CN201867778U - Electronic device and optical sensing module thereof - Google Patents

Abstract

The utility model discloses an optical sensing module. The optical sensing module includes a light source, a lens for transmitting light emitted by the light source, a photosensitive chip and a circuit board, wherein the light source and the photosensitive chip are both arranged on the circuit board and electrically connected with the circuit board. , the lens is arranged above the photosensitive chip, and includes an illumination optical path and an imaging optical path arranged as a whole, wherein the illumination optical path includes a reflective surface, and the lens is also provided with an operating area for placing a target object, and the reflective surface transmits the light emitted by the light source The light is reflected to the operating area, wherein the incident angle of the light reflected by the reflective surface is greater than the critical angle between the external medium and the lens surface, so that the light forms total reflection in the lens, and after the target object is placed in the operating area, the total reflection condition is obtained Destruction, the light reflected by the reflective surface is reflected by the surface of the target object and then irradiates the photosensitive chip.

Description

Electronic device and its optical sensing module

【Technical field】

The utility model relates to an optical sensing device, in particular to a module used in electronic devices for optical sensing of images of users' fingers or other objects. the

【Background technique】

Mouse, touchpad, and trackball are the most commonly used human-machine interface devices, but these devices have the problems of large size and complex structure, and are not easy to be integrated on portable electronic devices such as mobile phones and e-books. Although the industry also introduces touch screen technology into portable electronic devices such as mobile phones, the cost of the touch screen is high, and the requirements for the use environment are high, and the operation is not very convenient, which is not conducive to popularization and use. the

In response to the above problems, the industry has also developed an optical pointing device that uses optical image processing technology to control the cursor on the screen of an electronic device. For details, please refer to the Chinese patent No. 200920069182.2 filed by the applicant, in which Figure 1 is disclosed by the patent No. 200920069182.2 The structural schematic diagram of the thin optical indicating module of , the optical indicating module 1 includes a light source 10 , a lens 11 , a photosensitive chip 12 and a circuit board 13 . Wherein the light source 10 and the photosensitive chip 12 are installed on the circuit board 13 and are electrically connected with the circuit board 13, and the lens is arranged above the photosensitive chip 12 and the light source 10, and the lens 11 can be made of transparent plastic, including an illumination light path 110 and the imaging optical path 111 , wherein the illumination optical path 110 includes a concave spherical surface 112 , the concave spherical surface 112 is disposed on the surface of the lens 11 opposite to the light source 10 , and the light source 10 is disposed at the center of the concave spherical surface 112 . In addition, the lens 11 is provided with a hyperboloid reflective surface 113 on the other surface adjacent to the concave spherical surface 112, and is provided with a transmission plane 114 on the other side opposite to the hyperboloid reflective surface 113, so that the light emitted by the light source 10 is perpendicular to the concave surface. The spherical surface 112 is incident into the lens 11, and then reflected by the hyperboloid reflective surface 113, which is also emitted as parallel light perpendicular to the transmission plane 114, and the transmitted parallel light is irradiated on the navigation panel 115, and part of the light passes through the navigation panel 115 refracts and spreads on the surface of the navigation panel 115. When the finger is placed on the navigation panel 115, this part of the light is reflected by the surface of the finger, and then passes through the aspheric lens 116 of the imaging optical path 111 and irradiates on the photosensitive chip 12 to form Image, and then use the optical image processing technology to control the cursor on the screen of the actual electronic device. In actual implementation, a casing 14 is provided on the periphery of the photosensitive chip 12 and the light source 10, and the casing 14 is provided with first and second accommodation spaces 140, 141 for respectively accommodating the photosensitive chip 12 and the light source 10. The second containing spaces 140 and 141 are isolated from each other to prevent the light scattered by the light source 10 from affecting the collection of images by the photosensitive chip 12 . And the upper wall (not numbered) of the casing 14 is also provided with a positioning hole (not numbered), so that the lens 11 is assembled on the casing 14 in order to cooperate with the positioning column 117 arranged at the bottom of the lens 11 . In addition, the casing 14 further defines a recess 142 for receiving the aspheric lens 116 . Although the optical indicating device disclosed in this patent can realize the predetermined function, the first disadvantage is that when the parallel light perpendicular to the transmission plane 114 is irradiated on the navigation panel 115, a part of the light is refracted and scattered on the navigation panel 115. First, it may cause glare and reduce the comfort of use. The second disadvantage is that the optical indicator module has many components, which is not conducive to reducing the manufacturing cost. At the same time, it is too high to be integrated into the increasingly thin and light portable electronic devices. the

【Content of utility model】

The purpose of this utility model is to provide an optical sensing module, which overcomes the defect of reducing the comfort of use due to glare in the prior art through the structural arrangement of various components and the design of the optical path. the

In order to achieve the above object, the optical sensing module implementing the utility model includes a light source, a lens for transmitting light emitted by the light source, a photosensitive chip and a circuit board, wherein the light source and the photosensitive chip are both arranged on the circuit board and electrically connected to the circuit board, The lens is arranged above the photosensitive chip, and includes an illumination optical path and an imaging optical path that are arranged as a whole, wherein the illumination optical path includes a reflective surface, and the lens is also provided with an operating area for placing a target object, and the reflective surface receives the light emitted by the light source Reflected to the operating area, where the target object is not placed in the operating area, the incident angle of the light reflected by the reflective surface is greater than the critical angle between the external medium and the lens surface, the light forms total reflection in the lens, and the target object is placed in the operating area After the area, the refractive index of the target object is greater than the refractive index of the lens, the total reflection condition is destroyed, and the light reflected by the reflective surface is reflected by the surface of the target object and then irradiates the photosensitive chip through the imaging optical path. the

In order to achieve the above object, another optical sensing module implementing the utility model includes a light source, a lens for transmitting light emitted by the light source, a photosensitive chip and a circuit board, wherein the photosensitive chip is arranged on the circuit board and electrically connected to the circuit board, The lens is arranged above the photosensitive chip, and includes an illumination optical path and an imaging optical path that are arranged as a whole, wherein the illumination optical path includes a reflective surface, and the lens is also provided with an operating area for placing a target object, and the reflective surface receives the light emitted by the light source Reflected to the operating area, and the light does not leave the lens medium in the process, the refractive index of the lens is n, the refractive index of the external medium outside the lens is m, and the refractive index of the target object is k, wherein according to the above main characteristics, the photosensitive A light-shielding housing is arranged on the periphery of the chip, and the light-shielding housing is provided with an aspheric lens on the wall adjacent to the photosensitive chip. the

According to the main features above, the light source is a coherent light source. the

According to the above main features, the light source is a laser light source. the

According to the above main features, the light source is an incoherent light source. the

According to the above main features, the surface of the lens opposite to the light source is a concave spherical surface, and the light source is arranged at the center of the concave spherical surface. the

According to the main features above, a light-shielding housing is provided around the photosensitive chip and the light source. The light-shielding housing is provided with first and second storage spaces for respectively housing the photosensitive chip and the light source. The first and second storage spaces are isolated from each other. the

According to the main features above, the photosensitive chip, the light source and the casing are integrated. the

According to the above main features, the circuit board is a flexible printed circuit board, and the light source and the photosensitive chip are all arranged on the flexible printed circuit board. the

According to the above main features, the photosensitive chip is provided with a light-shielding shell on the periphery, and the light-shielding shell is provided with an aspheric lens on the wall adjacent to the photosensitive chip, and the light reflected by the surface of the target object is collected by the aspheric lens and irradiated. on the photosensitive chip. the

According to the above main features, the side of the lens adjacent to the photosensitive chip is protruded with two barrier walls, and the surface of the two barrier walls adjacent to the photosensitive chip is provided with an anti-transmission layer, and the photosensitive chip is accommodated between the two barrier walls. the

Another object of the present invention is to provide an electronic device using the optical sensing device. The optical sensing electronic device overcomes the defect of reducing comfort due to glare in the prior art through the structural arrangement of various components and the design of the optical path. . the

