CN202297106U - Packaging structure of vertical sensor - Google Patents
Packaging structure of vertical sensor Download PDFInfo
- Publication number
- CN202297106U CN202297106U CN2011204282189U CN201120428218U CN202297106U CN 202297106 U CN202297106 U CN 202297106U CN 2011204282189 U CN2011204282189 U CN 2011204282189U CN 201120428218 U CN201120428218 U CN 201120428218U CN 202297106 U CN202297106 U CN 202297106U
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- China
- Prior art keywords
- vertical reference
- substrate
- metal lead
- metal
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000004806 packaging method and process Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 33
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 238000004021 metal welding Methods 0.000 claims description 21
- 239000010931 gold Substances 0.000 claims description 19
- 229910052737 gold Inorganic materials 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 239000004568 cement Substances 0.000 claims description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 4
- 210000003141 lower extremity Anatomy 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 8
- 239000003292 glue Substances 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 9
- 239000006071 cream Substances 0.000 description 6
- 230000006698 induction Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007430 reference method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a packaging structure of a vertical sensor. The packaging structure comprises a substrate and a vertical sensor, wherein certain number of metallic leads are arranged on the substrate, metallic welding zones, of which the number is identical to that of the metallic leads, are arranged on the edge of the vertical sensor which is fixed on the substrate through insulating glue. The distance between two adjacent metallic leads of the substrate is identical to the distance between two adjacent metallic welding zones on the edge of the vertical sensor, and the metallic welding zones and the metallic leads are electrically conductive with each other. The packaging structure satisfies the requirements of a vertical sensor over vertical precision. Moreover, device can be produced in small size with low cost.
Description
Technical field
The utility model belongs to the semiconductor packaging field, relates in particular to the encapsulating structure of vertical reference in a kind of vertical encapsulation technology or the MEMS system of chip.
Background technology
Along with the MEMS (abbreviation of Micro Electro Mechanical systems; Being microelectromechanical systems) device is in the extensive use of consumer electronics field; More and more stronger to its low cost, miniaturization, multi-functional, large batch of requirement; For the gyroscope of being made up of chip (being " sensor " again), gravity accelerometer and the signal processing chip of X, Y, three magnetic induction of Z, wherein Z magnetic induction chip need be vertically mounted on the substrate.The vertically arranged magnetic induction chip of this need is vertical reference again.
For the installation of vertical reference, the structure of traditional handicraft encapsulation is as shown in Figure 1, and a plurality of metal lead wires 11,13 are arranged on the substrate 10, forms tin paste layer 12,14 through serigraphy on the metal lead wire.Among Fig. 1, left side tin paste layer 14 is used for the location of vertical reference, and right side tin paste layer 12 is used to connect the tin paste layer 22 of the metal welding zone 21 of vertical reference 20, realizes the location and the welding of vertical reference after the Reflow Soldering.
Adopt the shortcoming of traditional this process to have: in the substrate serigraphy because substrate warp and flatness problem; It is unusual to be prone to take place aspects such as tin cream wetability, skew short circuit, voidage, tin cream thickness evenness; And; Because the design of metal lead wire spacing can not be too close, so adopt traditional this technology to have relatively high expectations in operating aspect.
In addition, aspect reliability, adopt the incidental situation of this traditional handicraft to have: owing to do not adopt adhesives between vertical reference and substrate; But adopt tin paste layer location, left side; Be prone to form the air gap between encapsulation metacoxal plate and vertical reference contact-making surface, be commonly referred to as layering, under thermal shock the gap can become big and to around spread; When being diffused into the tin cream pad, the sealing-off risk takes place in this SAC pad easily under this stress.
The utility model content
For overcoming the above-mentioned defective of prior art, the utility model provides a kind of encapsulating structure of magnetic induction vertical reference, it can satisfy vertical reference to the vertical precision requirement, realizes low cost, the miniaturization of device.
