can reach thousands of watts.

In the present embodiment, the two

openings

1012 and 1013 of each channel 1011 are opposite to each other, so that the fluid flowing through the channel 1011 enters from one end and then rapidly flows out from the other end, which rapidly takes away the heat on the heat dissipation base 101, thereby dissipating the heat efficiently.

In addition, since each channel 1011 in the heat sink base 101 is not in communication with the circuit base 104 and the first cavity 107 where the LED is located, no fluid flowing through the channel 1011 enters the electrical performance of the main electrical and electronic devices.

In this embodiment, all of the heat dissipation base 101 may be located in the housing 106, and as shown in fig. 2, at least one or more through holes 201 are further provided on the light-transmitting cover 103 at the outer periphery of the connection position between the light-transmitting cover 103 and the heat dissipation base 101, and these through holes 201 are opposite to one end of the channel 1011 on the heat dissipation base 101. The fluid heat dissipation principle is as follows:

fluid such as water or air enters through the through hole 201 of the light-transmitting cover 103, enters the channel 1011 from one opening of the channel 1011 on the heat-dissipating base 101, then flows out from the other opening 1013 of the channel 1011, and flows out from the rear end 1061 of the housing 106.

In this embodiment, the rear end portion of the heat dissipation base 301 may also be extended beyond the rear end 1061 of the housing 106. With this design, as shown in fig. 3, water or air or other fluid can enter through the through hole 201 of the light-transmissive cover 103, enter the channel 3011 from one opening 3012 of the channel 3011 of the heat-dissipating base 301, and then directly flow to the outside from the other opening 3013 of the channel 3011. By adopting the design, the volume of the heat dissipation base 301 is favorably increased, so that the volume of the heat dissipation base 301 is not restricted by the shell, and the heat dissipation effect is further improved.

In this embodiment, the front end portion of the heat sink base 401 may further extend out of the light-transmissive cover 403, as shown in fig. 4. A through hole 4031 through which the front end portion of the heat dissipation base 401 can protrude is further provided on the light-transmissive cover 403 at the outer periphery of the connection position of the light-transmissive cover 403 and the heat dissipation base 401, so that the front end portion 4012 of the heat dissipation base 401 protrudes outside the light-transmissive cover 403. The fluid heat dissipation principle is as follows:

fluid, such as water or air, can enter through an opening 4012 in the heat sink base 401 that extends out of the light transmissive cover 403 and then exit through another opening 4013 in the channel 4011 that extends out of the rear port of the housing. By applying the technical scheme, on one hand, the heat dissipation volume of the heat dissipation base 401 is favorably improved, the heat dissipation efficiency is improved, on the other hand, because the inlets and the outlets 4012 and 4013 of the channels 4011 are arranged outside the shell and the light-transmitting cover 403, if all the channels 4011 are arranged in tubular structures instead of groove-shaped structures, the situation that fluid which directly flows through the heat dissipation base 401 does not need to flow through the shell, the fluid directly flows from the outside and then directly flows out of the shell is ensured, and the safety of all electronic components in the shell is further ensured.

Referring to fig. 2, 3 and 4, in order to improve the tight connection between the light-transmitting cover and the heat dissipation base, two

opposite flanges

1031 and 1032 may be disposed inside the connection portion between the light-transmitting cover and the heat dissipation base. During assembly, the connection part of the heat dissipation base and the light-transmitting cover is limited in the two

convex edges

1031, 1032, and is connected with the space formed by the

convex edges

1031, 1032 in a sealing way. Adopt this structure can further improve the compact type of heat dissipation base and printing opacity cover connection complex to adopt this face-to-face interference fit to connect and can further ensure the leakproofness of first cavity, guarantee its interior electronic components's stability.

In this embodiment, the

channels

1011, 3011, 4011 on the

heat dissipation bases

101, 301, 401 may be duct channels provided in the heat dissipation bases, or a plurality of fins may be provided on the back surface of the heat dissipation bases, and the grooves between any two fins may be groove-like channels through which the fluid flows in the heat dissipation bases.