In order to achieve the above object, the electronic device implementing the utility model includes a casing and a main circuit board, and an optical sensing module is installed on the casing, the optical sensing module is electrically connected to the main circuit board, and the optical sensing module includes a light source . A lens for transmitting light emitted by the light source, a photosensitive chip and a circuit board, wherein the light source and the photosensitive chip are both arranged on the circuit board and electrically connected to the circuit board. The lens is arranged above the photosensitive chip, including an integrated lighting optical path and the imaging light path, wherein the illumination light path includes a reflective surface, and the lens is also provided with an operating area for placing the target object, and the reflective surface reflects the light emitted by the light source to the operating area, wherein the lens protrudes from the surface of the photosensitive chip. There is a condensing lens, and the light reflected by the surface of the target object is condensed by the condensing lens and irradiated on the photosensitive chip. the

In order to achieve the above object, another electronic device implementing the utility model includes a casing and a main circuit board, and an optical sensing module is installed on the casing, the optical sensing module is electrically connected to the main circuit board, and the optical sensing module It includes a light source, a lens for transmitting light emitted by the light source, a photosensitive chip and a circuit board, wherein the photosensitive chip is arranged on the circuit board and electrically connected to the circuit board, the lens is arranged above the photosensitive chip, and includes an integral lighting optical path And the imaging light path, wherein the illumination light path includes a reflective surface, and the lens also has an operating area for the target object to be placed, the reflective surface reflects the light emitted by the light source to the operating area, and the light does not leave the lens medium during the process , the refractive index of the lens is n, the refractive index of the external medium outside the lens is m, and the refractive index of the target object is k, wherein the lens is protruding from the surface of the photosensitive chip with a condenser lens, the light reflected by the surface of the target object After being collected by the condenser lens, it is irradiated on the photosensitive chip. the

According to the main features above, the light source is a coherent light source. the

According to the above main features, the light source is a laser light source. the

According to the above main features, the light source is an incoherent light source. the

According to the above main features, the surface of the lens opposite to the light source is a concave spherical surface, and the light source is arranged at the center of the concave spherical surface. the

According to the main features above, a light-shielding housing is provided around the photosensitive chip and the light source. The light-shielding housing is provided with first and second storage spaces for respectively housing the photosensitive chip and the light source. The first and second storage spaces are isolated from each other. the

According to the main features above, the photosensitive chip, the light source and the light-shielding housing are integrated. the

According to the above main features, the circuit board is a flexible printed circuit board, and the light source and the photosensitive chip are all arranged on the flexible printed circuit board. the

According to the above main features, the photosensitive chip is provided with a light-shielding shell on the periphery, and the light-shielding shell is provided with an aspheric lens on the wall adjacent to the photosensitive chip, and the light reflected by the surface of the target object is collected by the aspheric lens and irradiated. on the photosensitive chip. the

According to the above main features, the side of the lens adjacent to the photosensitive chip is protruded with two barrier walls, and the surface of the two barrier walls adjacent to the photosensitive chip is provided with an anti-transmission layer, and the photosensitive chip is accommodated between the two barrier walls. the

In order to achieve the above object, another electronic device implementing the utility model includes at least a display screen, a main circuit board and a housing, and the electronic device also includes an optical sensing module, which includes a sensing chip and a lens. The sensor chip is welded on the main circuit board, including a light source, photosensitive chip and light-shielding housing. The lens is arranged above the sensor chip, including an integral lighting optical path and imaging optical path, wherein the illuminating optical path includes a reflective surface, and the lens The lens is also provided with an operating area for the target object to be placed. The reflective surface reflects the light emitted by the light source to the operating area, wherein the lens is protruded from the surface of the photosensitive chip with a condenser lens, and the light reflected by the surface of the target object After being collected by the condenser lens, it is irradiated on the photosensitive chip. the

In order to achieve the above object, another electronic device implementing the utility model includes at least a display screen, a main circuit board and a casing, and the electronic device also includes an optical sensing module, which includes a sensing chip and a lens. The sensor chip is welded on the main circuit board, including a light source, photosensitive chip and light-shielding housing. The lens is arranged above the sensor chip, including an integral lighting optical path and imaging optical path, wherein the illuminating optical path includes a reflective surface, and the lens The lens also has an operating area for the target object to be placed. The reflective surface reflects the light emitted by the light source to the operating area, and the light does not leave the lens medium during the process. The refractive index of the lens is n, and the external medium outside the lens refracts The refractive index of the target object is m, and the refractive index of the target object is k. The lens protrudes from the surface of the photosensitive chip with a condenser lens. the

According to the main features above, the light source is a coherent light source. the

According to the above main features, the light source is a laser light source. the

According to the above main features, the light source is an incoherent light source. the

According to the above main features, the surface of the lens adjacent to the light source is a concave spherical surface, and the light source is arranged at the center of the concave spherical surface. the

According to the above main features, the light-shielding housing is provided with first and second accommodating spaces for respectively accommodating the photosensitive chip and the light source, and the first and second accommodating spaces are isolated from each other. the

According to the above main features, the light-shielding housing is provided with an aspheric lens on the wall adjacent to the photosensitive chip, and the light reflected by the surface of the target object is collected by the aspheric lens and irradiated on the photosensitive chip. the

Compared with the prior art, the utility model makes the incident angle of the light reflected by the reflective surface of the lens larger than the critical angle between the external medium and the lens surface when the target object is not placed on the operating area, so that the light is within the lens Form total reflection, so as to prevent glare and improve the comfort of use, and the target object is placed behind the operating area, or because the refractive index of the target object is greater than the refractive index of the lens, the total reflection condition is destroyed, or when the refraction of the target object When the index is less than the refractive index of the lens, since the incident angle of the light reflected by the reflective surface is smaller than the critical angle between the target object and the lens surface, the total reflection condition is destroyed, so the light reflected by the reflective surface is reflected by the surface of the target object. It is irradiated on the photosensitive chip to form an image. At the same time, the utility model directly sets an operation area for placing the target object on the surface of the lens, so that there is no need to set a navigation panel, and the reflective surface and the condensing lens are all set on the lens as a whole, so that It is beneficial to reduce the overall height of the optical sensing module, and at the same time, the optical sensing module does not need other independent or movable components, so the structure is simple and easy to manufacture, thereby reducing the manufacturing cost of the optical sensing module. the

【Description of drawings】

FIG. 1 is a schematic structural diagram of an existing optical sensing module. the

Fig. 2 is a schematic structural diagram of an optical sensing module implementing the utility model. the

FIG. 3 is a schematic diagram of another usage state of the optical sensing module implementing the present invention. the

【Detailed ways】

Please refer to FIG. 2 , which is a structural diagram of an optical sensing module implementing the present invention, wherein the optical sensing module 2 includes a light source 20 , a lens 21 , a photosensitive chip 22 and a circuit board 23 . Wherein the light source 20 and the photosensitive chip 22 are installed on the circuit board 23 and electrically connected with the circuit board 23 . In a specific implementation, the light source 20 may be a coherent light source (such as laser) or an incoherent light source. Preferably, the light source 20 is mounted on the circuit board 23 by surface-mounting technology. The circuit board 23 can be a printed circuit board or a flexible printed circuit board, and one end of the circuit board 23 is provided with an interface connected to the circuit board (not shown) of the circuit device using the optical sensing module 2, For example, gold fingers or electrical connectors are electrically connected to the main circuit board (not shown) of the electronic device using the optical sensing module 2 . Certainly, the circuit board 23 can also be a circuit board of an electronic device using the optical sensing module 2 , that is, the light source 20 and the photosensitive chip 22 are directly assembled on the circuit board of the electronic device. the

The lens 21 is disposed above the photosensitive chip 22 and the light source 20, and includes an integral illumination optical path (not labeled) and an imaging optical path (not labeled). Structurally, the lens 21 includes a plate-like portion 210 and a protruding portion 211, The opposite surface of the protruding portion 211 and the light source 20 forms a concave spherical surface 212, and the light source 20 is arranged at the center of the concave spherical surface 212, so that the light emitted by the light source 20 can enter the lens 21 perpendicular to the concave spherical surface 212, thereby keeping relatively small High light transmittance. At the same time, the protruding portion 211 of the lens 21 is provided with a reflective surface 213 for illuminating the light path on the other surface adjacent to the concave spherical surface 212 . In addition, the plate-shaped portion 210 of the lens 21 is away from the surface of the circuit board 23 and facing the photosensitive chip 22. An operating area 214 is provided for placing a target object (such as a user’s finger), and the plate-shaped portion of the lens 21 A condensing lens 215 protrudes from the position 210 facing the surface of the circuit board 23 and facing the photosensitive chip 22 . In practice, the lens 21 is made of light-transmitting material, such as glass or transparent resin, and its refractive index is greater than that of the external medium (such as air). Wherein if the material of the lens 21 is transparent resin, its refractive index is 1.514, then the critical angle between the air and the surface of the lens 21 is 41.34 degrees, so as long as the height between the reflective surface 213 and the light source 20 and the curvature of the reflective surface 213 Adjustment can ensure that the incident angle of the light reflected by the reflective surface 213 is greater than the critical angle between the air and the surface of the lens 21, so that the light forms total reflection inside the lens 21, and finally exits from one side of the lens 21, so there is no The light is refracted from the surface of the lens 21 to prevent glare and improve the comfort of use. Furthermore, a cover body 4 can also be arranged on the periphery of the optical sensing module 2 to form a separate component module, which can be directly used on the casings (not shown) of electronic devices such as mobile phones and e-books, and can be combined with the The main circuit board (not shown) of the electronic device is electrically connected. the

Please refer to FIG. 3 , which is a schematic diagram of another usage state of the optical sensing module implementing the present utility model. When the target object 3 is placed on the operating area 214 of the lens 21, the refractive index of the target object 3 is larger than that of the lens 21. (such as the target object can be an opaque object or a finger), so that the total reflection condition is destroyed, so that the light reflected by the reflective surface 213 is reflected on the surface of the target object 3 and collected by the condenser lens 215 of the lens 21 to irradiate the photosensitive chip 22 Then, the data processing unit (not shown) connected to the photosensitive chip uses image processing technology to control the cursor on the screen of the electronic device using the optical sensing module or perform optical fingerprint recognition. the

Preferably, in order to prevent external light and light from the light source 20 from being scattered on the photosensitive chip 22 during implementation, a light-shielding housing 24 can be provided on the periphery of the photosensitive chip 22, and the light-shielding housing 24 is provided with a photosensitive chip respectively 22 and the first and second accommodating spaces 240, 241 of the light source 20, the first and second accommodating spaces 240, 241 are isolated from each other. Of course, an aspherical lens (being a part of the imaging optical path) can also be arranged on the wall facing the light-shielding housing 24 and the photosensitive chip 22. On the chip 22 , the lens 21 does not need to be provided with a condenser lens 215 . Or, it is not necessary to set the light-shielding housing 24 separately, and only need to protrude from the side of the lens 21 adjacent to the photosensitive chip 22 to be provided with two baffle walls (not shown), and the surface of the two baffle walls adjacent to the photosensitive chip 22 is provided with anti-penetration. Optical layer (not shown), the photosensitive chip 22 is accommodated between the two barrier walls, so as to prevent external light and light from the light source 20 from being scattered on the photosensitive chip 22 . the

Furthermore, during implementation, the light source 20, the photosensitive chip 22 and the light-shielding housing 24 can be manufactured as a whole, that is, a separate sensing chip can be formed, so that it can be directly welded on the circuit board 23, and then form a single sensor chip with the lens 21. separate modules. the

In addition, in the above-mentioned narration, it is assumed that the refractive index of the target object 3 is larger than the refractive index of the lens 21 so as to destroy the total reflection condition. is n, the refractive index of the external medium outside the lens is m, the refractive index of the target object is k, and the refractive index n of the lens is greater than the refractive index of the external medium m, and the refractive index k of the target object is smaller than the refractive index n of the lens, so When the target object is not placed on the operating area, the incident angle of the light reflected by the reflective surface is greater than or equal to arcsin (m/n), i.e. the critical angle between the external medium and the surface of the lens 21, so the light reflected by the reflective surface is at Total reflection is formed inside the lens, and when the target object is placed on the operating area, since the refractive index k of the target object is smaller than the refractive index n of the lens, there will also be a critical angle between the target object and the surface of the lens, that is, arcsin(k/ n), if the incident angle of the light reflected by the reflective surface is greater than the critical angle between the target object and the surface of the lens, the light will also form total reflection in the lens and cannot be irradiated to the photosensitive chip to form a sensing image, so it must be ensured The incident angle of the light reflected by the reflective surface is smaller than arcsin(k/n), that is, smaller than the critical angle between the target object and the lens surface. It is irradiated on the photosensitive chip, that is, in this case, it is necessary to ensure that the incident angle of the light reflected by the reflective surface is greater than or equal to arcsin (m/n) and less than or equal to arcsin (k/n), so that the target object is not placed on the operating area. When the target object is placed on the operating area, the light can be reflected by the surface of the target object and then illuminate the photosensitive chip. the

Of course, the utility model can also be implemented on an electronic device in another way, the electronic device at least includes a display screen, a main circuit board and a casing, and the electronic device also includes an optical sensing module, which includes a sensing Chip and lens, the sensing chip is welded on the main circuit board, including a light source, photosensitive chip and light-shielding housing, the lens is arranged above the sensing chip, and the lens includes a reflective surface and an operating area for placing a target object. The difference from the embodiment described in Fig. 2 and Fig. 3 is that the light source, the photosensitive chip and the light-shielding housing are formed into an independent sensing chip, and the sensing chip is directly welded on the main circuit board of the electronic device, and then on the Components such as lenses are installed on the sensing chip. the

Compared with the prior art, the utility model makes the incident angle of the light reflected by the reflective surface of the lens larger than the critical angle between the external medium and the lens surface when the target object is not placed on the operating area, so that the light is within the lens Form total reflection, so as to prevent glare and improve the comfort of use, and the target object is placed behind the operating area, or because the refractive index of the target object is greater than the refractive index of the lens, the total reflection condition is destroyed, or when the refraction of the target object When the index is less than the refractive index of the lens, since the incident angle of the light reflected by the reflective surface is smaller than the critical angle between the target object and the lens surface, the total reflection condition is destroyed, so the light reflected by the reflective surface is reflected by the surface of the target object. Illuminates onto a photosensitive chip to form an image. Furthermore, since the operation area for placing the target object is directly set on the surface of the lens, there is no need to set a navigation panel, and the reflective surface and the condensing lens are all set on the lens as a whole, thereby helping to reduce the overall height of the optical sensing module. At the same time, the optical sensing module does not need other independent or movable components, so it is simple in structure and easy to manufacture, thereby reducing the manufacturing cost of the optical sensing module. the

Claims (54)

1. optical sensor module, comprise a light source, the lens of transmission light source emission light, sensitive chip and circuit board, wherein this sensitive chip is arranged on the circuit board and with circuit board and electrically connects, these lens are located at the sensitive chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, and light does not leave lens medium in this process, the refractive index of lens is n, the outer external agency refractive index of lens is m, the refractive index of target object is k, it is characterized in that: the surface of the relative sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

2. optical sensor module as claimed in claim 1 is characterized in that: described light source is a coherent source.

3. as optical sensor module as described in the claim 2, its feature is being: described light source is a LASER Light Source.

4. optical sensor module as claimed in claim 1 is characterized in that: described light source is an incoherent light source.

5. optical sensor module as claimed in claim 1 is characterized in that: the surface of the relative light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

6. optical sensor module as claimed in claim 1, it is characterized in that: this sensitive chip and light source periphery also are provided with a shading housing, this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

7. optical sensor module as claimed in claim 6 is characterized in that: this sensitive chip, light source and shading housing are an integral body.

8. optical sensor module as claimed in claim 1 is characterized in that: this circuit board is a flexible printed circuit board, and light source and sensitive chip all are arranged on this flexible printed circuit board.

9. optical sensor module as claimed in claim 1, it is characterized in that: this sensitive chip periphery is provided with a shading housing, and this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

10. optical sensor module as claimed in claim 1 is characterized in that: the side of the contiguous sensitive chip of these lens is protruded and is provided with two retaining walls, and the contiguous surface of this two retaining wall and sensitive chip is provided with anti-photic zone, and this sensitive chip is located between this two retaining wall.

11. optical sensor module, comprise a light source, the lens of transmission light source emission light, sensitive chip and circuit board, wherein this light source and sensitive chip all are arranged on the circuit board and with circuit board and electrically connect, these lens are located at the sensitive chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, it is characterized in that: the surface of the relative sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

12. optical sensor module as claimed in claim 11 is characterized in that: described light source is a coherent source.

13. as optical sensor module as described in the claim 12, its feature is being: described light source is a LASER Light Source.

14. optical sensor module as claimed in claim 11 is characterized in that: described light source is an incoherent light source.

15. optical sensor module as claimed in claim 11 is characterized in that: the surface of the relative light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

16. as optical sensor module as described in the claim 11, it is characterized in that: this sensitive chip and light source periphery also are provided with a shading housing, this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

17. optical sensor module as claimed in claim 16 is characterized in that: this sensitive chip, light source and shading housing are an integral body.

18. optical sensor module as claimed in claim 11 is characterized in that: this circuit board is a flexible printed circuit board, and light source and sensitive chip all are arranged on this flexible printed circuit board.

19. optical sensor module as claimed in claim 11, it is characterized in that: this sensitive chip periphery is provided with a shading housing, and this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

20. optical sensor module as claimed in claim 11 is characterized in that: the side of the contiguous sensitive chip of these lens is protruded and is provided with two retaining walls, and the contiguous surface of this two retaining wall and sensitive chip is provided with anti-photic zone, and this sensitive chip is located between this two retaining wall.

21. electronic installation, comprise a shell and main circuit board, and be equiped with an optical sensor module on this shell, this optical sensor module and main circuit board electrically connect, this optical sensor module comprises a light source, the lens of transmission light source emission light, sensitive chip and circuit board, wherein this sensitive chip is arranged on the circuit board and with circuit board and electrically connects, these lens are located at the sensitive chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, and light does not leave lens medium in this process, the refractive index of lens is n, and the outer external agency refractive index of lens is m, and the refractive index of target object is k, it is characterized in that: the surface of the relative sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

22. electronic installation as claimed in claim 21 is characterized in that: described light source is a coherent source.

23. as electronic installation as described in the claim 22, its feature is being: described light source is a LASER Light Source.

24. electronic installation as claimed in claim 21 is characterized in that: described light source is an incoherent light source.

25. electronic installation as claimed in claim 21 is characterized in that: the surface of the relative light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

26. electronic installation as claimed in claim 21, it is characterized in that: this sensitive chip and light source periphery also are provided with a shading housing, this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

27. electronic installation as claimed in claim 26 is characterized in that: this sensitive chip, light source and shading housing are an integral body.

28. electronic installation as claimed in claim 21 is characterized in that: this circuit board is a flexible printed circuit board, and light source and sensitive chip all are arranged on this flexible printed circuit board.

29. electronic installation as claimed in claim 21, it is characterized in that: this sensitive chip periphery is provided with a shading housing, and this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

30. electronic installation as claimed in claim 21 is characterized in that: the side of the contiguous sensitive chip of these lens is protruded and is provided with two retaining walls, and the contiguous surface of this two retaining wall and sensitive chip is provided with anti-photic zone, and this sensitive chip is located between this two retaining wall.

31. electronic installation, comprise a shell and main circuit board, and be equiped with an optical sensor module on this shell, this optical sensor module and main circuit board electrically connect, this optical sensor module comprises a light source, the lens of transmission light source emission light, sensitive chip and circuit board, wherein this light source and sensitive chip all are arranged on the circuit board and with circuit board and electrically connect, these lens are located at the sensitive chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, it is characterized in that: the surface of the relative sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

32. electronic installation as claimed in claim 31 is characterized in that: described light source is a coherent source.

33. electronic installation as claimed in claim 32, its feature is being: described light source is a LASER Light Source.

34. electronic installation as claimed in claim 31 is characterized in that: described light source is an incoherent light source.

35. electronic installation as claimed in claim 31 is characterized in that: the surface of the relative light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

36. electronic installation as claimed in claim 31, it is characterized in that: this sensitive chip and light source periphery also are provided with a shading housing, this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

37. electronic installation as claimed in claim 36 is characterized in that: this sensitive chip, light source and shading housing are an integral body.

38. electronic installation as claimed in claim 31 is characterized in that: this circuit board is a flexible printed circuit board, and light source and sensitive chip all are arranged on this flexible printed circuit board.

39. electronic installation as claimed in claim 31, it is characterized in that: this sensitive chip periphery is provided with a shading housing, and this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

40. electronic installation as claimed in claim 31 is characterized in that: the side of the contiguous sensitive chip of these lens is protruded and is provided with two retaining walls, and the contiguous surface of this two retaining wall and sensitive chip is provided with anti-photic zone, and this sensitive chip is located between this two retaining wall.

41. electronic installation, at least comprise display screen, main circuit board and housing, and this electronic installation also comprises an optical sensor module, this optical sensor module comprises an induction chip and lens, this induction chip is welded on the main circuit board, comprise a light source, sensitive chip and shading housing, these lens are located at the induction chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, it is characterized in that: the surface of the contiguous sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

42. electronic installation as claimed in claim 41 is characterized in that: described light source is a coherent source.

43. as electronic installation as described in the claim 42, its feature is being: described light source is a LASER Light Source.

44. electronic installation as claimed in claim 41 is characterized in that: described light source is an incoherent light source.

45. electronic installation as claimed in claim 41 is characterized in that: the surface of the contiguous light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

46. electronic installation as claimed in claim 41 is characterized in that: this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

47. electronic installation as claimed in claim 41 is characterized in that: this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

48. electronic installation, at least comprise display screen, main circuit board and housing, and this electronic installation also comprises an optical sensor module, this optical sensor module comprises an induction chip and lens, this induction chip is welded on the main circuit board, comprise a light source, sensitive chip and shading housing, these lens are located at the induction chip top, comprise and be set to holistic illumination path and imaging optical path, wherein illumination path comprises a reflecting surface, these lens also are provided with the operating area of placing for target object simultaneously, this reflecting surface reflexes to operating area with the light of light emitted, and light does not leave lens medium in this process, the refractive index of lens is n, and the outer external agency refractive index of lens is m, and the refractive index of target object is k, it is characterized in that: the surface of the contiguous sensitive chip of these lens is protruded and is provided with a collector lens, is radiated on the sensitive chip after this collector lens is assembled through the light after the target object surface reflection.

49. electronic installation as claimed in claim 48 is characterized in that: described light source is a coherent source.

50. electronic installation as claimed in claim 49, its feature is being: described light source is a LASER Light Source.

51. electronic installation as claimed in claim 48 is characterized in that: described light source is an incoherent light source.

52. electronic installation as claimed in claim 48 is characterized in that: the surface of the contiguous light source of these lens is a concave spherical surface, and this light source is located at the center of this concave spherical surface.

53. electronic installation as claimed in claim 48 is characterized in that: this shading housing is provided with first and second receiving space of accommodating sensitive chip and light source respectively, and this first and second receiving space is isolated mutually.

54. electronic installation as claimed in claim 48 is characterized in that: this shading housing with the contiguous wall of sensitive chip on be provided with a non-spherical lens, be radiated on the sensitive chip after this non-spherical lens is assembled through the light after the target object surface reflection.

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