A kind of vertical reference encapsulating structure that the utility model proposes; Comprise substrate, vertical reference; Substrate is provided with the metal lead wire of some; Vertical reference is provided with the metal welding zone consistent with metal lead wire quantity, and vertical reference is fixed on the substrate through insulating cement, and the spacing between adjacent two metal welding zones equates with spacing between adjacent two metal lead wires; Realize conducting through solder joint between metal welding zone and the metal lead wire.Said solder joint be by the tin paste layer of on the metal welding zone, brushing and on metal lead wire the gold goal salient point of hot pressing ultrasonic bond bonding be welded through Reflow Soldering.
As preferably, the spacing between adjacent two metal welding zones at spacing between adjacent two metal lead wires and vertical reference edge is 200um.
As preferably, the distance between said insulating cement and the metal lead wire lower limb is not less than 50um.
As preferably, the thickness of said insulating cement is 5-20um.
The beneficial effect of the utility model is following:
1, the utility model is to the shortcoming on traditional product technology and the reliability, and with employing insulating cement bonding between vertical reference and substrate, but insulating cement has the impact of good retractility thermal stress resistance;
2, substrate is brushed process of tin and is changed the gold goal welding procedure into after, the toughness of gold goal capable of using effectively cushions the effect of stress, reduces the risk of solder joint sealing-off;
3, adopt bonding gold goal salient point on the substrate, simplified technologic complexity greatly, gold goal technology can satisfy close spacing requirement of welding simultaneously, and it is littler that the vertical reference size just can be done;
4, the vertical reference encapsulating structure of the utility model is beneficial to the realization of the encapsulation MCP (Multi ChipPackage) of multicore sheet, reduces time delay, encapsulation volume and weight in the encapsulation, has improved the reliability of system.
Description of drawings
Fig. 1 is for adopting a kind of vertical reference encapsulating structure of existing vertical reference method for packing encapsulation;
Fig. 2 is a kind of vertical reference encapsulating structure example structure sketch map of the utility model.
Fig. 3 is the floor map of the vertical reference installation base plate of the utility model embodiment;
Fig. 4 is the front schematic view of the vertical reference of the utility model embodiment;
Fig. 5 has been vertically mounted on the floor map on the substrate for the vertical reference of the utility model embodiment;
Fig. 6 is the side view behind the vertical reference that installs of the utility model embodiment;
Each description of symbols of accompanying drawing: 10-substrate; The 11-metal lead wire; The 12-tin paste layer; The 13-metal lead wire; The 14-tin paste layer; 15-gold goal salient point; The 16-insulating cement; The 20-vertical reference; 21-metal welding zone; The 22-tin paste layer; The 30-solder joint.
The specific embodiment
Fig. 2 is the encapsulating structure sketch map of the vertical reference of present embodiment, and this encapsulating structure comprises substrate 10, vertical reference 20, metal welding zone 21, metal lead wire 11, and said vertical reference is fixed on the substrate through insulating cement 16; A plurality of metal lead wires are arranged on the substrate, and spacing is and equates between a plurality of metal welding zones 21 on the vertical reference, the interval spacing of adjacent two metal welding and adjacent two gold goals; Solder joint 30 and metal lead wire that the metal welding zone forms after through Reflow Soldering conduct, and realize the transmission of signal.
The encapsulation of the vertical reference of present embodiment comprises following several aspect: there are several input and output metal welding zones at the edge of vertical reference, is brushed with tin cream on these welding zones and forms tin paste layer; On the installation base plate corresponding several metal lead wires are arranged also, the gold goal salient point of certain altitude is arranged through hot pressing ultrasonic bond bonding on metal lead wire with these tin paste layers;
Bonding between vertical reference and substrate then adopts insulating cement, and precuring, realizes the vertical placement of sensor; Metal lead wire on vertical reference tin paste layer and the substrate keeps corresponding relation simultaneously, and the sensor edge is as far as possible near the gold goal salient point;
Realize the welding of sensor and substrate gold goal salient point through the high temperature reflux weldering,, can guarantee the perpendicularity of sensor well owing to adopt the insulating cement bonding.