In addition, the inventor finds that the circuit base can be a PCB or other circuit board widely used at present through long-term experiments, and the following technical scheme can also be adopted:

referring to fig. 5, the circuit base according to the present embodiment mainly includes: metal substrate 501, insulating base material 502, line copper foil 503. The metal substrate 501 may be, but is not limited to, a copper plate, an aluminum plate or other metal plate, the insulating substrate 502 may be a PCB insulating substrate currently used in circuit fabrication, and the LEDs mounted on the circuit base are LED chips. The connection relationship of each component is as follows: the bottom surface of the metal substrate 501 is mounted on the surface of the heat dissipation base in a surface contact manner with the heat dissipation base, each LED wafer 504 is respectively fixed on the top surface of the metal substrate 501, the insulating layer 5041 on the bottom surface of each LED wafer 504 is in surface contact with the metal substrate 501 on the bottom surface of the LED wafer 504, one electrode pin of each LED wafer 504 is respectively welded on the metal substrate 501 on the bottom surface of the LED wafer 504, the other electrode pin is respectively electrically connected with the routing copper foil 503 laid in the insulating substrate 502 through each conductive lead, and the insulating substrate 502 is laid on the top surface of the metal substrate 501 and in an area except for the fixing position of the LED wafer 504. The metal substrate 501 and the trace copper foil 503 can be respectively and electrically connected with the anode and the cathode of the external power supply circuit.

The working principle is that the external power supply circuit respectively introduces direct current power to the metal substrate 501 and the routing copper foil 503, and the LED chip 504 electrically connected between the metal substrate 501 and the routing copper foil 503 works under the drive of the introduced current to emit light to the outside.

As can be seen from the above, in the above technical solution, the LED chips 504 are directly fixed on the metal substrate 501 in a face-to-face contact manner, the insulating layer 5041 on the bottom surface of the LED chip 504 is directly in face-to-face contact with the metal substrate 501, one electrode pin of each LED chip 504 is directly soldered on the metal substrate 501, and the other electrode pin of each LED chip 504 is electrically connected to the trace copper foil 503 laid in the insulating substrate 502 through a wire lead.

When the method is applied, a direct-current working power supply is introduced into each LED wafer 504 through the metal substrate 501 and the routing copper foil 503, heat generated in the working process of the LED wafer 504 can be quickly transferred to the metal substrate 501 with good heat dissipation performance through contact heat conduction, the heat on the LED wafer 504 is quickly transferred to the heat dissipation base through the metal substrate 501, and the heat dissipation base further dissipates the heat, and compared with the prior art of the die bonding technical scheme that the LED wafer 504 is welded on the positive and negative routing copper foils 503 of the conventional PCT substrate, the technical scheme is further favorable for improving the heat dissipation effect.

In addition, since the metal substrate 501 of the embodiment is in close contact with the heat dissipation base, in the working process of the LED chip 504, the heat dissipation base, besides dissipating heat, also serves as an electrode conductor having the same polarity as the metal substrate 501, and since the heat dissipation base has a larger volume, the application of the technical solution of the embodiment is further beneficial to reducing the internal resistance of the LED lighting lamp, reducing heat, and avoiding the conductor from being burned out due to excessive heat generated by long-term use, i.e., further prolonging the service life and stability.

In order to further improve the stability of the LED chip 607 on the circuit base, the LED chip 607 can be fixed on the metal substrate 601 by the solution shown in fig. 6.

The circuit base that this embodiment provided includes: the circuit board comprises a metal substrate 601, an insulating base material 602, a trace copper foil 603, a silica gel filling part 604, and a plurality of conductive leads 605.

A pit 6011 is formed in the top surface of the metal substrate 601, an insulating base material 602 is laid and fixed on the top surface area of the metal substrate 601 except the pit 6011, and a plurality of trace copper foils 603 are laid on the insulating base material 602.

A plurality of LED chips 607 are fixed in the recess 6011 of the metal substrate 601, the insulating layer 6071 on the bottom surface of the LED chips 607 is in face-to-face contact with the metal substrate 601 therebelow, one electrode lead of each LED chip 607 is directly soldered (indicated by 608 in the figure) to the metal substrate 601 below the chip 607, the other electrode lead of each LED chip 607 is electrically connected to the trace copper foil 603 laid outside the recess 6011 and on the insulating base 602 by a soldered conductive lead 605.

The top surface of each LED wafer 607 is coated with phosphor, and the phosphor is cured and molded to wrap the top surface of the LED wafer 607 after coating to form a phosphor layer. The phosphor layer can adjust the light emitted from the LED chip 607 to emit light of a predetermined color, such as yellow light, white light, etc., and generally, white light is mostly used.

