CN201878488U - The guide pin of the fan module and the chassis of the system module - Google Patents

Abstract

The utility model relates to a guide pin of a fan module and a housing of a system module. The guide pin is suitable for being arranged on a housing of a system module to guide a plurality of positioning pins of the housing to be respectively and correspondingly penetrated into a plurality of positioning holes of a rack of the fan module. The guide pin comprises a guide portion and a groove portion. The groove portion is engaged with the bottom of the guide portion. The inner diameter of the groove portion is smaller than the inner diameter of the guide portion, so that when the guide pin is located in the guide hole of the rack, a buffer gap is provided between the rack and the groove portion.

Description

The guide pin of the fan module and the chassis of the system module

technical field

The utility model relates to a guiding structure (Guiding Structure), and in particular to a guiding pin (Pin) of a fan module and a casing of a system module.

Background technique

In a system module, in order to reduce the temperature of the system during operation, a fan module is usually installed in the system module. Please refer to FIG. 1 , which is a partial device diagram illustrating a frame of a traditional fan module and a casing of a system module. The casing 100 of the system module has a bottom plate 102 and at least one side wall 104 , wherein the side wall 104 is erected on a side edge of the bottom plate 102 . The casing 100 of the system module generally further includes several positioning pins 106 . The positioning pins 106 are fixed on the bottom plate 102 of the casing 100 and protrude from the surface of the bottom plate 102 .

The fan module includes a cage (Cage) 108 . Generally speaking, in order to provide stronger cooling performance, the rack 108 has a plurality of accommodating spaces 110 , and each accommodating space 110 can accommodate a fan therein. The frame 108 of the fan module can be combined with the casing 100 of the system module and fixed in the inner space defined by the casing 100 . Usually, the side of the fan module frame 108 is combined with the side wall 104 of the cabinet 100 , and the bottom of the fan module frame 108 is combined with the bottom plate 102 of the cabinet 100 .

At present, in order to combine the bottom of the fan module frame 108 with the bottom plate 102 of the casing 100 and effectively position the fan module frame 108 in the casing 100, the bottom of the fan module frame 108 is provided with several positioning Hole 112. The position and quantity of these positioning holes 112 correspond to the position and quantity of the positioning pins 106 provided on the bottom plate 102 of the casing 100 . In this way, when the fan module is arranged in the casing 100 of the system module, the positioning pins 106 on the bottom plate 102 can respectively be respectively inserted in the positioning holes 112 at the bottom of the frame 108 of the fan module, and the effective positioning of the frame 108 in the frame position in the housing 100 .

In addition, since the fan will often vibrate when it is running, the frame 108 of the fan module also includes several ring-shaped cushions 114 . Each positioning hole 112 in the frame 108 is correspondingly provided with a buffer pad 114 , so the number of these buffer pads 114 is the same as the number of positioning holes 112 in the frame 108 . The buffer pad 114 is disposed on the periphery of the positioning hole 112 . In this way, when the fan in the fan module is running, the buffer pad 114 can provide a shock absorption effect, thereby reducing the impact of the vibration of the fan module on the system module.

In order to provide a cushioning effect, the cushion pad 114 is usually composed of a softer material. However, during the process of installing the frame 108 of the fan module on the casing 108, if the positioning hole 112 of the frame 108 is not aligned with the positioning pin 106 on the bottom plate 102 of the casing 108, the positioning hole 112 of the fan module will be aligned with the positioning pin 106 on the bottom plate 102 of the casing 108. The positioning pins 106 of the system modules often interfere with each other. Such an interference phenomenon will cause the soft buffer pad 114 to fall off from the positioning hole 112 of the frame 108, which is not conducive to the assembly operation.

Utility model content

Therefore, an object of the present invention is to provide a guide pin of a fan module, which has an inwardly recessed annular groove area. In this way, when the alignment pin is passed through the alignment hole of the frame of the fan module, there is a buffer space between the annular groove area and the frame, which can greatly reduce the collision of the fan frame with the alignment hole. pins, which can effectively avoid mutual interference between the fan frame and the guide pins.

Another object of the present invention is to provide a casing of a system module, which has at least one alignment pin. Because the height of the guide pin is higher than that of the positioning pin, when the fan frame is installed, the positioning pin can smoothly enter through the positioning hole of the fan frame through the guidance and positioning of the guide pin protruding from the positioning pin. in the ring cushion. Therefore, the problem of falling off of the buffer pad can be effectively avoided, and the difficulty of installing the fan frame can be reduced, thereby improving the production efficiency.

According to the above purpose of the present utility model, a guide pin for a fan module is proposed, which is suitable for being arranged on a casing of a system module, so as to guide several positioning pins of the casing to respectively pass through one of the fan modules. Several positioning holes of the rack. The alignment pin includes a guiding portion and a groove portion. This groove portion engages the bottom of the guide portion. Wherein, the inner diameter of the groove portion is smaller than the inner diameter of the guide portion, so that there is a buffer gap between the frame and the groove portion when the pilot pin is located in the pilot hole of the frame.

According to an embodiment of the present invention, the above-mentioned guiding part includes a chamfer structure disposed on the top peripheral edge of the guiding part.

According to an embodiment of the present invention, the chamfer structure is a rounded corner.

According to another embodiment of the present invention, the height of the above-mentioned guiding pin is greater than that of each positioning pin.

According to another embodiment of the present invention, the guiding pin is adjacent to at least one of the positioning pins.

According to the above purpose of the present invention, another system module casing is provided, which is suitable for loading a fan module. The casing of the system module includes a bottom plate, several positioning pins, and at least one guiding pin. The backplane can carry the fan modules. The aforementioned positioning pins are arranged on the bottom plate. At least one alignment pin is disposed on the bottom plate to guide the aforementioned positioning pins to respectively pass through several positioning holes of a frame of the fan module. Wherein, the aforementioned at least one alignment pin can be correspondingly passed through at least one alignment hole of the frame, and the height of the alignment pin is greater than that of each positioning pin.

According to an embodiment of the present invention, the above-mentioned at least one alignment pin includes a guiding portion and a groove portion. The groove portion engages the bottom of the guide portion. Wherein, the inner diameter of the groove portion is smaller than the inner diameter of the guide portion, so that when the aforementioned at least one alignment pin is located in at least one alignment hole of the frame, there is a buffer gap between the frame and the groove portion.

According to an embodiment of the present invention, the above-mentioned guiding part includes a chamfer structure disposed on the top peripheral edge of the guiding part.

According to an embodiment of the present invention, the chamfer structure is a rounded corner.

According to another embodiment of the present invention, the guiding pin is adjacent to at least one of the positioning pins.

The utility model has the advantage that the guide pin of the fan module has an inwardly recessed groove area. Therefore, when the guide pin is passed through the guide hole of the frame of the fan module, there is a buffer space between the groove area and the frame, which can reduce the chance of the fan frame colliding with the guide pin, thereby preventing the fan frame from colliding with the guide pin. The vibration of the rack is transmitted to the system modules through the pilot pins.

Another advantage of the present invention is that the casing of the system module has at least one alignment pin. Since the height of the guide pin is higher than that of the positioning pin, when installing the fan frame, through the guidance and positioning of the more prominent guide pin, the positioning pin can be smoothly inserted into the ring of the positioning hole of the fan frame. type cushion. Therefore, the problem of falling off of the buffer pad can be effectively avoided, and the difficulty of installing the fan frame can be reduced, thereby improving the production efficiency.

Description of drawings

In order to make the above and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the accompanying drawings are described as follows:

FIG. 1 is a partial device diagram illustrating a frame of a traditional fan module and a casing of a system module;

FIG. 2 is a partial device diagram showing a frame of a fan module and a casing of a system module according to an embodiment of the present invention;

3A to 3C are partial cross-sectional flow charts illustrating a rack of a fan module installed on a casing of a system module according to an embodiment of the present invention.

[Description of main component symbols]

100: Chassis 102: Bottom plate

104: Side wall 106: Locating pin

108: Rack 110: Accommodating space

112: positioning hole 114: buffer pad

200: Chassis 202: Bottom plate

204: Side wall 206: Locating pin

208: Rack 210: Accommodating space

212: positioning hole 214: buffer pad

216: Pilot pin 218: Pilot hole

220: Guide part 222: Groove part

224: Angle structure 226: Buffer gap

Detailed ways

Please refer to FIG. 2 , which is a partial device diagram illustrating a frame of a fan module and a casing of a system module according to an embodiment of the present invention. The system module generally includes several electronic components (not shown), and the housing 200 for loading these electronic components. In addition, in order to reduce the temperature of these electronic components during operation, the system module is usually equipped with a fan module to enhance heat convection between the system module and the external environment. The fan module can also be installed in the casing 200 .

