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CN202268389U - Near-infrared diode using blue light chip to stimulate down-conversion phosphor - Google Patents

Near-infrared diode using blue light chip to stimulate down-conversion phosphor Download PDF

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CN202268389U
CN202268389U CN2011203899139U CN201120389913U CN202268389U CN 202268389 U CN202268389 U CN 202268389U CN 2011203899139 U CN2011203899139 U CN 2011203899139U CN 201120389913 U CN201120389913 U CN 201120389913U CN 202268389 U CN202268389 U CN 202268389U
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王旭升
彭登峰
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Tongji University
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Abstract

本实用新型涉及一种利用蓝光芯片激发下转换荧光体的近红外二极管。该近红外二极管包括衬底、蓝光芯片、红外下转换发光层和/或与之配合的蓝光滤波层及封装层。本实用新型采用GaInN蓝光芯片,无毒无污染,采用的下转换荧光体具有接近200%的量子转换效率。在蓝光芯片所发射的蓝光激发下,下转换红外荧光体具有高效率的红外光发射,发射的近红外光波长在900~1100nm,中心波长在980nm。该近红外二极管环境友好,容易大规模工业化生产,成本低廉,节能环保,并能提高近红外二极管的发光效率,在红外遥控、红外探测、光纤通信、环境监控、生物成像和生物医药等方面有着广泛的应用前景,并能极大地拓展蓝光芯片的应用市场。

The utility model relates to a near-infrared diode that uses a blue light chip to excite a down-conversion phosphor. The near-infrared diode includes a substrate, a blue-light chip, an infrared down-conversion light-emitting layer and/or a blue-light filter layer and a packaging layer matched therewith. The utility model adopts a GaInN blue light chip, which is non-toxic and pollution-free, and the down-converting fluorescent body adopted has a quantum conversion efficiency close to 200%. Under the excitation of blue light emitted by the blue light chip, the down-conversion infrared phosphor has high-efficiency infrared light emission, and the emitted near-infrared light has a wavelength of 900~1100nm and a center wavelength of 980nm. The near-infrared diode is environmentally friendly, easy for large-scale industrial production, low in cost, energy-saving and environmentally friendly, and can improve the luminous efficiency of the near-infrared diode, and has great potential in infrared remote control, infrared detection, optical fiber communication, environmental monitoring, biological imaging and biomedicine It has wide application prospects and can greatly expand the application market of Blu-ray chips.

Description

一种利用蓝光芯片激发下转换荧光体的近红外二极管A near-infrared diode that uses a blue light chip to excite down-conversion phosphors

技术领域 technical field

本实用新型涉及一种利用蓝光芯片激发“下转换”荧光体的近红外二极管装置,属于发光器件技术领域;本实用新型作为一种环境友好型高效红外二极管,可用于红外遥控、红外探测、光纤通信、环境监控、生物成像和生物医药等领域。  The utility model relates to a near-infrared diode device which uses a blue light chip to excite a "down-conversion" phosphor, and belongs to the technical field of light-emitting devices; communication, environmental monitoring, biological imaging and biomedicine and other fields. the

背景技术 Background technique

光致发光是指用光激发发光体引起的发光现象,利用这种现象做成的发光器件已广泛用于人们的日常生活当中。目前发现光致发光现象的光转换形式主要遵循以下三种规律:(1)一个能量高的激发光子引起一个能量低的发射光子的“下转移”(Down-Shifting)形式。(2)两个或多个能量低的激发光子引起一个能量高的发射光子的“上转换”(Up-Conversion)形式。(3)一个能量高的激发光子引起两个或多个能量低的发射光子的“下转换”(Down-Conversion)形式。参看文献Advanced Materials,2011,23(22-23):2675-2680。通常在光致发光的三种转换中,Down-Shifting和Up-conversion的转换效率都会小于100%,其中Up-conversion转换效率更低,目前转换效率最高的上转换荧光粉量子效率不足5%。这种低效率的上转换荧光粉曾被涂覆到红外芯片上用来制备红、绿和蓝色发光二极管产品。参看《固体发光材料》,孙家跃等编,2003年,第1版,第595页,第1段记述。但是,由于荧光粉的光转换效率低,导致这种二极管的发光效率极低,以致在实际应用中没有竞争力。  Photoluminescence refers to the luminescence phenomenon caused by exciting luminous bodies with light. Light-emitting devices made of this phenomenon have been widely used in people's daily life. At present, it is found that the light conversion form of photoluminescence phenomenon mainly follows the following three rules: (1) A high-energy excitation photon causes a low-energy emission photon in the "Down-Shifting" form. (2) Two or more low-energy excitation photons cause an "up-conversion" (Up-Conversion) form of a high-energy emission photon. (3) A high-energy excitation photon causes two or more low-energy emission photons in the "down-conversion" (Down-Conversion) form. See the literature Advanced Materials, 2011, 23(22-23): 2675-2680. Generally, in the three conversions of photoluminescence, the conversion efficiency of Down-Shifting and Up-conversion are both less than 100%, and the conversion efficiency of Up-conversion is even lower. Currently, the quantum efficiency of the up-conversion phosphor with the highest conversion efficiency is less than 5%. This low-efficiency up-conversion phosphor has been coated on infrared chips to make red, green and blue light-emitting diode products. See "Solid Luminescent Materials", edited by Sun Jiayue et al., 2003, first edition, page 595, paragraph 1 description. However, due to the low light conversion efficiency of the phosphor, the luminous efficiency of this diode is extremely low, so that it is not competitive in practical applications. the