The silicone filling portion 604 is filled in the recess 6011, and covers the top surface of the recess 6011 as an exposed light-permeable protective layer, the silicone filling portion 604 fills the recess 6011, and each LED chip 607, the conductive lead 605 and the phosphor layer in the recess 6011 are tightly and collectively wrapped in the silicone filling portion 604.

When in use, the negative electrode of the external dc power supply is electrically connected to the metal substrate 601, and the positive electrode of the external dc power supply is electrically connected to the trace copper foil 603. When the power is on, the routing copper foil 603 becomes a positive power supply electrode, the large-area metal substrate 601 at the bottom becomes a negative power supply electrode, which collectively provides a working power supply for the LED chips 607 welded on the surface of the metal substrate 601, and draws working current for each LED chip 607, the LED chips 607 emit light under electric drive, and the light is emitted outside after passing through the fluorescent powder layer and the silica gel filling portion 604, thereby realizing illumination.

Therefore, in the embodiment, the LED chip is directly welded on the metal substrate to fix the LED chip, so that the insulating layer on the bottom surface of the LED chip directly contacts with the metal substrate in a face-to-face manner, one electrode pin of each LED chip is directly welded on the metal substrate, the other electrode pin of each LED chip is electrically connected with the routing copper foil laid in the insulating substrate through the lead wire, and when the LED chip is applied, the metal substrate and the routing copper foil introduce a dc working power supply to each LED chip. The heat generated in the working process of the LED wafer can be quickly transferred to the metal substrate with good heat dissipation performance through contact heat conduction, and the metal substrate dissipates the heat on the LED wafer, so that compared with the prior art of the die bonding technical scheme that the LED wafer is welded on the wiring copper foil of the conventional PCT substrate, the technical scheme is favorable for improving the heat dissipation effect.

As an alternative application of this embodiment, the anode of each LED chip can be soldered on the metal substrate, and the cathode of each LED chip can be electrically connected to the trace copper foil outside the concave pit through a lead. When the direct current power supply is applied, the negative input terminal of the external direct current power supply is electrically connected with the wiring copper foil, and the positive input terminal is electrically connected with the metal substrate. The alternative is selected according to the actual application scene.

As a preferred application embodiment of this embodiment, the cathode of each LED chip can be soldered to the metal substrate, and the anode of each LED chip can be electrically connected to the trace copper foil outside the recess through a lead (but not limited to, electrically connected by soldering). When the direct current power supply is applied, the positive input terminal of the external direct current power supply is electrically connected with the wiring copper foil, and the negative input terminal is electrically connected with the metal substrate. At the moment, the volume of the negative electrode block-shaped metal substrate is large in electrical performance, so that compared with the prior art of a die bonding technical scheme of welding the LED wafer on the wiring copper foil of the conventional PCT substrate, the technical scheme is beneficial to enhancing the stability of current, improving the illumination stability of the LED wafer and prolonging the service life of the LED wafer.

In addition, compared with the traditional LED fixing mode in the prior art: fixed welding LED wafer on the line copper foil is walked to positive negative pole of laying on insulating substrate, the embodiment of the utility model provides a technical scheme who directly welds LED wafer at solid metal substrate surface has broken through current technical staff's inertial thinking, has overcome the technical bias.

It should be noted that the cross section of the housing in this embodiment may be square, circular, oval, trapezoidal, triangular or a combination of 1 to several of the foregoing; in this embodiment, the cross section of the heat dissipation base can be square, circular, oval, trapezoidal, triangular or a combination of 1 to several of the foregoing.

Example 2:

please refer to fig. 7.

The difference between the LED light source with the heat dissipation base 701 structure provided in this embodiment and that shown in embodiment 1 mainly includes:

in the LED light source of the present embodiment,

circuit bases

7041 and 7042 are fixed to at least two opposing surfaces of the heat dissipation base 701, and LEDs are fixed to the

respective circuit bases

7041 and 7042.

A lens 702 is sleeved outside the heat dissipation base 701, a housing is sleeved outside the lens 702, the lens 702 and the front end of the housing are jointly connected and fixed with a light-transmitting cover 703, all the LEDs on the

circuit bases

7041 and 7042 and the

circuit bases

7041 and 7042 on the surfaces of the heat dissipation base 701 are jointly located in a sealed cavity 707 formed by the lens 702, the heat dissipation base 701 and the light-transmitting cover 703, and the sealed cavity 707 surrounds the periphery of the heat dissipation base 701.

