CN201945137U - Semiconductor refrigerating cup - Google Patents
Semiconductor refrigerating cup Download PDFInfo
- Publication number
- CN201945137U CN201945137U CN2011200568115U CN201120056811U CN201945137U CN 201945137 U CN201945137 U CN 201945137U CN 2011200568115 U CN2011200568115 U CN 2011200568115U CN 201120056811 U CN201120056811 U CN 201120056811U CN 201945137 U CN201945137 U CN 201945137U
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- China
- Prior art keywords
- radiator
- fixed
- pipe
- bowl cover
- pedestal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 47
- 235000009967 Erodium cicutarium Nutrition 0.000 claims description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004411 aluminium Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a semiconductor refrigerating cup. The utility model relates to a cup by utilizing a semiconductor for refrigeration. The semiconductor refrigerating cup solves the problem that the refrigerating effect of the present semiconductor refrigerating cup is not ideal. A cup cover (2) of the semiconductor refrigerating cup is of a hollow structure, a semiconductor refrigerating plate (3) is fixed on the bottom part of the cup cover (2), the heat radiating end of the semiconductor refrigerating plate (3) is arranged inside the cup cover (2), the refrigerating end of the semiconductor plate (3) is connected with a cold transferring device (4), the cold transferring device (4) stretches out from the bottom part of the cup cover (2), a heat radiating fan (5) is fixed inside the cup cover (2), the cup cover (2) is provided with a vent hole corresponding to the heat radiating fan (5), and the semiconductor refrigerating cup is characterized in that: a heat tube heat radiating device is fixed on the heat radiating end of the semiconductor refrigerating plate (3).The semiconductor refrigerating cup has the advantages of good refrigerating effect, high efficiency and convenience and rapidness in use.
Description
Technical field
The utility model belongs to the daily necessities field, is specifically related to a kind of cup that utilizes semiconductor refrigerating.
Background technology
At present, semiconductor refrigerating technology has obtained extensive use, and be applied to the refrigeration cup field also has report more.But because all there is the not high problem of refrigerating efficiency in the conventional semiconductor refrigeration cup all the time, thereby its application has been subjected to very big influence.The semiconductor refrigerating cup mainly freezes by semiconductor chilling plate, and semiconductor chilling plate is after energising, and a side can produce heat, and opposite side then can turn cold fast.Usually the temperature of radiating end can reach when not having heat abstractor about 100 degree, very easily surpass the limit of bearing of cooling piece, and the key of raising semiconductor refrigerating efficient will reduce hot-side temperature exactly as early as possible to reduce the two ends temperature difference.The radiating end of the cooling piece of existing refrigeration cup adopts the zigzag radiator to add the form of fan usually, because the radiating efficiency of radiating end is low, unreasonable structure, this has just caused it fast and effeciently heat not to be come out, and has therefore directly influenced the refrigeration of refrigeration cup.
Summary of the invention
The purpose of this utility model is for the unfavorable problem of the refrigeration that solves the conventional semiconductor refrigeration cup, and a kind of semiconductor refrigerating cup is provided.
This semiconductor refrigerating cup comprises cup, bowl cover, bowl cover is a hollow structure, the bottom of bowl cover is fixed with semiconductor chilling plate, the radiating end of semiconductor chilling plate is positioned at bowl cover, the refrigeration end of semiconductor chilling plate is connected with cool transferring device, cool transferring device stretches out from the bottom of bowl cover, is fixed with radiator fan in the bowl cover, has on the bowl cover and the corresponding vent of radiator fan; The radiating end of described semiconductor chilling plate is fixed with heat-pipe radiator.
Described heat-pipe radiator can be made up of " U " shape heat pipe, pedestal and radiating fin, the bottom and the pedestal of " U " shape heat pipe fix, the bottom of pedestal and the radiating end of semiconductor chilling plate fix, and are fixed with radiating fin between two free ends of " U " shape heat pipe; Described radiator fan is fixed on the side of bowl cover.
