CN201985230U - Miniature microwave cavity - Google Patents
Miniature microwave cavity Download PDFInfo
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- CN201985230U CN201985230U CN2011200326991U CN201120032699U CN201985230U CN 201985230 U CN201985230 U CN 201985230U CN 2011200326991 U CN2011200326991 U CN 2011200326991U CN 201120032699 U CN201120032699 U CN 201120032699U CN 201985230 U CN201985230 U CN 201985230U
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Abstract
Description
技术领域technical field
本实用新型涉及一种微波无源器件,主要用于现代通信系统中,满足了现代通信系统的电路小型化要求。The utility model relates to a microwave passive device, which is mainly used in modern communication systems and meets the circuit miniaturization requirements of the modern communication systems.
背景技术Background technique
微波谐振腔是微波系统中常用的元件。20世纪80年代,环形谐振器制作的滤波器、振荡器、混频器和耦合器等微波电路也开始出现。最近,蜂窝通信和其他移动通信系统也开始使用由微带环谐振器组成的紧凑型滤波器。环形电路应用在共面波导和槽线结构的时候也表现出优异的性能。此类固态器件经过整合后也能够实现开关、放大和光电功能。Microwave resonators are commonly used components in microwave systems. In the 1980s, microwave circuits such as filters, oscillators, mixers, and couplers made of ring resonators also began to appear. More recently, cellular and other mobile communication systems have also started using compact filters consisting of microstrip ring resonators. Ring circuits also exhibit excellent performance when applied to coplanar waveguide and slotline structures. Such solid-state devices can also be integrated to perform switching, amplification, and optoelectronic functions.
谐振腔作为普通的微波器件广泛应用于微波电路中,但是随着现代通信系统的发展,普通微波谐振腔已经不能完全满足电路小型化的紧迫要求。Resonant cavities are widely used in microwave circuits as common microwave devices, but with the development of modern communication systems, common microwave resonant cavities can no longer fully meet the urgent requirements of circuit miniaturization.
发明内容Contents of the invention
本实用新型的目的在于提供一种新型的微波谐振腔,能够很好的满足现代通信系统电路小型化的工作要求。The purpose of the utility model is to provide a new type of microwave resonant cavity, which can well meet the working requirements of circuit miniaturization in modern communication systems.
实现本实用新型目的的技术解决方案为:一种小型化微波谐振腔,包括正方形金属导带、隔离层、介质层、金属焊盘、金属通孔和接地板;整个微波谐振腔关于中轴对称,接地板上方为介质层;介质层上方为隔离层;正方形金属导带印制在隔离层上面;金属导带正下方的介质层中,均匀地嵌入接地金属通孔,每个金属通孔上方连接金属焊盘。The technical solution to realize the purpose of this utility model is: a miniaturized microwave resonant cavity, including a square metal conduction strip, an isolation layer, a dielectric layer, a metal pad, a metal through hole and a grounding plate; the entire microwave resonant cavity is symmetrical about the central axis , above the ground plate is the dielectric layer; above the dielectric layer is the isolation layer; the square metal conduction strip is printed on the isolation layer; in the dielectric layer directly below the metal conduction strip, the ground metal vias are evenly embedded, and each metal via is above Connect to the metal pad.
本实用新型与现有技术相比,其显著优点:金属贴片与通孔的结构相当于提高了接地板的位置,增大了谐振器的分布电容,提高了有效介电常数,减小了电路尺寸,当谐振频率f 0=2.01GHz时,本实用新型谐振腔的电路面积比普通微带谐振腔电路面积减少43%左右;同时本实用新型谐振腔的有载品质因数只比普通微带谐振腔降低了4.6%;该新型谐振腔的工程实现也较为简单,能够实现电路的小型化。Compared with the prior art, the utility model has significant advantages: the structure of the metal patch and the through hole is equivalent to improving the position of the grounding plate, increasing the distributed capacitance of the resonator, increasing the effective dielectric constant, and reducing the Circuit size, when the resonant frequency f 0 =2.01GHz, the circuit area of the resonant cavity of the utility model is reduced by about 43% compared with the circuit area of the common microstrip resonant cavity; at the same time, the load quality factor of the resonant cavity of the utility model is only smaller than that of the common microstrip The resonant cavity is reduced by 4.6%; the engineering realization of the new resonant cavity is also relatively simple, which can realize the miniaturization of the circuit.
附图说明Description of drawings
图1所示的是根据本实用新型提出的俯视图。What Fig. 1 shows is according to the plan view that the utility model proposes.
图2所示的是根据本实用新型提出的主视图。What Fig. 2 shows is the front view proposed according to the utility model.
图3所示的是本实用新型的仿真结果图。What Fig. 3 shows is the simulation result figure of the utility model.
具体实施方式Detailed ways
下面结合附图对本实用新型作进一步详细描述。Below in conjunction with accompanying drawing, the utility model is described in further detail.
本实用新型结构由下到上分别是接地板、人工介质层、隔离层和金属微带线,其结构图如图1和图2所示。该机构为左右上下对称的正方形结构;人工介质层中嵌入相同大小的金属通孔,每个金属通孔上方连接等大的圆形金属焊盘;这些金属通孔和焊盘均匀分布于微带电路的正下方;微带电路为均匀正方形微带线圈。由于本新型谐振腔采用基片集成人工介质,提高了介质的有效介电常数,从而实现了电路的小型化。The structure of the utility model is respectively ground plate, artificial dielectric layer, isolation layer and metal microstrip line from bottom to top, and its structure diagram is shown in Fig. 1 and Fig. 2 . The mechanism is a square structure with left, right, up and down symmetry; metal vias of the same size are embedded in the artificial dielectric layer, and circular metal pads of equal size are connected above each metal via; these metal vias and pads are evenly distributed in the microstrip Directly below the circuit; the microstrip circuit is a uniform square microstrip coil. Since the novel resonant cavity adopts the substrate integrated artificial medium, the effective dielectric constant of the medium is improved, thereby realizing the miniaturization of the circuit.
实施例:结合图1和图2以谐振频段为2.01GHz的微波谐振腔为例,详细说明本实用新型结构的具体实施方式。Embodiment: Combining with Fig. 1 and Fig. 2, taking a microwave resonant cavity with a resonant frequency band of 2.01 GHz as an example, the specific implementation of the structure of the utility model will be described in detail.
借助目前已非常成熟的微波集成电路加工工艺技术,按下列参数在印刷电路板上制作微带线,正方形微带[1]总长81 mm,单边长度l 1=20.25mm,宽W 1=0.6 mm;金属通孔[5]直径d=0.4m,间距p=2mm,高度等于介质层[3]的高度;金属圆盘[4]直径D=1.2mm;介质层[3]隔离层[2]采用相同介质,相对介电常数为2.2,厚度分别为h 1=0.2mm, h 2=0.8mm;接地板[6]长31.61mm。整个微波谐振腔结构关于中轴呈左右上下对称。With the help of the very mature microwave integrated circuit processing technology at present, the microstrip line is produced on the printed circuit board according to the following parameters. mm; metal through hole [5] diameter d = 0.4m, spacing p = 2mm, height equal to the height of the dielectric layer [3]; metal disc [4] diameter D = 1.2mm; dielectric layer [3] isolation layer [2 ] Using the same medium, the relative permittivity is 2.2, and the thicknesses are h 1 =0.2mm, h 2 =0.8mm; the grounding plate [6] is 31.61mm long. The structure of the whole microwave resonant cavity is left, right, up and down symmetrical about the central axis.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109379056A (en) * | 2018-12-03 | 2019-02-22 | 全讯射频科技(无锡)有限公司 | A kind of SAW filter |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN109379056A (en) * | 2018-12-03 | 2019-02-22 | 全讯射频科技(无锡)有限公司 | A kind of SAW filter |
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Granted publication date: 20110921 Termination date: 20130131 |