CN202029479U - Heat insulation pressure-resistant board structure - Google Patents
Heat insulation pressure-resistant board structure Download PDFInfo
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- CN202029479U CN202029479U CN2011200411528U CN201120041152U CN202029479U CN 202029479 U CN202029479 U CN 202029479U CN 2011200411528 U CN2011200411528 U CN 2011200411528U CN 201120041152 U CN201120041152 U CN 201120041152U CN 202029479 U CN202029479 U CN 202029479U
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Abstract
The utility model discloses a heat insulation pressure-resistant board structure, which comprises a board body unit. The board body unit is composed of a base material layer and a binding layer, wherein the binding layer is a thermosetting high polymer material layer, is attached to the surface of the base material layer, and partially permeates into the base material layer. A plurality of board body units are stacked, and adjacent board body units are combined through the binding layers. The heat insulation pressure-resistant board structure has the advantages that the binding layer comprises a colloid layer, powders, a hardening agent and a coupling agent, and the coupling agent can link the colloid layer and the powders, so that the colloid layer and the powders can be well combined, and further mechanical strength is improved. The heat insulation pressure-resistant board is formed by combining the plurality of board body units, the binding layers between adjacent board body units have heat insulation effect, and therefore the heat insulation pressure-resistant board has good heat insulation effect. The hardening agent is contained in the binding layer, enables polymer moleculars to be crosslinked with each other, and enables the binding layer to have good pressure-resistance and mechanical strength after the binding layer is solidified.
Description
Technical field
The utility model relates to a kind of technical field of plate construction, particularly repeatedly puts with a plurality of plate bodys unit and coheres the heat insulation resistance to compression plate structure that becomes big thickness, and the heating location that can be applicable to vulcanizer provides heat insulation and the resistance to compression effect.
Background technology
General vulcanizing machine need dispose firing equipment in order to mould is heated.Because firing equipment can produce high temperature, so need the collocation thermal insulation board to conduct to other position on the vulcanizing machine to prevent heat.This end baffle plate can move and the compacting of bearing another mould along with firing equipment or mould, so thermal insulation board need possess suitable structural strength resistance to compression, otherwise breaks easily.
The tradition thermal insulation board can utilize powder to make the plate body with emptying aperture; After the plural number plate body binded mutually, the surface was coated with heat insulating coat again.Because plate body has emptying aperture, thus good effect of heat insulation possessed, but the structural strength deficiency.As notification number is that the utility model patent of CN2371426Y discloses a kind of thermal insulation board, this thermal insulation board is a kind of soft heat-barrier material that is made of insulation material and glass fabric, the middle part of this material is soft litaflex goods or the complex silicate salt product that has micropore, in the fire-retardant white glues adhering glass of insulation material external application fiber cloth, this material has forming, easy to process, characteristics such as heat-proof quality is good.
Another kind of thermal insulation board is to be that material is integrally formed with the fiberglass-reinforced plastic.Because material behavior make thermal insulation board possess good structural strength, but effect of heat insulation is relatively poor.As notification number is the disclosed a kind of thermal insulation board of utility model patent of CN2737862Y, form by foamed plastics, glass fibre, cement, sand, pitch, foamed plastics is at bottom, one deck cement layer is arranged on the foamed plastics, one deck bitumen layer is arranged on the cement layer, the layer of glass layer is arranged above the bitumen layer, one deck cement layer is arranged on the glass layer.
Summary of the invention
Technical problem to be solved in the utility model is the present situation at prior art, and a kind of heat insulation resistance to compression plate structure that has excellent heat insulation property and compressive property simultaneously is provided.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: heat insulation resistance to compression plate structure, comprise the plate body unit, the plate body unit is made up of substrate layer and gluing layer, and gluing layer is the thermoset macromolecule material layer, and gluing layer is covering on the substrate layer surface and partly infiltrating in the substrate layer; At least the two boards body unit is repeatedly put, and interosculates with gluing layer between the neighboring board body unit.
For optimizing technique scheme, the measure of taking also comprises:
Above-mentioned substrate layer is cloth material layer, glass layer of cloth or short fiber layers, and gluing layer is a colloid layer.
Above-mentioned colloid layer is the thermoset macromolecule material layer, and the thermoset macromolecule material composition of layer is epoxy resin, phenolic resins, unsaturated polyester (UP), polyimides or silicon rubber.
Above-mentioned gluing layer contains curing agent, and curing agent is acid anhydrides, amine type hardeners or aromatics curing agent.Curing agent can be described as curing agent, curing agent again, be material or the mixture that curing reaction is promoted or controlled to a class, can make between high-polymer molecular produce crosslinked, thereby make gluing layer after curing, have good pressure resistance energy and mechanical strength, and can make gluing layer have certain hear resistance, improve the heat-proof quality of heat insulation resistance to compression plate.
Heat insulation resistance to compression plate is interosculated by the plate body unit of multilayer and forms, and the gluing layer between the neighboring board body unit more possesses effect of heat insulation because of its material behavior except adhesive effect is provided; The multilayer gluing layer stacks mutually, makes heat insulation resistance to compression plate can possess good effect of heat insulation.
Above-mentioned gluing layer contains powder, and powder is one or more in silica, aluminium oxide, titanium oxide, iron oxide, chromium oxide, zirconia, manganese oxide, magnesia, calcium oxide, barium monoxide, carborundum, magnesium carbonate, calcium carbonate, zirconium silicate, calcium silicates, barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite, mica, perlite, talcum, wollastonite or the glass.
Above-mentioned gluing layer contains coupling agent.Because colloid layer is an organic material, and powder is an inorganic material, coupling agent can produce with powder colloid layer and link, thereby makes colloid layer and powder can have the mechanical strength that the good binding effect improves heat insulation resistance to compression plate.
Heat insulation resistance to compression plate structure, comprise plate body unit and material of main part layer, the material of main part layer constitutes one by colloid layer, powder, fibrous material mixing, the plate body unit is attached to relative two sides of material of main part layer respectively, each plate body unit comprises a substrate layer and a thermal insulation layer, thermal insulation layer is made up of at least a macromolecular material, and is covering on substrate layer surface and partly and infiltrate in the substrate layer.
Powder in the above-mentioned material of main part layer is one or more in silica, aluminium oxide, titanium oxide, iron oxide, chromium oxide, zirconia, manganese oxide, magnesia, calcium oxide, barium monoxide, carborundum, magnesium carbonate, calcium carbonate, zirconium silicate, calcium silicates, barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite, mica, perlite, talcum, wollastonite or the glass, and gross weight is 0.1～30wt% of colloid layer weight.
Fibrous material in the above-mentioned material of main part layer is one or more in glass fibre, quartz fibre, tripoli fiber, silicate fiber, carbon fiber, ceramic fibre, mineral wool, asbestos, mineral wool or the basalt cotton, and gross weight is 0.1～30wt% of colloid layer weight.
Colloid layer in the above-mentioned material of main part layer is the thermoset macromolecule material layer, and the thermoset macromolecule material composition of layer is one or more in epoxy resin, phenolic resins, unsaturated polyester (UP), polyimides or the silicon rubber.
The substrate layer of above-mentioned plate body unit is cloth material layer, glass layer of cloth or short fiber layers.
The thermal insulation layer of above-mentioned plate body unit is a colloid layer, and colloid layer is the thermoset macromolecule material layer, and the thermoset macromolecule material composition of layer is epoxy resin, phenolic resins, unsaturated polyester (UP), polyimides or silicon rubber.Thermal insulation layer possesses effect of heat insulation because of its material behavior, and plate body unit and material of main part layer are cohered mutually, makes heat insulation resistance to compression plate can possess good effect of heat insulation and compression strength.
Above-mentioned thermal insulation layer contains curing agent, and thermal insulation layer contains epoxy resin, and curing agent is acid anhydrides, amine type hardeners or aromatics curing agent.
Above-mentioned thermal insulation layer contains powder, and powder is one or more in silica, aluminium oxide, titanium oxide, iron oxide, chromium oxide, zirconia, manganese oxide, magnesia, calcium oxide, barium monoxide, carborundum, magnesium carbonate, calcium carbonate, zirconium silicate, calcium silicates, barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite, mica, perlite, talcum, wollastonite or the glass.
Compared with prior art, the utility model comprises the plate body unit, and the plate body unit is made up of substrate layer and gluing layer, and gluing layer is the thermoset macromolecule material layer, and gluing layer is covering on the substrate layer surface and partly infiltrating in the substrate layer; At least the two boards body unit is repeatedly put, and interosculates with gluing layer between the neighboring board body unit.Advantage of the present utility model is that gluing layer comprises colloid layer, powder, curing agent and coupling agent, colloid layer is an organic material, powder is an inorganic material, coupling agent can produce with powder colloid layer and link, thereby makes colloid layer and powder can have the mechanical strength that the good binding effect improves heat insulation resistance to compression plate; Heat insulation resistance to compression plate is interosculated by the plate body unit of multilayer and forms, and the gluing layer between the neighboring board body unit more because of its material behavior possesses effect of heat insulation, thereby makes heat insulation resistance to compression plate possess good effect of heat insulation except adhesive effect is provided; Gluing layer contains curing agent, curing agent can make between high-polymer molecular produce crosslinked, thereby make gluing layer after curing, have good pressure resistance energy and mechanical strength, and can make gluing layer have certain hear resistance, improve the heat-proof quality of heat insulation resistance to compression plate; The constituent material of each plate body unit comprises substrate layer, heat insulation resistance to compression plate possesses the stacking version of putting of multi-layer substrate, thermal insulation board resistance to compression plate after the curing can possess good structural strength by the substrate layer of respectively repeatedly putting, thereby makes heat insulation resistance to compression plate have the good pressure resistance energy.
Description of drawings
Fig. 1 is the structural representation of the utility model first embodiment;
Fig. 2 is the formation schematic diagram of gluing layer among Fig. 1;
Fig. 3 is the schematic diagram that heat insulation resistance to compression plate is formed in plural plate body unit among the utility model first embodiment;
Fig. 4 is the structural representation of the utility model second embodiment.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
As shown in Figures 1 to 4, figure grade is described as follows: plate body unit 1, substrate layer 11, gluing layer 12, material of main part layer 2, colloid layer 21, powder 22, curing agent 23, coupling agent 24, fibrous material 25.
Embodiment one:
Heat insulation resistance to compression plate structure of the present utility model comprises plate body unit 1, and plate body unit 1 is made up of substrate layer 11 and gluing layer 12, and gluing layer 12 is the thermoset macromolecule material layer, and gluing layer 12 is covering on substrate layer 11 surfaces and partly infiltrating in the substrate layer 11; At least two boards body unit 1 is repeatedly put, and 1 of neighboring board body unit interosculates with gluing layer 12.
Substrate layer 11 is cloth material layer, glass layer of cloth or short fiber layers.
Get plural plate body unit 1 and repeatedly put, and the suitable pressure of arranging in pairs or groups, temperature make the gluing layer 12 of neighboring board body unit 1 to bind mutually; After solidifying, each plate body unit 1 of combination can form heat insulation resistance to compression plate.
Further, heat insulation resistance to compression plate is interosculated by the plate body unit 1 of multilayer and forms, and the gluing layer 12 that the neighboring board body unit is 1 more because of its material characteristic possesses effect of heat insulation, thereby makes heat insulation resistance to compression plate possess good effect of heat insulation except adhesive effect is provided.
The constituent material of each plate body unit 1 comprises substrate layer 11 in addition, so when heat insulation resistance to compression plate possessed the version that multi-layer substrate layer 11 repeatedly puts, the thermal insulation board resistance to compression plate after the curing can possess good structural strength by the substrate layer of respectively repeatedly putting 11.
Embodiment two:
Second embodiment of the present utility model comprises plate body unit 1 and material of main part layer 2, material of main part layer 2 constitutes one by colloid layer 21, powder 22, fibrous material 25 mixing, plate body unit 1 is attached to relative two sides of material of main part layer 2 respectively, each plate body unit 1 comprises a substrate layer 11 and a thermal insulation layer, thermal insulation layer is made up of at least a macromolecular material, and is covering on substrate layer 11 surface and partly infiltrate in the substrate layer 11.
Material of main part layer 2 is constituted one, and is mixed an amount of curing agent 23 by powder 22, fibrous material 25, colloid layer 21 mixing.
The substrate layer 11 of plate body unit 1 is cloth material layer, glass layer of cloth or short fiber layers.
The thermal insulation layer of plate body unit 1 is a colloid layer 21, and colloid layer 21 compositions are the thermoset macromolecule material layer, and the thermoset macromolecule material layer is epoxy resin, phenolic resins, unsaturated polyester (UP), polyimides or silicon rubber.
Thermal insulation layer contains curing agent 23, and thermal insulation layer contains epoxy resin, and curing agent 23 is acid anhydrides, amine type hardeners or aromatics curing agent.Curing agent 23 can make between high-polymer molecular produce crosslinked, thereby make thermal insulation layer after curing, have good pressure resistance energy and mechanical strength, and improve its hear resistance, strengthen the heat-proof quality of heat insulation resistance to compression plate.Thermal insulation layer possesses effect of heat insulation because of its material behavior, and two sides up and down of heat insulation resistance to compression plate all are shaped on a plate body unit 1, so heat insulation resistance to compression plate possesses good effect of heat insulation.
Thermal insulation layer contains powder 22, and powder 22 is one or more in silica, aluminium oxide, titanium oxide, iron oxide, chromium oxide, zirconia, manganese oxide, magnesia, calcium oxide, barium monoxide, carborundum, magnesium carbonate, calcium carbonate, zirconium silicate, calcium silicates, barium titanate, calcium hydroxide, iron hydroxide, carbon nanotube, ilmenite, clay, vermiculite, mica, perlite, talcum, wollastonite or the glass.
One of mode that plate body unit 1 is attached to material of main part layer 2 relative two side is to make plate body unit 1 and material of main part layer 2 respectively, and then binds mutually; Also can get a plate body unit 1 in addition earlier places in the mould, in this mould, form material of main part layer 2 then, make plate body unit 1 combining main body material layer 2, attach another plate body unit 1 again on material of main part layer 2 surface at last, material of main part layer 2 and plate body unit 1 are fully cohered, thereby allow heat insulation resistance to compression plate have sufficient compression strength.
Compared with prior art, the utility model comprises plate body unit 1, and plate body unit 1 is made up of substrate layer 11 and gluing layer 12, and gluing layer 12 is the thermoset macromolecule material layer, and gluing layer 12 is covering on substrate layer 11 surfaces and partly infiltrating in the substrate layer 11; A plurality of plate bodys unit 1 is repeatedly put, and 1 of neighboring board body unit interosculates with gluing layer 12.Advantage of the present utility model is that gluing layer 12 comprises colloid layer 21, powder 22, curing agent 23 and coupling agent 24, colloid layer 21 is organic materials, powder 22 is inorganic material, coupling agent 24 can produce with powder 22 colloid layer 21 and link, thereby makes colloid layer 21 and powder 22 can have the mechanical strength that the good binding effect improves heat insulation resistance to compression plate; Heat insulation resistance to compression plate is interosculated by the plate body unit 1 of multilayer and forms, and the gluing layer 12 of 1 of neighboring board body unit more because of its material behavior possesses effect of heat insulation, thereby makes heat insulation resistance to compression plate possess excellent heat insulation property except adhesive effect is provided; Gluing layer 12 contains curing agent 23, curing agent 23 can make between high-polymer molecular produce crosslinked, thereby make gluing layer 12 after curing, have good pressure resistance energy and mechanical strength, and can make gluing layer 12 have certain hear resistance, improve the heat-proof quality of heat insulation resistance to compression plate; The constituent material of each plate body unit 1 comprises substrate layer 11, and heat insulation resistance to compression plate possesses the version that multi-layer substrate layer 11 is repeatedly put, and the thermal insulation board resistance to compression plate after the curing can possess good structural strength by the substrate layer of respectively repeatedly putting 11.
Most preferred embodiment of the present utility model is illustrated, and various variations or the remodeling made by those of ordinary skills can not break away from scope of the present utility model.
Claims (4)
1. heat insulation resistance to compression plate structure, comprise plate body unit (1), it is characterized in that: described plate body unit (1) is made up of substrate layer (11) and gluing layer (12), described gluing layer (12) is the thermoset macromolecule material layer, and gluing layer (12) is covering on described substrate layer (11) surface and partly infiltrating in the substrate layer (11); At least two boards body unit (1) is repeatedly put, and interosculates with gluing layer (12) between neighboring board body unit (1).
2. heat insulation resistance to compression plate structure according to claim 1, it is characterized in that: described substrate layer (11) is cloth material layer, glass layer of cloth or short fiber layers, described gluing layer (12) is colloid layer (21), and described colloid layer (21) is the thermoset macromolecule material layer.
3. heat insulation resistance to compression plate structure, comprise plate body unit (1) and material of main part layer (2), it is characterized in that: described plate body unit (1) is attached to relative two sides of described material of main part layer (2) respectively, each plate body unit (1) comprises a substrate layer (11) and a thermal insulation layer, and described thermal insulation layer is covering on described substrate layer (11) surface and partly infiltrating in this substrate layer (11).
4. heat insulation resistance to compression plate structure according to claim 3, it is characterized in that: the substrate layer (11) of described plate body unit (1) is cloth material layer, glass layer of cloth or short fiber layers, the thermal insulation layer of described plate body unit (1) is colloid layer (21), and described colloid layer (21) is the thermoset macromolecule material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200411528U CN202029479U (en) | 2011-02-17 | 2011-02-17 | Heat insulation pressure-resistant board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200411528U CN202029479U (en) | 2011-02-17 | 2011-02-17 | Heat insulation pressure-resistant board structure |
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| CN202029479U true CN202029479U (en) | 2011-11-09 |
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| CN2011200411528U Expired - Fee Related CN202029479U (en) | 2011-02-17 | 2011-02-17 | Heat insulation pressure-resistant board structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173164A (en) * | 2011-02-17 | 2011-09-07 | 东毓(宁波)油压工业有限公司 | Heat insulation pressure-resistant plate structure |
| CN102495568A (en) * | 2011-12-05 | 2012-06-13 | 南京大学 | Development board of network multi-core processor on test board based on four field programmable gate arrays (FPGA) |
| CN104441789A (en) * | 2014-11-17 | 2015-03-25 | 常熟市中海塑胶制品有限公司 | Edge banding strip for waterproof board |
-
2011
- 2011-02-17 CN CN2011200411528U patent/CN202029479U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173164A (en) * | 2011-02-17 | 2011-09-07 | 东毓(宁波)油压工业有限公司 | Heat insulation pressure-resistant plate structure |
| CN102495568A (en) * | 2011-12-05 | 2012-06-13 | 南京大学 | Development board of network multi-core processor on test board based on four field programmable gate arrays (FPGA) |
| CN102495568B (en) * | 2011-12-05 | 2013-08-07 | 南京大学 | Development board of network multi-core processor on test board based on four field programmable gate arrays (FPGA) |
| CN104441789A (en) * | 2014-11-17 | 2015-03-25 | 常熟市中海塑胶制品有限公司 | Edge banding strip for waterproof board |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111109 Termination date: 20200217 |
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| CF01 | Termination of patent right due to non-payment of annual fee |