Described heat-pipe radiator can be made up of " U " shape heat pipe, pedestal and radiating fin, one end and the pedestal of " U " shape heat pipe fix, the bottom of pedestal and the radiating end of semiconductor chilling plate fix, and free end one side of " U " shape heat pipe is fixed with radiating fin; Described radiator fan is fixed on the top of bowl cover.
Described heat-pipe radiator can be made up of cylindrical heat pipe, pedestal and heronsbill radiator, and the lower end and the pedestal of cylindrical heat pipe fix, and the bottom of pedestal and the radiating end of semiconductor chilling plate fix, and the outside of cylindrical heat pipe is fixed with the heronsbill radiator; Described radiator fan is fixed on the top of bowl cover.
Described heat-pipe radiator can be made up of directly-heated pipe, pedestal and radiating fin, and the lower end and the pedestal of directly-heated pipe fix, and a side of pedestal and the radiating end of semiconductor chilling plate fix, and are fixed with radiating fin on the directly-heated pipe; Described radiator fan is fixed on the side of bowl cover.
Described heat-pipe radiator can be made up of flat-plate heat pipe and zigzag radiator, and the upper surface of flat-plate heat pipe is fixed with the zigzag radiator, and the lower surface of flat-plate heat pipe and the radiating end of semiconductor chilling plate fix; Described radiator fan is fixed on the top of bowl cover.
The utlity model has following beneficial effect:
This semiconductor refrigerating cup has installed a heat-pipe radiator additional at the radiating end of semiconductor chilling plate, this heat-pipe radiator can be by heat pipe, pedestal and the radiating fin that can further strengthen heat dispersion, heronsbill radiator or zigzag radiator are formed, wherein heat pipe is a kind of high efficient heat exchanging element, its shape can be " U " shape, straight tube shape, cylindrical, plate shaped or other shape, adopt said structure, heat pipe can conduct heat apace, radiating fin, heronsbill radiator or zigzag radiator can effectively increase area of dissipation, after energising work, the heat that radiating end produced of semiconductor chilling plate can be conducted fast gives heat pipe, and radiating fin is given in final conduction, heronsbill radiator or zigzag radiator, the wind that radiator fan produced is taken away heat more apace, thereby its heat dispersion is improved greatly.Only adopt the zigzag heat spreader structures to compare with respect to existing refrigeration cup, radiating efficiency of the present utility model is higher, and refrigerating speed is faster, and refrigeration is better.The refrigerating plant of this semiconductor refrigerating cup is arranged on the bowl cover, therefore can carry out successively refrigeration by turns to a plurality of cups, and is convenient to use.
The utlity model has good refrigeration effect, efficient height, advantage convenient to use.
Description of drawings
Fig. 1 adopts the structural representation of " U " shape heat-pipe radiator for the utility model;
Fig. 2 adopts the structural representation of the another kind of fixed form of " U " shape heat-pipe radiator for the utility model;
Fig. 3 adopts the structural representation of cylindrical heat pipe radiator for the utility model;
Fig. 4 adopts the structural representation of directly-heated tube radiator for the utility model;
Fig. 5 adopts the structural representation of flat heat pipe radiator for the utility model;
Fig. 6 is the structural representation of heronsbill radiator.
1-cup; 2-bowl cover; 3-semiconductor chilling plate; 4-cool transferring device; 5-radiator fan; 6-" U " shape heat pipes; 7-pedestal; 8-radiating fin; 9-cylindrical heat pipe; 10-heronsbill radiator; 11-directly-heated pipe; 12-heat-insulation layer; 13-attaching plug; 14-flat-plate heat pipe; 15-zigzag radiator.
The specific embodiment
Below in conjunction with Fig. 1 to Fig. 6 the utility model is described further:
This semiconductor refrigerating cup is drawn together cup 1, bowl cover 2, and bowl cover 2 is a hollow structure, and the bottom of bowl cover 2 can be provided with one deck heat-insulation layer 12, in order to heat insulation; The bottom of bowl cover 2 is fixed with semiconductor chilling plate 3, the radiating end of semiconductor chilling plate 3 is positioned at bowl cover 2, the refrigeration end of semiconductor chilling plate 3 is connected with cool transferring device 4, cool transferring device 4 stretches out from the bottom of bowl cover 2, described cool transferring device 4 can be made by good material by guide temps such as aluminium or copper, and can make difformity as required.Be fixed with radiator fan 5 in the bowl cover 2, have on the bowl cover 2 and radiator fan 5 corresponding vents, the position of radiator fan 5 can be adjusted accordingly according to the position of heat-pipe radiator, takes away to guarantee the distinguished and admirable heat that can most effectively heat-pipe radiator be given out that is produced.
The radiating end of described semiconductor chilling plate 3 is fixed with heat-pipe radiator, heat-pipe radiator can be made up of heat pipe, pedestal 7 and radiating fin 8, heronsbill radiator 10 or the zigzag radiator 15 that can further strengthen heat dispersion, wherein heat pipe is a kind of high efficient heat exchanging element, its shape can be " U " shape, straight tube shape, cylindrical, plate shaped or other shape, pedestal 7 can adopt materials such as the aluminium of good heat-transfer or copper to make, and its effect is fixing heat pipe and the radiating end of heat pipe with semiconductor chilling plate 3 be connected.
When adopting " U " shape heat-pipe radiator, its structure can have two kinds: a kind of is that the bottom and the pedestal 7 of " U " shape heat pipe 6 fixes, the radiating end of the bottom of pedestal 7 and semiconductor chilling plate 3 fixes, be fixed with radiating fin 8 between two free ends of " U " shape heat pipe 6, radiator fan 5 is fixed on the side of bowl cover 2; Another kind is that an end and the pedestal 7 of " U " shape heat pipe 6 fixes, and the radiating end of the bottom of pedestal 7 and semiconductor chilling plate 3 fixes, and free end one side of " U " shape heat pipe 6 is fixed with radiating fin 8, and radiator fan 5 is fixed on the top of bowl cover 2.Before adopting during a kind of structure, the multi-disc radiating fin 7 that installs additional between 6 two free ends of " U " shape heat pipe can effectively increase area of dissipation, improve radiating efficiency, radiator fan 5 is fixed on the side of bowl cover 2, over against radiating fin 8, air-flow is passed between radiating fin 8, to guarantee good circulation of air, air-flow can be taken away heat quickly and effectively.When adopting a kind of structure in back, the multi-disc radiating fin 8 that free end one side of " U " shape heat pipe 6 fixedly installs additional also can effectively increase area of dissipation, improve radiating efficiency, radiator fan 5 is fixed on the top of bowl cover 2, over against radiating fin 8, passes between radiating fin 8 with same assurance air-flow.
When adopting the directly-heated tube radiator, the lower end of directly-heated pipe 11 and pedestal 7 fix, and a side of pedestal 7 and the radiating end of semiconductor chilling plate 3 fix, and are fixed with radiating fin 8 on the directly-heated pipe 11, and radiator fan 5 is fixed on the side of bowl cover 2.The fixing multi-disc radiating fin 7 in the top of directly-heated pipe 11 can effectively increase area of dissipation, improve radiating efficiency, radiator fan 5 be fixed on bowl cover 2 the side, over against the position of radiating fin 8 air-flow is passed between radiating fin 8, to guarantee good circulation of air, air-flow can be taken away heat quickly and effectively.
When adopting the cylindrical heat pipe radiator, the lower end of cylindrical heat pipe 9 and pedestal 7 fix, the radiating end of the bottom of pedestal 7 and semiconductor chilling plate 3 fixes, and the outside of cylindrical heat pipe 9 is fixed with heronsbill radiator 10, and radiator fan 5 is fixed on the top of bowl cover 2.Heronsbill radiator 10 can be made by the material of good heat-transfers such as aluminium, and it has a plurality of radiating fins, and this structure can increase the area of dissipation of cylindrical heat pipe 9 effectively, improves radiating efficiency; Radiator fan 5 be fixed on bowl cover 2 the top, can guarantee good performance of heat dissipation over against the position of heronsbill radiator 10.
When adopting flat heat pipe radiator, the upper surface of flat-plate heat pipe 14 is fixed with zigzag radiator 15, and the radiating end of the lower surface of flat-plate heat pipe 14 and semiconductor chilling plate 3 fixes, and flat-plate heat pipe 14 and zigzag radiator 15 can be made into one; Radiator fan 5 is fixed on the top of bowl cover 2.Zigzag radiator 15 can be made by the material of good heat-transfers such as aluminium, and it has a plurality of radiating fins, and this structure can increase the area of dissipation of flat-plate heat pipe 14 effectively, improves radiating efficiency; Radiator fan 5 is fixed on the top of bowl cover 2, over against the position of zigzag radiator 15, adopt said structure can guarantee good performance of heat dissipation.
Semiconductor refrigerating cup of the present utility model is responsible for can adopting general attaching plug as required to the attaching plug 13 of semiconductor chilling plate 3 and radiator fan 5 power supplies, also can adopt plug special in the automobile.The whole refrigerating plant of this semiconductor refrigerating cup is arranged in the bowl cover 2, and therefore a bowl cover can carry out continuous cooling successively to a plurality of cups, and is convenient to use.The utlity model has good refrigeration effect, efficient height, advantage convenient to use.
Claims (6)
1. semiconductor refrigerating cup, comprise cup (1), bowl cover (2), bowl cover (2) is a hollow structure, the bottom of bowl cover (2) is fixed with semiconductor chilling plate (3), the radiating end of semiconductor chilling plate (3) is positioned at bowl cover (2), the refrigeration end of semiconductor chilling plate (3) is connected with cool transferring device (4), cool transferring device (4) stretches out from the bottom of bowl cover (2), be fixed with radiator fan (5) in the bowl cover (2), have on the bowl cover (2) and the corresponding vent of radiator fan (5), it is characterized in that: the radiating end of described semiconductor chilling plate (3) is fixed with heat-pipe radiator.
2. a kind of semiconductor refrigerating cup according to claim 1, it is characterized in that: described heat-pipe radiator is made up of " U " shape heat pipe (6), pedestal (7) and radiating fin (8), the bottom of " U " shape heat pipe (6) and pedestal (7) fix, the radiating end of the bottom of pedestal (7) and semiconductor chilling plate (3) fixes, and is fixed with radiating fin (8) between two free ends of " U " shape heat pipe (6); Described radiator fan (5) is fixed on the side of bowl cover (2).
3. a kind of semiconductor refrigerating cup according to claim 1, it is characterized in that: described heat-pipe radiator is made up of " U " shape heat pipe (6), pedestal (7) and radiating fin (8), one end of " U " shape heat pipe (6) and pedestal (7) fix, the radiating end of the bottom of pedestal (7) and semiconductor chilling plate (3) fixes, and free end one side of " U " shape heat pipe (6) is fixed with radiating fin (8); Described radiator fan (5) is fixed on the top of bowl cover (2).
4. a kind of semiconductor refrigerating cup according to claim 1, it is characterized in that: described heat-pipe radiator is made up of cylindrical heat pipe (9), pedestal (7) and heronsbill radiator (10), the lower end of cylindrical heat pipe (9) and pedestal (7) fix, the radiating end of the bottom of pedestal (7) and semiconductor chilling plate (3) fixes, and the outside of cylindrical heat pipe (9) is fixed with heronsbill radiator (10); Described radiator fan (5) is fixed on the top of bowl cover (2).
5. a kind of semiconductor refrigerating cup according to claim 1, it is characterized in that: described heat-pipe radiator is made up of directly-heated pipe (11), pedestal (7) and radiating fin (8), the lower end of directly-heated pipe (11) and pedestal (7) fix, the radiating end of one side of pedestal (7) and semiconductor chilling plate (3) fixes, and is fixed with radiating fin (8) on the directly-heated pipe (11); Described radiator fan (5) is fixed on the side of bowl cover (2).
6. a kind of semiconductor refrigerating cup according to claim 1, it is characterized in that: described heat-pipe radiator is made up of flat-plate heat pipe (14) and zigzag radiator (15), the upper surface of flat-plate heat pipe (14) is fixed with zigzag radiator (15), and the radiating end of the lower surface of flat-plate heat pipe (14) and semiconductor chilling plate (3) fixes; Described radiator fan (5) is fixed on the top of bowl cover (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200568115U CN201945137U (en) | 2011-03-07 | 2011-03-07 | Semiconductor refrigerating cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200568115U CN201945137U (en) | 2011-03-07 | 2011-03-07 | Semiconductor refrigerating cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201945137U true CN201945137U (en) | 2011-08-24 |
Family
ID=44472477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200568115U Expired - Fee Related CN201945137U (en) | 2011-03-07 | 2011-03-07 | Semiconductor refrigerating cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201945137U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066506A (en) * | 2015-08-18 | 2015-11-18 | 胡海明 | Semiconductor refrigeration structure of soda water cup |
| CN105147111A (en) * | 2015-08-18 | 2015-12-16 | 胡海明 | Instant-type automatic refrigerating and soda producing beverage cup |
| CN105466152A (en) * | 2015-12-22 | 2016-04-06 | 华南理工大学 | Zip-top can quick-cooling device based on semiconductor refrigeration |
| CN106895602A (en) * | 2017-02-21 | 2017-06-27 | 山东大学 | A kind of semiconductor refrigerating auxiliary steam compression refrigerating system and method |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
| CN107525171A (en) * | 2016-06-21 | 2017-12-29 | 丁文凯 | Semiconductor air conditioner is fanned |
| CN110822764A (en) * | 2019-10-21 | 2020-02-21 | 淮阴工学院 | Refrigeration and heating dual-purpose device based on refrigeration chip |
| CN113178119A (en) * | 2021-05-11 | 2021-07-27 | 南开大学 | Non-uniform refractive index field construction device and mirage demonstration device |
| CN114526951A (en) * | 2022-02-24 | 2022-05-24 | 南京理工大学 | Semiconductor refrigerating device for collecting flame soot particles |
-
2011
- 2011-03-07 CN CN2011200568115U patent/CN201945137U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105147111B (en) * | 2015-08-18 | 2017-05-10 | 胡海明 | Instant-type automatic refrigerating and soda producing beverage cup |
| CN105147111A (en) * | 2015-08-18 | 2015-12-16 | 胡海明 | Instant-type automatic refrigerating and soda producing beverage cup |
| CN105066506A (en) * | 2015-08-18 | 2015-11-18 | 胡海明 | Semiconductor refrigeration structure of soda water cup |
| CN105066506B (en) * | 2015-08-18 | 2017-03-15 | 胡海明 | A kind of semiconductor refrigeration structure of carbonated drink cup |
| CN105466152B (en) * | 2015-12-22 | 2021-05-14 | 华南理工大学 | A quick-cooling device for cans based on semiconductor refrigeration |
| CN105466152A (en) * | 2015-12-22 | 2016-04-06 | 华南理工大学 | Zip-top can quick-cooling device based on semiconductor refrigeration |
| CN107525171A (en) * | 2016-06-21 | 2017-12-29 | 丁文凯 | Semiconductor air conditioner is fanned |
| CN106895602A (en) * | 2017-02-21 | 2017-06-27 | 山东大学 | A kind of semiconductor refrigerating auxiliary steam compression refrigerating system and method |
| CN107507811A (en) * | 2017-07-24 | 2017-12-22 | 华南理工大学 | The chip cooling cooling device that a kind of flat-plate heat pipe cluster couples with semiconductor refrigerating |
| CN107507811B (en) * | 2017-07-24 | 2023-06-20 | 华南理工大学 | Chip heat dissipation and cooling device coupled with flat heat pipe cluster and semiconductor refrigeration |
| CN110822764A (en) * | 2019-10-21 | 2020-02-21 | 淮阴工学院 | Refrigeration and heating dual-purpose device based on refrigeration chip |
| CN113178119A (en) * | 2021-05-11 | 2021-07-27 | 南开大学 | Non-uniform refractive index field construction device and mirage demonstration device |
| CN114526951A (en) * | 2022-02-24 | 2022-05-24 | 南京理工大学 | Semiconductor refrigerating device for collecting flame soot particles |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20140307 |