In one embodiment, the housing 200 of the system module includes a bottom plate 202 , a plurality of alignment pins 206 , and one or more alignment pins 216 . In another embodiment, as shown in FIG. 2 , the casing 200 may further include at least one side wall 204 according to product requirements. The side wall 204 can be erected on the side edge of the bottom plate 202 . The electronic components and the fan module of the system module can be disposed on the bottom plate 202 of the casing 200 .

The positioning pin 206 is disposed on the bottom plate 202 of the casing 200 for fixing the position of the fan module. The guiding pin 216 is also disposed on the bottom plate 202 of the casing 200 for guiding the combination of the positioning pin 206 and the fan module. In one embodiment, the pilot pin 216 is preferably adjacent to at least one alignment pin 206 as shown in FIG. 2 . In addition, as shown in FIGS. 3A to 3C , the height of the guide pin 216 is preferably greater than that of the positioning pin 206 , so as to guide the combination of the fan module and the positioning pin 206 .

In one embodiment, please refer to FIGS. 3A to 3C , the guiding pin 216 may include a guiding portion 220 and a groove portion 222 . The groove part 222 is engaged at the bottom of the guide part 220 . In one example, the groove portion 222 and the guide portion 220 may be an integrated structure, that is, the alignment pin 216 is an integrally formed structure. In another example, the groove part 222 and the guide part 220 can be two independent structures, but the groove part 222 is fixed on the bottom of the guide part 220 .

In this embodiment, the inner diameter of the guide part 220 is larger than the inner diameter of the groove part 222, that is, compared with the guide part 220, the groove part 222 is recessed inward, and the guide pin 216 forms a kind of wine glass-shaped structure. . In an embodiment, the guide part 220 may further include a chamfer structure 224 , and the chamfer structure 224 is disposed on the periphery of the top of the guide part 220 . In one example, as shown in FIG. 3A , the chamfer structure 224 may be a rounded corner.

Please refer to FIG. 2 again, the fan module mainly includes a rack 208 and at least one fan (not shown). The rack 208 can define several accommodating spaces 210 , and each accommodating space 210 can accommodate a fan therein. Therefore, the fan module can include several fans to provide more powerful heat convection performance. The side of the frame 208 of the fan module can be combined with the side wall 204 of the casing 200 , and the bottom of the frame 208 can be combined with the bottom plate 202 to be fixed in the inner space of the casing 200 .

Cooperating with the alignment pin 216 and the positioning pin 206 on the bottom plate 202 of the casing 200 , the bottom of the frame 208 is provided with an alignment hole 218 and a positioning hole 212 . Wherein, the positions and numbers of these guide holes 218 and positioning holes 212 correspond to the positions and numbers of guide pins 216 and positioning pins 206 provided on the bottom plate 202 .

In some examples, the frame 208 of the fan module further includes a plurality of annular buffer pads 214 . These buffer pads 214 are respectively arranged on the periphery of the positioning holes 212 of the frame 208 correspondingly. The cushion pad 214 can be made of soft material to provide better cushioning effect. When the fan is running, the buffer pad 214 can provide a shock absorption effect, so as to prevent the operation of the fan module from interfering with the system module.

Please refer to FIG. 3A to FIG. 3C , which are partial cross-sectional flow charts illustrating a rack of a fan module installed on a casing of a system module according to an embodiment of the present invention. When assembling the frame 208 of the fan module on the casing 300 , the alignment holes 218 of the frame 208 can be aligned with the alignment pins 216 of the casing 200 . Since the pilot pin 216 is higher than the alignment pin 206 , it is easier to align the pilot hole 218 with the pilot pin 216 . Next, as shown in FIG. 3A , the frame 208 is moved toward the bottom plate 202 of the casing 200 , so that the peripheral edge of the pilot hole 218 of the frame 208 is engaged with the pilot pin 216 . Since the top of the guiding portion 220 of the pilot pin 216 has a chamfer structure 224 , the frame 208 can be smoothly slid into the pilot pin 216 .

Next, through the guidance of the guide hole 218 of the frame 208 and the guide portion 220 of the guide pin 216, the positioning pins 206 can be respectively accurately inserted into the buffer pads 214 in the corresponding positioning holes 212 of the frame 208. , as shown in Figure 3B. In this way, the positioning pin 206 of the casing 200 can be smoothly combined with the buffer pad 214 in the positioning hole 212 of the frame 208 , and the buffer pad 214 of the frame 208 can be prevented from falling off during the assembly process. After the positioning pins 206 pass through the positioning holes 212 of the frame 208 , not only can the frame 208 of the fan module be combined with the casing 200 , but also the position of the frame 208 of the fan module in the casing 200 can be effectively positioned.

Next, under the guidance of the guide portion 220 , the alignment hole 218 of the frame 208 fits on the periphery of the groove portion 222 of the alignment pin 216 . At this time, the pilot pin 216 is passed through the pilot hole 218 . Since the inner diameter of the groove portion 222 of the alignment pin 216 is smaller than the inner diameter of the guide portion 220 , compared to the guide portion 220 , the groove portion 222 is recessed inward. Therefore, as shown in FIG. 3C , after the pilot pin 216 passes through the pilot hole 218 , there may be a buffer gap 226 between the frame 208 around the pilot hole 218 and the groove portion 222 of the pilot pin 216 . With the existence of the buffer gap 226 , the vibration of the external environment or the vibration generated by the operation of the fan will not be transmitted to the alignment pin 216 of the casing 200 through the frame 208 . Therefore, it is possible to prevent the fan module from interfering with the system module via the alignment pin 216 .

It can be known from the above embodiments that one advantage of the present invention is that the guide pin of the fan module has an inwardly recessed annular groove area. Therefore, when the guide pin is passed through the guide hole of the frame of the fan module, there is a buffer space between the annular groove area and the frame, which can greatly reduce the chance of the fan frame colliding with the guide pin. Furthermore, mutual interference between the fan frame and the guide pin can be effectively avoided.

It can be known from the above embodiments that another advantage of the present invention is that the casing of the system module has at least one alignment pin. Because the height of the guide pin is higher than that of the positioning pin, when the fan frame is installed, the positioning pin can smoothly enter through the positioning hole of the fan frame through the guidance and positioning of the guide pin protruding from the positioning pin. in the ring cushion. Therefore, the problem of falling off of the buffer pad can be effectively avoided, and the difficulty of installing the fan frame can be reduced, thereby improving the production efficiency.

Although the present utility model has been disclosed as above in terms of implementation, it is not intended to limit the present utility model. Anyone with ordinary knowledge in this technical field can make various modifications without departing from the spirit and scope of the present utility model. Changes and modifications, so the scope of protection of the present utility model should be as defined by the appended claims.

Claims (10)

1. the pilot pin of a blower module is characterized in that, is suitable for on the casing that is arranged on a system module, and several alignment pins of this casing are corresponding respectively to be arranged in a plurality of location holes of a frame of this blower module to guide, and this pilot pin comprises:

One guidance part; And

One concave part is bonded on the bottom of this guidance part, and wherein an internal diameter of this concave part is less than an internal diameter of this guidance part, when being arranged in a correcting hole of this frame at this pilot pin, makes between this frame and this concave part to have a buffer gap.

2. the pilot pin of blower module according to claim 1 is characterized in that, this guidance part comprises the top periphery that a lead angle structure is located at this guidance part.

3. the pilot pin of blower module according to claim 2 is characterized in that, this lead angle structure is a fillet.

4. the pilot pin of blower module according to claim 1 is characterized in that, the height of this pilot pin is greater than the height of each those alignment pin.

5. the pilot pin of blower module according to claim 1 is characterized in that, this pilot pin is adjacent to by at least one of those alignment pins.

6. the casing of a system module is characterized in that, is suitable for to load a blower module, and the casing of this system module comprises:

One base plate can carry this blower module;

Several alignment pins are arranged on this base plate; And

At least one pilot pin, be arranged on this base plate, in several location holes of guiding the corresponding respectively frame that is arranged in this blower module of those alignment pins, wherein this at least one pilot pin can corresponding be located at least one correcting hole of this frame, and the height of this at least one pilot pin is greater than the height of each those alignment pin.

7. the casing of system module according to claim 6 is characterized in that, this at least one pilot pin comprises:

One guidance part; And

One concave part is bonded on the bottom of this guidance part, and wherein an internal diameter of this concave part is less than an internal diameter of this guidance part, when being arranged in this at least one correcting hole of this frame at this at least one pilot pin, makes between this frame and this concave part to have a buffer gap.

8. the casing of system module according to claim 7 is characterized in that, this guidance part comprises the top periphery that a lead angle structure is located at this guidance part.

9. the casing of system module according to claim 8 is characterized in that, this lead angle structure is a fillet.

10. the casing of system module according to claim 6 is characterized in that, this at least one pilot pin is adjacent to by at least one of those alignment pins.

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