The encapsulation of the vertical reference of present embodiment is adopted and is comprised the steps:
Step 1, shown in Figure 3 be the floor map of vertical reference installation base plate, the metal lead wire of some is arranged on the substrate 10, metal lead wire is sensor power supply and signal transmission pathway.Material can be gold, nickel alloy etc., has identical distance values (representing spacing with pitch in the accompanying drawing) between each lead-in wire, and distance values is about 200um in the present embodiment; On each metal lead wire through gold goal salient point 15 of each bonding of hot pressing ultrasonic bond.Reliable in order to guarantee that the vertical reference tin paste layer is connected with the gold goal salient point, the diameter 70-100um of gold goal salient point is advisable, and the diameter in the present embodiment on the gold goal salient point horizontal direction is about 90um, high (being the height of gold goal salient point in the vertical direction) the about 50um of ball; Gold goal salient point center overlaps with the metal lead wire center as far as possible simultaneously.
Step 2, on substrate point insulating glue, adhere on the metal lead wire for fear of insulating cement, the distance between insulating cement and the metal lead wire lower limb is not less than 50um and is advisable, like 75um.
Step 3, Fig. 4 are the front schematic view of vertical reference; Its edge designs has and the same number of metal welding zone of metal lead wire; Has the uniform distances value between the adjacent metal welding zone; And the distance values on the distance values between the adjacent metal welding zone and the substrate between the adjacent metal lead-in wire is identical, also is about 200um; Tin cream in serigraphy on the metal welding zone of vertical reference chip.
Step 4, vertical reference 20 is vertically mounted on the substrate; As shown in Figure 5; Between vertical reference and substrate certain thickness insulating cement will be arranged, the preferred 5-20um of the thickness of present embodiment insulating cement can make the insulating cement of vertical reference adhesive surface be stained with the profit rate and reach more than 75%.The bonding of insulating cement has guaranteed the position precision and the perpendicularity of vertical reference, and tin cream on the vertical reference and gold goal salient point position must keep one-to-one relationship simultaneously.
Fig. 5 is the side view that installs vertical reference.
Step 5, vertical reference shown in Figure 6 is carried out Reflow Soldering, Fig. 2 is the encapsulating structure sketch map of the vertical reference after the reflow soldering.
Claims (5)
1. the encapsulating structure of a vertical reference; Comprise substrate and vertical reference; It is characterized in that: substrate is provided with the metal lead wire of some; Vertical reference is provided with the metal welding zone consistent with metal lead wire quantity, and vertical reference is fixed on the substrate through insulating cement, and the spacing between the spacing between adjacent two metal lead wires and adjacent two the metal welding zones is equal; Realize conducting through solder joint between metal welding zone and the metal lead wire.
2. encapsulating structure as claimed in claim 1 is characterized in that: said solder joint be by the tin paste layer of on the metal welding zone, brushing and on metal lead wire the gold goal salient point of hot pressing ultrasonic bond bonding be welded through Reflow Soldering.
3. encapsulating structure as claimed in claim 1 is characterized in that: the spacing between adjacent two metal welding zones at spacing between adjacent two metal lead wires and vertical reference edge is 200um.
4. encapsulating structure as claimed in claim 1 is characterized in that: the distance between said insulating cement and the metal lead wire lower limb is not less than 50um.
5. encapsulating structure as claimed in claim 1 is characterized in that: the thickness of said insulating cement is 5-20um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204282189U CN202297106U (en) | 2011-11-02 | 2011-11-02 | Packaging structure of vertical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204282189U CN202297106U (en) | 2011-11-02 | 2011-11-02 | Packaging structure of vertical sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202297106U true CN202297106U (en) | 2012-07-04 |
Family
ID=46366044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204282189U Expired - Lifetime CN202297106U (en) | 2011-11-02 | 2011-11-02 | Packaging structure of vertical sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202297106U (en) |
-
2011
- 2011-11-02 CN CN2011204282189U patent/CN202297106U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190108 Address after: 610000 1-3 Floor, No. 9 Shixin Road, Huaikou Town, Jintang County, Chengdu City, Sichuan Province (Chengdu-Aba Industrial Development Zone) Patentee after: Chengdu jeakco science and Technology Co Ltd Address before: 310018 No. 308, No. 10 Road, East District, Hangzhou (Xiasha) Economic and Technological Development Zone, Zhejiang Province Patentee before: Hangzhou Silan Integrated Circuit Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |