CN201961836U - Manual wafer pick-and-place machine - Google Patents
Manual wafer pick-and-place machine Download PDFInfo
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- CN201961836U CN201961836U CN2011200314119U CN201120031411U CN201961836U CN 201961836 U CN201961836 U CN 201961836U CN 2011200314119 U CN2011200314119 U CN 2011200314119U CN 201120031411 U CN201120031411 U CN 201120031411U CN 201961836 U CN201961836 U CN 201961836U
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- annular
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- pick
- manual type
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- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 230000000295 complement effect Effects 0.000 claims description 6
- 230000001174 ascending effect Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 abstract 6
- 238000005498 polishing Methods 0.000 abstract 1
- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model relates to a wafer pick-and-place machine, in particular to a manual wafer pick-and-place machine, which comprises an adsorption film, a fixed mechanism and an operation mechanism, wherein the adsorption film is round and has elasticity, the fixed mechanism is bridged above the back surface of the adsorption film, the operation mechanism is arranged between the adsorption film and the fixed mechanism, and comprises a circular plate, a pull rod and a flexible piece, the circular plate is arranged at the middle part of the adsorption film, one end of the pull rod is connected with the middle part of the circular plate, the other end of the pull rod is connected with one end of the flexible piece, and the other end of the flexible piece is connected with the fixed mechanism. The manual wafer pick-and-place machine can avoid the contact between hands and the wafer so as to reduce pollution and wafer scratching caused by the contact of the hands and the wafer and effectively protect the wafer. Moreover, a waste film in a CMP (chemical mechanical polishing) process can be directly used as the adsorption film of the manual wafer pick-and-place machine, so local materials can be used, and manufacturing cost and difficulty are effectively reduced.
Description
Technical field
The utility model relates to a kind of wafer and picks up and put device, relates in particular to a kind of manual type wafer and picks up and put device.
Background technology
In the chemical-mechanical planarization CMP of semiconductor production technology; when grinding; because the reason of irrational reason of some flow processs or careless manipulation causes slide plate, promptly wafer (Wafer) falls down from grinding head (Head), drops on the grinding pad (Pad) through regular meeting.In order to reclaim the wafer that these drop, operating personal has to go to pick up with hand, and hand just can touch wafer inevitably like this, thereby stays a lot of stains even can scratch wafer on this wafer, and serious meeting causes this wafer loss.
Therefore, how to provide a kind of manual type wafer that can avoid hand direct contact wafer can effectively protect wafer to pick up putting device is the technical matters that those skilled in the art need to be resolved hurrily.
The utility model content
The purpose of this utility model is to provide the manual type wafer to pick up and puts device, can be under the prerequisite of not damaging wafer, and picking up of wafer of realization put.
To achieve the above object, the utility model adopts following technical scheme:
A kind of manual type wafer picks up puts device, comprise absorbed film, fixed mechanism and operating mechanism, described absorbed film is circular and has elasticity, described fixed mechanism is set up in the top at the absorbed film back side, described operating mechanism is located between absorbed film and the fixed mechanism, described operating mechanism comprises circular slab, pull bar and extensible member, described circular slab is located at the middle part of described absorbed film, one end of described pull bar is connected in the middle part of described circular slab, the other end is connected with an end of described extensible member, and the other end of described extensible member is connected in described fixed mechanism.
Described fixed mechanism comprises annular slab and handle, and described annular slab is arranged at the back side of described absorbed film, and described annular slab and described absorbed film are provided with one heart, and the two ends of described handle are set up in the two ends of described annular slab.
The front of described absorbed film is a circular flat, and the front of absorbed film is relative with wafer during use.The back side of described absorbed film is provided with some annular housings, and described some annular housings are around the ascending concentric setting in the center of circle of described absorbed film.
Described circular slab is located in the annular housing of the minimum in described some annular housings, and the size of the annular housing of the size of described circular slab and described minimum coupling.
