CN202411554U - Composite diamond wire saw - Google Patents
Composite diamond wire saw Download PDFInfo
- Publication number
- CN202411554U CN202411554U CN2012200352806U CN201220035280U CN202411554U CN 202411554 U CN202411554 U CN 202411554U CN 2012200352806 U CN2012200352806 U CN 2012200352806U CN 201220035280 U CN201220035280 U CN 201220035280U CN 202411554 U CN202411554 U CN 202411554U
- Authority
- CN
- China
- Prior art keywords
- diamond
- wire saw
- saw
- metal
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 47
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 47
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 18
- 238000005520 cutting process Methods 0.000 abstract description 12
- 238000009713 electroplating Methods 0.000 abstract description 11
- 238000012545 processing Methods 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 239000003082 abrasive agent Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003754 machining Methods 0.000 abstract description 2
- 239000011230 binding agent Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 229910001573 adamantine Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model relates to a composite diamond wire saw comprising a metal thread and an electroplated layer, wherein the electroplated layer is coated on the metal thread by electroplating for fixing the bottoms of diamond particles. The diamond particles are uniformly distributed on the electroplated layer. The wire saw is a tool to deposit a metal layer on the metal thread by an electroplating method and consolidate diamond abrasives in the deposited metal to manufacture a linear ultra-hard material. The metal coating is a binding agent; and the diamond abrasives are used for cutting process. The electroplating diamond wire saw can be manufactured into different diameters and lengths as required, and can be arranged on different devices to form different processing ways, such as reciprocating and recirculation way, high-speed belt-saw way, and linear cutting way. For the processing of hard-brittle materials, the wire saw cannot only be used for cutting slices, but also can be used for surface machining and hole grinding, thereby having a very wide application future.
Description
Technical field
The utility model relates to the diamond cut electrician testing tool technology field, specifically is a kind of composite diamond fretsaw, also claims diamond fret saw.
Background technology
At present, the instrument that is used to cut hard brittle material (for example: monocrystalline silicon crystal bar, gallium arsenide, quartz glass etc.) in the prior art is interior circle or cylindrical or annular diamond saw blade, once cuts an otch.Use this diamond saw blade cutting to make sheet material, effect is lower; Because saw blade is thicker, otch is bigger in the cutting sheet material, and material deterioration inside is bigger during the film-making material like this.
In order to improve stock-removing efficiency, also has a kind of scroll saw in the prior art, its normally linear wire; On the sawing device that uses this scroll saw; Often a wires is organized more and arranged setting, once can cut a plurality of otch, make multi-disc hard & brittle material sheet.Use existing scroll saw cutting sheet material, scroll saw is moved under the drive of power set, on scroll saw, spread the abrasive powders of immersion oil then, through falling abrasive material and the friction sawing workpiece between the workpiece on the scroll saw steel wire.This cutting is because abrasive material separates with scroll saw, and therefore, the cutting work efficiency is lower, and simultaneously, owing to moving of abrasive grain in working angles, therefore, the otch that on workpiece, cuts out is also bigger, and general otch will be about 1mm.Have again; Everywhere thickness difference is bigger on the sheet material that obtains of cutting like this, and warpage is serious, (remain in the cut channel on the face of cutting into slices dark); In order to make sheet material reach instructions for use; Also to carry out follow-up processing such as polishing, increase processing cost and production cycle, and cause the quality of the material of cutting into slices bad easily it.
The problems referred to above are all due to the scroll saw of the invar silk and the unpack format of the sand grains that is used for sawing.With above-mentioned scroll saw cut workpiece, want in the operation to spread abrasive material on the continuous online saw, extremely inconvenient, the immersion oil abrasive material also has bigger pollution to environment.
The utility model content
The less composite diamond fretsaw of otch that the technical problem that the utility model will solve produces when providing a kind of simple in structure, service life long, work.
For solving the problems of the technologies described above; The composite diamond fretsaw that the utility model provides; Be characterized in comprising: diameter be 0.33mm tinsel, be coated on the electrodeposited coating that is used for fixing the diamond particles middle and lower part on the tinsel through plating; Said diamond particles is uniformly distributed on the said electrodeposited coating continuously, and the size of diamond particles is the 3.0-4.0 order.
The technique effect that the utlity model has:
(1) the composite plating diamond fretsaw of the utility model is with the electric plating method a kind of linear tool made of superhard material that consolidating material and diamond abrasive is processed in the metal that deposits layer of metal (being generally nickel and nickel cobalt (alloy)) on the tinsel and depositing.The coat of metal is a bond, and diamond abrasive is used for cut.Electroplating diamond wire saw can be made into different diameters and length as required; Scroll saw can be contained in the different processing mode of formation on the different equipment, like reciprocation cycle (saw frame) formula, high speed band saw formula, line cutting type etc.To the processing of hard brittle material, scroll saw not only can dicing sheet, but also processing curve more can be used for the advanced study and training of aperture, and its application prospect is very wide.
