CN202253177U - Backlight module with thin circuit layer cover body - Google Patents
Backlight module with thin circuit layer cover body Download PDFInfo
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- CN202253177U CN202253177U CN2011203532651U CN201120353265U CN202253177U CN 202253177 U CN202253177 U CN 202253177U CN 2011203532651 U CN2011203532651 U CN 2011203532651U CN 201120353265 U CN201120353265 U CN 201120353265U CN 202253177 U CN202253177 U CN 202253177U
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Abstract
The utility model relates to a backlight module with a thin circuit layer cover body. The backlight module comprises a cover body, a light source assembly, a reflection layer, a light guide plate and a bottom reflector, wherein the light source assembly wraps the cover body and comprises a circuit substrate, a circuit layer and a plurality of LED (light-emitting diode) components. According to the backlight module with the thin circuit layer cover body, after the circuit layer is formed on the circuit substrate, the circuit substrate and the circuit layer are arranged outside the cover body by a mode that the cover body is wrapped by the circuit substrate, accordingly, the increase in the whole area of the circuit layer can be utilized so as to provide more elastic designs for backlight module manufactures in the design of an electronic circuit of the circuit layer.
Description
Technical field
The utility model is about a kind of backlight module, particularly about a kind of backlight module with slim circuit layer cover body.
Background technology
In recent years, (Light-Emitting Diode LED) is applied on the lighting device of daily life light emitting diode widely.Because LED is easy to generate high heat when luminous, therefore, the existing LED lighting device of commonly using can assemble the material or the utensil of assisting heat radiation usually.
See also Fig. 1, a kind of side view of the existing LED-backlit module of commonly using.As shown in Figure 1; The LED-backlit module 200 ' that should existing commonly use is installed in the liquid crystal indicator; In order to launch the LGP (not shown) in a backlight to this main frame; Wherein, the existing LED-backlit module of commonly using 200 ' has and comprises a LGP 210 ', a light source assembly 220 ', a cover body 230 ', an and top frame 240 '.Wherein, light source assembly 220 ' comprises a circuit board 222 ' and is arranged at a plurality of LED assemblies 224 ' on this circuit board 222 ' surface.In addition; Cover body 230 ' is the profile of a L font, and, because the LED assembly 224 ' in the running can generate heat; For these heat energy of dissipation, cover body 230 ' more comprises one first heat-conducting part (not shown) and connects the second heat-conducting part (not shown) of first heat-conducting part.Moreover LED-backlit module 200 ' more can comprise a reflector plate 212 ' to improve the light utilization ratio.
Above-mentioned this LED-backlit module 200 ' has advantage simple in structure and that be convenient to install, and therefore, this LED-backlit module 200 ' is applied in the various liquid crystal indicators widely, so that backlight source of liquid crystal display apparatus to be provided.Yet, along with the change of user's use habit, no matter be large scale or undersized liquid crystal indicator, all be asked to be made into the liquid crystal indicator of light and thin type.But; For the LED-backlit module that is applied to slim liquid crystal indicator, it must face a significant challenge, promptly; Must on the circuit board of limited size, print complicated and complete electronic circuit, possibly cause electronic circuit intactly to be printed to circuit board.In addition; For this LED-backlit module 200 ', because therefore this circuit board 222 ' is arranged in the cover body 230 '; When LED assembly 224 ' adstante febre, this heat energy will be passed to the circuit on circuit board 222 ' surface and be easy in cover body 230 ', produce the phenomenon of hot stack.
This shows that above-mentioned existing LED-backlit module obviously still has inconvenience and defective, and demands urgently further improving in structure and use.Therefore how to found the backlight module of the slim circuit layer cover body of having of a kind of new structure, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing LED-backlit module exists; The inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge; And cooperate the utilization of studying the science, actively study innovation, in the hope of founding the backlight module of the slim circuit layer cover body of having of a kind of new structure; Can improve general existing LED-backlit module, make it have more practicality.Through constantly research, design, and, found out the utility model of true tool practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The purpose of the utility model is, overcomes the defective that existing LED-backlit module exists, and the backlight module of the slim circuit layer cover body of having of a kind of new structure is provided; Technical problem to be solved is after making it that circuit layer is formed at a circuit substrate; Utilization is arranged at the mode of this circuit substrate coating backlight module cover body outside the cover body with circuit substrate and circuit layer, so; Can be beneficial to the increase of the entire area of circuit layer; When the electronic circuit of backlight module manufacturer at the design circuit layer is provided, can adopt more Flexible Design, be very suitable for practicality.
Another purpose of the utility model is; Overcome the defective that existing LED-backlit module exists, and the backlight module of the slim circuit layer cover body of having of a kind of new structure is provided, technical problem to be solved is after making it that circuit layer is formed at a circuit substrate; Utilization coats this circuit substrate the mode of backlight module cover body; Circuit substrate and circuit layer are arranged at outside the cover body, so, can be beneficial to the increase of the entire area of circuit layer; When the electronic circuit of backlight module manufacturer at the design circuit layer is provided, can adopt more Flexible Design; In addition,, more can control a plurality of LED assemblies that are arranged at the circuit layer surface and get into the degree of depth of cover body, and then can prevent that these a plurality of LED assemblies from receiving the bump of LGP when assembling, thereby be suitable for practicality more by the use of distance piece.
The purpose of the utility model and to solve its technical problem be that technical scheme below adopting realizes.According to a kind of backlight module of the utility model proposition with slim circuit layer cover body, comprising: a cover body have a cover body base, the long limit of a cover body and a cover body minor face at least, and this cover body base is formed with a plurality of first holes; One light source assembly coats this cover body, and has: a circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body; One circuit layer is formed at this circuit substrate surface; And a plurality of LED assemblies, be arranged on this circuit layer, and each LED assembly passes this first hole and gets into cover body inside with the one of which light emitting surface, so that a light source to be provided; One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further; One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And an end reflector plate, be arranged at this LGP bottom, in order to prevent the light source escape.
The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.
Aforesaid backlight module, the manufactured materials of wherein said this cover body with slim circuit layer cover body can be following any: metal, high reflectance polyester film, plastics and glass fibre.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is a metal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer; And one second insulating heat-conductive layer, be attached at the circuit layer surface, and between circuit layer and this cover body, wherein, this second insulating heat-conductive layer has a plurality of the 3rd holes.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is a metal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is nonmetal.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is nonmetal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this reflecting layer is sprayed at the inner surface of this cover body by a reflecting material and is shaped.
Aforesaid backlight module with slim circuit layer cover body, wherein said this reflecting layer is shaped by reflecting material bending.
Aforesaid backlight module with slim circuit layer cover body; Wherein said this reflecting layer has more base, a reflecting layer, long limit, a reflecting layer and a reflecting layer minor face; And an end of this reflecting layer minor face is formed with reflecting layer tasselled, and these a plurality of second holes are formed at this base, reflecting layer.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, then an end on the long limit of cover body more is formed with cover body tasselled.
Aforesaid backlight module, the outer surface of wherein said this circuit substrate with slim circuit layer cover body can spray further one have a thermal radiation property material.
Aforesaid backlight module with slim circuit layer cover body; Wherein said this circuit layer that is formed at this circuit substrate surface more comprises a plurality of metal pads and many metallic traces; And; These a plurality of metal pads are arranged at this substrate base, and these many metallic traces are arranged at the long limit of this substrate and this substrate minor face.
The purpose of the utility model and solve its technical problem and also adopt following technical scheme to realize.According to a kind of backlight module of the utility model proposition with slim circuit layer cover body, comprising: a cover body have a cover body base, the long limit of a cover body and a cover body minor face at least, and this cover body base is formed with a plurality of first holes; One light source assembly coats this cover body, and has: a circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body; One circuit layer is formed at this circuit substrate surface; And a plurality of LED assemblies, be arranged on this circuit layer, and each LED assembly passes this first hole and gets into cover body inside with the one of which light emitting surface, so that a light source to be provided; One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further; At least one distance piece is arranged at this circuit layer surface and between circuit layer and this cover body base, in order to the spacing on adjustment circuit layer and cover body base, to control the degree of depth of these a plurality of LED assemblies entering cover bodies; One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And an end reflector plate, be arranged at this LGP bottom, in order to prevent the light source escape.
The purpose of the utility model and solve its technical problem and can also adopt following technical measures to come further to realize.
Aforesaid backlight module, the manufactured materials of wherein said this cover body with slim circuit layer cover body can be following any: metal, high reflectance polyester film, plastics and glass fibre.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is a metal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer; And one second insulating heat-conductive layer, be attached at the circuit layer surface, and between circuit layer and this cover body, this second insulating heat-conductive layer has a plurality of the 3rd holes.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is a metal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is nonmetal.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is nonmetal.
Aforesaid backlight module with slim circuit layer cover body, wherein said this reflecting layer is sprayed at the inner surface of this cover body by a reflecting material and is shaped.
Aforesaid backlight module with slim circuit layer cover body, wherein said this reflecting layer is shaped by reflecting material bending.
Aforesaid backlight module with slim circuit layer cover body; Wherein said this reflecting layer has more base, a reflecting layer, long limit, a reflecting layer and a reflecting layer minor face; And an end of this reflecting layer minor face is formed with reflecting layer tasselled, and these a plurality of second holes are formed at this base, reflecting layer.
Aforesaid backlight module with slim circuit layer cover body, wherein said manufactured materials when this cover body is a metal, then an end on the long limit of cover body more is formed with cover body tasselled.
Aforesaid backlight module, the outer surface of wherein said this circuit substrate with slim circuit layer cover body can spray further one have a thermal radiation property material.
Aforesaid backlight module with slim circuit layer cover body; Wherein said this circuit layer that is formed at this circuit substrate surface more comprises a plurality of metal pads and many metallic traces; And; These a plurality of metal pads are arranged at this substrate base, and these many metallic traces are arranged at the long limit of this substrate and this substrate minor face.
The utility model compared with prior art has tangible advantage and beneficial effect.Can know by above technology contents; For achieving the above object, the utility model provides a kind of backlight module with slim circuit layer cover body, comprising: a cover body; At least have a cover body base, the long limit of a cover body and a cover body minor face, and this cover body base is formed with a plurality of first holes; One light source assembly coats this cover body, and has: a circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body; One circuit layer is formed at this circuit substrate surface; And a plurality of LED assemblies, be arranged on this circuit layer, and each LED assembly passes this first hole and gets into cover body inside with the one of which light emitting surface, so that a light source to be provided; One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further; One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And an end reflector plate, be arranged at this LGP bottom, in order to prevent the light source escape.
Propose a kind of backlight module with slim circuit layer cover body, comprising: a cover body have a cover body base, the long limit of a cover body and a cover body minor face at least, and this cover body base is formed with a plurality of first holes; One light source assembly coats this cover body, and has: a circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body; One circuit layer is formed at this circuit substrate surface; And a plurality of LED assemblies, be arranged on this circuit layer, and each LED assembly passes this first hole and gets into cover body inside with the one of which light emitting surface, so that a light source to be provided; One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further; At least one distance piece is arranged at this circuit layer surface and between circuit layer and this cover body base, in order to the spacing on adjustment circuit layer and cover body base, to control the degree of depth of these a plurality of LED assemblies entering cover bodies; One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And an end reflector plate, be arranged at this LGP bottom, in order to prevent the light source escape.
By technique scheme, the backlight module that the utlity model has slim circuit layer cover body has advantage and beneficial effect at least:
1. in the utility model, circuit layer is formed at circuit substrate after, utilization coats this circuit substrate the mode of cover body; Circuit substrate and circuit layer are arranged at outside the cover body; So, because circuit substrate and circuit layer are not to be arranged at cover body inside, can be beneficial to the increase of the entire area of circuit layer; So that the electronic circuit of backlight module manufacturer at the design circuit layer to be provided, can adopt more Flexible Design.
2. because circuit substrate and circuit layer are not to be arranged at cover body inside, therefore, when the LED assembly was luminous, its heat that is passed to circuit layer can directly be got rid of via circuit substrate and cover body, and can in cover body, not produce the phenomenon of hot stack.
Above-mentioned explanation only is the general introduction of the utility model technical scheme; In order more to know the technological means of understanding the utility model; And can implement according to the content of specification, and for let the above-mentioned of the utility model with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is a kind of stereogram of the existing LED-backlit module of commonly using;
Fig. 2 is the side view of first embodiment of backlight module with slim circuit layer cover body of the utility model a kind of;
Fig. 3 is the stereogram of first embodiment with backlight module of slim circuit layer cover body;
Fig. 4 is a light source assembly and the combination sketch map of a cover body with backlight module of slim circuit layer cover body;
Fig. 5 is second stereogram of first embodiment with backlight module of slim circuit layer cover body;
Fig. 6 is the side view of second embodiment of backlight module with slim circuit layer cover body of the utility model a kind of;
Fig. 7 is the stereogram of second embodiment with backlight module of slim circuit layer cover body; And
Fig. 8 is second stereogram of second embodiment with backlight module of slim circuit layer cover body.
1: backlight module with slim circuit layer cover body
11: cover body 12: light source assembly
14: reflecting layer 15: LGP
16: end reflector plate 111: the cover body base
112: the long limit 113 of cover body: cover body minor face
122: circuit layer 120:LED assembly
123: the first insulating heat-conductive layers of 140: the second holes
124: the second insulating heat-conductive layers 1211: substrate base
1212: the long limit 1213 of substrate: substrate minor face
1221: metal pad 1222: metallic circuit
141: base, reflecting layer 142: long limit, reflecting layer
143: reflecting layer minor face 1431: the reflecting layer tasselled
1121: cover body tasselled 17: distance piece
200 ': LED-backlit module 210 ': LGP
220 ': light source assembly 230 ': cover body
240 ': top frame 222 ': circuit board
224 ': LED assembly 212 ': reflector plate
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked; Below in conjunction with accompanying drawing and preferred embodiment; To its specific embodiment of the backlight module with slim circuit layer cover body, structure, characteristic and the effect thereof that proposes according to the utility model, specify as after.
See also Fig. 2 and Fig. 3; Be side view and the stereogram of first embodiment of the utility model a kind of backlight module with slim circuit layer cover body; Like Fig. 2 and shown in Figure 3; This first embodiment with backlight module 1 of slim circuit layer cover body comprises: a cover body 11, a light source assembly 12, a reflecting layer 14, a LGP 15 and an end reflector plate 16; Wherein, this cover body 11 has a cover body base 111, the long limit 112 of a cover body and a cover body minor face 113, and cover body base 111 is formed with a plurality of first holes 1111.
This light source assembly 12 coats these cover bodies 11 also to have: a circuit substrate 121, a circuit layer 122 and a plurality of LED assemblies 120, and wherein this circuit layer 122 is formed at circuit substrate 121 surfaces; These 120 of a plurality of LED assemblies are arranged on the circuit layer 122, and each LED assembly 120 passes this first hole 1111 with the one of which light emitting surface and entering cover body 11 inside, so that a light source to be provided.This reflecting layer 14 is arranged in the cover body 11 with respect to these a plurality of LED assemblies 120, and this reflecting layer 14 has a plurality of second holes 140, and the light emitting surface that makes each pass the LED assembly 120 of this first hole 1111 can pass this second hole 140 further.In addition, this LGP 15 is arranged in the cover body 11 with respect to reflecting layer 14, sees through this light source that these a plurality of second holes 140 are penetrated in order to receive; 16 of this end reflector plates are arranged at LGP 15 bottoms, in order to prevent the light source escape.
In first embodiment of the backlight module 1 of the slim circuit layer cover body of having of the utility model; The manufactured materials of this cover body 11 can be metal, high reflectance polyester film, plastics and glass fibre; Wherein, high reflectance polyester film, plastics and glass fibre belong to nonmetallic materials.When the manufactured materials of this cover body 11 is metal; Expression cover body 11 is in order to ccontaining high-power LED assembly 120; Then the manufactured materials of circuit substrate 121 can be metal, and for example aluminium base is like this; The heat that LED assembly 120 is produced when luminous can be passed to circuit substrate 121 by cover body 11, sees through circuit substrate 121 again hot type is removed.
Seeing also Fig. 4, is a light source assembly and the combination sketch map of a cover body with backlight module of slim circuit layer cover body.As shown in Figure 4; When the manufactured materials of circuit substrate 121 is metal; In order to prevent the short circuit between two metals; When making this light source assembly 12, must one first insulating heat-conductive layer 123 be attached at these circuit substrate 121 surfaces and between circuit substrate 121 and this circuit layer 122, to prevent the short circuit of circuit substrate 121 and circuit layer 122; Simultaneously, must one second insulating heat-conductive layer 124 be attached at circuit layer 122 surface and between circuit layer 122 and this cover body 11, to prevent the short circuit of circuit layer 122 and cover body 11.What must pay special attention to is that this second insulating heat-conductive layer 124 has a plurality of the 3rd holes (not indicating among the figure) that can let these a plurality of LED assemblies 120 pass respectively.So, after light source assembly 12 completes, can be attached at cover body 11 outer surfaces and coat this cover body 11.Moreover, after light source assembly 12 is attached at cover body 11 outer surfaces, in order to strengthen radiating effect, can circuit substrate 121 outer surfaces further spray one have a thermal radiation property material, with the thermal convection current phenomenon between intensifier circuit substrate 121 and extraneous air.
Hold the narration of epimere, when the manufactured materials of this cover body 11 is metal, then the manufactured materials of circuit substrate 121 also can be nonmetal, for example by PI or the made soft circuit board of PET; So, as shown in Figure 3, circuit substrate 121 can have respectively a substrate base 1211, the long limit 1212 of a substrate and the substrate minor face 1213 with respect to cover body base 111, the long limit 112 of cover body and cover body minor face 113.In addition; This circuit layer 122 that is formed at circuit substrate 121 surfaces more comprises a plurality of metal pads 1221 and many metallic traces 1222; Wherein, These a plurality of metal pads 1221 can see through the mode of screen painting and be formed at this substrate base 1211, and these many metallic traces 1222 can see through the mode of screen painting and be formed at the long limit 1212 of this substrate and this substrate minor face 1213.
In addition; When the manufactured materials of this cover body 11 when being nonmetal; Then the manufactured materials of circuit substrate 121 also can be metal, at this moment, and in order to prevent the short circuit between circuit layer 122 and the circuit substrate 121; In this light source assembly 12, this first insulating heat-conductive layer (not shown) must be attached at this circuit substrate 121 surfaces and between circuit substrate 121 and this circuit layer 122.Yet owing to must not consider the short circuit phenomenon between cover body 11 and the circuit layer 122, this second insulating heat-conductive layer (not shown) that therefore has a plurality of the 3rd holes needn't be arranged between circuit layer 122 and this cover body 11, can remove.Or when the manufactured materials of this cover body 11 when being nonmetal, then the manufactured materials of circuit substrate 121 also can be nonmetally, at this moment, then must not use the isolated metal material that contacts with each other of the first insulating heat-conductive layer and the second insulating heat-conductive layer.
Please consulting Fig. 5 in addition, is second stereogram of first embodiment of this backlight module with slim circuit layer cover body.In the backlight module 1 of the slim circuit layer cover body of having of the utility model, this reflecting layer 14 can be sprayed at the inner surface of this cover body 11 and be shaped by a reflecting material.A kind of in addition form reflecting layer 14 to do rule as shown in Figure 5; One reflecting material is bent into this reflecting layer 14 and makes reflecting layer 14 have a long limit 142 in base, a reflecting layer 141, a reflecting layer and a reflecting layer minor face 143 of growing limit 112 and cover body minor face 113 respectively with respect to cover body base 111, cover body; And an end of this reflecting layer minor face 143 is formed with reflecting layer tasselled 1431; Wherein, When this LGP 15 was set in the cover body 11, these reflecting layer tasselled 1431 intactly were attached at the top surface of LGP 15, made LGP 15 not have the space with reflecting layer 14 mutual driving fits; So, then can prevent the space escape of light source that this LED assembly 120 launched by 14 in LGP 15 reflecting layer.
Please consult Fig. 5 unceasingly, backlight module is mounted on the main frame in the LCD usually, and so that this backlight of LCD to be provided, wherein this main frame has a base plate and at least one frame.In order to make the backlight module 1 of the slim circuit layer cover body of having of the utility model closely to fit with the base plate of main frame; As shown in Figure 5; Can form cover body tasselled 1121 in an end on the long limit 112 of this cover body; So, when this backlight module 1 with slim circuit layer cover body is mounted to main frame, but cover body tasselled 1121 complete body are attached on the main frame base plate; And, see through cover body tasselled 1121 and can the heat that cover body 11 is distributed be conducted to the long-range of base plate, cause the even effect of backplate surface temperature.
So; Via above-mentioned; This of the utility model have slim circuit layer cover body backlight module first embodiment framework with constitute clear and intactly disclose; Below, will be in following characteristic that backlight module had and the advantage that the slim circuit layer cover body of having of the utility model clearly is described:
1. in the utility model, circuit layer 122 is formed at circuit substrate 121 after, utilization coats this circuit substrate 121 mode of cover bodies 11; Circuit substrate 121 and circuit layer 122 are arranged at outside the cover body 11; So, because circuit substrate 121 is not to be arranged at cover body 11 inside with circuit layer 122, can be beneficial to the increase of the entire area of circuit layer 122; So that the electronic circuit of backlight module manufacturer at design circuit layer 122 to be provided, can adopt more Flexible Design.
2. because circuit substrate 121 is not to be arranged at cover body 11 inside with circuit layer 122; Therefore; When LED assembly 120 was luminous, its heat that is passed to circuit layer 122 can directly be got rid of via circuit substrate 121 and cover body 11, and can in cover body 11, not produce the phenomenon of hot stack.
The backlight module with slim circuit layer cover body of the utility model more comprises one second embodiment.See also Fig. 6 and Fig. 7; Be side view and the stereogram of second embodiment of the utility model a kind of backlight module with slim circuit layer cover body; Like Fig. 6 and shown in Figure 7; This second embodiment with backlight module 1 of slim circuit layer cover body comprises: a cover body 11, a light source assembly 12, a reflecting layer 14, a LGP 15, an end reflector plate 16 and two distance pieces 17; Wherein, this cover body 11 that second embodiment is had, this light source assembly 12, this reflecting layer 14, this LGP 15, with this end reflector plate 16, its formation be same as cover body 11 that aforementioned first embodiment had, light source assembly 12, reflecting layer 14, LGP 15, with end reflector plate 16; Therefore, at this just no longer to cover body 11, light source assembly 12, reflecting layer 14, LGP 15, be repeated in this description with end reflector plate 16.
Yet; Be different from first embodiment; This second embodiment with backlight module 1 of slim circuit layer cover body more comprises by two made distance pieces 17 of insulating materials, and like Fig. 6 and shown in Figure 7, this two distance piece 17 is arranged at these circuit layer 122 surfaces and between circuit layer 122 and this cover body base 111; In order to the spacing of adjustment circuit layer 122, to control the degree of depth that these a plurality of LED assemblies 120 get into cover body 11 with cover body base 111; So, can make each the LED assembly 120 that gets in the cover body 11 can penetrate second hole 140 in reflecting layer 14, and be embedded in second hole 140; Such design can prevent that LED assembly 120 is exposed to outside second hole 140, so avoid and assembling or when carrying the LED assembly 120 clashed into.At this, what must specify is, this two distance piece 17 also can be replaced by the monospace spare with a plurality of distance piece holes, and wherein, these a plurality of distance piece holes are in order to make that these a plurality of LED assemblies 120 pass through.
Please continue to consult Fig. 8 again; It is second stereogram of second embodiment of the backlight module of the slim circuit layer cover body of having of the utility model; As shown in Figure 8; Be same as aforementioned first embodiment, have among second embodiment of backlight module 1 of slim circuit layer cover body at this, reflecting layer 14 can be bent into this reflecting layer 14 by a reflecting material; And make reflecting layer 14 have a long limit 142 in base, a reflecting layer 141, a reflecting layer and a reflecting layer minor face 143 of growing limit 112 and cover body minor face 113 respectively with respect to cover body base 111, cover body, and an end of this reflecting layer minor face 143 is formed with reflecting layer tasselled 1431.And an end on the long limit 112 of cover body can form cover body tasselled 1121, and so, when this backlight module 1 with slim circuit layer cover body is mounted to main frame, but cover body tasselled 1121 complete body are attached on the main frame base plate.
The above; It only is the preferred embodiment of the utility model; Not being that the utility model is done any pro forma restriction, though the utility model with the preferred embodiment exposure as above, yet is not in order to limit the utility model; Anyly be familiar with the professional and technical personnel; In not breaking away from the utility model technical scheme scope, when the structure of above-mentioned announcement capable of using and technology contents are made a little change or are modified to the equivalent embodiment of equivalent variations, but every content that does not break away from the utility model technical scheme;, all still belong in the scope of the utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to the technical spirit of the utility model.
Claims (28)
1. backlight module with slim circuit layer cover body is characterized in that comprising:
One cover body have a cover body base, the long limit of a cover body and a cover body minor face at least, and this cover body base is formed with a plurality of first holes;
One light source assembly coats this cover body, and has:
One circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body;
One circuit layer is formed at this circuit substrate surface; And
A plurality of LED assemblies are arranged on this circuit layer, and each LED assembly passes this first hole and get into cover body inside with the one of which light emitting surface, so that a light source to be provided;
One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further;
One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And
One end reflector plate is arranged at this LGP bottom, in order to prevent the light source escape.
2. the backlight module with slim circuit layer cover body as claimed in claim 1, the manufactured materials that it is characterized in that this cover body can be following any: metal, high reflectance polyester film, plastics and glass fibre.
3. the backlight module with slim circuit layer cover body as claimed in claim 2 is characterized in that the manufactured materials when this cover body is a metal, and the manufactured materials of this circuit substrate can be metal.
4. the backlight module with slim circuit layer cover body as claimed in claim 3 is characterized in that this light source assembly more comprises:
One first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer; And
One second insulating heat-conductive layer is attached at the circuit layer surface, and between circuit layer and this cover body, wherein, this second insulating heat-conductive layer has a plurality of the 3rd holes.
5. the backlight module with slim circuit layer cover body as claimed in claim 2 is characterized in that the manufactured materials when this cover body is nonmetal, and the manufactured materials of this circuit substrate is a metal.
6. the backlight module with slim circuit layer cover body as claimed in claim 5 is characterized in that this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer.
7. the backlight module with slim circuit layer cover body as claimed in claim 2 is characterized in that the manufactured materials when this cover body is nonmetal, and the manufactured materials of this circuit substrate is nonmetal.
8. the backlight module with slim circuit layer cover body as claimed in claim 2 is characterized in that the manufactured materials when this cover body is a metal, and the manufactured materials of this circuit substrate is nonmetal.
9. the backlight module with slim circuit layer cover body as claimed in claim 1 is characterized in that this reflecting layer is sprayed at the inner surface of this cover body by a reflecting material and is shaped.
10. the backlight module with slim circuit layer cover body as claimed in claim 1 is characterized in that this reflecting layer is shaped by reflecting material bending.
11. the backlight module with slim circuit layer cover body as claimed in claim 10; It is characterized in that this reflecting layer has more base, a reflecting layer, long limit, a reflecting layer and a reflecting layer minor face; And an end of this reflecting layer minor face is formed with reflecting layer tasselled, and these a plurality of second holes are formed at this base, reflecting layer.
12. the backlight module with slim circuit layer cover body as claimed in claim 2 is characterized in that the manufactured materials when this cover body is a metal, then an end on the long limit of cover body more is formed with cover body tasselled.
13. the backlight module with slim circuit layer cover body as claimed in claim 3, the outer surface that it is characterized in that this circuit substrate can spray further one have a thermal radiation property material.
14. the backlight module with slim circuit layer cover body as claimed in claim 1; It is characterized in that this circuit layer that is formed at this circuit substrate surface more comprises a plurality of metal pads and many metallic traces; And; These a plurality of metal pads are arranged at this substrate base, and these many metallic traces are arranged at the long limit of this substrate and this substrate minor face.
15. the backlight module with slim circuit layer cover body is characterized in that comprising:
One cover body have a cover body base, the long limit of a cover body and a cover body minor face at least, and this cover body base is formed with a plurality of first holes;
One light source assembly coats this cover body, and has:
One circuit substrate has a long limit of a substrate base, a substrate and a substrate minor face of growing limit and this cover body minor face respectively with respect to this cover body base, this cover body;
One circuit layer is formed at this circuit substrate surface; And
A plurality of LED assemblies are arranged on this circuit layer, and each LED assembly passes this first hole and get into cover body inside with the one of which light emitting surface, so that a light source to be provided;
One reflecting layer is arranged in the cover body with respect to these a plurality of LED assemblies, and this reflecting layer has a plurality of second holes, and this light emitting surface that makes each pass the LED assembly of this first hole can pass this second hole further;
At least one distance piece is arranged at this circuit layer surface and between circuit layer and this cover body base, in order to the spacing on adjustment circuit layer and cover body base, to control the degree of depth of these a plurality of LED assemblies entering cover bodies;
One LGP is arranged in the cover body with respect to the reflecting layer, sees through this light source that these a plurality of second holes are penetrated in order to receive; And
One end reflector plate is arranged at this LGP bottom, in order to prevent the light source escape.
16. the backlight module with slim circuit layer cover body as claimed in claim 15, the manufactured materials that it is characterized in that this cover body can be following any: metal, high reflectance polyester film, plastics and glass fibre.
17. the backlight module with slim circuit layer cover body as claimed in claim 16 is characterized in that the manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is a metal.
18. the backlight module with slim circuit layer cover body as claimed in claim 17 is characterized in that this light source assembly more comprises:
One first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer; And
One second insulating heat-conductive layer is attached at the circuit layer surface, and between circuit layer and this cover body, this second insulating heat-conductive layer has a plurality of the 3rd holes.
19. the backlight module with slim circuit layer cover body as claimed in claim 16 is characterized in that the manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is a metal.
20. the backlight module with slim circuit layer cover body as claimed in claim 19 is characterized in that this light source assembly more comprises: one first insulating heat-conductive layer is attached at this circuit substrate surface and between circuit substrate and this circuit layer.
21. the backlight module with slim circuit layer cover body as claimed in claim 16 is characterized in that the manufactured materials when this cover body is nonmetal, the manufactured materials of this circuit substrate is nonmetal.
22. the backlight module with slim circuit layer cover body as claimed in claim 15 is characterized in that the manufactured materials when this cover body is a metal, the manufactured materials of this circuit substrate is nonmetal.
23. the backlight module with slim circuit layer cover body as claimed in claim 15 is characterized in that this reflecting layer is sprayed at the inner surface of this cover body by a reflecting material and is shaped.
24. the backlight module with slim circuit layer cover body as claimed in claim 15 is characterized in that this reflecting layer is shaped by reflecting material bending.
25. the backlight module with slim circuit layer cover body as claimed in claim 24; It is characterized in that this reflecting layer has more base, a reflecting layer, long limit, a reflecting layer and a reflecting layer minor face; And an end of this reflecting layer minor face is formed with reflecting layer tasselled, and these a plurality of second holes are formed at this base, reflecting layer.
26. the backlight module with slim circuit layer cover body as claimed in claim 16 is characterized in that the manufactured materials when this cover body is a metal, then an end on the long limit of cover body more is formed with cover body tasselled.
27. the backlight module with slim circuit layer cover body as claimed in claim 17, the outer surface that it is characterized in that this circuit substrate can spray further one have a thermal radiation property material.
28. the backlight module with slim circuit layer cover body as claimed in claim 15; It is characterized in that this circuit layer that is formed at this circuit substrate surface more comprises a plurality of metal pads and many metallic traces; And; These a plurality of metal pads are arranged at this substrate base, and these many metallic traces are arranged at the long limit of this substrate and this substrate minor face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203532651U CN202253177U (en) | 2011-09-15 | 2011-09-15 | Backlight module with thin circuit layer cover body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203532651U CN202253177U (en) | 2011-09-15 | 2011-09-15 | Backlight module with thin circuit layer cover body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202253177U true CN202253177U (en) | 2012-05-30 |
Family
ID=46114417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203532651U Expired - Fee Related CN202253177U (en) | 2011-09-15 | 2011-09-15 | Backlight module with thin circuit layer cover body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202253177U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767759A (en) * | 2012-07-04 | 2012-11-07 | 深圳市华星光电技术有限公司 | Liquid crystal display device and backlight module thereof |
| CN103727434A (en) * | 2013-12-20 | 2014-04-16 | 苏州东山精密制造股份有限公司 | Sidelight type backlight module |
| CN108167663A (en) * | 2016-12-14 | 2018-06-15 | 深圳市中科燧承科技有限公司 | For the LED light source and manufacturing method of LED light |
| EP3825605A1 (en) * | 2014-05-15 | 2021-05-26 | Rohinni, Inc. | Light diffusion with light-generating sources |
-
2011
- 2011-09-15 CN CN2011203532651U patent/CN202253177U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767759A (en) * | 2012-07-04 | 2012-11-07 | 深圳市华星光电技术有限公司 | Liquid crystal display device and backlight module thereof |
| CN102767759B (en) * | 2012-07-04 | 2015-07-15 | 深圳市华星光电技术有限公司 | Liquid crystal display device and backlight module thereof |
| CN103727434A (en) * | 2013-12-20 | 2014-04-16 | 苏州东山精密制造股份有限公司 | Sidelight type backlight module |
| EP3825605A1 (en) * | 2014-05-15 | 2021-05-26 | Rohinni, Inc. | Light diffusion with light-generating sources |
| CN108167663A (en) * | 2016-12-14 | 2018-06-15 | 深圳市中科燧承科技有限公司 | For the LED light source and manufacturing method of LED light |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20140915 |
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| EXPY | Termination of patent right or utility model |