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CN202224784U - Microelectrode array with hollow structure - Google Patents

Microelectrode array with hollow structure Download PDF

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Publication number
CN202224784U
CN202224784U CN2011203435026U CN201120343502U CN202224784U CN 202224784 U CN202224784 U CN 202224784U CN 2011203435026 U CN2011203435026 U CN 2011203435026U CN 201120343502 U CN201120343502 U CN 201120343502U CN 202224784 U CN202224784 U CN 202224784U
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hollow structure
microelectrode array
array
single electrode
hollow
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汪红
吴静
丁桂甫
赵小林
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Shanghai Jiao Tong University
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Abstract

本实用新型公开一种微细电化学加工用中空结构微电极阵列,包括微电极阵列支撑底板以及位于该底板上的中空结构圆形单电极,所述中空结构圆形单电极由实心圆柱微电极内开孔形成,该中空结构圆形单电极的端面设有一个口径小于所开内孔直径的单电极端面约束孔。本实用新型若配合脉冲电源,再将电解液以径向流方式通过中空结构微电极阵列,则在工件上可以得到精度较高、表面质量较好的阵列孔。

Figure 201120343502

The utility model discloses a micro-electrode array with a hollow structure for micro-electrochemical processing, which comprises a support base plate of the micro-electrode array and a circular single electrode with a hollow structure located on the base plate. The circular single electrode with a hollow structure is composed of a solid cylindrical micro-electrode The opening is formed, and the end face of the hollow circular single electrode is provided with a single electrode end face constraining hole whose diameter is smaller than the diameter of the opened inner hole. If the utility model cooperates with the pulse power supply, and then passes the electrolyte through the hollow structure micro-electrode array in a radial flow mode, array holes with high precision and good surface quality can be obtained on the workpiece.

Figure 201120343502

Description

一种中空结构微电极阵列A hollow microelectrode array

技术领域 technical field

本实用新型涉及一种微电极阵列,特别是一种群孔微细电化学加工研究用的具有中空结构的微电极阵列。The utility model relates to a micro-electrode array, in particular to a micro-electrode array with a hollow structure, which is used for the research of group-hole micro-electrochemical processing.

背景技术 Background technique

目前,在群孔微细电化学加工中的微电极阵列为实心圆柱微电极阵列,通过对其进行侧壁绝缘,可以较好的约束两极间隙内的电场分布,将电解液从侧面喷入,可以补充间隙内的反应物浓度,并冲走电极反应生成的不溶性产物,再应用脉冲电源等措施,一定程度上提高了工件上群孔的成形精度和表面质量。但是电解液的侧流式补充方式难以很好的维持加工过程中间隙内流场的稳定性,其对间隙内的反应物补充不充足不均匀,反应产物的冲刷也不均匀不彻底,这阻碍了群孔成形精度与表面质量的进一步提高。At present, the microelectrode array in the group hole microelectrochemical machining is a solid cylindrical microelectrode array. By insulating the side wall, the electric field distribution in the gap between the two electrodes can be better restricted, and the electrolyte can be sprayed from the side. Supplementing the concentration of reactants in the gap, washing away the insoluble products generated by the electrode reaction, and then applying pulse power and other measures, to a certain extent, the forming accuracy and surface quality of the group holes on the workpiece are improved. However, the side-flow replenishment method of electrolyte is difficult to maintain the stability of the flow field in the gap during the processing process. It replenishes the reactants in the gap insufficiently and unevenly, and the flushing of the reaction products is uneven and incomplete. The forming precision and surface quality of group holes are further improved.

实用新型内容 Utility model content

为了克服现有圆柱实心微电极阵列,只能进行电解液的侧流式补充的缺陷,本实用新型提出一种具有中空结构的微电极阵列,可进行电解液的径向流式的补充,可以更快更均匀的补充间隙内被电极反应消耗的反应物,也可以更为均匀有效的冲刷掉电极反应不溶性产物,进一步维持间隙内流场的稳定性,保障电解加工的持续有效进行。In order to overcome the defect that the existing cylindrical solid microelectrode array can only carry out lateral flow replenishment of electrolyte, the utility model proposes a microelectrode array with a hollow structure, which can carry out radial flow replenishment of electrolyte, and can Faster and more uniform replenishment of the reactants consumed by the electrode reaction in the gap can also flush out the insoluble products of the electrode reaction more uniformly and effectively, further maintaining the stability of the flow field in the gap, and ensuring the continuous and effective electrolytic processing.

为实现上述目的,本实用新型所述的中空结构微电极阵列包括微电极阵列支撑底板以及位于该底板上的多个中空结构圆形单电极,所述中空结构圆形单电极由实心圆柱微电极内开孔形成,该中空结构圆形单电极的端面设有一个口径小于所开内孔直径的单电极端面约束孔,以减小开孔对微电极形状的影响。In order to achieve the above object, the hollow structure microelectrode array described in the utility model includes a microelectrode array support base plate and a plurality of hollow structure circular single electrodes located on the base plate, and the hollow structure circular single electrodes are composed of solid cylindrical microelectrodes The inner opening is formed, and the end face of the hollow structure circular single electrode is provided with a single electrode end face constraining hole with a diameter smaller than the diameter of the opened inner hole, so as to reduce the influence of the opening on the shape of the microelectrode.

所述中空结构圆形单电极的侧壁设有绝缘层。The side wall of the hollow circular single electrode is provided with an insulating layer.

所述中空结构圆形单电极的单电极支撑底板,该支撑底板设有绝缘层。The single electrode supporting bottom plate of the circular single electrode with hollow structure is provided with an insulating layer.

所述微电极阵列支撑底板上设有通液孔阵列,该通液孔阵列位于中空结构微电极阵列内。The support base plate of the microelectrode array is provided with a liquid hole array, and the liquid hole array is located in the hollow structure microelectrode array.

本实用新型上述结构采用UV-LIGA和电沉积技术相结合的工艺来制备,中空圆柱微电极阵列按M×N排列,每个微电极的侧壁和微电极的支撑底板均进行绝缘处理。The above-mentioned structure of the utility model is prepared by combining UV-LIGA and electrodeposition technology. The hollow cylindrical microelectrode array is arranged in M×N, and the side wall of each microelectrode and the supporting bottom plate of the microelectrode are all insulated.

本实用新型的有益效果是,在进行微细电化学加工时,采用该中空结构的微电极阵列,以径向流的方式补充电解液可以有效的冲刷电极反应产物并补充间隙内电解液中所消耗的反应物,结合微秒级脉冲电源,则可使工件获得较好的成型精度和表面质量。The beneficial effect of the utility model is that, when micro-electrochemical processing is performed, the micro-electrode array of the hollow structure is used to replenish the electrolyte in the form of radial flow, which can effectively flush the electrode reaction products and replenish the electrolyte consumed in the gap. The reactant, combined with the microsecond pulse power supply, can make the workpiece obtain better forming accuracy and surface quality.

附图说明 Description of drawings

图1:中空结构单个微电极电解液径向喷流示意图;Figure 1: Schematic diagram of the radial jet flow of the electrolyte in a single microelectrode with a hollow structure;

图1中:1-单电极支撑底板;2-侧壁绝缘层;3-中空结构圆形单电极;4-单电极端面约束孔;5-工件;6-电解液。In Fig. 1: 1-single electrode supporting bottom plate; 2-side wall insulation layer; 3-circular single electrode with hollow structure; 4-constraining hole on the end face of single electrode; 5-workpiece; 6-electrolyte.

图2:中空结构微电极阵列示意图;Figure 2: Schematic diagram of hollow structure microelectrode array;

图2中:7-微电极阵列支撑底板;8-底板上通液孔阵列;9-中空结构微电极阵列;4-微电极端面约束孔。In Fig. 2: 7-microelectrode array support base plate; 8-liquid hole array on the base plate; 9-microelectrode array with hollow structure; 4-micro-electrode end surface constraining holes.

具体实施方式 Detailed ways

下面将结合附图和实施例对本实用新型进一步说明。以下实施例以本实用新型技术方案为前提进行实施,给出了详细的实施方式和过程,但本实用新型的保护范围不限于下述的实施例。The utility model will be further described below in conjunction with the accompanying drawings and embodiments. The following examples are implemented on the premise of the technical solution of the utility model, and detailed implementation methods and processes are provided, but the protection scope of the utility model is not limited to the following examples.

如图1所示,中空结构单个微电极电解液径向喷流示意图,图中:1-单电极支撑底板;2-侧壁绝缘层;3-中空结构圆形单电极;4-单电极端面约束孔;5-工件;6-电解液。中空结构圆形单电极3由实心圆柱微电极内开孔形成,中空结构圆形单电极3的端面设有一个口径小于所开内孔直径的单电极端面约束孔4,以减小开孔对微电极形状的影响。中空结构圆形单电极3的侧壁和支撑底板均1设有绝缘层2。在进行微细电化学加工时,电解液6以径向流的方式通过中空结构圆形单电极3,再经过约束孔4后,流经工件5和中空结构圆形单电极3的间隙。As shown in Figure 1, the schematic diagram of the radial jet flow of the electrolyte in a single microelectrode with a hollow structure, in the figure: 1-single electrode support base plate; 2-side wall insulation layer; 3-circular single electrode with hollow structure; 4-single electrode end face Constraint hole; 5-workpiece; 6-electrolyte. The hollow structure circular single electrode 3 is formed by the inner opening of the solid cylindrical microelectrode, and the end face of the hollow structure circular single electrode 3 is provided with a single electrode end surface constraining hole 4 with a diameter smaller than the diameter of the opened inner hole, so as to reduce the impact of the opening. Effect of Microelectrode Shape. Both the side wall and the supporting bottom plate 1 of the hollow circular single electrode 3 are provided with an insulating layer 2 . When performing micro-electrochemical machining, the electrolyte 6 flows through the hollow circular single electrode 3 in a radial flow, and then flows through the gap between the workpiece 5 and the hollow circular single electrode 3 after passing through the constraining hole 4 .

如图2所示,图中:7-微电极阵列支撑底板;8-底板上通液孔阵列;9-中空结构微电极阵列;10-微电极端面约束孔。中空圆柱微电极阵列9由中空结构圆形单电极3按M×N排列构成,位于微电极阵列支撑底板7上,微电极阵列支撑底板7上设有多个底通液孔阵列8,该通液孔阵列8位于中空圆柱微电极阵列9内。每个中空结构圆形单电极3的侧壁和支撑底板1均设有绝缘层2。As shown in Figure 2, in the figure: 7-microelectrode array support base plate; 8-liquid hole array on the base plate; 9-microelectrode array with hollow structure; 10-microelectrode end surface constraining holes. The hollow cylindrical microelectrode array 9 is composed of hollow circular single electrodes 3 arranged in M×N, and is located on the microelectrode array support base plate 7, and the micro electrode array support base plate 7 is provided with a plurality of bottom liquid hole arrays 8, the through The liquid hole array 8 is located in the hollow cylindrical microelectrode array 9 . An insulating layer 2 is provided on the side wall and the supporting bottom plate 1 of each hollow circular single electrode 3 .

本实施例采用UV-LIGA和电沉积技术相结合的工艺来制备,由36根直径为300um的镍圆柱微电极按6×6阵列排列,每根中空结构圆形单电极3相距900um,以甩胶的方法进行侧壁绝缘处理,待绝缘膜成形后,以端面溶解法去除端面的绝缘膜,使端面导电。This embodiment is prepared by combining UV-LIGA and electrodeposition technology. 36 nickel cylindrical microelectrodes with a diameter of 300um are arranged in a 6×6 array, and each circular single electrode 3 with a hollow structure is 900um apart. The method of glue is used for side wall insulation treatment. After the insulating film is formed, the insulating film on the end face is removed by the end face dissolution method to make the end face conductive.

在进行微细电化学加工时,将电解液以径向流的方式通过此中空结构微电极阵列向间隙内补充,再配合以脉冲电源,则在加工脉间内,间隙内的所消耗的反应物会得到更充分的补充,电极反应的不溶性产物也可以得到更为有效的冲刷,从而可使微细电解加工在一个稳定环境内进行。在加工进行一段时间后,在工件上可得到精度较高,表面质量较好的圆孔。When performing micro-electrochemical machining, the electrolyte is replenished into the gap through the hollow microelectrode array in the form of radial flow, and then combined with a pulse power supply, the consumed reactants in the gap between the processing veins It will be more fully supplemented, and the insoluble products of the electrode reaction can also be washed more effectively, so that the micro electrolytic processing can be carried out in a stable environment. After processing for a period of time, round holes with higher precision and better surface quality can be obtained on the workpiece.

Claims (6)

1.一种中空结构微电极阵列,其特征在于包括微电极阵列支撑底板以及位于该底板上的多个中空结构圆形单电极,所述中空结构圆形单电极由实心圆柱微电极内开孔形成,该中空结构圆形单电极的端面设有一个口径小于所开内孔直径的单电极端面约束孔。 1. A hollow structure microelectrode array is characterized in that comprising a microelectrode array support base plate and a plurality of hollow structure circular single electrodes positioned on the base plate, and the hollow structure circular single electrode is perforated by a solid cylindrical microelectrode Formed, the end face of the hollow circular single electrode is provided with a single electrode end face constraining hole whose diameter is smaller than the diameter of the opened inner hole. 2.根据权利要求1所述的中空结构微电极阵列,其特征在于:所述中空结构圆形单电极的侧壁设有绝缘层。 2 . The hollow structure microelectrode array according to claim 1 , wherein an insulating layer is provided on the side wall of the hollow structure circular single electrode. 3 . 3.根据权利要求1或2所述的中空结构微电极阵列,其特征在于:所述中空结构圆形单电极的单电极支撑底板设有绝缘层。 3. The hollow structure microelectrode array according to claim 1 or 2, characterized in that: the single electrode support base plate of the hollow structure circular single electrode is provided with an insulating layer. 4.根据权利要求1所述的中空结构微电极阵列,其特征在于:所述微电极阵列支撑底板上设有通液孔阵列。 4 . The microelectrode array with hollow structure according to claim 1 , wherein an array of liquid holes is arranged on the support base plate of the microelectrode array. 5.根据权利要求1或4所述的中空结构微电极阵列,其特征在于:所述微电极阵列支撑底板上的通液孔阵列位于中空结构微电极阵列内。 5 . The hollow structure microelectrode array according to claim 1 or 4 , characterized in that: the liquid hole array on the support base plate of the microelectrode array is located in the hollow structure microelectrode array. 6 . 6.根据权利要求1所述的中空结构微电极阵列,其特征在于:所述多个中空圆柱微电极阵列按M×N排列构成位于微电极阵列支撑底板上的中空结构微电极阵列。 6 . The hollow microelectrode array according to claim 1 , wherein the plurality of hollow cylindrical microelectrode arrays are arranged in M×N to form a hollow microelectrode array located on the support base of the microelectrode array. 7 .
CN2011203435026U 2011-09-14 2011-09-14 Microelectrode array with hollow structure Expired - Fee Related CN202224784U (en)

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CN106644898A (en) * 2016-12-05 2017-05-10 遵义师范学院 Microelectrode array device
CN106914666A (en) * 2017-05-10 2017-07-04 常州工学院 The preparation method and array inclined hole negative electrode of a kind of Electrolyzed Processing array inclined hole negative electrode
CN107081491A (en) * 2017-05-16 2017-08-22 深圳大学 New thin slice queue microelectrode
CN107081491B (en) * 2017-05-16 2020-06-02 深圳大学 Novel sheet array microelectrode
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