CN202507156U - Large polishing machine - Google Patents
Large polishing machine Download PDFInfo
- Publication number
- CN202507156U CN202507156U CN201120464182XU CN201120464182U CN202507156U CN 202507156 U CN202507156 U CN 202507156U CN 201120464182X U CN201120464182X U CN 201120464182XU CN 201120464182 U CN201120464182 U CN 201120464182U CN 202507156 U CN202507156 U CN 202507156U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- polished silicon
- polishing machine
- polishing
- transmission mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 59
- 230000005540 biological transmission Effects 0.000 claims abstract description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 42
- 229910052710 silicon Inorganic materials 0.000 claims description 42
- 239000010703 silicon Substances 0.000 claims description 42
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 238000005457 optimization Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a large polishing machine, which comprises a polishing mechanism, and a transmission mechanism connected with the polishing mechanism, wherein a driving mechanism is connected below the transmission mechanism; the polishing mechanism comprises an upper polishing sheet and a lower polishing sheet; a beam is arranged on the upper polishing sheet; an air cylinder is arranged above the beam; the transmission mechanism comprises a support shaft supporting the lower polishing sheet, and an operating device arranged around the support shaft and connected with the driving mechanism; a speed reducer is connected between the driving mechanism and the transmission mechanism; small box bodies are compactly arranged outside the driving mechanism and the transmission mechanism; and large box bodies are arranged outside the small box bodies. With the adopting the structure, the large polishing machine disclosed by the utility model is long in service life, high in work efficiency and high in polishing precision.
Description
Technical field
The utility model relates to the polishing machine mechanical field, is specifically related to a kind of large-scale polishing machine.
Background technology
The kind of conventional polisher is a lot; We mainly introduce the large-scale automatic numerical control polishing machine that is used for polished glass, pottery etc.; Above this polishing machine is general is polishing mechanism; Be provided with transmission mechanism below, the control device of conventional polisher directly links to each other with the cylinder of polishing mechanism top, can cause control accuracy not high; What the drive system of conventional polisher was used is cycloidal-pin wheel, little, the poor stability of power, and what established the support axis axle sleeve of polishing machine outside is self-lubricating bearing, the self-lubricating bearing poor rigidity, is not durable.Need permeate polishing fluid between two polished silicon wafer up and down in the time of polishing; Work a period of time need be taken off polished silicon wafer and cleared up; The polished silicon wafer thickness of a large-scale polishing machine is at 35-45mm, and the weight of large-scale polished silicon wafer probably has about 250 kilograms, and unloading is difficulty relatively.Polishing machine transmission mechanism outside only is provided with a casing, and for large-scale polishing machine, a casing is not easy transmission mechanism is stablized.
The utility model content
The utility model purpose: the utility model is in order to solve the deficiency of prior art, provides that a kind of power is big, good stability, large-scale polishing machine that the polishing accuracy is high.
Technical scheme: a kind of large-scale polishing machine; Comprise polishing mechanism, with the transmission mechanism that said polishing mechanism links to each other, be connected with driving mechanism below the said transmission mechanism, said polishing mechanism comprises polished silicon wafer and following polished silicon wafer; Above the said last polished silicon wafer crossbeam is installed; Cylinder is equipped with in said crossbeam top, and said transmission mechanism comprises the back shaft that supports said polished silicon wafer down and is installed in said back shaft and the running gear that links to each other with said driving mechanism on every side, is connected with decelerator between said driving mechanism and the said transmission mechanism; Said driving mechanism and transmission mechanism outside compactness are equipped with small box, and said small box outside is provided with big casing.
The large-scale polishing machine of the utility model; With transmission device that drive unit links to each other on reductor is housed; Make that this transmission mechanism power is big, good stability; The structure of small box is set in big casing, can makes many axles in the transmission mechanism that compactness, rational in infrastructure is installed, guarantee accurate control top polished silicon wafer work.
As optimization, said back shaft axle sleeve outside is provided with needle bearing.Reduced the fit clearance between bearing and the axle sleeve, the needle bearing good rigidly of changing simultaneously, durable, not easy to wear, service life of having increased polishing machine.
As optimization, the side of said big casing is provided with door, and said door is lower frame with the base, side of said big casing, and is said
Be provided with the fractionation jockey between the side of big casing and the said big casing.The lower frame of door adopts detachable apparatus, is come in the casing side, is convenient to the installation and the maintenance of transmission mechanism in the casing.
As optimization; The driving mechanism of said large-scale polishing machine links to each other with the PLC centralized-control box; Said PLC centralized-control box is provided with the PCL centralized control system, proportioning valve is housed in the said PLC centralized-control box links to each other with said PCL centralized control system, and said proportioning valve also links to each other with said cylinder.Proportioning valve in the control cabinet is directly controlled the cylinder of polishing mechanism top, and control accuracy is high, more accurately controls the polishing of polishing mechanism.
As optimization; The said polished silicon wafer that goes up comprises upper strata polished silicon wafer and lower floor's polished silicon wafer; Correspondence is provided with some through holes that are complementary mutually in the middle of said upper strata polished silicon wafer and the lower floor polished silicon wafer; In the said through hole fixture is housed, the center that also is provided with on the polished silicon wafer of said upper strata with said upper strata polished silicon wafer is a symmetric points symmetry alignment pin.Be divided into two last polished silicon wafer, dismounting can remove lower floor's polished silicon wafer when clearing up and get final product, and avoids the dismounting of monoblock polished silicon wafer to increase the dismounting difficulty because of weight is excessive.
As optimization, said driving mechanism is a motor.
Beneficial effect: the large-scale polishing machine of the utility model pastes the polishing skin on last polished silicon wafer or polishing cloth can carry out polishing, adopts said structure long service life, high efficiency, polishing accuracy height.
Description of drawings
Fig. 1 is the large-scale polishing machine front view of the utility model;
Fig. 2 is side structure sketch map of the big casing of the large-scale polishing machine of the utility model.
The specific embodiment
As shown in the figure, a kind of large-scale polishing machine comprises polishing mechanism 1, the transmission mechanism 2 that links to each other with said polishing mechanism 1; Be connected with driving mechanism 3 below the said transmission mechanism 2, said polishing mechanism 1 comprises polished silicon wafer 4 and following polished silicon wafer 5, above the said last polished silicon wafer 4 crossbeam 6 is installed; Cylinder 7 is equipped with in said crossbeam 6 tops; Around said transmission mechanism 2 comprises the back shaft 8 that supports said polished silicon wafer 5 down and is installed in said back shaft 8 and the running gear that links to each other with said driving mechanism 3, be connected with decelerator 9 between said driving mechanism 3 and the said transmission mechanism 2, said driving mechanism 3 and transmission mechanism 2 outside compactnesses are equipped with small box 10; Said small box 10 outsides are provided with big casing 11; Said back shaft 8 axle sleeves outside is provided with needle bearing, and the side of said big casing 11 is provided with door 12, and said door 12 bases, side with said big casing 11 are lower frame; Be provided with between the side of said big casing 11 and the said big casing 11 and split jockey 13; The driving mechanism 3 of said polishing machine links to each other with PLC centralized-control box 14, and said PLC centralized-control box 14 is provided with the PCL centralized control system, proportioning valve 15 is housed in the said PLC centralized-control box 14 links to each other with said PCL centralized control system; Said proportioning valve 15 also links to each other with said cylinder 7; The said polished silicon wafer 4 that goes up comprises upper strata polished silicon wafer 16 and lower floor's polished silicon wafer 17, and said upper strata polished silicon wafer 16 is provided with some through holes that are complementary mutually 18 with lower floor polished silicon wafer 17 centre correspondences, in the said through hole 18 fixture is housed; The center that also is provided with on the said upper strata polished silicon wafer 16 with said upper strata polished silicon wafer 16 is a symmetric points symmetry alignment pin 19, and said driving mechanism 3 is a motor.
