CN202296379U - Discharging device for solar battery assembly line - Google Patents

Abstract

A blanking device for a solar cell production line includes: a silicon wafer conveying unit, which supports and conveys silicon wafers; a suction pipe, located above the silicon wafer conveying unit; and a manifold distributor, where the suction pipe is installed on the manifold distributor Upper; multiple manifolds; one end of each manifold is mounted on the manifold distributor and is in gas communication with the suction pipe through the manifold distributor; manifold support plate, the other end of each manifold is pierced and fixed On the manifold support plate; a plurality of vacuum pen suction cups, each vacuum pen suction cup mounted on said other end of a corresponding one of the manifolds and in gas communication with said corresponding one of the manifolds; an adjustable air knife located on the wafer Below the conveying unit, on the upper surface of the adjustable air knife, there is a gas discharge port that blows gas upward; the silicon wafer limit baffle is located downstream of the conveying direction of the silicon wafer conveying unit, driven by the drive unit in the standby position and the blocking position; the control unit is used to control the unloading device to pick up silicon wafers.

Description

Unloading device for solar cell production line

technical field

The utility model belongs to the field of solar cell technology equipment, in particular to a material-cutting device after the texturing and etching processes of a solar cell production line.

Background technique

Solar cells (photovoltaic cells), as a renewable and environmentally friendly energy source, have attracted widespread attention at home and abroad, and various measures have been introduced to promote the large-scale construction of photovoltaic power plants. At the same time, the production process equipment of solar cells has also developed rapidly. The production capacity of each process equipment is constantly increasing, and the requirements of low fragmentation rate and high yield rate of good products put forward strict requirements on the performance of process equipment. The pick-up and transfer of silicon wafers runs through the whole process of the battery process, and is a key link in the rate of fragmentation and yield.

However, the currently used online blanking devices use a central suction cup above the silicon wafer in the blanking area or a pen-type suction cup distributed at the four corners of the silicon wafer or a combination of the two to complete the suction of the silicon wafer, and then through the servo motor Control and move the manipulator to complete the transfer of silicon wafers. Since the rollers and guide sleeves carrying the silicon wafers are in continuous operation, when the control unit controls the sucker to pick up the silicon wafer, the sucker must be at a certain distance from the silicon wafer. Therefore, the suction force of the sucker is much greater than the minimum threshold required to absorb the silicon wafer. This larger suction force will form an instantaneous impact on the surface of the silicon wafer, which will easily cause local deformation of the silicon wafer surface, resulting in the formation and expansion of cracks, and even directly lead to fragmentation.

Utility model content

The purpose of the utility model is to provide a material unloading device for a solar cell production line to solve the problem of damage to silicon chips when picking them up.

According to one aspect of the present invention, there is provided an unloading device for a solar cell production line, the unloading device includes: a silicon wafer conveying unit, used to support and transport the silicon wafers to be picked up; Above the silicon wafer conveying unit; manifold distributor, the suction pipe is installed on the manifold distributor; multiple manifolds; one end of each manifold is installed on the manifold distributor, and is connected with the suction pipe through the manifold distributor Tracheal gas communication; manifold support plate, located between the silicon wafer delivery unit and the manifold distributor, the other end of each manifold penetrates and is fixed on the manifold support plate; multiple vacuum pen suction cups, each The vacuum pen suction cup is installed on the other end of the corresponding one of the multiple manifolds and is in gas communication with the corresponding one of the manifolds; the adjustable air knife is located in the lower middle of the silicon wafer conveying unit, The upper surface of the adjustable air knife is provided with a gas discharge port that blows gas upward; the silicon wafer limit baffle is located downstream of the conveying direction of the silicon wafer conveying unit, and is driven by the drive unit on the lower part of the silicon wafer conveying unit. A standby position and a blocking position for blocking silicon wafers to be picked up; a control unit for controlling the unloading device to pick up silicon wafers.

The unloading device may further include: a central suction cup, fixed at the center of the lower surface of the manifold support plate, and communicating with the air suction pipe.

The plurality of vacuum pen chucks may be arranged in a quadrangular manner relative to the silicon wafer to be picked up.

A solenoid valve and an air pressure regulating valve can be installed on the upstream of the suction pipe, the solenoid valve controls the on-off of the air circuit, and the air pressure regulating valve adjusts the air pressure of the air circuit.