下转换荧光粉的量子效率在100%以上,这使得下转换荧光材料在发光二极管领域有着潜在的应用前景。然而长期以来,下转换荧光体激发光大多在真空紫外部分(~180nm),而实际芯片则很难发射出高效率的真空紫外光。所以,一直以来这类荧光粉未曾在发光二极管领域得到实际应用。  The quantum efficiency of the down-converting fluorescent powder is above 100%, which makes the down-converting fluorescent material have a potential application prospect in the field of light-emitting diodes. However, for a long time, the excitation light of the down-conversion phosphor is mostly in the vacuum ultraviolet (~180nm), and it is difficult for the actual chip to emit high-efficiency vacuum ultraviolet light. Therefore, this type of phosphor has never been practically applied in the field of light-emitting diodes. the

近年来,由于硅基太阳能电池产业的推动,作为提高硅基太阳能电池光电转换效率的有效途径,下转换荧光体又成为光致发光材料的研究热点之一,参看文献:Solar Energy Materials and Solar Cells,2006,90(9):1189-1207;Solar Energy Materials and Solar Cells,2007,91(4):238-249;J.Appl.Phys.2002,92,1668;Progress in Materials Science,2010, 55(5):353-427。最近发光学者研究发现一类和Yb3+稀土共掺杂的荧光粉在蓝光的激发下具有高效率的红外光发射,其量子效率都在100%以上,最高的可接近200%,参看近几年的文献:Adv.Mater.2009,21,3073-3077;Appl.Phys.Lett.,2010,96,151106;Appl.Phys.Lett.2008,92,141112;Appl.Phys.Lett.2009,94,061905;Appl.Phys.Lett.2007,90,061914;Journal of Applied Physics 2009,106(6):063518-063518-4;Solar Energy Materials and Solar Cells,2007,91(4):238-249;Journal of Luminescence,2011,131(4):608-613;Optics Letters,2009,34(22):3565-3567;Phys.Rev.B,2005,71:014119;Phys.Rev.B,2010,81:035107;Physical Review B,2010,81,035107;Physical Review B 2010,81,155112。以上这些研究发现,这类高效率下转换荧光材料在提高硅基太阳光电转换效率上具有实际应用价值。本专利申请人认为,鉴于下转换红外荧光粉在蓝光激发下具有接近200%的转换效率,利用蓝光芯片激发此类荧光粉制备高效率近红外二极管具有可行性。然而,到目前为止,并没有专利和文献报道将这一类荧光粉应用于蓝光激发的近红外二极管领域中,也未曾有资料报道提出关于利用蓝光激发下转换红外荧光粉制备近红外二极管的设想。  In recent years, due to the promotion of the silicon-based solar cell industry, as an effective way to improve the photoelectric conversion efficiency of silicon-based solar cells, down-conversion phosphors have become one of the research hotspots of photoluminescent materials. See the literature: Solar Energy Materials and Solar Cells , 2006, 90(9): 1189-1207; Solar Energy Materials and Solar Cells, 2007, 91(4): 238-249; J.Appl.Phys.2002, 92, 1668; Progress in Materials Science, 2010, 55 (5): 353-427. Recently, luminescent scholars have found that a kind of fluorescent powder co-doped with Yb 3+ rare earth has high-efficiency infrared light emission under the excitation of blue light, and its quantum efficiency is above 100%, and the highest can be close to 200%. Years of literature: Adv.Mater.2009, 21, 3073-3077; Appl.Phys.Lett., 2010, 96, 151106; Appl.Phys.Lett.2008, 92, 141112; Appl.Phys.Lett.2009, 94 , 061905; Appl.Phys.Lett.2007, 90, 061914; Journal of Applied Physics 2009, 106(6): 063518-063518-4; Solar Energy Materials and Solar Cells, 2007, 91(4): 238-249; Journal of Luminescence, 2011, 131(4): 608-613; Optics Letters, 2009, 34(22): 3565-3567; Phys.Rev.B, 2005, 71: 014119; Phys.Rev.B, 2010, 81 : 035107; Physical Review B, 2010, 81, 035107; Physical Review B 2010, 81, 155112. The above studies have found that this type of high-efficiency down-conversion fluorescent material has practical application value in improving the photoelectric conversion efficiency of silicon-based solar energy. The applicant of this patent believes that, considering that the down-conversion infrared phosphor has a conversion efficiency close to 200% under blue light excitation, it is feasible to prepare high-efficiency near-infrared diodes by using blue light chips to excite such phosphors. However, so far, there are no patents and literature reports on the application of this type of phosphors in the field of near-infrared diodes excited by blue light, and no data reports have proposed the idea of using down-conversion infrared phosphors excited by blue light to prepare near-infrared diodes.

近红外二极管是一种很重要的发光二极管,在红外遥控,光纤通信,环境监控,生物成像及生物医药等方面有着广泛的应用。目前商用的近红外二极管类型主要是有机电致发光二极管和GaAs半导体发光二极管。但是有机发光二极管热稳定性差,发光效率低。而GaAs二极管发光光谱范围受限,且GaAs的制备过程用到元素As。作为氮族元素的一员,As是毒性元素,砷化物均有很强的毒性,三价砷化合物比其它砷化合物毒性更强。As化合物在制备或加工过程中,如果进入人体内被吸收后,能破坏了细胞的氧化还原能力,影响细胞正常代谢,引起组织损害和机体障碍,可直接导致多种疾病,其中包括:高血压、心脑血管病、神经病变、糖尿病、皮肤色素代谢异常及皮肤角化,影响劳动和生活能力,并最终发展为皮肤癌,可伴膀胱、肾、肝等多种内脏癌的高发。最新研究还表明胎儿比成人对砷的毒性更敏感。由此可见,GaAs的使用对环境隐患很大,危害人类健康。因此,从环境角度长远考虑,有必要寻找新的环境友好型材料来取代GaAs产品。  Near-infrared diode is a very important light-emitting diode, which has a wide range of applications in infrared remote control, optical fiber communication, environmental monitoring, biological imaging and biomedicine. The current commercial near-infrared diode types are mainly organic electroluminescent diodes and GaAs semiconductor light-emitting diodes. However, organic light-emitting diodes have poor thermal stability and low luminous efficiency. However, GaAs diodes have a limited emission spectrum range, and the GaAs preparation process uses the element As. As a member of nitrogen group elements, As is a toxic element, arsenic compounds are highly toxic, and trivalent arsenic compounds are more toxic than other arsenic compounds. During the preparation or processing of As compounds, if they enter the human body and are absorbed, they can destroy the redox ability of cells, affect the normal metabolism of cells, cause tissue damage and body disorders, and directly lead to various diseases, including: high blood pressure , cardiovascular and cerebrovascular diseases, neuropathy, diabetes, abnormal skin pigmentation metabolism and skin keratosis, affect labor and living ability, and eventually develop into skin cancer, which may be accompanied by high incidence of bladder, kidney, liver and other visceral cancers. The latest research also shows that fetuses are more sensitive to arsenic toxicity than adults. It can be seen that the use of GaAs has great hidden dangers to the environment and endangers human health. Therefore, from an environmental point of view, it is necessary to find new environmentally friendly materials to replace GaAs products. the

当前,蓝光芯片作为第四代固态照明领域中的关键技术,是白光二极管的重要组成部件。采用蓝光InGaN芯片涂敷黄色“下转移”荧光粉YAG:Ce3+(该荧光粉量子效率只接近80%)所形成白光二极管自1996年问世以来,其发展迅速,发光效率不断提高,有望取代白炽灯、荧光灯和高压汞灯等传统的照明光源,成为二十一世纪最具发展前景的绿色照明光源。在巨大应用市场的推动下,蓝光LED芯片的制备技术日趋成熟,成本逐年降低。目前,市场上同等功率的GaN和GaAs二极管,前者的价格大约是后者的1/4。且蓝光芯片InGaN中的氮元素不 像砷元素那样具有毒性,氮资源丰富,环境友好。  At present, as the key technology in the field of fourth-generation solid-state lighting, blue light chips are an important component of white light diodes. White light-emitting diodes formed by coating yellow "down-transfer" phosphor YAG:Ce 3+ (the quantum efficiency of the phosphor is only close to 80%) with blue InGaN chips have developed rapidly since their appearance in 1996, and their luminous efficiency has been continuously improved. It is expected to replace Traditional lighting sources such as incandescent lamps, fluorescent lamps and high-pressure mercury lamps have become the most promising green lighting sources in the 21st century. Driven by the huge application market, the preparation technology of blue LED chips is becoming more and more mature, and the cost is decreasing year by year. At present, the price of GaN and GaAs diodes with the same power on the market is about 1/4 of the latter. Moreover, the nitrogen element in the InGaN of the blue-ray chip is not as toxic as the arsenic element, and the nitrogen resource is abundant and environmentally friendly.

因此,本实用新型利用蓝光芯片,制备近红外二极管,对提高发光效率,降低生产成本,环保节能等方面具有实际应用价值,同时也拓展了蓝光芯片的应用市场。  Therefore, the utility model utilizes blue light chips to prepare near-infrared diodes, which has practical application value for improving luminous efficiency, reducing production costs, environmental protection and energy saving, and also expands the application market of blue light chips. the

实用新型内容 Utility model content

本实用新型的目的在于提供一种环境友好型近红外发光二极管器件,以提高近红外二极管的发光效率,降低成本,减少环境污染,同时,还拓展蓝光芯片的应用。  The purpose of the utility model is to provide an environment-friendly near-infrared light-emitting diode device to improve the luminous efficiency of the near-infrared diode, reduce the cost, reduce environmental pollution, and at the same time, expand the application of the blue light chip. the

为了实现上述目的,本实用新型采用以下技术方案来实现:  In order to achieve the above object, the utility model adopts the following technical solutions to achieve:

一种利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架、位于支架上的衬底、设于所述衬底上的蓝光芯片和封装层,所述衬底和蓝光芯片均与贯穿封装层的导线相连,所述近红外二极管还包括设于蓝光芯片之上的红外下转换发光层。  A near-infrared diode that uses a blue chip to excite down-conversion phosphors, including a bracket, a substrate on the bracket, a blue chip and a packaging layer on the substrate, and the substrate and the blue chip are connected through the packaging The wires of the layers are connected, and the near-infrared diode also includes an infrared down-conversion light-emitting layer arranged on the blue-light chip. the

进一步的,所述红外下转换发光层之上还设有与红外下转换发光层相配合的蓝光滤波层。  Further, a blue light filter layer matched with the infrared down-conversion light-emitting layer is provided on the infrared down-conversion light-emitting layer. the

较佳的,所述蓝光滤波层为平板形滤波片或凹面朝向红外下转换发光层的弧形滤波片。  Preferably, the blue light filter layer is a flat filter or an arc filter with a concave surface facing the infrared down-conversion light-emitting layer. the

较佳的,所述红外下转换发光层为涂覆于蓝光芯片上的下转换荧光粉涂层或设于蓝光芯片上的下转换荧光块体层。  Preferably, the infrared down-conversion luminescent layer is a down-conversion phosphor coating coated on the blue chip or a down-conversion phosphor bulk layer provided on the blue chip. the

较佳的,所述设于蓝光芯片上的下转换荧光块体层与蓝光芯片可以为直接接触形式,二者也可以保持一定距离,即二者之间留有空隙。 Preferably, the down-converting phosphor bulk layer disposed on the blue chip may be in direct contact with the blue chip, or a certain distance may be maintained between them, that is, there is a gap between them.

本实用新型所用的衬底为商用蓝光芯片制备过程中所采用的衬底,可以为蓝宝石衬底、硅衬底、碳化硅衬底、氮化镓衬底和氮化铝衬底中的一种或多种。  The substrate used in the utility model is a substrate used in the preparation process of a commercial blue-ray chip, which can be one of a sapphire substrate, a silicon substrate, a silicon carbide substrate, a gallium nitride substrate and an aluminum nitride substrate or more. the

较佳的,所述支架上还设有金属散热片。  Preferably, metal cooling fins are also provided on the support. the

本实用新型所用的蓝光芯片为GaInN芯片,发射波长为400~500nm,较佳的,发射主峰为450nm、470nm或490nm附近,目的是为了更加有效的激发下转换荧光体。  The blue light chip used in the utility model is a GaInN chip, and the emission wavelength is 400-500nm. Preferably, the main emission peak is around 450nm, 470nm or 490nm, in order to more effectively excite the down-conversion phosphor. the

在衬底上制备蓝光芯片的过程,采用现有蓝光LED芯片的工艺,较佳的为外延生长制备技术。  The process of preparing the blue light chip on the substrate adopts the existing blue light LED chip technology, preferably the epitaxial growth preparation technology. the

本实用新型所用的近红外下转换荧光体层在蓝光的激发下的红外发射量子效率大于100%,可高达近200%的量子转换效率。采用量子效率大于100%的下转换荧光体目地在于提高红外光的发射效率。  The infrared emission quantum efficiency of the near-infrared down-conversion phosphor layer used in the utility model under the excitation of blue light is greater than 100%, and the quantum conversion efficiency can be as high as nearly 200%. The purpose of using the down-converting phosphor with quantum efficiency greater than 100% is to improve the emission efficiency of infrared light. the

本实用新型采用的下转换荧光体发射波长在900~1100nm,中心波长在980nm附近。所用的下转换荧光体基质材料优选为卤化物、氧化物、硫化物、卤氧化物或硫氧化物。更优的,所述下转换荧光体基质所选用的稀土离子为和Yb3+共参杂的稀土离子,如:采用Pr3+-Yb3+,Er3+-Yb3+,Ho3+-Yb3+,Nd3+-Yb3+,Tm3+-Yb3+或Tb3+-Yb3+共掺杂的荧光体中的一种或多种。所用蓝光滤波层为阻止蓝光透过并允许红外透过的蓝光滤波片。  The emission wavelength of the down-conversion phosphor adopted in the utility model is 900-1100 nm, and the central wavelength is near 980 nm. The down-converting phosphor matrix materials used are preferably halides, oxides, sulfides, oxyhalides or oxysulfides. More preferably, the rare earth ions selected for the down-conversion phosphor matrix are rare earth ions co-doped with Yb 3+ , such as: using Pr 3+ -Yb 3+ , Er 3+ -Yb 3+ , Ho 3+ One or more of -Yb 3+ , Nd 3+ -Yb 3+ , Tm 3+ -Yb 3+ or Tb 3+ -Yb 3+ co-doped phosphors. The used blue light filter layer is a blue light filter that prevents blue light from passing through and allows infrared light to pass through.

本实用新型所用的下转换荧光体层可以为荧光粉体层,也可以是荧光单晶体、荧光玻璃体、荧光透明陶瓷体、荧光粉嵌入无机或有机玻璃体。  The down-conversion phosphor layer used in the present invention can be a phosphor powder layer, or a fluorescent single crystal, fluorescent glass body, fluorescent transparent ceramic body, or phosphor powder embedded in an inorganic or organic glass body. the

本实用新型的利用蓝光芯片激发下转换荧光体的近红外二极管,所采用的下转换荧光体在GaInN蓝光芯片所发射的蓝光激发下,具有高强度的近红外光发射。  The utility model utilizes the blue light chip to excite the near-infrared diode of the down-conversion phosphor, and the adopted down-conversion phosphor has high-intensity near-infrared light emission under the excitation of the blue light emitted by the GaInN blue light chip. the

本实用新型的利用蓝光芯片激发下转换荧光体的近红外二极管,在红外下转换发光层之上加蓝光滤波片后,二极管通电后发射的光为肉眼不可见的红外线,波长在900~1100nm波段,中心波长在980nm附近的红外线。不加蓝光滤波片后,发出的光线包括芯片发射的肉眼可见的蓝光和下转换荧光体发射的肉眼不可见的红外光。  The utility model utilizes the blue light chip to excite the near-infrared diode of the down-conversion phosphor, and after the blue-light filter is added on the infrared down-conversion light-emitting layer, the light emitted by the diode after power-on is infrared rays invisible to the naked eye, and the wavelength is in the 900-1100nm band. , Infrared rays with a center wavelength around 980nm. Without the blue light filter, the emitted light includes the visible blue light emitted by the chip and the invisible infrared light emitted by the down conversion phosphor. the

本实用新型的利用蓝光芯片激发下转换荧光体的近红外二极管环境友好,容易大规模工业化生产,成本低廉,节能环保,并能提高近红外二极管的发光效率。该近红外二极管在红外遥控、红外探测、光纤通信、环境监控、生物成像和生物医药等方面有着广泛的应用前景,并能极大地拓展蓝光芯片的应用市场。  The near-infrared diode of the utility model, which utilizes the blue-light chip to excite the down-conversion phosphor, is environmentally friendly, easy for large-scale industrial production, low in cost, energy-saving and environment-friendly, and can improve the luminous efficiency of the near-infrared diode. The near-infrared diode has broad application prospects in infrared remote control, infrared detection, optical fiber communication, environmental monitoring, biological imaging and biomedicine, and can greatly expand the application market of blue light chips. the

附图说明 Description of drawings

下面结合附图和具体实施例进一步阐述本实用新型,应理解,实施例仅用于说明本实用新型而不用于限制本实用新型的保护范围。  The utility model is further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the embodiments are only used to illustrate the utility model and not to limit the protection scope of the utility model. the

图1实施例1中的近红外LED的结构示意图,红外荧光体为粉体涂层,LED的结构中不加蓝光滤波层。  FIG. 1 is a schematic structural diagram of the near-infrared LED in Example 1. The infrared phosphor is powder coating, and the blue light filter layer is not added to the structure of the LED. the

图2实施例2中的近红外LED的结构示意图,红外荧光体为粉体涂层,LED的结构中加蓝光滤波片。  Fig. 2 is a schematic diagram of the structure of the near-infrared LED in Example 2, the infrared phosphor is powder coating, and a blue light filter is added to the structure of the LED. the

图3实施例3中的近红外LED的结构示意图,红外荧光体为块体层,LED的结构中不加蓝光滤波层。  Fig. 3 is a schematic structural diagram of the near-infrared LED in Example 3, the infrared phosphor is a bulk layer, and no blue light filter layer is added to the structure of the LED. the

图4实施例4中的近红外LED的结构示意图,红外荧光体为块体层,LED的结构中加蓝光 滤波片。  The structural representation of the near-infrared LED in Fig. 4 embodiment 4, the infrared phosphor is a block layer, and a blue light filter is added in the structure of the LED. the

图5蓝光芯片和下转换块体荧光体之间保持一定距离,且采用弧形滤波片的近红外二极管示意图。  Fig. 5 is a schematic diagram of a near-infrared diode with a certain distance between the blue light chip and the down-converting bulk phosphor, and using a curved filter. the

图6本实用新型中所采用的商用蓝光芯片示意图。  Fig. 6 is a schematic diagram of a commercial Blu-ray chip used in the utility model. the

具体实施方式 Detailed ways

实施例1:  Example 1:

如图1所示的利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架1、位于支架上的衬底2、制备在所述衬底上的蓝光芯片3和封装层4,所述衬底2和蓝光芯片3均与贯穿封装层4的导线7相连,所述近红外二极管还包括设于蓝光芯片3上的红外下转换发光层5,该红外下转换发光层5为涂覆于蓝光芯片上的下转换荧光粉涂层。所述支架上还设有金属散热片8。  As shown in Figure 1, a near-infrared diode that uses a blue chip to excite a down-conversion phosphor includes a support 1, a substrate 2 on the support, a blue chip 3 and an encapsulation layer 4 prepared on the substrate, the substrate Both the bottom 2 and the blue light chip 3 are connected to the wire 7 passing through the encapsulation layer 4, and the near-infrared diode also includes an infrared down-conversion light-emitting layer 5 arranged on the blue-light chip 3, and the infrared down-conversion light-emitting layer 5 is coated on the blue light Down-converting phosphor coating on chip. Metal cooling fins 8 are also provided on the bracket. the

上述利用蓝光芯片激发下转换荧光体的近红外二极管的制备为:先利用现有技术制备蓝光LED芯片,所述蓝光芯片的发射波长根据下转换荧光粉激发波长的中心波长而定,采用发射主峰中心波长优选为440~450nm、460~470nm或480~490nm附近,目的是为了更加有效的激发下转换荧光粉。再采用现有白光LED技术,在蓝光芯片上方涂上合适厚度的下转换荧光粉,该下转换荧光粉在蓝光激发下的红外发射量子效率大于100%,发射波长在900~1100nm,中心波长在980nm附近。所用下转换荧光粉基质材料选为卤化物、氧化物、硫化物、卤氧化物或硫氧化物。所用下转换荧光粉基质所选的稀土离子为和Yb3+共参杂的稀土离子,如:Pr3+-Yb3+,Er3+-Yb3+,Ho3+-Yb3+,Nd3+-Yb3+,Tm3+-Yb3+或Tb3+-Yb3+共掺杂的荧光粉中的一种或多种。对应的下转换荧光粉具有接近200%量子效率,选用SrF2:Yb3+,Pr3+;Cs3Y2Br9:Er3+-Yb3+;CaF2:Tb3+,Yb3+;YPO4:Yb3+,Tm3+;GdAl3(BO3)4:RE3+,Yb3+,其中RE=Pr,Tb或Tm;KPb2Cl5:Er3+,Yb3+;GdBO3:Tb3+,Yb3+;YF3:Pr3+,Yb3+;YF3:Nd3+,Yb3+;NaYF4:Pr3+,Yb3+中的一种或多种。上述换荧光粉可根据需要,优先选择发光效率高,化学稳定性好,生产成本低的下转换转红外荧光粉。最后采用LED封装技术进行封装。  The preparation of the above-mentioned near-infrared diodes using the blue-light chip to excite the down-conversion phosphor is as follows: firstly, the prior art is used to prepare the blue-light LED chip. The center wavelength is preferably around 440-450nm, 460-470nm or 480-490nm, in order to more effectively excite the down conversion phosphor. Then use the existing white light LED technology to coat the down-conversion phosphor with a suitable thickness on the top of the blue-light chip. The infrared emission quantum efficiency of the down-conversion phosphor under the excitation of blue light is greater than 100%, the emission wavelength is 900-1100nm, and the center wavelength is at Around 980nm. The host material of the down conversion phosphor used is selected from halide, oxide, sulfide, oxyhalide or oxysulfide. The rare earth ions selected for the down-conversion phosphor matrix used are rare earth ions co-doped with Yb 3+ , such as: Pr 3+ -Yb 3+ , Er 3+ -Yb 3+ , Ho 3+ -Yb 3+ , Nd One or more of 3+ -Yb 3+ , Tm 3+ -Yb 3+ or Tb 3+ -Yb 3+ co-doped phosphors. The corresponding down-conversion phosphor has a quantum efficiency close to 200%. SrF 2 : Yb 3+ , Pr 3+ ; Cs 3 Y 2 Br 9 : Er 3+ -Yb 3+ ; CaF 2 : Tb 3+ , Yb 3+ ; YPO 4 : Yb 3+ , Tm 3+ ; GdAl 3 (BO 3 ) 4 : RE 3+ , Yb 3+ , where RE=Pr, Tb or Tm; KPb 2 Cl 5 : Er 3+ , Yb 3+ ; GdBO 3 : Tb 3+ , Yb 3+ ; YF 3 : Pr 3+ , Yb 3+ ; YF 3 : Nd 3+ , Yb 3+ ; NaYF 4 : one or more of Pr 3+ , Yb 3+ . The above-mentioned phosphor powder can be replaced according to the needs, and the down-conversion infrared phosphor powder with high luminous efficiency, good chemical stability and low production cost can be preferentially selected. Finally, LED packaging technology is used for packaging.

以上封装出的红外二极管通电后,发出的光中含有芯片本身发出的蓝光。  After the above-packaged infrared diode is powered on, the light emitted contains the blue light emitted by the chip itself. the

实施例2:  Example 2:

如图2所示的利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架1、位于支架上的衬底2、制备在所述衬底上的蓝光芯片3和树脂封装层4,所述衬底2和蓝光芯片3均 与贯穿封装层4的导线7相连,所述近红外二极管还包括设于蓝光芯片3上的红外下转换发光层5,该红外下转换发光层5为涂覆于蓝光芯片上的下转换荧光粉涂层。所述红外下转换发光层5之上还设有与红外下转换发光层相配合的蓝光滤波层6,该蓝光滤波层6为凹面朝向红外下转换发光层的弧形滤波片,也可以采用平板形滤波片。  As shown in Figure 2, a near-infrared diode that uses a blue chip to excite a down-conversion phosphor includes a support 1, a substrate 2 positioned on the support, a blue chip 3 prepared on the substrate and a resin encapsulation layer 4, the Both the substrate 2 and the blue light chip 3 are connected to the wire 7 that runs through the encapsulation layer 4, and the near-infrared diode also includes an infrared down-conversion light-emitting layer 5 disposed on the blue-light chip 3, and the infrared down-conversion light-emitting layer 5 is coated on the Down-converting phosphor coating on a blue chip. The infrared down-conversion luminescent layer 5 is also provided with a blue light filter layer 6 that matches the infrared down-conversion luminescent layer. The blue light filter layer 6 is an arc-shaped filter with a concave surface facing the infrared down-conversion luminescent layer. shape filter. the

上述的蓝光滤波层6在蓝光激发下转换荧光粉之后滤掉剩余的蓝光,只得到波长范围为900-1100nm的近红外光。除加有蓝光滤波层外其余构造和实施例1相同。  The above-mentioned blue light filter layer 6 filters the remaining blue light after converting the phosphor powder under the excitation of blue light, and only obtains near-infrared light with a wavelength range of 900-1100 nm. The rest of the structure is the same as that of Embodiment 1 except that a blue light filter layer is added. the

以上封装出的红外LED二极管通电后,发出的光中不含有芯片本身发出的蓝光,有望应用于现行GaAs的相关领域。  After the above-packaged infrared LED diode is powered on, the light emitted does not contain the blue light emitted by the chip itself, and is expected to be applied to the current GaAs-related fields. the

实施例3:  Example 3:

如图3所示的利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架1、位于支架上的衬底2、制备在所述衬底上的蓝光芯片3和树脂封装层4,所述衬底2和蓝光芯片3均与贯穿封装层4的导线7相连,所述近红外二极管还包括设于蓝光芯片3上的红外下转换发光层5,该红外下转换发光层5为设于蓝光芯片之上的下转换荧光块体层。  As shown in Figure 3, a near-infrared diode that uses a blue chip to excite a down-conversion phosphor includes a support 1, a substrate 2 on the support, a blue chip 3 prepared on the substrate and a resin encapsulation layer 4, the Both the substrate 2 and the blue light chip 3 are connected to the wire 7 penetrating the encapsulation layer 4, and the near-infrared diode also includes an infrared down-conversion light-emitting layer 5 arranged on the blue-light chip 3, and the infrared down-conversion light-emitting layer 5 is arranged on the blue light A bulk layer of down-converting phosphors on top of the chip. the

和实施例1不同的是荧光体不是粉体,而是块体,该块体是荧光单晶体、荧光玻璃体、荧光透明陶瓷体、荧光粉嵌入无机或有机玻璃体形成的块体中一种或多种形式。近红外二极管的蓝光芯片发射蓝光,所发射的蓝光再激发下转换荧光块体,发射近红外光,工作原理和实施例1相同。蓝光芯片和下转换块体荧光体之间可以直接接触,也可以保持一定距离。当蓝光芯片和下转换荧光块体固定好后,采用现有LED封装技术进行封装。  The difference from Example 1 is that the phosphor is not a powder, but a block, which is one or more of a fluorescent single crystal, a fluorescent glass body, a fluorescent transparent ceramic body, and a block formed by embedding phosphor powder into an inorganic or organic glass body. form. The blue light chip of the near-infrared diode emits blue light, and the emitted blue light then excites the down-conversion fluorescent block to emit near-infrared light. The working principle is the same as that of embodiment 1. The blue light chip and the down-converting bulk phosphor can be in direct contact, or a certain distance can be kept. After the blue light chip and the down-converting fluorescent block are fixed, the existing LED packaging technology is used for packaging. the

以上封装出的红外LED二极管通电后,发出的光中含有芯片本身发出的蓝光。  After the infrared LED diode packaged above is energized, the light emitted contains the blue light emitted by the chip itself. the

实施例4:  Example 4:

如图4所示的利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架1、位于支架上的衬底2、制备在所述衬底上的蓝光芯片3和树脂封装层4,所述衬底2和蓝光芯片3均与贯穿封装层4的导线7相连,所述近红外二极管还包括设于蓝光芯片3上的红外下转换发光层5,该红外下转换发光层5为设于蓝光芯片之上的下转换荧光块体层。所述红外下转换发光层5之上还设有与红外下转换发光层相配合的蓝光滤波层6,该蓝光滤波层6采用平板形滤波片,可以采用凹面朝向红外下转换发光层的弧形滤波片。  As shown in Figure 4, a near-infrared diode that uses a blue chip to excite a down-conversion phosphor includes a support 1, a substrate 2 on the support, a blue chip 3 prepared on the substrate and a resin encapsulation layer 4, the Both the substrate 2 and the blue light chip 3 are connected to the wire 7 penetrating the encapsulation layer 4, and the near-infrared diode also includes an infrared down-conversion light-emitting layer 5 arranged on the blue-light chip 3, and the infrared down-conversion light-emitting layer 5 is arranged on the blue light A bulk layer of down-converting phosphors on top of the chip. The infrared down-conversion light-emitting layer 5 is also provided with a blue light filter layer 6 that matches the infrared down-conversion light-emitting layer. The blue light filter layer 6 adopts a flat filter, and the concave surface can be used to face the arc shape of the infrared down-conversion light-emitting layer. filter. the

上述加有蓝光滤波层,目的是在蓝光激发下转换荧光体之后,滤掉剩余的蓝光,只得到波长范围为900~1100nm的近红外光。其余构造和实施例3相同。  The purpose of adding the blue light filter layer above is to filter out the remaining blue light after converting the phosphor under the excitation of blue light, and only obtain near-infrared light with a wavelength range of 900-1100nm. All the other structures are the same as in Embodiment 3. the

如图5所示的蓝光芯片和下转换块体荧光体之间保持一定距离,且采用弧形滤波片的近红外二极管。  As shown in FIG. 5 , a certain distance is maintained between the blue chip and the down-conversion bulk phosphor, and a near-infrared diode with an arc filter is used. the

以上封装出的红外LED二极管通电后,发出的光中不含有芯片本身发出的蓝光,有望替代GaAs芯片应用于在红外遥控、红外探测、光纤通信、环境监控、生物成像和生物医药相关领域。  After the above-packaged infrared LED diode is powered on, the light emitted does not contain the blue light emitted by the chip itself, and is expected to replace GaAs chips in infrared remote control, infrared detection, optical fiber communication, environmental monitoring, biological imaging and biomedicine related fields. the

上述实施例1到实施例4所采用的商用蓝光芯片如图6所示。  The commercial Blu-ray chips used in the foregoing embodiments 1 to 4 are shown in FIG. 6 . the

综上所述,实施例1到实施例4所列举的4实施例仅为本实用新型专利的简易构型而已,其结构并不限于所列举的形状,凡在本实用新型专利的构想之内所做的任何修改,等同替换和改进等,均应含在本实施新型的保护范围之内。  In summary, the 4 examples listed in Example 1 to Example 4 are only simple configurations of the utility model patent, and their structures are not limited to the listed shapes, and all within the conception of the utility model patent Any modifications, equivalent replacements and improvements, etc., should be included in the scope of protection of this new implementation model. the

Claims (7)

1.一种利用蓝光芯片激发下转换荧光体的近红外二极管,包括支架、位于支架上的衬底、设于所述衬底上的蓝光芯片和封装层,所述衬底和蓝光芯片均与贯穿封装层的导线相连,其特征在于,所述近红外二极管还包括设于蓝光芯片之上的红外下转换发光层。1. A near-infrared diode utilizing a blue chip to excite a down-conversion phosphor, comprising a support, a substrate positioned on a support, a blue chip and an encapsulation layer arranged on the substrate, and the substrate and the blue chip are all compatible with The wires penetrating through the encapsulation layer are connected, and the feature is that the near-infrared diode also includes an infrared down-conversion light-emitting layer arranged on the blue chip. 2.如权利要求1所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述红外下转换发光层之上还设有与红外下转换发光层相配合的蓝光滤波层。2. The near-infrared diode that utilizes a blue-ray chip to excite down-conversion phosphors as claimed in claim 1, wherein a blue-light filter layer that matches the infrared down-conversion light-emitting layer is also provided on the infrared down-conversion light-emitting layer . 3.如权利要求2所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述蓝光滤波层为平板形滤波片或凹面朝向红外下转换发光层的弧形滤波片。3. The near-infrared diode that utilizes a blue-light chip to excite down-conversion phosphors according to claim 2, wherein the blue-light filter layer is a flat filter or an arc-shaped filter with a concave surface facing the infrared down-conversion luminescent layer. 4.如权利要求1-3任一项所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述红外下转换发光层为涂覆于蓝光芯片上的下转换荧光粉涂层或设于蓝光芯片上的下转换荧光块体层。4. The near-infrared diode utilizing a blue-light chip to excite a down-conversion phosphor as claimed in any one of claims 1-3, wherein the infrared down-conversion luminescent layer is a down-conversion phosphor coated on the blue-light chip Coating or down-converting fluorescent bulk layer on blue chip. 5.如权利要求4所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述设于蓝光芯片上的下转换荧光块体层与蓝光芯片直接接触。5 . The near-infrared diode for exciting down-conversion phosphors by using a blue-light chip according to claim 4 , wherein the down-conversion fluorescent bulk layer arranged on the blue-light chip is in direct contact with the blue-light chip. 6 . 6.如权利要求4所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述设于蓝光芯片上的下转换荧光块体层与蓝光芯片之间留有空隙。6 . The near-infrared diode for exciting down-conversion phosphors by using a blue-light chip according to claim 4 , wherein there is a gap between the down-conversion fluorescent bulk layer arranged on the blue-light chip and the blue-light chip. 7 . 7.如权利要求1-3任一项所述的利用蓝光芯片激发下转换荧光体的近红外二极管,其特征在于,所述支架上还设有金属散热片。7. The near-infrared diode for exciting down-converting phosphors excited by a blue light chip according to any one of claims 1-3, wherein a metal heat sink is also provided on the bracket.
CN2011203899139U 2011-10-13 2011-10-13 Near-infrared diode using blue light chip to stimulate down-conversion phosphor Expired - Fee Related CN202268389U (en)

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CN103840064A (en) * 2014-03-06 2014-06-04 晶科电子(广州)有限公司 Three-dimensional luminous LED device and manufacturing method thereof
CN107086264A (en) * 2017-06-23 2017-08-22 深圳市德辰光电科技有限公司 A kind of red light LED lamp bead and its manufacturing method
CN107180905A (en) * 2017-04-21 2017-09-19 深圳市源磊科技有限公司 Infrared LED lamp based on blue chip excitated fluorescent powder and preparation method thereof
CN107924971A (en) * 2015-09-02 2018-04-17 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic component and method for producing an optoelectronic component
CN108174467A (en) * 2017-06-01 2018-06-15 欧普照明股份有限公司 LED heating method, device, component, Yuba heater, and heater
CN110094699A (en) * 2019-05-27 2019-08-06 轻工业部南京电光源材料科学研究所 Ultraviolet germicidal and preparation method thereof is converted in one kind
CN110970541A (en) * 2018-09-29 2020-04-07 有研稀土新材料股份有限公司 Semiconductor light source and optical device prepared by same
CN111066162A (en) * 2017-09-19 2020-04-24 ams有限公司 Phosphor-Converted Light-Emitting Devices

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103840064A (en) * 2014-03-06 2014-06-04 晶科电子(广州)有限公司 Three-dimensional luminous LED device and manufacturing method thereof
CN107924971A (en) * 2015-09-02 2018-04-17 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic component and method for producing an optoelectronic component
CN107180905A (en) * 2017-04-21 2017-09-19 深圳市源磊科技有限公司 Infrared LED lamp based on blue chip excitated fluorescent powder and preparation method thereof
CN107180905B (en) * 2017-04-21 2019-07-23 深圳市源磊科技有限公司 Infrared LED lamp and preparation method thereof based on blue chip excitated fluorescent powder
CN108174467A (en) * 2017-06-01 2018-06-15 欧普照明股份有限公司 LED heating method, device, component, Yuba heater, and heater
CN108174467B (en) * 2017-06-01 2024-05-14 欧普照明股份有限公司 LED heating method, device, assembly, bathroom heater and warmer
CN107086264A (en) * 2017-06-23 2017-08-22 深圳市德辰光电科技有限公司 A kind of red light LED lamp bead and its manufacturing method
CN111066162A (en) * 2017-09-19 2020-04-24 ams有限公司 Phosphor-Converted Light-Emitting Devices
CN111066162B (en) * 2017-09-19 2024-02-13 ams有限公司 Phosphor-converted light-emitting devices
CN110970541A (en) * 2018-09-29 2020-04-07 有研稀土新材料股份有限公司 Semiconductor light source and optical device prepared by same
CN110970541B (en) * 2018-09-29 2023-04-21 有研稀土新材料股份有限公司 Semiconductor light source and optical device prepared by same
CN110094699A (en) * 2019-05-27 2019-08-06 轻工业部南京电光源材料科学研究所 Ultraviolet germicidal and preparation method thereof is converted in one kind

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