(2) compare with other process technology, electroplating diamond wire saw has its unique advantage: compare with the free abrasive scroll saw, its working (machining) efficiency is higher, and energy consumption is lower; Can avoid batch mixing, granulation, sintering, welding loaded down with trivial details operations such as (or injection mouldings) in the sintered diamond tool manufacture process; Can be used for the non-conductor that electron discharge processing EDM can't process is processed; Diamond fretsaw is wrapped in around the cylinder, can repeatedly cut workpiece (like silicon rod) simultaneously, and can process a plurality of workpieces simultaneously; Owing to have spacing between the sintered diamond scroll saw beading, the spacing part possibly worn and torn prematurely and caused the fracture of steel wire (line), and adamantine continuous distributed in the electroplating diamond wire saw, can avoid the premature failure of scroll saw; Compare with band saw with annular saw, scroll saw can change cut direction neatly, can be used for the geometry of processed complex; Since wire saw diameters little (general＜1mm), it is little to add the man-hour kerf loss, this has great importance for the expensive semiconductor of cost and the processing of jewel.
(3) tinsel can be steel wire, stainless steel wire, tungsten silk, molybdenum filament and brass wire etc.For adapting to processing, matrix material should be selected tensile strength height and toughness material preferably for use; For ease of electroplating, its electrode potential should be lower than the current potential of plated metal (like nickel and nickel alloy).The definite of diameter wiry and length should decide according to machined material, processing mode and appointed condition.Generally speaking, for saving machined material, improve the wire that the line flexibility should be selected minor diameter for use as far as possible.
(4) electroplating diamond wire saw generally adopts the adamantine method manufacturing of composite plating nickel (or nickel alloy).The plating solution formula that composite plating nickel (or nickel alloy) diamond is used has multiple, is main salt with nickelous sulfate commonly.But the optimal selection for the electroplating diamond wire saw that bending motion is arranged then is to be the plating bath of main salt with nickel sulfamic acid, and it has that the nickel deposition velocity is fast, internal stress is little and advantage such as suitable isochronism, therefore is particularly suitable for electroplating diamond wire saw.
Description of drawings
For the content that makes the utility model is more clearly understood, below basis specific embodiment and combine accompanying drawing, the utility model is done further detailed explanation, wherein
Fig. 1 is the contour structures sketch map of the composite diamond fretsaw of the utility model;
Fig. 2 is the sectional structure chart of Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is elaborated:
Like Fig. 1-2; The composite diamond fretsaw 1 of present embodiment; It comprises: diameter be 0.33mm tinsel 11, be coated on the electrodeposited coating 12 that is used for fixing diamond particles 3 middle and lower parts on the tinsel 11 through plating; Said diamond particles 3 is uniformly distributed on the said electrodeposited coating 12 continuously, and the size of diamond particles 3 is the 3.0-4.0 order.
Above-mentioned diamond wire saw production method comprises: the first step: the diamond surface preliminary treatment at first, place alkaline solution to remove surperficial grease the diadust after, the clear water washing; Then, place strong acid solution to remove surface metal oxide after, the clear water washing; Second step: the diadust after the diamond surface cationization is handled the first step places cationic surface active agent solution; Cationic surface active agent solution is applied the positive potential of 0.1-2V; The cation of cationic surface active agent is under the effect of electrophoresis; With the diamond particle is the center, forms the film that one deck has positive charge at diamond surface; The 3rd step: the composite plating of diamond fretsaw is an electroplate liquid with electronickelling watt solution, and steel wire rope is a negative electrode, and electroplating voltage is: 2.25-7.55V, and the 0.1%-1.0% that surperficial cationization diadust is pressed the electroplate liquid quality adds; Promptly make composite diamond fretsaw of the present invention.
Obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not to be qualification to the embodiment of the utility model.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all embodiments.And conspicuous variation that these spirit that belong to the utility model are extended out or change still are among the protection domain of the utility model.
Claims (1)
1. composite diamond fretsaw; It is characterized in that comprising: diameter be 0.33mm tinsel (11), be coated on the electrodeposited coating (12) that is used for fixing diamond particles (3) middle and lower part on the tinsel (11) through plating; Said diamond particles (3) continuous distributed is on said electrodeposited coating (12), and the size of diamond particles (3) is the 3.0-4.0 order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200352806U CN202411554U (en) | 2012-02-05 | 2012-02-05 | Composite diamond wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200352806U CN202411554U (en) | 2012-02-05 | 2012-02-05 | Composite diamond wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202411554U true CN202411554U (en) | 2012-09-05 |
Family
ID=46736349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200352806U Expired - Fee Related CN202411554U (en) | 2012-02-05 | 2012-02-05 | Composite diamond wire saw |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202411554U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104088001A (en) * | 2013-05-09 | 2014-10-08 | 吴红平 | Production device of diamond wire |
| CN105908243A (en) * | 2013-05-09 | 2016-08-31 | 吴红平 | Diamond wire production method |
-
2012
- 2012-02-05 CN CN2012200352806U patent/CN202411554U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104088001A (en) * | 2013-05-09 | 2014-10-08 | 吴红平 | Production device of diamond wire |
| CN105908243A (en) * | 2013-05-09 | 2016-08-31 | 吴红平 | Diamond wire production method |
| CN104088001B (en) * | 2013-05-09 | 2016-09-07 | 江西理工大学 | The process units of diamond wire |
| CN105926024A (en) * | 2013-05-09 | 2016-09-07 | 吴红平 | Method for producing diamond wire |
| CN105908243B (en) * | 2013-05-09 | 2017-12-12 | 连云港太阳光石英陶瓷有限公司 | A kind of method for producing diamond wire |
| CN105926024B (en) * | 2013-05-09 | 2017-12-12 | 连云港市荣泰碳化硅有限公司 | The method for producing diamond wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20130205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |