CN202079475U

CN202079475U - Loose pulley capable of grinding high-frequency and high-precision wafer with small tolerance

Info

Publication number: CN202079475U
Application number: CN2011201053900U
Authority: CN
Inventors: 朱正义; 夏金鑫; 杜刚; 赵富平
Original assignee: TONGLING SANKE ELECTRONIC CO Ltd
Current assignee: TONGLING SANKE ELECTRONIC CO Ltd
Priority date: 2011-04-12
Filing date: 2011-04-12
Publication date: 2011-12-21
Anticipated expiration: 2021-04-12

Abstract

The utility model relates to a loose pulley capable of grinding a high-frequency and high-precision wafer with small tolerance. A plurality of through holes for placing the wafers are uniformly distributed between the rim of a pulley disk and a central hole and the areas where the through holes are positioned are arranged at the inner sides of the rims of an upper grinding disk and a lower grinding disk; and a plurality of technical round holes are uniformly placed between the through holes and the central hole. As all the wafers are closed in the upper grinding disk and the lower grinding disk, the uniformity of the processed wafers is good and the production efficiency and the yield of the wafers are improved, therefore the loose pulley can meet the requirements of 49S, SMD3225, 2520, 2016 and UM-5 wafers with fundamental frequency of above 35 MHz; and the universality of the loose pulley is enhanced.

Description

Can grind the pleasure boat of high frequency and high accuracy closed tolerance wafer

Technical field

The utility model relates to a kind of abrasive working appts that is used for the processing of quartz wafer thickness, specifically a kind of pleasure boat that grinds high frequency and high accuracy closed tolerance wafer.

Background technology

Quartz crystal is the present crystalline material of consumption maximum in the world, and the electronic devices and components that the physical characteristic of utilizing crystal itself to have produces are such as quartz-crystal resonator, crystal filter and quartz oscillator etc.For complying with the requirement that the crystal product frequency produces resonance, need be to the processing of quartz wafer, comprise that frequency processing is thickness processing and edge contour dimensioned, this processing is carried out in the pleasure boat of lapping device usually, such as publication number is that the Chinese patent of CN201385254Y is exactly a kind of pleasure boat that is used for frequency processing, and the upper and lower dish that grinds will be placed on the upper and lower surface grinding of wafer in the pleasure boat through hole to setting thickness.And the edge contour dimensioned is a plurality of wafers to be bonded together with adhesive form brilliant stone roller and putting into the through hole of pleasure boat, and by the revolution and the rotation of pleasure boat, the upper and lower dish that grinds grinds brilliant stone roller surface and reaches the setting size.

Usually for the stress that constantly produces when grinding can be discharged preferably; cause the pleasure boat distortion to prevent the stress effect; the through hole of placing wafer on the pleasure boat has the subregion usually and exceeds the outside of grinding the plate wheel edge; it exceeds the spacing of the nearly 0.5mm of part; can the stress release of pleasure boat will be created in the process of lapping, to reduce the infringement of stress to pleasure boat.Because conventional medium and low frequency wafer thickness when grinding is thicker, the suffered stress of wafer can not cause the infringement of wafer, and wafer generally can not be easy to just broken or the crack occur.But along with present wafer market to fundamental frequency high-frequency section development, SMD3225,2520, the high accuracy closed tolerance wafer of series such as 2016 and high frequency strip piece and the circular piece more than the fundamental frequency 35MHz are badly in need of by More and more factories.But present pleasure boat is in the production process of these wafers, because the miniaturization of wafer and high-frequency (thin thickness) are very easy to occur problems such as cut easily because the stress effect causes wafer crack or fragment to occur, seriously delay production, reduced production efficiency.

Summary of the invention

The purpose of this utility model is at the deficiencies in the prior art part, and a kind of pleasure boat that grinds high frequency and high accuracy closed tolerance wafer is provided, and can effectively reduce fragment and reduce the probability that cut occurs, and improves the yields of quartz wafer.

For achieving the above object, the utility model has adopted following technical scheme: several the through hole of placement wafer of evenly distributing between the wheel disc margin and center hole, and the through hole region is arranged on the wheel rim inboard of grinding dish; Several fabrication holes evenly are set between through hole and the centre bore.

The utility model compared with prior art, the fabrication hole that is arranged between through hole and the centre bore following advantage arranged: owing to can be eliminated the suffered stress of pleasure boat, thereby, wafer can be all closed in top lap, the stress that quartz wafer is subjected to is even, be difficult for broken, reduced the occurrence probability of the cut that causes because of broken wafers, reduced the possibility that the crack appears in wafer, improved the yields of production efficiency and wafer, can satisfy the above 49S of fundamental frequency 35MHz, SMD3225,2520,2016 and the requirement of UM-5 circular piece, the versatility of pleasure boat improves, and has reduced the proportion of goods damageds and the processing cost of pleasure boat; And can improve the uniformity of whole dish wafer when grinding.

Description of drawings

Fig. 1 is the utility model structural representation.

The specific embodiment

As shown in Figure 1, several the through hole 2 of placement wafer evenly distributes between the wheel disc 1 margin and center hole 4, through hole 2 has two circles in this example, and through hole 2 regions are arranged on i.e. dotted line circular arc 5 inboards among the figure of wheel rim of grinding dish, and promptly the outer side edges 21 of all through holes all is located at dotted line circular arc 5 inboards among the figure; Several fabrication holes 3 evenly are set between through hole 2 and the centre bore 4, and this fabrication hole 3 is a circular hole.Fabrication hole 3 has eight in this example.

Fabrication hole 3 is used to eliminate the suffered stress of pleasure boat, and the wafer in the through hole 2 is all closed when grinding, and the stress that quartz wafer is subjected to is even in top lap, and difficult broken, the wafer uniformity of processing is good, the yields height.Can satisfy the above 49S of fundamental frequency 35MHz, SMD3225,2520,2016 and the requirement of UM-5 circular piece, the versatility of pleasure boat improves.

Claims

1. can grind the pleasure boat of high frequency and high accuracy closed tolerance wafer, several the through hole (2) of placement wafer of evenly distributing between wheel disc (1) the margin and center hole (4), it is characterized in that: through hole (2) region is arranged on wheel rim (5) inboard of grinding dish; Between through hole (2) and the centre bore (4) several fabrication holes (3) are set evenly.