CN202580974U - Backlight module and display equipment - Google Patents

Abstract

The utility model discloses a backlight module and display equipment. The backlight module comprises a back plate, a lamp strip and a temperature equalizing plate, wherein the temperature equalizing plate is in a sealed hollow structure, and a phase-change material is filled in the cavity; the temperature equalizing plate is fixed on the back plate, and the lamp strip is arranged on the temperature equalizing plate. The utility model adopts the characteristic of large specific heat capacity of the phase-change material in the temperature equalizing plate, the heat of the lamp strip is quickly diffused onto the whole temperature equalizing plate, so that the temperature of an LED (Light Emitting Diode) is greatly lowered, on the one hand, part of the heat of the LED is conducted to a metal front frame for outward diffusion by a rubber strip at one side of the temperature equalizing plate, on the other hand, the heat of the LED is also conducted to the radiating plate, the radiating plate radiates part of the heat by the plastic back plate, and finally the temperature of the LED is lowered; and simultaneously due to the adoption of the small-sized combined structure with the radiating plate and the plastic back plate, the cost is reduced.

Description

Backlight module and display device

technical field

The utility model relates to the technical field of electronic products, in particular to a backlight module and a display device of an ultra-narrow frame display device.

Background technique

At present, the ultra-thin design features of narrow-frame LED LCD TVs are becoming more and more sought after by the market. However, the narrower the frame of the LED LCD TV, the smaller the light mixing distance of the backlight, and it is necessary to increase the number of LEDs on the light bar, so that the LEDs on the light bar are arranged very densely, resulting in a very high heat flux density of the LEDs. Large, the heat is quite concentrated, and it is very difficult to dissipate heat.

As shown in FIG. 1 , FIG. 1 is a schematic diagram of a backlight module of a narrow-frame LED TV in the prior art. The existing backlight module includes: a metal backplane 100, an aluminum substrate light strip 90 and an L-shaped light strip heat sink 70, and a heat-conducting double-sided adhesive 80 is arranged between the aluminum substrate light strip 90 and the L-shaped light strip heat dissipation plate 70 , the aluminum substrate light bar 90 conducts heat to the L-shaped light bar heat sink 70 through the heat-conducting double-sided adhesive 80, and the L-shaped light bar heat sink 70 conducts the heat to the metal back plate 100 connected to it, and finally flows through the metal back The air above the plate 100 carries the heat away.

The above-mentioned heat dissipation structure of the prior art has the following defects:

It is necessary to ensure the thickness of the heat sink 70 of the L-shaped light bar so that the heat of the LEDs can be well conducted to the metal back plate 100 . However, this limits the narrowing of the frame of the LCD TV.

Utility model content

The main purpose of the present utility model is to provide a backlight module, aiming at reducing the thickness of the frame of the LED display and at the same time reducing the heat dissipation cost of the backlight.

In order to achieve the above purpose, the utility model proposes a backlight module, including: a backplane, a lamp bar and a temperature chamber, the temperature chamber is a sealed hollow structure, and the cavity is used to inject phase change materials; The uniform temperature plate is fixed on the back plate, and the light bar is installed on the uniform temperature plate.

Preferably, the temperature chamber includes a hollow bottom plate; a groove is provided on the upper surface of the bottom plate, and the light bar is embedded in the groove and bonded to the bottom of the groove through silica gel.

Preferably, the temperature chamber further includes side plates perpendicular to the bottom plate, and the bottom plate and side plates make the temperature chamber form an L-shaped structure; the temperature chamber is fixed to the back panel.

Preferably, the heat dissipation structure further includes a heat dissipation plate, the heat dissipation plate is arranged between the back plate and the side plate of the temperature chamber, and the temperature chamber is fixed on the back plate through the heat dissipation plate .

Preferably, a step is provided on the outer surface of the heat dissipation plate on the side plate of the temperature chamber, and the heat dissipation plate rests on the step and is in close contact with the outer surface of the side plate.

Preferably, the bottom wall of the heat dissipation plate is bonded to the step by silica gel; the side wall of the heat dissipation plate is bonded to the outer surface of the side plate by silica gel.

Preferably, it also includes a front frame and a rubber strip. The front frame abuts against the side wall of the bottom plate of the temperature chamber through the rubber strip.

Preferably, both ends of the temperature chamber are respectively provided with plugs for sealing the cavity of the temperature chamber.

Preferably, the groove of the uniform temperature plate is provided with an injection hole for injecting phase change material into its cavity, and the injection hole is sealed by silica gel.

The utility model also proposes a display device, which includes the above-mentioned backlight module.

A backlight module proposed by the utility model utilizes the characteristics of the large specific heat capacity of the phase-change material in the vapor chamber to quickly spread the heat of the light strip to the entire vapor chamber, greatly reducing the LED temperature. On the one hand, part of the LED heat The rubber strip on one side of the vapor chamber is conducted to the metal front frame, and is dissipated through the external atmosphere. On the other hand, most of the heat of the LED is conducted to the heat dissipation plate connected to the other side of the vapor chamber, and the heat dissipation plate passes part of the heat through the plastic The back plate is dissipated, and most of the heat is taken away by the air flowing through its surface, which finally reduces the temperature of the LED. Heat dissipation structure reduces cost.

Description of drawings

FIG. 1 is a schematic diagram of a backlight module of a narrow-frame LED TV in the prior art;

Fig. 2 is a schematic structural view of a preferred embodiment of the utility model backlight module;

Fig. 3 is a schematic diagram of an enlarged structure at A in Fig. 2;

Fig. 4 is a schematic diagram of an exploded structure of a vapor chamber in a preferred embodiment of the backlight module of the present invention;

Fig. 5 is a schematic diagram of the installation structure of the uniform temperature plate and the heat dissipation plate in the preferred embodiment of the backlight module of the present invention;

FIG. 6 is a schematic structural view of the backplane in a preferred embodiment of the backlight module of the present invention.

In order to make the technical solution of the utility model clearer and clearer, it will be further described in detail below in conjunction with the accompanying drawings.

Detailed ways

As shown in FIG. 2 and FIG. 3 , FIG. 2 is a schematic structural view of a preferred embodiment of the backlight module of the present invention; FIG. 3 is an enlarged structural schematic view of A in FIG. 2 .

A backlight module proposed in this embodiment includes: a metal front frame 3, a back plate 7, a light strip 5, a heat dissipation plate 2, a light guide plate 1, a rubber strip 4, and a vapor chamber for conducting heat from the light strip 5 6, of which:

The back plate 7 is made of plastic material; the metal front frame 3, the rubber strip 4, the temperature equalization plate 6, the heat dissipation plate 2 and the back plate 7 are arranged in sequence from left to right, the heat dissipation plate 2 is fixed on the back plate 7, and the temperature equalization plate 6 is fixed On the cooling plate 2 , heat is transferred between the metal front frame 3 and the vapor chamber 6 through the rubber strip 4 ;

The light bar 5 includes LEDs and a PCB board for installing LEDs. The PCB board is an FR4PCB structure with multiple layers of copper foil. The bottom copper foil layer of the PCB board is exposed, and via holes are provided at the bottom and sides of the LEDs. In this way, Each layer of copper foil is connected as a whole through via holes, which can quickly conduct heat away from the PCB board.

Specifically, as shown in FIG. 4 and FIG. 5 , FIG. 4 is a schematic exploded view of the structure of the temperature chamber in this embodiment; FIG. 5 is a schematic diagram of the installation structure of the temperature chamber and the cooling plate in this embodiment.

In this embodiment, the vapor chamber 6 is a sealed hollow structure, and a phase change material is injected into the cavity 20 thereof.

In this embodiment, the uniform temperature plate 6 adopts an L-shaped structure, which includes a hollow bottom plate 61 and a side plate 62 perpendicular to the bottom plate 61. The upper surface of the bottom plate 61 is provided with a groove 40, and the light bar 5 Embedded in the groove 40 , and glued to the bottom of the groove 40 through silica gel, the side plate 62 of the temperature chamber 6 is fixedly connected with the heat dissipation plate 2 .

In this embodiment, the side plate 62 of the temperature equalizing plate 6 is provided with a step 50 on the outer surface where the cooling plate 2 is installed.

The bottom wall of the cooling plate 2 and the step 50 are bonded by silica gel, and the side wall of the cooling plate 2 and the outer surface of the side plate 62 are bonded by silica gel; the side plate 62 of the temperature chamber 6 is located in the The part below the step 50 is a hollow structure.

Both ends of the vapor chamber 6 are respectively provided with plugs 30 for sealing the cavity 20, and the plug 30 is L-shaped in accordance with the cross section of the vapor chamber 6. Specifically, the plugs at both ends of the vapor chamber 6 The head 30 seals the cavity 20 by mechanical pressing.

At the same time, an injection hole 10 for injecting phase change material into the cavity 20 is provided on the groove 40 of the uniform temperature plate 6 , and the injection hole 10 is sealed by silica gel.

During installation, the phase change material at a certain temperature is injected into the cavity 20 inside the chamber 6 , and the phase change material becomes solid at room temperature. When the light bar 5 is installed, the injection hole 10 is plugged with silica gel. Then the vapor chamber 6 is fixedly connected to the heat dissipation plate 2. First, the step 50 on the side plate 62 of the vapor chamber 6 is bonded to the bottom wall of the heat dissipation plate 2 through silica gel, and then the side plate 62 of the vapor chamber 6 is positioned on the step 50. The upper part is bonded to the side wall of the cooling plate 2 through silica gel, and then the side plate 62 of the uniform temperature plate 6 and the side wall of the cooling plate 2 are locked by external screws; after that, the cooling plate 2 is fixed on the plastic back by external screws. On board 7, when displays such as LED TVs are turned on, the phase change material is heated and gradually changes from solid to liquid. Due to the high specific heat capacity of the phase change material, it absorbs a large amount of heat generated by the LED, and the surface of the vapor chamber 6 is evenly temperatured, so that the lamp where the LED is located The effective heat conduction area under the bottom of the bar 5 is increased, that is to say, the heat conduction area of the LED is not limited to the area of the light bar 5 where the LED is located, but the heat conduction area of the LED is divided by the area of the LED where the LED is located. The area of the light bar 5 is expanded to the surface of the entire temperature chamber 6 below the light bar 5, thereby achieving the purpose of greatly reducing the temperature of the LED; at the same time, since the light bar 5 is embedded in the groove 40 in the temperature chamber 6, The combined thickness of the light bar 5 and the vapor chamber 6 is relatively small, so as to achieve the purpose of reducing the frame of the LED TV.

In this embodiment, the front frame 3 is arranged on the side of the bottom plate 61 of the temperature chamber 6 away from the side plate 62, and contacts the side wall of the bottom plate 61 of the temperature chamber 6 through the rubber strip 4, namely The rubber strip 4 is arranged between the left side of the temperature chamber 6 and the metal front frame 3 . The rubber strip 4 is used as a heat conduction medium between the vapor chamber 6 and the metal front frame 3, and can conduct part of the heat of the light bar 5 to the metal front frame 3, and dissipate it through the external atmosphere.

In addition, as shown in FIG. 6 , the plastic back plate 7 of this embodiment is provided with ventilation holes 60 , so that the cooling plate 2 is partially exposed to the external ambient air, and the external air flows through the surface of the cooling plate 2 to take away most of the heat.

The heat dissipation principle of the backlight structure in this embodiment is as follows:

This embodiment utilizes the characteristics of the large specific heat capacity of the phase change material in the cavity 20 of the vapor chamber 6 to quickly spread the heat of the light bar 5 to the entire vapor chamber 6 to greatly reduce the temperature of the LEDs. On the one hand, the heat of some LEDs passes through The rubber strip 4 on the left side of the temperature chamber 6 conducts to the metal front frame 3, and dissipates through the external atmosphere. On the other hand, most of the heat of the LED is conducted to the heat dissipation plate 2 connected to the right side of the temperature chamber 6, and the heat dissipation plate 2 will partly The heat is dissipated through the plastic backplane 7, and finally reduces the temperature of the LED; at the same time, this embodiment adopts the combination structure of the heat dissipation plate 2 and the plastic backplane 7 to replace the traditional heat dissipation structure of the combination of the aluminum heat dissipation plate 2 and the aluminum backplane 7, which reduces the cost .

It should be noted that, in other embodiments, the vapor chamber 6 may not adopt an L-shaped structure, or the heat dissipation plate 2 may not be provided, and the heat dissipation of the LEDs may be realized directly through the vapor chamber 6 .

In addition, the present invention also proposes a display device, which includes the backlight module of the above-mentioned embodiment. Please refer to the above-mentioned embodiment for its internal structure and functional features, and will not repeat them here.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Any equivalent structure or process transformation made by using the specification of the utility model and the contents of the accompanying drawings, or directly or indirectly used in other related All technical fields are all included in the scope of patent protection of the utility model in the same way.

Claims (10)

1. module backlight comprises: backboard and lamp bar is characterized in that also comprise temperature-uniforming plate, said temperature-uniforming plate is the hollow structure of sealing, injects phase-change material in its cavity;

Said temperature-uniforming plate is fixed on the said backboard, and said lamp bar is installed on the said temperature-uniforming plate.

2. module backlight according to claim 1 is characterized in that said temperature-uniforming plate comprises the base plate of hollow;

The upper surface of said base plate is provided with groove, and said lamp bar is embedded in the said groove, and bonding through the bottom of silica gel and said groove.

3. module backlight according to claim 2 is characterized in that, said temperature-uniforming plate also comprises the side plate vertical with said base plate, and said base plate and side plate make said temperature-uniforming plate form L type structure; Said temperature-uniforming plate is fixed on the said backboard through said side plate.

4. module backlight according to claim 3 is characterized in that, also comprises heat sink, and said heat sink is arranged between the side plate of said backboard and said temperature-uniforming plate, and said temperature-uniforming plate is fixed on the said backboard through said heat sink.

5. module backlight according to claim 4 is characterized in that the outer surface that the side plate of said temperature-uniforming plate is installed said heat sink is provided with step, and said heat sink is shelved on the said step, and is close to the outer surface of said side plate.

6. module backlight according to claim 5 is characterized in that, and is bonding through silica gel between the diapire of said heat sink and the said step; Bonding between the sidewall of said heat sink and the outer surface of said side plate through silica gel.

7. according to each described module backlight among the claim 3-6, it is characterized in that, frame and rubber strip before also comprising, said preceding frame is through the sidewall butt of the base plate of said rubber strip and said temperature-uniforming plate.

8. module backlight according to claim 7 is characterized in that, the two ends of said temperature-uniforming plate are respectively equipped with the plug of the cavity that is used to seal said temperature-uniforming plate.

9. module backlight according to claim 7 is characterized in that, the groove of said temperature-uniforming plate is provided with the injection orifice that is used in its cavity, injecting phase-change material, and said injection orifice passes through silica gel sealing.

10. a display device is characterized in that, comprises each described module backlight among the claim 1-9.

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