The heat dissipation principle and the corresponding beneficial effects are the same as those of the embodiment 1, and the layout of the LEDs of the embodiment is distributed on a plurality of surfaces of the heat dissipation base 701, so that the illumination range is wider and the illumination intensity is stronger.

Similar to fig. 1-4 in embodiment 1, at least one duct channel 7011 is disposed in the heat sink base 701, and two opposite outlets of the duct channel 7011 are both communicated with each other, and similar to the description of the duct channel 7011 in embodiment 1, the duct channels 7011 on the heat sink base 701 may be both located in the light-transmitting cover 703 and the housing, or may extend from a front end portion of the duct channel 7011 to the outside of the light-transmitting cover 703, or may extend from a rear end portion of the duct channel 7011 to the outside of the housing, or may extend from the front end portion of the duct channel 7011 to the outside of the housing and the light-.

Similar to embodiment 1, the

circuit bases

7041 and 7042 for fixing the LEDs may be PCB circuit boards or other circuit boards widely used at present, or the technical solutions of fig. 6 and 7 in embodiment 1 may also be adopted. The beneficial effects are described in example 1.

Example 3:

please refer to fig. 8.

In this embodiment, at least one

circuit base

8041 and 8042 may be respectively fixed on the top surface and the bottom surface of a large-area heat dissipation base 801, and LEDs 8051 and 8052 are respectively fixed on each

circuit base

8041 and 8042, and the specific connection of the circuit substrate and the LEDs 8051 and 8052 may be, but is not limited to, the description in embodiments 1 and 2.

The outside of the heat dissipation base 801 is also hermetically sleeved with the

light distribution lenses

8021 and 8022, the outside of the

light distribution lenses

8021 and 8022 is also sleeved with a shell 806, and the front end of the shell 806 and the front ends of the

light distribution lenses

8021 and 8022 are respectively and fixedly connected with the light-transmitting cover 803; the circuit base 8041 and the LEDs on the top surface of the heat dissipation base 801 are located in a first sealed cavity 8071 formed by the lens 8021, the heat dissipation base 801 and the translucent cover 803, and the circuit base 8042 and the LEDs on the bottom surface of the heat dissipation base 801 are located in a second sealed cavity 8072 formed by the lens 8022, the heat dissipation base 801 and the translucent cover 803.

At least one pipeline channel 8011 is further arranged in the heat dissipation base 801, and two

openings

8013, 8013 opposite to each channel 8011 are communicated with the outside.

Similar to fig. 1-4 in embodiment 1, the duct channel 8011 in the heat dissipation base 801 may be located in the light-transmissive cover 803 and the housing 806, may extend from a front end portion of the duct channel 8011, may extend from a rear end portion of the duct channel 801803, or may extend from the housing 806 and the light-transmissive cover 803. The specific operation principle and effect are described in embodiment 1.

It should be noted that, by applying the technical solutions of the above embodiments, in addition to the designs of embodiments 1 and 2, in the application process, the LED light sources with the structures shown in fig. 1 to 4 and 7 of embodiments 1 and 2 may be used as units, and a plurality of units are combined together to form a large-scale high-light LED light source matrix with good heat dissipation capability, so as to implement LED high-light directional energy-saving lighting with good heat dissipation.

In order to further explain the utility model discloses an effect, the utility model discloses the high-power LED lamp to adopting this embodiment to make has carried out following experimental test.

And (3) testing environment: room temperature and air was blown into the second cavity 111 from the first through hole 112 located below the lens 103 at a wind speed of 2m per second to simulate an air flow during the traveling of the automobile.

Object under test 1: and the power of the LED lamp is 100W.

In the test environment, after the LED chip continuously works for 1 hour, an infrared temperature detector is adopted to test the temperature on the surface of the main radiating base 0.3mm away from the periphery of the LED chip, the measured temperature value is 50.2 ℃, and the temperature on the surface of the LED chip with the high beam is 55.6 ℃;

after the LED lamp continuously works for 2 hours, an infrared temperature detector is adopted to test the temperature on the surface of the main radiating base 0.3mm away from the periphery of the LED wafer, the measured temperature value is 52.2 ℃, and the temperature on the surface of the high beam LED wafer is 58.6 ℃.

Object under test 2: the LED lamp matrix with the power of 1000W is adapted to increase the body of the heat dissipation base, so that the heat dissipation base extends out from the front end of the light-transmitting cover 403 and the rear end extends out from the rear end of the shell 106 as shown in FIG. 4, wherein all the channels are pipeline channels;

and (3) testing environment: room temperature, from duct channel 3011 to simulate airflow during vehicle travel. Water was blown into the second chamber 111 at 2m per second to simulate the flow of water during ship travel.

In the test environment, after the LED chip continuously works for 1 hour, an infrared temperature detector is adopted to test the temperature on the surface of the main radiating base 0.3mm away from the periphery of the LED chip, the measured temperature value is 45.2 ℃, and the temperature on the surface of the LED chip with the high beam is 50.6 ℃;

after the LED lamp continuously works for 2 hours, an infrared temperature detector is adopted to test the temperature on the surface of the main radiating base 0.3mm away from the periphery of the LED wafer, the measured temperature value is 52.2 ℃, and the temperature on the surface of the high beam LED wafer is 55.6 ℃.

Therefore, by applying the technical scheme of the embodiment, high-power LED illumination can be realized, and efficient heat dissipation is realized through fluid communication. It should be noted that the embodiment can be applied to not only high-power illumination in various conventional occasions, but also LED headlamps of motorcycles, automobiles, ships and the like, and is particularly suitable for high-power illumination equipment placed outdoors, and heat dissipation can be realized by utilizing natural wind, rain and the like; the embodiment is also particularly suitable for lighting on movable equipment, and the reverse airflow or water flow generated in the moving process of the equipment can be utilized to realize the efficient heat dissipation of the fluid through.

In order to further optimize the light distribution and illumination effect, the following optimization design is also performed in the embodiment:

the technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the description should not be construed as a limitation to the present invention.

Claims

1. An LED light source is characterized by comprising a heat dissipation base,

a lens is hermetically connected outside the heat dissipation base, a shell is fixed outside the lens, the front end of the shell and the front end of the lens are respectively and fixedly connected with a light-transmitting cover,

2. The LED light source of claim 1,

each channel is a pipeline channel formed in the heat dissipation base; or,

a plurality of fins are formed on the surface of the heat dissipation base,

each channel is a groove-shaped channel between any two adjacent fins.

3. The LED light source as claimed in claim 1 or 2,

the rear end portion of the heat dissipation base protrudes outside the rear end of the housing,

4. The LED light source as claimed in claim 1 or 2,

the heat dissipation base is entirely positioned on one side of the light-transmitting cover,

at least one through hole is arranged on the periphery of the part of the transparent cover connected with the heat dissipation base,

each through hole is opposite to an opening of each channel on the heat dissipation base.

5. The LED light source as claimed in claim 1 or 2,

the heat dissipation base part extends out of the light-transmitting cover,

6. The LED light source as claimed in claim 1 or 2,

two opposite convex edges are arranged at the part of the transparent cover which is mutually connected with the heat dissipation base,

7. The LED light source as claimed in claim 1 or 2,

the connection part of the light-transmitting cover, the shell and the lens is provided with a first convex edge,

8. The LED light source as claimed in claim 1 or 2,

the heat dissipation base includes: the circuit comprises a metal substrate, an insulating layer and a routing copper foil;

one electrode pin of each LED wafer is respectively welded on the metal substrate, and the other electrode pin is respectively and electrically connected with the routing copper foil laid in the insulating base material through each conductive lead;

the insulating base material is laid on the top surface of the metal substrate except for the LED chip fixing position, and the routing copper foil is laid in the insulating base material;

9. The LED light source of claim 8,

the top surface of the metal substrate is also provided with a pit,

the insulating base material is paved on the top surface of the metal substrate except for the LED chip fixing position, and specifically comprises the following steps: the insulating layer is specifically paved on the top surface area of the metal substrate except the pits;

a silica gel filling part is also filled in the pit,

10. An LED light source, comprising: comprises a heat dissipation base,

11. An LED light source as claimed in claim 10,

12. An LED light source as claimed in claim 10,

13. An LED light source as claimed in claim 10,

the heat dissipation base part extends out of the light-transmitting cover,

14. An LED light source as claimed in claim 10,

15. The LED light source of claim 10,

16. The LED light source of claim 10,

the insulating base material is paved on the top surface of the metal substrate except for the LED chip fixing position, and the routing copper foil is paved in the insulating base material;

17. The LED light source of claim 16,

the top surface of the metal substrate is also provided with a pit,

a silica gel filling part is also filled in the pit,