Described annular slab is located in the bigger annular housing in described some annular housings, and the size of the size of described annular slab and this cooresponding annular housing is complementary.
Described annular slab is located in the annular housing of the maximum in described some annular housings, and the size of the size of described annular slab and this maximum annular housing is complementary.
The quantity of described annular housing has 3-8.
The two ends that the two ends of described handle are set up in described annular slab are meant that the two ends of described handle are fixedly connected on the two ends of described annular slab respectively by pipe link.
Described pull bar is to be connected to form by vertical bar and horizon bar, and an end of described horizon bar is captiveed joint with the upper end of described vertical bar, captives joint with described circular slab in the lower end of described vertical bar, and described horizon bar is captiveed joint with described extensible member.
Described extensible member is a spring.
The beneficial effects of the utility model are as follows:
The utility model manual type wafer picks up puts device, simple in structure, easy to use.When being attached to absorbed film on the wafer, periphery by the fixing described absorbed film of fixed mechanism, simultaneously, by upwards spurring the middle part upward movement that pull bar drives absorbed film, make the zone between absorbed film and the wafer produce vacuum, because the effect of external pressure makes wafer firmly be adsorbed on the absorbed film.In the time wafer will being put down, only need to discharge pull bar, manually start the edge at high speed destruction absorbed film of absorbed film and the vacuum between the wafer, make wafer and absorbed film break away from smoothly.This shows that the utility model is put in the wafer picking up, need not, thereby can avoid hand contamination and scratch wafer, thereby effectively protect wafer with hand direct contact wafer.And the manual type wafer picks up the absorbed film of putting device can directly utilize film discarded in the CMP technology, can realize gathering materials on the spot, thereby effectively reduce its manufacturing cost and difficulty.
Description of drawings
Manual type wafer of the present utility model picks up to be put device and is provided by following embodiment and accompanying drawing.
Fig. 1 picks up the structural representation of putting device for the utility model manual type wafer;
Fig. 2 is the structural representation of fixed mechanism of the present utility model and operating mechanism;
Fig. 3 is the structural representation at the back side of absorbed film of the present utility model.
Among the figure, 1-absorbed film, 11-first annular housing, 12-second annular housing, 13-the 3rd annular housing, 14-Fourth Ring shape cavity, 15-five rings shape cavity, 2-fixed mechanism, 21-annular slab, 22-handle, 23-pipe link, 3-operating mechanism, 31-circular slab, 32-pull bar, 33-extensible member
The specific embodiment
Below will pick up and put device and be described in further detail manual type wafer of the present utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this developmental work may be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose of this utility model, feature are become apparent, the specific embodiment of the present utility model is further described below in conjunction with accompanying drawing.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 1 to Fig. 3, wherein, Fig. 1 picks up the structural representation of putting device for the utility model manual type wafer; Fig. 2 is the structural representation of fixed mechanism of the present utility model and operating mechanism; Fig. 3 is the structural representation at the back side of absorbed film of the present utility model.
This manual type wafer picks up puts device, comprises absorbed film 1, fixed mechanism 2 and operating mechanism 3; Described absorbed film 1 is circular and has elasticity; Described fixed mechanism 2 and described operating mechanism 3 are arranged at the back side of described absorbed film 1; Described fixed mechanism 2 is set up in the top at absorbed film 1 back side, and described operating mechanism 3 is located between absorbed film 1 and the fixed mechanism 2.
Described fixed mechanism 2 comprises annular slab 21 and handle 22.Described annular slab 21 is arranged at the back side of described absorbed film 1, and described annular slab 21 and described absorbed film 1 are provided with one heart.The two ends of described handle 22 are set up in the two ends of described annular slab 21.The two ends that the two ends of described handle 22 are set up in described annular slab 21 are meant that specifically the two ends of described handle 22 are fixedly connected on the two ends of described annular slab 21 respectively by pipe link 23.
