CN202123322U - Laser rotary-cut drilling device - Google Patents
Laser rotary-cut drilling device Download PDFInfo
- Publication number
- CN202123322U CN202123322U CN 201120158392 CN201120158392U CN202123322U CN 202123322 U CN202123322 U CN 202123322U CN 201120158392 CN201120158392 CN 201120158392 CN 201120158392 U CN201120158392 U CN 201120158392U CN 202123322 U CN202123322 U CN 202123322U
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- China
- Prior art keywords
- wedge prism
- laser
- wedge
- prism
- rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005553 drilling Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 4
- 230000001788 irregular Effects 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035772 mutation Effects 0.000 description 2
- 230000009183 running Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201120158392 CN202123322U (en) | 2011-05-18 | 2011-05-18 | Laser rotary-cut drilling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201120158392 CN202123322U (en) | 2011-05-18 | 2011-05-18 | Laser rotary-cut drilling device |
Publications (1)
Publication Number | Publication Date |
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CN202123322U true CN202123322U (en) | 2012-01-25 |
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ID=45486393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201120158392 Expired - Lifetime CN202123322U (en) | 2011-05-18 | 2011-05-18 | Laser rotary-cut drilling device |
Country Status (1)
Country | Link |
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CN (1) | CN202123322U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102218605A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Laser rotary-cut drilling device |
CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
US20160178918A1 (en) * | 2014-12-17 | 2016-06-23 | Zhen Tang | Size-adjustable elliptical laser marker |
CN107262943A (en) * | 2017-08-10 | 2017-10-20 | 温州大学 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
CN113510393A (en) * | 2020-04-10 | 2021-10-19 | 大族激光科技产业集团股份有限公司 | Method for laser drilling ceramic workpiece |
-
2011
- 2011-05-18 CN CN 201120158392 patent/CN202123322U/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102218605A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Laser rotary-cut drilling device |
US20160178918A1 (en) * | 2014-12-17 | 2016-06-23 | Zhen Tang | Size-adjustable elliptical laser marker |
US9507157B2 (en) * | 2014-12-17 | 2016-11-29 | Zhen Tang | Size-adjustable elliptical laser marker |
CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
CN105598593B (en) * | 2016-02-29 | 2018-05-22 | 英诺激光科技股份有限公司 | For the laser-processing system and method for hard brittle material drilling |
CN107262943A (en) * | 2017-08-10 | 2017-10-20 | 温州大学 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
CN113510393A (en) * | 2020-04-10 | 2021-10-19 | 大族激光科技产业集团股份有限公司 | Method for laser drilling ceramic workpiece |
CN113510393B (en) * | 2020-04-10 | 2023-08-18 | 大族激光科技产业集团股份有限公司 | Method for laser drilling of ceramic workpiece |
CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Patentee after: Jiangyin Deli Laser Equipment Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. Patentee before: Jiangyin Deli Laser Equipment Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20120125 |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Yan Hua Document name: Notice of termination of patent right |