The silicon wafer conveying unit may include a plurality of rollers, the plurality of rollers are separated from each other by a predetermined distance, guide sleeves are respectively installed on both ends of each roller, and the silicon wafers are placed on the rollers and located at two opposite ends. Between the guide sleeves, the plurality of rollers rotate at a predetermined speed to drive the silicon wafers to move to the feeding area.

A photoelectric sensor can be arranged above or below the silicon wafer conveying unit to determine whether the silicon wafer has reached the predetermined unloading area. When the photoelectric sensor determines that the silicon wafer has reached the predetermined unloading area, the photoelectric sensor sends a pick-up signal.

After the photoelectric sensor detects that the silicon wafer moves to the predetermined unloading area, the control unit can send a control signal according to the pick-up signal of the photoelectric sensor to activate the drive unit so that the silicon wafer limit baffle moves upward from the standby position to the blocking position to block the silicon wafer , so as to limit the forward movement of the silicon wafer, through the limitation of the guide sleeve and the blocking of the silicon wafer limit baffle, the silicon wafer is limited in the predetermined unloading area, waiting to be picked up.

When the silicon wafer is limited in the predetermined unloading area, the control unit can send a control signal to the solenoid valve installed upstream of the suction pipe to open the vacuum pen suction cup and the central suction cup above the silicon wafer to carry out The suction action, and the control unit sends a control signal to open the adjustable air knife installed under the silicon wafer conveying unit, and the gas discharge port blows up the gas to make the silicon wafer suspend and leave the roller for a certain distance, close to the vacuum pen suction cup above the silicon wafer And the center suction cup, so as to form the silicon wafer picking method of the parallel combination of the bottom-up blowing of the adjustable air knife and the bottom-up suction of the vacuum pen suction cup and the center suction cup.

The adjustable air knife can be arranged in the center of the unloading area of the silicon wafer, and includes an air knife body, an air inlet pipe, sealing screws and washers, and an air pressure fine-tuning mechanism. The air intake pipe, sealing screw and washer are arranged on the side surface of the air knife body. The air pressure fine-tuning mechanism is located inside the air knife body. The air pressure fine-tuning mechanism is a top screw with a conical head at one end. There is a predetermined gap between the air passages. By adjusting the gap between the conical head of the top wire and the air channel inside the air knife body, the thickness of the air curtain and the air pressure generated by the gas discharge port are adjusted and controlled.

The manifold support plate can be connected with the transfer manipulator of the solar cell production line, and the transfer manipulator moves the manifold support plate according to a predetermined trajectory, thereby moving the silicon wafers adsorbed on the vacuum pen suction cup and the center suction cup to a predetermined position.

According to the utility model, when the unloading device used in the solar cell production line is in operation, the air knife below the silicon wafer and the suction cup above act simultaneously to form a combined silicon wafer picking method of blowing down and sucking up. Compared with the method of using the upper suction cup alone in the prior art, the impact force of the silicon wafer on the suction cup is greatly reduced, and the surface deformation of the silicon wafer is prevented, so there will be no picking and moving of the silicon wafer in the production line. Problems with fragmentation and debris caused by loading.

Description of drawings

These and/or other aspects and advantages of the present utility model will become clear and easier to understand from the description of the following embodiments in conjunction with the accompanying drawings, wherein:

1 is a schematic structural view of a blanking device for a solar cell production line according to an embodiment of the present invention;

Fig. 2 is a schematic structural view of the combined application of the blanking device shown in Fig. 1;

3 is a schematic structural view of a blanking device for a solar cell production line according to another embodiment of the present invention;

Fig. 4 is a structural schematic diagram of combined application of the unloading device shown in Fig. 3 .

Detailed ways

Hereinafter, embodiments of the present utility model will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of a blanking device used in a solar cell production line according to an embodiment of the present invention.

Referring to Fig. 1, the unloading device for a solar cell production line includes: suction pipe 1, manifold distributor 2, multiple manifolds 3, manifold support plate 4, silicon wafer limit baffle 5, multiple vacuum pens Type suction cup 6, silicon wafer conveying unit 8, adjustable air knife 9 and center suction cup 10.

The silicon wafer conveying unit 8 is used for supporting and conveying the silicon wafer 7 to be picked up. Here, the silicon wafer 7 may include a crystalline silicon wafer used for solar cells, especially a 125×125 mm single crystal silicon wafer and a 156×156 mm polycrystalline silicon wafer that are widely used at present.

The suction pipe 1 is located above the silicon wafer conveying unit 8 and installed on the manifold distributor 2 .

Preferably, the manifold distributor 2 can be an approximately circular plate with a hollow interior, a central opening is formed in its center, and a plurality of through holes are formed on its outer periphery, and the plurality of through holes are formed along the circular plate shape. The radial extension of the manifold distributor 2 communicates with said central opening. A suction pipe 1 is connected to said central opening for gas communication with a manifold distributor 2 .

One end of each of the plurality of manifolds 3 is mounted on the manifold distributor 2 , and is in gas communication with the suction pipe 1 through the manifold distributor 2 . The plurality of manifolds 3 extend for a certain distance along the radial direction of the disk-shaped manifold distributor 2 and then bend downwards at a predetermined angle (for example, 90 degrees) and extend for a certain distance. The manifold support plate 4 is located between the silicon wafer conveying unit 8 and the manifold distributor 2 , and the other end of each manifold 3 penetrates and is fixed on the manifold support plate 4 . Each vacuum pen suction cup 6 is mounted on the other end of a corresponding one of the plurality of manifolds 3 and is in gas communication with the corresponding one.

The silicon wafer conveying unit 8 is located below the plurality of vacuum pen suction cups 6 . The silicon wafer limit baffle plate 5 is arranged on the downstream of the conveying direction of the silicon wafer conveying unit 8, and is positioned at the standby position below the silicon wafer conveying unit 8 and is used to stop the silicon wafer 7 to be picked up by the drive unit. Movement between positions is blocked. The blocking position is above the alternate position. Therefore, the silicon wafer limit stopper 5 can move up a predetermined distance from the standby position, thereby reaching the blocking position.

The adjustable air knife 9 is located at the lower middle of the silicon wafer conveying unit 8 , and the upper surface of the adjustable air knife 9 is provided with a gas discharge port 94 for blowing gas upward. The gas discharge port 94 can be narrow and long, and the length of the gas discharge port 94 can correspond to the size of the silicon wafer. The adjustable air knife 9 may also include an air knife body 91 , an air inlet pipe 92 , sealing screws and washers 93 and an air pressure fine-tuning mechanism (not shown). The air knife body 91 can be made of materials such as aluminum, stainless steel or copper. An air inlet pipe 92 and a sealing screw and washer 93 are provided on the side surface of the air knife body 91 . A gas discharge port 94 is provided on the upper surface of the gas knife body 91 for blowing gas upward. The air pressure fine-tuning mechanism is located inside the air knife body 91. The air pressure fine-tuning mechanism is a top wire with a conical head at one end, and there is a predetermined gap between the cone head of the top wire and the air channel inside the air knife body. By adjusting the gap between the conical head of the top wire and the air channel inside the air knife body, the thickness of the air curtain and the air pressure generated by the air discharge port 94 can be adjusted and controlled.

The central sucker 10 is fixed at the center of the lower surface of the manifold support plate 4 and is in air communication with the suction pipe 1 . Thus, the suction pipe 1 , the manifold distributor 2 , the manifold 3 , the vacuum pen suction cup 6 and the central suction cup 10 are in gaseous communication with each other.

In addition, the unloading device for a solar cell production line according to the present invention further includes a control unit (not shown) to control the unloading device to pick up silicon wafers 7 .

Optionally, the manifold support plate 4 can be substantially square, and the number of a plurality of vacuum pen suction cups 6 can be 4, and the 4 vacuum pen suction cups 6 can be located on four sides of the square manifold support plate 4 respectively. At the corners, that is, the vacuum pen suction cup is arranged in a four-corner manner relative to the silicon wafer 7 . The central suction cup 10 may be an annular central suction cup. Although four vacuum pen suction cups 6 arranged in a four-corner manner relative to the silicon wafer 7 are shown in the accompanying drawings, according to the shape and structure of the manifold support plate 4 and the shape and structure of the silicon wafer 7, the vacuum pen suction cup 6 The number and arrangement can be changed accordingly, as long as the silicon wafer can be adsorbed smoothly.

