CN202061841U - Quartz crystal cleaning device - Google Patents
Quartz crystal cleaning device Download PDFInfo
- Publication number
- CN202061841U CN202061841U CN2011201582764U CN201120158276U CN202061841U CN 202061841 U CN202061841 U CN 202061841U CN 2011201582764 U CN2011201582764 U CN 2011201582764U CN 201120158276 U CN201120158276 U CN 201120158276U CN 202061841 U CN202061841 U CN 202061841U
- Authority
- CN
- China
- Prior art keywords
- cleaning
- quartz wafer
- cylinder mould
- washing bucket
- quartz crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 81
- 239000010453 quartz Substances 0.000 title claims abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 239000013078 crystal Substances 0.000 title abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005406 washing Methods 0.000 claims description 27
- AEEAZFQPYUMBPY-UHFFFAOYSA-N [I].[W] Chemical group [I].[W] AEEAZFQPYUMBPY-UHFFFAOYSA-N 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims 9
- 238000000034 method Methods 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 9
- 230000002000 scavenging effect Effects 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- Cleaning By Liquid Or Steam (AREA)
Abstract
The utility model discloses a quartz crystal cleaning device, which increases the cleaning efficiency and comprises a cleaning barrel (3). The cleaning barrel (3) is provided with a spillway (8) and is internally provided with a cylinder mould (4) used for placing quartz crystals; an ultrasonic vibrator (9) is arranged at the bottom of the cleaning barrel (3). The quartz crystal cleaning device is characterized in that holes are arranged at the bottom of the cleaning barrel (3) and communicated with a water inlet tube (5) and a water outlet tube (6) controlled by an electromagnetic valve; and the electromagnetic valve and the ultrasonic vibrator (9) are controlled by a PLC (Programmable Logic Controller) control device, thereby realizing the primary cleaning and cleaning the quartz crystal at least twice. The device is simply structured so as to increase the automatic control degree of the device; the residual liquid can be effectively cleaned through dehydrating and whirling procedures after the quartz crystal is cleaned every time; therefore, the cleaning effect is increased; the drying time is only 20 minutes; so the cleaning time is greatly shortened; the production efficiency is greatly improved; and the labor intensity of workers is reduced.
Description
Technical field
The utility model relates to a kind of process equipment of quartz oscillator, and specifically a kind of cleaning device particularly relates to a kind of cleaning device of quartz wafer.
Background technology
In the quartz oscillator manufacturing, the clean level that quartz wafer is cleaned requires very strictness, because the clean level that quartz wafer cleans directly influences the product quality that quartz oscillator is made.The cleaning device of existing quartz wafer generally is to adopt a plurality of ultrasonic cleaners quartz wafer is finished manual ultrasonic wave previous cleaning one by one and to clean 2～9 times, after having cleaned, with in the cylinder mould the quartz wafer taking-up, put into baking oven and dried 2 hours.The automaticity of whole cleaning process is not high, and scavenging period is longer, and the quartz wafer cleanliness factor after usually can causing because of artificial factor cleaning is not high.Simultaneously, because quartz wafer needs to clean in high purity water 2～9 times, after cleaning was finished each time, quartz wafer did not all have the spin-dry process, and the residual liquid that made clean last time has small part to sneak in the next cleaning process, influences the cleaning performance of quartz wafer.
The patent No. is 201020180557.5, the applying date is on 04 30th, 2010, publication number be CN201644439U patent disclosure a kind of quartz crystal post cleaning device, this device comprises primary launder, spray groove, the washing groove, dry groove and a plurality of grooves of drench pit position, during work, wafer carries out previous cleaning by primary launder, after previous cleaning is finished, spray groove is put in the wafer taking-up, it is sprayed, after spray is finished, need again the washing groove is put in the wafer taking-up, whenever finish a procedure, all need the wafer taking-up of a last groove position is moved on in next groove position, increased working strength of workers, when transferring plates, the quartz wafer cleanliness factor after causing cleaning because of artificial factor easily is not high; And this apparatus structure complexity, the cost height, floor space is bigger.
Summary of the invention
The purpose of this utility model provides a kind of cleaning device that improves the quartz wafer of cleaning efficiency.
The utility model is to adopt following technical scheme to realize its goal of the invention, a kind of cleaning device of quartz wafer, it comprises the washing bucket that is provided with gap, be provided with the cylinder mould that is used to place quartz wafer in the washing bucket, washing bucket bottom is equipped with ultrasonic oscillator, and the washing bucket bottom is provided with the hole, and described hole is communicated with water inlet pipe and outlet pipe by solenoid control, described magnetic valve, ultrasonic oscillator are realized the previous cleaning of quartz wafer, the cleaning of secondary at least by the control of PLC control device.
The utility model is provided with the cylinder mould frame that is used to install cylinder mould for quartz wafer is carried out spin-dry in the washing bucket, the cylinder mould frame is installed on the main shaft of centrifuge, and described centrifuge is realized the spin-dry to quartz wafer by the control of PLC control device.