Described operating mechanism 3 comprises circular slab 31, pull bar 32 and extensible member 33.Described extensible member 33 can be the parts that spring etc. has Telescopic.Described circular slab 31 is located at the middle part of described absorbed film 1, and an end of described pull bar 32 is connected in the middle part of described circular slab 31, and the other end is connected with an end of described extensible member 33, and the other end of described extensible member 33 is connected in described fixed mechanism 2.The concrete structure of described pull bar 32 is as follows: described pull bar 32 is to be connected to form by vertical bar and horizon bar, one end of described horizon bar is captiveed joint with the upper end of described vertical bar, captive joint with described circular slab 31 in the lower end of described vertical bar, described horizon bar is captiveed joint with described extensible member 33.
The front of described absorbed film 1 is a circular flat.The back side of described absorbed film 1 is provided with some annular housings, and described some annular housings are around the ascending concentric setting in the center of circle of described absorbed film 1.The quantity of described annular housing for example is 3-8.In the present embodiment, the quantity of described annular housing has 5.Suppose that minimum annular housing is first annular housing 11, other ascending annular housings are second annular housing 12, the 3rd annular housing 13, Fourth Ring shape cavity 14 and five rings shape cavity 15 successively.Described five rings shape cavity 15 is annular housings maximum in the present embodiment.
The annular housing that described circular slab 31 is located at the minimum in described some annular housings is in first annular housing 11, and the size of the annular housing of the size of described circular slab 31 and described minimum coupling.
Described annular slab 21 can be located in the bigger annular housing in described some annular housings, and the size of the size of described annular slab 21 and this cooresponding annular housing is complementary.
Certainly, best scheme is that described annular slab 21 is located in the annular housing of the maximum in described some annular housings promptly in the five rings shape cavity 15, and the size of the size of described annular slab 21 and this maximum annular housing is complementary.This scheme can be better the fixing periphery of absorbed film, the handled easily personnel use.
In addition, in chemical mechanical milling tech, need use film (Membrane), it is the vitals of grinding head and wafer direct contact, its function is that the pressure that will configure affacts on the wafer, thus realize to wafer absorption, action such as discharge, exert pressure.Because of the technologic particularity of CMP needs, the replacement cycle of film is often shorter, makes that its service life is shorter.Yet the service life of being changed, matured film found that through test it still can provide very strong suction, if directly abandon more unfortunate.And can directly utilize these films of being changed selecting for use of absorbed film 1, pick up the manufacturing cost of putting device thereby can effectively reduce this manual type wafer.
Manual type wafer of the present utility model picks up that to put the device assembling process as follows, please continue to consult Fig. 1 to Fig. 3:
1. annular slab 21 is embedded in the respective chamber at absorbed film 1 back side.
2. the circular slab 31 of operating mechanism 3 is embedded in the annular housing of minimum at absorbed films 1 back side.
Manual type wafer of the present utility model picks up that to put the device working process as follows:
1. hold handle 22, pick up and put device to mention whole manual type wafer.
2. the front with absorbed film 1 is that circular flat covers and be adjacent to the full wafer wafer that drops fully.
3. point pull-up pull bar 32 gently, make pull bar 32 upwards make the middle part (being middle section) of absorbed film 1 raise up by driving circular slab 31.Because atmospheric effect, wafer is adsorbed under the absorbed film 1 firmly.
4. mention whole manual type wafer and pick up the wafer of putting device and being picked up by holding handle 22.
5. the manual type wafer is picked up and put device and aim at and put down gently on the platform of board somewhere.
6. discharge pull bar 32, can manually start the edge, a place (vacuum that this method can the rapid damage middle section forms) of absorbed film 1, make wafer and absorbed film 1 hightail.
The utility model manual type wafer picks up puts device, simple in structure, easy to use, can avoid hand direct contact wafer by using this manual type wafer to pick up to put device, thereby has avoided hand contamination and scratched the generation of wafer phenomenon.Simultaneously, the manual type wafer picks up the absorbed film 1 of putting device can directly utilize film discarded in the CMP technology, can realize gathering materials on the spot, and effectively reduces its manufacturing cost and difficulty.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (10)
1. a manual type wafer picks up and puts device, it is characterized in that, comprise absorbed film, fixed mechanism and operating mechanism, described absorbed film is circular and has elasticity, described fixed mechanism is set up in the top at the described absorbed film back side, described operating mechanism is located between described absorbed film and the described fixed mechanism, described operating mechanism comprises circular slab, pull bar and extensible member, described circular slab is located at the middle part of described absorbed film, one end of described pull bar is connected in the middle part of described circular slab, the other end is connected with an end of described extensible member, and the other end of described extensible member is connected in described fixed mechanism.
2. pick up according to the described manual type wafer of claim 1 and put device, it is characterized in that: described fixed mechanism comprises annular slab and handle, described annular slab is arranged at the back side of described absorbed film, and described annular slab and described absorbed film are provided with one heart, and the two ends of described handle are set up in the two ends of described annular slab.
3. pick up according to the described manual type wafer of claim 2 and put device, it is characterized in that: the front of described absorbed film is a circular flat, the back side of described absorbed film is provided with some annular housings, and described some annular housings are around the ascending concentric setting in the center of circle of described absorbed film.
4. pick up according to the described manual type wafer of claim 3 and put device, it is characterized in that: described circular slab is located in the annular housing of the minimum in described some annular housings, and the size of the annular housing of the size of described circular slab and described minimum coupling.
5. pick up according to the described manual type wafer of claim 4 and put device, it is characterized in that: described annular slab is located in the bigger annular housing in described some annular housings, and the size of the size of described annular slab and this cooresponding annular housing is complementary.
6. pick up according to the described manual type wafer of claim 4 and put device, it is characterized in that: described annular slab is located in the annular housing of the maximum in described some annular housings, and the size of the size of described annular slab and this maximum annular housing is complementary.
7. pick up according to the described manual type wafer of claim 3 and put device, it is characterized in that: the quantity of described annular housing has 3-8.
8. pick up according to the described manual type wafer of claim 2 and put device, it is characterized in that: the two ends that the two ends of described handle are set up in described annular slab are meant that the two ends of described handle are fixedly connected on the two ends of described annular slab respectively by pipe link.
9. pick up according to the described manual type wafer of claim 1 and put device, it is characterized in that: described pull bar is to be connected to form by vertical bar and horizon bar, one end of described horizon bar is captiveed joint with the upper end of described vertical bar, captive joint with described circular slab in the lower end of described vertical bar, described horizon bar is captiveed joint with described extensible member.
10. pick up according to the described manual type wafer of claim 1 and put device, it is characterized in that: described extensible member is a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200314119U CN201961836U (en) | 2011-01-28 | 2011-01-28 | Manual wafer pick-and-place machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200314119U CN201961836U (en) | 2011-01-28 | 2011-01-28 | Manual wafer pick-and-place machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201961836U true CN201961836U (en) | 2011-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200314119U Expired - Fee Related CN201961836U (en) | 2011-01-28 | 2011-01-28 | Manual wafer pick-and-place machine |
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| Country | Link |
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| CN (1) | CN201961836U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106660715A (en) * | 2014-06-11 | 2017-05-10 | 环球仪器公司 | Test device for establishing, verifying, and/or managing accuracy |
-
2011
- 2011-01-28 CN CN2011200314119U patent/CN201961836U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106660715A (en) * | 2014-06-11 | 2017-05-10 | 环球仪器公司 | Test device for establishing, verifying, and/or managing accuracy |
| CN106660715B (en) * | 2014-06-11 | 2020-07-24 | 环球仪器公司 | Test device for establishing, verifying and/or managing accuracy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130409 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130409 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20190128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |