CN201780992U - Package structure of series flexible light-emitting diodes - Google Patents

Abstract

The utility model provides a compliance emitting diode packaging structure contains: a first metal substrate; a light emitting diode chip carried on the first metal substrate by a conductive adhesive; a second metal substrate electrically connected with the LED chip by wire bonding, wherein a space is arranged between the first metal substrate and the second metal substrate; and a flexible packaging colloid which is used for completely packaging the LED chip and partially packaging the first metal substrate and the second metal substrate so as to expose the lower surface of the first metal substrate and the second metal substrate. And the plurality of light emitting diodes can be electrically connected in parallel or in series by utilizing the structural principle. The metal substrate can effectively improve the heat dissipation effect, and the flexible characteristic can be matched with various lamps.

Description

Package structure of series flexible light-emitting diodes

technical field

The utility model relates to the field of light-emitting diode packaging, in particular to a flexible light-emitting diode packaging structure that uses a metal substrate to carry a diode chip to improve heat dissipation efficiency and uses a flexible packaging colloid.

Background technique

The technical development of Light Emitting Diode (LED) has become increasingly mature, and its application fields are also extremely wide and practical. For example, the use of LED lights as display backlight settings, indoor and outdoor electronic billboards, or directly as lighting fixtures, etc., can be seen everywhere.

However, no matter what field it is used in, in order to enhance the brightness of its light source, it is common practice to accumulate multiple LEDs and use them at the same time. Although such an approach can directly and effectively achieve its purpose, it is accompanied by the issue of heat dissipation efficiency. In addition, traditional LED lamps often use printed circuit boards as substrates. Since the substrate material is not conducive to conduction and heat dissipation, the light-emitting elements are prone to fail or burn out due to the high temperature.

In addition, in addition to using a large number of LED lamps at the same time to enhance the intensity of the light source, in order to match the shape and appearance of various lamps, the traditional LED lamps are not designed to be bendable as a whole. In this regard, an improvement is proposed by using a flexible material as the substrate to achieve bending of each independent LED lamp. However, for multiple LED light devices in a single packaging body, the purpose of bending cannot be achieved. In this way, for the purpose of accumulating multiple LEDs to enhance the brightness and to achieve the purpose of being bendable, under the condition that each LED lamp is individually packaged and does not contact each other, the limited arrangement density will limit its configuration.

In view of this, the author proposes a flexible light-emitting diode packaging structure. In addition to changing the substrate material to achieve high-efficiency heat dissipation, the packaging gel is also implemented using flexible materials to achieve the overall LED light. bendable purpose.

Contents of the invention

In view of the above problems, the purpose of this utility model is to provide a light-emitting diode that can effectively improve the heat dissipation efficiency, and at the same time change the existing rigid packaging structure, and use flexible packaging colloid to make the packaged light-emitting diode also bendable for implementation, and Loaded on various types of lighting structures.

In order to achieve the above purpose, the utility model proposes a flexible light-emitting diode packaging structure, including: a first metal substrate; a light-emitting diode chip, which is carried on the first metal substrate by using a conductive glue; a second metal substrate a substrate electrically connected to the light-emitting diode chip by wire bonding, wherein there is a space between the first metal substrate and the second metal substrate; and an encapsulant, which is a flexible material and completely covers the light-emitting diode chip and partially covering the first metal substrate and the second metal substrate, so that the lower surfaces of the first metal substrate and the second metal substrate are exposed.

Wherein the conductive glue is a solder paste or silver glue. The flexible LED packaging structure further includes: two pins electrically connected to the first metal substrate and the second metal substrate respectively.

In practice, the conductive adhesive is a solder paste.

During implementation, the conductive glue is a silver glue.

In order to achieve the above purpose, the utility model also proposes a parallel flexible light emitting diode packaging structure, including: a chip carrier, having at least one V-shaped groove to form a plurality of first metal substrates, and using a plurality of conductive adhesives A light-emitting diode chip and a second metal substrate are respectively arranged on the plurality of first metal substrates, and are respectively electrically connected to the plurality of light-emitting diode chips through bonding, wherein there is a chip carrier and the second metal substrate. spacer; and an encapsulant, which is a flexible material and completely covers the multi-light-emitting diode chip and partially covers the chip carrier and the second metal substrate, so that the chip carrier and the lower layer of the second metal substrate The surface is exposed.

In order to achieve the above purpose, the utility model also proposes a series-type flexible light-emitting diode packaging structure, including: a plurality of light-emitting diode units, which are electrically connected in series with each other, wherein each light-emitting diode unit includes: a first a metal substrate; and a light-emitting diode chip, which is carried on the first metal substrate by using a conductive glue; a second metal substrate, which is electrically connected to the multi-light-emitting diode unit by bonding, wherein each of the first metal There is a gap between the substrates and between each of the first metal substrates and the second metal substrate; and an encapsulant, which is a flexible material and completely covers the multiple LED chips and partially covers the multiple first metal substrates. The metal substrate and the second metal substrate expose the lower surfaces of the first metal substrate and the second metal substrate.

In order to achieve the above purpose, the utility model also proposes a flexible light emitting diode packaging structure, including: a first metal substrate; a light emitting diode chip, which is carried on the first metal substrate by using a conductive glue; two second Two metal substrates are respectively electrically connected to the positive and negative electrodes of the light-emitting diode chip through wire bonding, wherein there is a space between the first metal substrate and the two second metal substrates; The flexible material completely covers the LED chip and partially covers the first metal substrate and the two second metal substrates, so that the lower surfaces of the first metal substrate and the two second metal substrates are exposed.

In order to achieve the above purpose, the utility model also proposes a flexible light-emitting diode packaging structure, including: a first metal substrate; a light-emitting diode chip, wherein one end of the positive and negative electrodes of the light-emitting diode chip is carried on the On the first metal substrate; a second metal substrate, wherein the other end of the positive and negative electrodes of the light-emitting diode chip is carried on the second metal substrate by using the conductive glue; the first metal substrate and the second metal substrate There is a gap between them; and an encapsulant, which is a flexible material and completely covers the light-emitting diode chip and partially covers the first metal substrate and the second metal substrate, so that the first metal substrate and the second metal substrate The lower surface of the metal substrate is exposed.

Compared with the prior art, the flexible light-emitting diode packaging structure provided by the utility model utilizes the metal substrate as the diode chip. In this way, the heat dissipation efficiency can be greatly improved, and it is widely used in products with high power or accumulated multiple LED lamps. In addition, the flexible encapsulating colloid can enable the utility model to be bent and implemented after the encapsulation is completed, so that it can be mounted on various types of lamps, which thoroughly improves the applicability of the utility model. At the same time, when the multiple light-emitting diode chips are used in series or in parallel, the aforementioned advantages can still be effectively brought into play.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of a preferred embodiment of the present invention;

Fig. 2A is a schematic plan view of a preferred embodiment of the utility model;

Fig. 2B is a schematic diagram of a bending plane of a preferred embodiment of the utility model;

Fig. 3A is a top view of the structure of a plurality of light-emitting diode chips connected in parallel in the utility model;

Fig. 3B is a side view of the structure of multiple light-emitting diode chips connected in parallel in the utility model;

Fig. 4A is a top view of the structure of a plurality of light-emitting diode chips connected in series in the utility model;

Fig. 4B is a side view of the structure of a plurality of light-emitting diode chips connected in series in the utility model;

Fig. 5 is a side view of a preferred embodiment in which the positive and negative electrodes of the light-emitting diode chip of the package structure of the present invention are located on the front side;

FIG. 6 is a side view of a preferred embodiment in which both the positive and negative electrodes of the light-emitting diode chip are located on the back side of the package structure of the present invention.

Explanation of reference signs: 1-chip carrier; 10-first metal substrate; 2-light-emitting diode unit; 20-second metal substrate; 30-light-emitting diode chip; 40-packaging colloid; 50-conductive glue; 60-interval ; 70-two pins.

Detailed ways

In order to enable your examiner to clearly understand the content of this utility model, the following descriptions are used to match the drawings, please refer to them.

Please refer to FIG. 1 , FIG. 2A and FIG. 2B , which are respectively a perspective view, a plan view and a structure bending plan view of a preferred embodiment of the present invention. As can be seen from the figure, the present invention provides a flexible LED packaging structure, including: a first metal substrate 10 , a LED chip 30 , a second metal substrate 20 and an encapsulation compound 40 . Wherein the first metal substrate 10 is used to carry the LED chip 30 , and in order to stabilize the LED chip 30 , a conductive glue 50 can be placed between the LED chip 30 and the first metal substrate 10 . In addition, the purpose of using the metal substrate is to enhance the heat dissipation effect of the LED, so any material can be selected as long as it has better thermal conductivity, for example, metals including aluminum or copper can be used. In addition, the second metal substrate 20 is electrically connected to the LED chip 30 via wire bonding. There is a gap 60 between the first metal substrate 10 and the second metal substrate 20, so that the first metal substrate 10 and the second metal substrate 20 can be used as positive and negative electrodes independently of each other, and because the The encapsulant 40 is a flexible material, so when the encapsulant 40 wraps the first metal substrate 10 and the second metal substrate 20 , the gap 60 can be used for bending.

In order to enhance the effect of heat dissipation, the encapsulant 40 does not completely cover the first metal substrate 10 and the second metal substrate 20, so that the lower surfaces of the first metal substrate 10 and the second metal substrate 20 are exposed to the environment or other The external cooling fins are in direct contact, effectively enhancing the overall cooling effect. As for the LED chip 30, it is completely covered in the encapsulant 30 for protection.

In addition, the heat conduction adhesive 50 can use solder paste or silver paste to enhance the stability of the LED chip 30 and effectively conduct heat to the first metal substrate 10 in consideration of heat conduction efficiency.

In addition to using the first metal substrate 10 and the second metal substrate 20 as positive and negative electrodes, it can also include two pins 70 electrically connected to the first metal substrate 10 and the second metal substrate 20 respectively, and then The two pins 70 can be directly soldered on various circuit boards.

Please refer to FIG. 3A and FIG. 3B together, which are a top view and a side view of the structure of multiple light-emitting diode chips connected in parallel in the present invention. This embodiment utilizes the structural principles of the foregoing embodiments and includes a chip carrier 1 , a second metal substrate 20 and an encapsulant 40 , and a plurality of LED chips 30 connected in parallel are formed on the chip carrier 1 . Structurally, the chip carrier 1 has at least one V-shaped groove to form a plurality of first metal substrates 10 , and then the plurality of LED chips 30 are adhered on the plurality of first metal substrates 10 by conductive adhesive 50 . The other electrode arrangement is to use the second metal substrate 20 to electrically connect with the multi-LED chip 30 through wire bonding, wherein there is a gap 60 between the chip carrier 1 and the second metal substrate 20 . In addition, similar to the foregoing embodiments, in order to achieve the purpose of being bendable, the encapsulant 40 is a flexible material and completely covers the LED chip 30, and partially covers the chip carrier 1 and the second metal substrate. 20, so that the wafer carrier 1 and the lower surface of the second metal substrate 20 are exposed, so as to effectively improve heat dissipation efficiency and be bendable.

Please refer to FIG. 4A and FIG. 4B together, which are a top view and a side view of the structure of a plurality of light-emitting diode chips connected in series in the present invention. As can be seen from the figure, this embodiment includes a plurality of LED units 2 , a second metal substrate 20 and an encapsulant 40 . The plurality of LED units 2 are electrically connected in series, and each of the LED units 2 includes a first metal substrate 10 and an LED chip 30 . Same as the previous embodiment, the LED chip 30 is mounted on the first metal substrate 10 with a conductive glue 50 . The second metal substrate 20 is electrically connected to the multi-LED unit 2 via wire bonding. There is a gap 60 between each first metal substrate 10 and between each first metal substrate 10 and the second metal substrate 20 . The purpose is the same as that of the above-mentioned embodiments, except that the spacer 60 is mainly for achieving the purpose of being bendable except that it is used to separate the configurations of the electrodes. The encapsulation compound 40 is a flexible material for the purpose of bending after encapsulation. At the same time, the encapsulant 40 completely covers the multiple light-emitting diode chips 30 and partially covers the multiple first metal substrates 10 and the second metal substrate 20, so that the multiple first metal substrates 10 and the second metal substrate 20 The surface of the lower layer is exposed, which can effectively improve its heat dissipation efficiency.

Please refer to FIG. 5 , which is a side view of a preferred embodiment in which the positive and negative electrodes of the LED chip of the package structure of the present invention are located on the front side. As can be seen from the figure, the flexible LED packaging structure of this embodiment includes a first metal substrate 10 , a LED chip 30 , two second metal substrates 20 and an encapsulant 50 . The LED chip 30 is mounted on the first metal substrate 10 with a conductive glue 50 . Since the positive and negative terminals of the light emitting diode chip 30 are arranged on the front side, the first metal substrate 10 is only used for supporting the light emitting diode chip 30 . As for the positive and negative poles of the LED chip 30 , they are electrically connected to the two second metal substrates 20 by wire bonding. Meanwhile, in order to achieve the purpose of isolating the positive and negative electrodes from each other, there is a space 60 between the first metal substrate 10 and the two second metal substrates 20 . Same as the above-mentioned embodiments, in order to achieve the purpose of overall bending after encapsulation, the encapsulant 40 is a flexible material and completely covers the light-emitting diode chip 30 and partially covers the first metal substrate 10 and the two There are two second metal substrates 20, so that the lower surfaces of the first metal substrate 10 and the two second metal substrates 20 are exposed, thereby achieving high heat dissipation efficiency.

Please refer to FIG. 6 , which is a side view of a preferred embodiment in which the positive and negative electrodes of the LED chip of the package structure of the present invention are located on the back side. As can be seen from the figure, the flexible LED packaging structure of this embodiment includes a first metal substrate 10 , a LED chip 30 , a second metal substrate 20 and an encapsulant 50 . Since the positive and negative electrodes of the light emitting diode chip 30 in this embodiment are all arranged on the back side thereof, one end of the positive and negative electrodes of the light emitting diode chip 30 is carried on the first metal substrate 10 with a conductive glue; The other ends of the positive and negative electrodes of the LED chip 30 are carried on the second metal substrate 20 by using the conductive glue 50 . Meanwhile, in order to achieve the purpose of isolating the positive and negative electrodes from each other, there is a gap 60 between the first metal substrate 10 and the second metal substrate 20 . Same as the previous embodiment, in order to achieve the purpose of overall bending after encapsulation, the encapsulant 40 is a flexible material that completely covers the LED chip 30 and partially covers the first metal substrate 10 and the second metal substrate 10 . Two metal substrates 20, so that the lower surfaces of the first metal substrate 10 and the second metal substrate 20 are exposed, thereby achieving high heat dissipation efficiency.

The efficacy of the utility model lies in that the flexible light-emitting diode packaging structure utilizes the metal substrate as the diode chip. In this way, the heat dissipation efficiency can be greatly improved, and it is widely used in products with high power or accumulated multiple LED lamps. In addition, the flexible encapsulating colloid can enable the utility model to be bent and implemented after the encapsulation is completed, so that it can be mounted on various types of lamps, which thoroughly improves the applicability of the utility model. At the same time, when the multiple light-emitting diode chips are used in series or in parallel, the aforementioned advantages can still be effectively brought into play.

What is described above is only a preferred embodiment of the present utility model, and is not intended to limit the scope of implementation of the present utility model. Therefore, equivalent or easy changes made by those skilled in the art will not depart from the scope of the present utility model. The equivalent changes and modifications made under the spirit and scope should all be covered within the patent scope of the present utility model.

Claims (8)

1. a pliability package structure for LED is characterized in that, comprises:

One first metal substrate;

One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;

One second metal substrate is electrically connected through routing and this LED wafer, wherein, has one between this first metal substrate and this second metal substrate at interval; And

One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate with local, and makes this first metal substrate and this second metal substrate lower floor surface exposed.

2. pliability package structure for LED as claimed in claim 1 is characterized in that, this conducting resinl is a tin cream.

3. pliability package structure for LED as claimed in claim 1 is characterized in that, this conducting resinl is an elargol.

4. as claim 1,2 or 3 described pliability package structure for LED, it is characterized in that, more comprise two pins, described two pins is electrically connected with this first metal substrate and this second metal substrate respectively.

5. a parallel pliability package structure for LED is characterized in that, comprises:

One wafer carrier has at least one V-type groove and forms a plurality of first metal substrates, and utilizes a plurality of conducting resinls respectively at a LED wafer is set on these a plurality of first metal substrates;

One second metal substrate, and be electrically connected with this pilosity optical diode wafer respectively through routing, wherein, have one between this wafer carrier and this second metal substrate at interval; And

One packing colloid is a flexible materials and coat this pilosity optical diode wafer fully and coat this wafer carrier and this second metal substrate with local, and makes this wafer carrier and this second metal substrate lower floor surface exposed.

6. a tandem pliability package structure for LED is characterized in that, comprises:

A plurality of light emitting diodes are being electrically connected of a series connection each other, and this light emitting diode respectively wherein comprises:

One first metal substrate; And

One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;

One second metal substrate, and be electrically connected through routing and this pilosity optical diode unit wherein, has an interval between this each first metal substrate and between this each first metal substrate and this second metal substrate; And

One packing colloid is a flexible materials and coat this pilosity optical diode wafer fully and coat these first metal substrates and this second metal substrate with local, and makes these many first metal substrates and this second metal substrate lower floor surface exposed.

7. a pliability package structure for LED is characterized in that, comprises:

One first metal substrate;

One LED wafer is utilized a conducting resinl and is stated from this first metal substrate;

Two second metal substrates are electrically connected with this LED wafer positive and negative electrode end respectively through routing, wherein, have one between this first metal substrate and this two second metal substrates respectively at interval; And

One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this two second metal substrates with local, and makes this first metal substrate and this two second metal substrate lower floors surface exposed.

8. a pliability package structure for LED is characterized in that, comprises:

One first metal substrate;

One LED wafer, wherein an end of this LED wafer positive and negative electrode utilizes a conducting resinl and is stated from this first metal substrate;

One second metal substrate, wherein the other end of this LED wafer positive and negative electrode utilizes this conducting resinl and is stated from this second metal substrate; Have one between this first metal substrate and this second metal substrate at interval; And

One packing colloid is a flexible materials and coat this LED wafer fully and coat this first metal substrate and this second metal substrate with local, and makes this first metal substrate and this second metal substrate lower floor surface exposed.

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