Claims (7)
1. large-scale polishing machine; It is characterized in that: comprise polishing mechanism (1), the transmission mechanism (2) that links to each other with said polishing mechanism (1); Be connected with driving mechanism (3) below the said transmission mechanism (2); Said polishing mechanism (1) comprises polished silicon wafer (4) and following polished silicon wafer (5); Above the said last polished silicon wafer (4) crossbeam (6) is installed; Cylinder (7) is equipped with in said crossbeam (6) top, and said transmission mechanism (2) comprises the back shaft (8) that supports said polished silicon wafer (5) down and is installed in said back shaft (8) and the running gear that links to each other with said driving mechanism (3) on every side, is connected with decelerator (9) between said driving mechanism (3) and the said transmission mechanism (2); Said driving mechanism (3) and transmission mechanism (2) outside compactness are equipped with small box (10), and said small box (10) outside is provided with big casing (11).
2. a kind of large-scale polishing machine according to claim 1 is characterized in that: said back shaft (8) axle sleeve outside is provided with needle bearing.
3. a kind of large-scale polishing machine according to claim 1; It is characterized in that: the side of said big casing (11) is provided with door (12); Said door (12) is a lower frame with the base, side of said big casing (11), is provided with between the side of said big casing (11) and the said big casing (11) to split jockey (13).
4. a kind of large-scale polishing machine according to claim 1 is characterized in that: the driving mechanism of said polishing machine (3) links to each other with PLC centralized-control box (14), and said PLC centralized-control box (14) is provided with the PCL centralized control system.
5. a kind of large-scale polishing machine according to claim 4 is characterized in that: in the said PLC centralized-control box (14)
Proportioning valve (15) is housed links to each other with said PCL centralized control system, said proportioning valve (15) also links to each other with said cylinder (7).
6. a kind of large-scale polishing machine according to claim 1; It is characterized in that: the said polished silicon wafer (4) that goes up comprises upper strata polished silicon wafer (16) and lower floor's polished silicon wafer (17); Said upper strata polished silicon wafer (16) is provided with some through holes that are complementary mutually (18) with the middle correspondence of lower floor's polished silicon wafer (17); Said through hole is equipped with fixture in (18), and the center that also is provided with on the said upper strata polished silicon wafer (16) with said upper strata polished silicon wafer (16) is a symmetric points symmetry alignment pin (19).
7. a kind of large-scale polishing machine according to claim 1 is characterized in that: said driving mechanism (3) is a motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120464182XU CN202507156U (en) | 2011-11-21 | 2011-11-21 | Large polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120464182XU CN202507156U (en) | 2011-11-21 | 2011-11-21 | Large polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202507156U true CN202507156U (en) | 2012-10-31 |
Family
ID=47059660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120464182XU Expired - Fee Related CN202507156U (en) | 2011-11-21 | 2011-11-21 | Large polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202507156U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722465A (en) * | 2014-01-21 | 2014-04-16 | 南通天盛新能源科技有限公司 | Glass substrate surface bath polishing device for biochips |
| CN106239339A (en) * | 2016-07-27 | 2016-12-21 | 湖南宇晶机器股份有限公司 | A kind of curved surface polishing machine |
-
2011
- 2011-11-21 CN CN201120464182XU patent/CN202507156U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722465A (en) * | 2014-01-21 | 2014-04-16 | 南通天盛新能源科技有限公司 | Glass substrate surface bath polishing device for biochips |
| CN106239339A (en) * | 2016-07-27 | 2016-12-21 | 湖南宇晶机器股份有限公司 | A kind of curved surface polishing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20141121 |
|
| EXPY | Termination of patent right or utility model |