An electromagnetic valve and an air pressure regulating valve may be installed upstream of the suction pipe 1 . The solenoid valve can control the on-off of the air circuit, and then open/close the empty pen suction cup 6 and the central suction cup 10. The air pressure regulating valve can adjust the air pressure of the air circuit.

The silicon wafer conveying unit 8 includes a plurality of rollers 81 and a plurality of guide sleeves 82 respectively sleeved on both ends of each roller 81 , and the plurality of rollers 81 are separated from each other by a predetermined distance. The silicon wafer 7 can be placed on a roller 81 and located between two opposite guide sleeves 82 . A plurality of rollers 81 rotate at a predetermined speed, thereby driving the silicon wafer 7 to move to the feeding area. Since the outer diameter of the guide sleeves 82 is larger than the diameter of the rollers 81 , the silicon wafer 7 can be located between two opposite guide sleeves 82 , thereby preventing the silicon wafer 7 from moving out of the silicon wafer conveying unit 8 .

According to the different specifications of the silicon wafer 7 , the larger the size of the silicon wafer 7 is, the greater the required speed of conveying the silicon wafer 7 is. The moving speed of the silicon wafer 7 can be changed by changing the rotation speed and/or the diameter of the roller 81 . That is, the greater the rotation speed of the roller 81 , the faster the moving speed of the silicon wafer 7 ; the larger the diameter of the roller 81 , the faster the moving speed of the silicon wafer 7 .

After the process of the silicon wafer 7 is completed, the rotation (rolling) of the roller 81 drives the silicon wafer 7 to move to the feeding area.

A photoelectric sensor is arranged above or below the silicon wafer conveying unit 8 to determine whether the silicon wafer 7 has reached a predetermined unloading area. When the photoelectric sensor determines that the silicon wafer 7 reaches the predetermined unloading area, the photoelectric sensor sends a pick-up signal. Preferably, with the silicon wafer transport unit 8 as a reference, a light source is arranged opposite to the photoelectric sensor, and the light emitted by the light source is received by the photoelectric sensor. The photoelectric sensor can judge that the silicon wafer has reached the predetermined unloading area.

Optionally, the silicon wafer limit baffle 5 can be driven by an air cylinder. In this case, an air cylinder is arranged under the silicon wafer limit baffle 5, and the silicon wafer limit baffle 5 can be fixedly connected to the cylinder by screws. . After the photoelectric sensor detects that the silicon wafer 7 has moved to the predetermined blanking area, the control unit sends a control signal to start the cylinder solenoid valve to drive the cylinder according to the pick-up signal of the photoelectric sensor, so that the silicon wafer limit baffle 5 moves from the silicon wafer conveying unit 8 The standby position below moves upwards to the blocking position for blocking the silicon wafer 7 to be picked up, so as to block the silicon wafer 7, thereby limiting the forward movement of the silicon wafer 7. Through the restriction of the guide sleeve 82 and the blocking of the silicon wafer limit baffle 5, the silicon wafer 7 is limited in a predetermined unloading area, waiting to be picked up. Of course, the silicon wafer limit baffle 5 can also be driven by other drive units (for example, hydraulic drive unit or mechanical drive unit), as long as the silicon wafer limit baffle 5 can be positioned at the standby position below the silicon wafer conveying unit 8. position and a blocking position for blocking the silicon wafer 7 to be picked up.

At this time, the control unit sends a control signal to the solenoid valve installed upstream of the suction pipe 1 to open the vacuum pen suction cup 6 and the central suction cup 10 above the silicon wafer 7 to perform a suction action on the silicon wafer 7 . The vacuum pen suction cup 6 and the central suction cup 10 are gas-communicated with the suction pipe 1, and are adjusted and controlled by an air pressure regulating valve installed upstream of the suction pipe 1, so as to adjust the suction force.

At the same time, the control unit sends an instruction to open the adjustable air knife 9 installed below the silicon wafer conveying unit 8, and the gas discharge port 94 blows gas upwards to act on the silicon wafer 7 above, so that the silicon wafer 7 is suspended and separated from the roller 81 A small distance, close to the vacuum pen suction cup 6 and the central suction cup 10 above the silicon wafer, thereby forming a parallel combination of the bottom-up blowing of the adjustable air knife 9 and the bottom-up suction of the vacuum pen suction cup 6 and the central suction cup 10 Silicon wafer pick-up method. Under the assisting effect of the blowing force of the adjustable air knife 9, the vacuum pen type suction cup 6 and the central suction cup 10 can absorb the silicon wafer 7 smoothly with a relatively small suction force.

Preferably, the adjustable air knife 9 is arranged at the center of the unloading area of the silicon wafer. The manifold support plate 4 is connected with the transfer manipulator of the solar cell production line to perform the transfer operation of the silicon wafer 7 . Specifically, after the silicon wafer 7 is picked up, the control unit issues a control command, and the transfer manipulator is driven by a servo motor to move the manifold support plate 4 according to a predetermined track, so that the vacuum pen sucker 6 and the central sucker 10 are sucked. The wafer 7 is moved to a predetermined position. After the silicon wafer 7 is moved to a predetermined position, the solenoid valve installed upstream of the suction pipe 1 can close the empty pen suction cup 6 and the central suction cup 1, releasing the silicon wafer 7 to perform the next process for the silicon wafer 7 process (such as texturing or etching).

Usually, in order to increase equipment capacity, a multi-station loading and unloading system can be used. Therefore, multiple unloading devices shown in Figure 1 can be combined according to the production capacity and equipment layout of the actual production line process equipment. Fig. 2 shows the combined application structure of the five unloading devices shown in Fig. 1 . The working mode and process of the combined unloading device are exactly the same as those of the single unloading device, and it is easy to integrate and operate.

Fig. 3 is a schematic structural view of a blanking device used in a solar cell production line according to another embodiment of the present invention. The unloading device in FIG. 3 is similar to the embodiment shown in FIG. 1 , the main difference is that no central sucker is provided in the unloading device in FIG. 3 . The unloading device of Fig. 3 is suitable for the situation that the transfer distance of the silicon wafer 7 is not large.

Similar to the situation shown in Figure 2, multiple unloading devices shown in Figure 3 can be combined according to the capacity and equipment layout of the actual production line process equipment. Fig. 4 shows the combined application structure of the five unloading devices shown in Fig. 3 . The working mode and process of the combined unloading device are exactly the same as those of the single unloading device, and it is easy to integrate and operate.

When the unloading device for solar cell production line according to the utility model is in operation, the air knife below the silicon wafer and the suction cup above act simultaneously to form a combined silicon wafer picking method of blowing down and sucking up. Compared with the method of picking up the upper suction cup alone in the prior art, the impact force of the silicon wafer by the suction cup is greatly reduced, and it can prevent the surface of the silicon wafer from being deformed, so there will be no picking up of the silicon wafer in the production line. and chipping and debris problems caused by transfers. The blanking device can be used on the process equipment of the solar cell production line, and can also be used in other similar applications.

Although the utility model has been specifically described and shown with reference to exemplary embodiments thereof, those skilled in the art should understand that, without departing from the spirit and scope of the utility model defined by the claims, the It undergoes various changes in form and detail.

Claims (10)

1. blanking device that is used for the manufacture of solar cells line comprises:

The silicon chip supply unit is used to support and carry the silicon chip that will be picked up;

Aspirate tube is positioned at the top of silicon chip supply unit;

Manifold distributing box, aspirate tube are installed on the manifold distributing box;

A plurality of manifolds; One end of each manifold is installed on the manifold distributing box, and through manifold distributing box and aspirate tube gas communication;

The manifold support plate, between silicon chip supply unit and manifold distributing box, the other end of each manifold penetrates and is fixed on the manifold support plate;

A plurality of vacuum pen type suckers, each vacuum pen type sucker are installed in the said other end of the corresponding manifold in said a plurality of manifold and are communicated with a corresponding manifold gases;

Adjustable air knife is positioned in the middle part of the below of silicon chip supply unit, and the upper surface of adjustable air knife is provided with the upwards gas discharge outlet of blow gas;

The silicon chip postive stop baffle is positioned at the downstream of the throughput direction of silicon chip supply unit, and the driving through driver element is in the spare space below the silicon chip supply unit be used to stop between the blocking position with the silicon chip that is picked up and move;

Control unit is used to control said blanking device to pick up silicon chip.

2. the blanking device that is used for the manufacture of solar cells line according to claim 1; It is characterized in that; The said blanking device that is used for the manufacture of solar cells line also comprises: the center sucker is fixed on the center position of the lower surface of manifold support plate, with the aspirate tube gas communication.

3. the blanking device that is used for the manufacture of solar cells line according to claim 2 is characterized in that, said a plurality of vacuum pen type suckers are four jiaos of modes with respect to the silicon chip that will be picked up and arrange.

4. the blanking device that is used for the manufacture of solar cells line according to claim 2 is characterized in that, electromagnetic valve and air pressure pressure regulating valve are installed at the upper reaches of aspirate tube, the break-make of solenoid control gas circuit, the air pressure size of air pressure adjusting valve adjustment gas circuit.

5. the blanking device that is used for the manufacture of solar cells line according to claim 2; It is characterized in that the silicon chip supply unit comprises a plurality of roller bearings, said a plurality of roller bearings are spaced apart at a predetermined distance from each other; Be separately installed with guide pin bushing on the two ends of each roller bearing; Silicon chip is placed on the roller bearing and between two relative guide pin bushings, said a plurality of roller bearings rotate at a predetermined velocity, moves to the blanking zone to drive silicon chip.

6. according to each described blanking device that is used for the manufacture of solar cells line among the claim 3-5; It is characterized in that; Above or below the silicon chip supply unit, be provided with opto-electronic pickup; To judge whether silicon chip arrives predetermined blanking zone, when opto-electronic pickup confirmed that silicon chip arrives predetermined blanking zone, opto-electronic pickup sent pickoff signals.

7. the blanking device that is used for the manufacture of solar cells line according to claim 6; It is characterized in that; After opto-electronic pickup detects silicon chip and moves to predetermined blanking zone; Control unit transmits control signal according to the pickoff signals of opto-electronic pickup and makes the silicon chip postive stop baffle move upward to blocking position from the spare space blocking silicon chip to start driver element, thereby the restriction silicon chip moves forward, through the restriction of guide pin bushing and stopping of silicon chip postive stop baffle; Silicon chip is limited at predetermined blanking zone, waits for and being picked up.

8. the blanking device that is used for the manufacture of solar cells line according to claim 7; It is characterized in that; When silicon chip is limited at predetermined blanking zone; Control unit sends to the electromagnetic valve at the upper reaches that are installed in aspirate tube with control signal, to open vacuum pen type sucker and the center sucker of silicon chip top, to silicon chip enforcement sucking action; And control unit transmits control signal and is installed on the adjustable air knife of silicon chip supply unit below with unlatching; The gas discharge outlet blow gas that makes progress suspends silicon chip and breaks away from roller bearing one segment distance, near the vacuum pen type sucker and the center sucker of silicon chip top, thereby form adjustable air knife from bottom to top brush and the silicon chip of vacuum pen type sucker and center sucker absorption The parallel combined from bottom to top picks up mode.

9. the blanking device that is used for the manufacture of solar cells line according to claim 8 is characterized in that, adjustable air knife is arranged in the center in the blanking zone of silicon chip, and comprises air knife body, air inlet pipe, sealing screw and packing ring and air pressure micro-adjusting mechanism,

Air inlet pipe and sealing screw and packing ring are arranged on the side surface of air knife body; The air pressure micro-adjusting mechanism is positioned at the inside of air knife body; The air pressure micro-adjusting mechanism is that an end has cone headed jackscrew, has predetermined gap between the gas channels of the nose cone of jackscrew and air knife body interior

Gap between nose cone through regulating jackscrew and the gas channels of air knife body interior, it is big or small to regulate the air curtain thickness and the air pressure that are produced with the control gaseous discharge side.

10. the blanking device that is used for the manufacture of solar cells line according to claim 9; It is characterized in that; The manifold support plate is connected with the shifting mechanical arm of manufacture of solar cells line; Shifting mechanical arm moves the manifold support plate according to desired trajectory, thereby the silicon chip that will be adsorbed on vacuum pen type sucker and the center sucker moves to the desired location.

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