The utility model cylinder mould frame is installed in by support on the main shaft of centrifuge, and the cylinder mould frame is connected with support by bearing pin.
The utility model is for to dry quartz wafer, and washing bucket is provided with bung, and bung is provided with baker, and described baker is realized the oven dry to quartz wafer by the control of PLC control device.
Baker described in the utility model is an iodine-tungsten lamp.
Because adopt technique scheme, the utility model has been realized goal of the invention preferably, it is simple in structure, improved the automatic controlling level of device, by the spin-dry program, residual liquid can effectively be cleared up, simultaneously in each back of cleaning, employing running water cleans, improved cleaning performance, drying time only needs 20 minutes, has significantly reduced scavenging period, improve production efficiency greatly, reduced labor strength.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of the utility model cylinder mould frame 10, support 11.
The specific embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
Embodiment 1:
A kind of cleaning method of quartz wafer, it comprises previous cleaning, cleaning, the oven dry of secondary at least to quartz wafer, make quartz wafer reach the clean level of technological requirement, the previous cleaning of described quartz wafer, the cleaning of secondary is a washing bucket of quartz wafer being put into cleaning device at least, control by the PLC control device, quartz wafer need not to take out, and finishes previous cleaning, the cleaning of secondary at least with cleaning fluid in same washing bucket.
As shown in Figure 1, a kind of cleaning device of realizing above-mentioned quartz wafer cleaning method, it comprises the washing bucket 3 that is provided with gap 8, be provided with the cylinder mould 4 that is used to place quartz wafer in the washing bucket 3, washing bucket 3 bottoms are equipped with ultrasonic oscillator 9, washing bucket 3 bottoms are provided with the hole, described hole is communicated with water inlet pipe 5 and outlet pipe 6 by solenoid control, described magnetic valve, ultrasonic oscillator 9 are realized the previous cleaning of quartz wafer, the cleaning of secondary at least by PLC control device (programmable logic controller (PLC)) control.
During the utility model work, quartz wafer that at first will be to be washed is put into cylinder mould 4, cleaning agent adds in the washing bucket 3, and the magnetic valve of PLC control device control water inlet pipe 5 is opened, and temperature is that 40 ℃～60 ℃ cleaning fluid (present embodiment is 50 ℃ a high purity water) enters in the washing bucket 3; Simultaneously, 9 work of PLC control device control ultrasonic oscillator are carried out previous cleaning to the quartz wafer in the cylinder mould 4, and unnecessary cleaning fluid constantly overflows from gap 8,5 minutes～15 minutes previous cleaning time (present embodiment is 10 minutes); After previous cleaning is finished, the closed electromagnetic valve of PLC control device control water inlet pipe 5, the magnetic valve of outlet pipe 6 is opened, and cleaning fluid is discharged.
Then, quartz wafer is cleaned, during cleaning, the magnetic valve of PLC control device control water inlet pipe 5 is opened, the closed electromagnetic valve of outlet pipe 6, and temperature is that 40 ℃～60 ℃ cleaning fluid (present embodiment is 50 ℃ a high purity water) enters in the washing bucket 3; 9 work of PLC control device control ultrasonic oscillator are cleaned the quartz wafer in the cylinder mould 4, and unnecessary cleaning fluid constantly overflows from gap 8, scavenging period 5 minutes～15 minutes (present embodiment is 10 minutes); After cleaning is finished, the closed electromagnetic valve of PLC control device control water inlet pipe 5, the magnetic valve of outlet pipe 6 is opened, and cleaning fluid is discharged; Then, the PLC control device cuts out the magnetic valve of outlet pipe 6 once more, opens the magnetic valve of water inlet pipe 5, and cleaning fluid enters in the washing bucket 3 quartz wafer in the cylinder mould 4 is cleaned once more, so circulation is cleaned 2 times～9 times (present embodiment is 5 times) to the quartz wafer in the cylinder mould 4.
When quartz wafer was cleaned for the last time, for eliminating the stress of quartz wafer, the temperature of cleaning fluid was 90 ℃～95 ℃ (present embodiment is 95 ℃ a high purity water).
After cleaning is finished, take out cylinder mould 4, put into the drying baker oven dry and get final product.
Embodiment 2:
The utility model is for improving cleaning performance, prevent that last time, the residual liquid of cleaning was sneaked in the next cleaning process, influence the cleaning performance of quartz wafer, during cleaning, all by the control of PLC control device quartz wafer is carried out spin-dry after each the cleaning, the rotating speed of spin-dry is 800 rev/mins～1000 rev/mins.
The utility model is for to carry out spin-dry to quartz wafer, be provided with the cylinder mould frame 10 that is used to install cylinder mould 4 in the washing bucket 3, cylinder mould frame 10 is installed on the main shaft 12 of centrifuge 7, and described centrifuge 7 is realized the spin-dry to quartz wafer by the control of PLC control device.
As shown in Figure 2, the utility model is for preventing cylinder mould 4 distortion, and cylinder mould frame 10 is installed in by support 11 on the main shaft 12 of centrifuge 7, and cylinder mould frame 10 is connected with support 11 by bearing pin 13.
During the utility model work, the previous cleaning step of quartz wafer is with embodiment 1, in cleaning step, after each the cleaning, PLC control device control centrifuge 7 starts, rotating speed is 800 rev/mins～1000 rev/mins (present embodiment is 900 rev/mins), to the quartz wafer spin-dry 2 minutes～4 minutes (present embodiment is 2 minutes) in the cylinder mould 4.
Surplus with embodiment 1.
Embodiment 3:
The utility model reaches the effect of flash baking for simpler, and described oven dry is controlled in the washing bucket by the PLC control device and finishes.
The utility model is for to dry quartz wafer, and washing bucket 3 is provided with bung 1, and bung 1 is provided with baker, and described baker is realized the oven dry to quartz wafer by the control of PLC control device.Described baker is an iodine-tungsten lamp 2.
During the utility model work, the previous cleaning of quartz wafer, cleaning step are with embodiment 1,2, the last time during spin-dry, PLC control device control baker work (present embodiment is an iodine-tungsten lamp 2), when drying, use iodine-tungsten lamp 2 to toast simultaneously, drying time 15 minutes～30 minutes (present embodiment is 20 minutes).
The utility model is simple in structure, improved the automatic controlling level of cleaning device, by the spin-dry program, can effectively clear up residual liquid in each back of cleaning, improve cleaning performance, drying time only needs about 20 minutes, shorten scavenging period greatly, simultaneously, adopted running water to clean, improve production efficiency, reduced labor strength.
Claims (5)
1. the cleaning device of a quartz wafer, it comprises the washing bucket (3) that is provided with gap (8), be provided with the cylinder mould (4) that is used to place quartz wafer in the washing bucket (3), washing bucket (3) bottom is equipped with ultrasonic oscillator (9), it is characterized in that washing bucket (3) bottom is provided with the hole, described hole is communicated with water inlet pipe (5) and outlet pipe (6) by solenoid control, described magnetic valve, ultrasonic oscillator (9) are realized the previous cleaning of quartz wafer, the cleaning of secondary at least by the control of PLC control device.
2. according to the cleaning device of the described quartz wafer of claim 1, it is characterized in that being provided with in the washing bucket (3) the cylinder mould frame (10) that is used to install cylinder mould (4), cylinder mould frame (10) is installed on the main shaft (12) of centrifuge (7), described centrifuge (7) is realized the spin-dry to quartz wafer by the control of PLC control device.
3. according to the cleaning device of the described quartz wafer of claim 2, it is characterized in that described cylinder mould frame (10) is installed in by support (11) on the main shaft (12) of centrifuge (7), cylinder mould frame (10) is connected with support (11) by bearing pin (13).
4. according to the cleaning device of claim 1 or 2 or 3 described quartz wafers, it is characterized in that washing bucket (3) is provided with bung (1), bung (1) is provided with baker, and described baker is realized the oven dry to quartz wafer by the control of PLC control device.
5. according to the cleaning device of the described quartz wafer of claim 4, it is characterized in that described baker is iodine-tungsten lamp (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201582764U CN202061841U (en) | 2011-05-18 | 2011-05-18 | Quartz crystal cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201582764U CN202061841U (en) | 2011-05-18 | 2011-05-18 | Quartz crystal cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202061841U true CN202061841U (en) | 2011-12-07 |
Family
ID=45055721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201582764U Expired - Fee Related CN202061841U (en) | 2011-05-18 | 2011-05-18 | Quartz crystal cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202061841U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825052A (en) * | 2012-09-07 | 2012-12-19 | 铜陵日科电子有限责任公司 | Water filtering net box for cleaning and dewatering quartz crystals |
| CN110312375A (en) * | 2019-05-17 | 2019-10-08 | 惠州市特创电子科技有限公司 | A kind of the copper billet cleaning equipment and cleaning method of the extra small plate of 5G and embedding copper sheet |
-
2011
- 2011-05-18 CN CN2011201582764U patent/CN202061841U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825052A (en) * | 2012-09-07 | 2012-12-19 | 铜陵日科电子有限责任公司 | Water filtering net box for cleaning and dewatering quartz crystals |
| CN110312375A (en) * | 2019-05-17 | 2019-10-08 | 惠州市特创电子科技有限公司 | A kind of the copper billet cleaning equipment and cleaning method of the extra small plate of 5G and embedding copper sheet |
| CN110312375B (en) * | 2019-05-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Cleaning equipment and cleaning method for 5G ultra-small plate and copper embedded plate copper block |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20170518 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |