CN201779526U - Led light source - Google Patents
Led light source Download PDFInfo
- Publication number
- CN201779526U CN201779526U CN201020542205XU CN201020542205U CN201779526U CN 201779526 U CN201779526 U CN 201779526U CN 201020542205X U CN201020542205X U CN 201020542205XU CN 201020542205 U CN201020542205 U CN 201020542205U CN 201779526 U CN201779526 U CN 201779526U
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- CN
- China
- Prior art keywords
- led chip
- led
- light source
- led light
- photic zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 7
- 210000002421 cell wall Anatomy 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 210000005056 cell body Anatomy 0.000 claims description 3
- 239000002223 garnet Substances 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 34
- 238000005516 engineering process Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
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- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses an LED light source, which comprises a bearing substrate, a fluorescent wafer and LED chips. Bottom surfaces of the LED chips are fixed onto the bearing substrate, light transmitting layers are wrapped outside the LED chip and are glue dots formed on the LED chips, wherein the light transmitting layer on the top surface of each LED chip is a thin layer, the light transmitting layers on the side surfaces of the LED chip are inclined structures which lead horizontal emergent light to be refracted upwards, and the fluorescent wafer is pressed on the light transmitting layers on the top surfaces of the LED chips. The LED light source is capable of greatly increasing radiating effect and leads LEDs to work better at lower temperature, and simultaneously light emergent utilization rate of the LEDs is high.
Description
Technical field
The utility model relates to a kind of light source, relates in particular to a kind of led light source.
Background technology
Along with the led chip luminous efficiency increases substantially continuous reduction with cost, the LED application product has progressed into the market application.
Development of Packaging Technology is a decision LED product key in application, single 1WLED encapsulating products is more in the market, but find in actual applications will single 1W the lamp pearl when being applied in the light fixture owing to lamp pearl quantity is more, cause the photochromic uniformity of light source poor, the colour temperature deviation is bigger, problems such as the colour temperature difference on the different directions is also bigger, and integrated encapsulated LED light source can address these problems to a certain extent, but because integrated encapsulated LED light source heat is more concentrated, node temperature height and fluorescent material are easier to be aging, fail well to be used.Therefore, be necessary to design radiating effect led light source better, simple in structure, to adapt to the needs in led light source market.
In addition, the LED light direction is not concentrated, and except the exiting surface of end face, the side also can be luminous.But in the LED encapsulating structure, do not have the light that send fine consideration side, these light are mostly absorbed by peripheral obstacle and lose.Particularly a plurality of LED are arranged in conplane structure together, lose more serious.
The utility model content
The technical problem that the utility model mainly solves provides a kind of led light source, can significantly improve radiating effect LED is preferably worked at a lower temperature, and LED goes out the light utilization efficiency height simultaneously.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of led light source is provided, comprises: bearing substrate, fluorescence wafer and led chip; The bottom surface of described led chip is fixed on the bearing substrate, and the led chip outside coats one deck photic zone; Described photic zone is the some glue that is formed on the led chip, and wherein the photic zone of led chip end face is a thin layer, and the photic zone of led chip side is the incline structure that horizontal emergent light is up reflected; Described fluorescence wafer is pressed on the led chip end face photic zone.
Wherein, described photic zone is silica gel or resin.
Wherein, described bearing substrate is a temperature-uniforming plate.
Wherein, being included in two sliver transvers sections that the temperature-uniforming plate surface is oppositely arranged is the reflector support of L type, and described fluorescence wafer is embedded in two L type reflector supports and constitutes in the cell body, and described mounting groove is open-ended reflector bracket end side position.
Wherein, the heat conduction pressing plate of windowing in the middle of comprising, described bearing substrate comprises mounting groove, described led chip is arranged at the bottom land of described mounting groove, described fluorescence wafer presses solidly on described led chip end face photic zone by the heat conduction pressing plate of top, and the cell wall of described mounting groove is provided with and extraneous air-vent or the groove that communicates.
Wherein, be filled with air or inert gas in the described mounting groove.
Wherein, described led chip quantity is a plurality of, and the matrix arrangement, and described led chip is the LED blue chip, and described fluorescence wafer is a gold-tinted fluorescence wafer.
Wherein, described gold-tinted fluorescence wafer is that yttrium aluminium garnet YAG wafer or surface-coated have gold-tinted fluorescent material.
The beneficial effects of the utility model are: be different from the not good and light source of prior art led light source radiating effect and go out the not high situation of light utilization efficiency, the simple dispensing technology of the utility model utilization, form photic zone on the led chip surface, play the effect of protection oxygen barrier, the more important thing is the photic zone incline structure of led chip side, the light that the led chip side is sent up reflects, make full use of this part light, can not make its loss, thereby on the basis of not improving the power of led chip own, improve brightness greatly; The utility model also designs the fluorescence wafer and presses solidly the end face at LED, and the heat of led chip can be directly conducted to the fluorescence wafer, and the fluorescence wafer is because area is big, can quick heat radiating, and LED is preferably worked at a lower temperature.
The utility model also designs the fluorescence wafer and is fixed on and states on the mounting groove, has spacing between led chip, makes to have heat-dissipating space between the led chip in the groove, for the gaseous exchange heat radiation provides necessary condition; Simultaneously, cell wall at mounting groove is provided with and extraneous air-vent or the groove that communicates, space in the mounting groove is communicated with space outerpace, the heat that makes led chip send is directed at the outside by air or inert gas, this structure is beneficial to heat and distributes efficiently, can significantly improve radiating effect, led chip is preferably worked at a lower temperature, prolong the life-span of led chip greatly.
Description of drawings
Fig. 1 is the solid combination schematic diagram of the utility model led light source embodiment one;
Fig. 2 is the partial cross section figure of the utility model led light source embodiment one;
Fig. 3 is the perspective exploded view of the utility model led light source embodiment one;
Fig. 4 is the part schematic perspective view of the utility model led light source embodiment two;
Fig. 5 is the three-dimensional exploded view of the utility model led light source embodiment three;
Fig. 6 is the schematic cross-section of the LED street lamp that is applied to of the utility model led light source embodiment.
The specific embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
Consult Fig. 1 and Fig. 2, the utility model led light source embodiment one comprises:
The bottom surface of described led chip 33 is fixed on the bearing substrate 31, and led chip 33 outsides coat one deck photic zone 37;
Described photic zone 37 is for being formed on the some glue on the led chip 33, and wherein the photic zone 37 of led chip 33 end faces is a thin layer, the incline structure of photic zone 37 for horizontal emergent light is up reflected of led chip 33 sides;
Described fluorescence wafer 34 is pressed on the photic zone 37 of led chip 33 end faces.
The simple dispensing technology of the utility model utilization, form photic zone 37 on led chip 33 surfaces, play the effect of protection oxygen barrier, the more important thing is photic zone 37 incline structures of led chip 33 sides, the light that led chip 33 sides are sent up reflects, make full use of this part light, can not make its loss, thereby on the basis of not improving led chip 33 power own, improve brightness greatly;
The utility model also designs fluorescence wafer 34 and presses solidly at led chip 33 end faces, and the heat of led chip 33 can be directly conducted to fluorescence wafer 34, and fluorescence wafer 34 is because area is big, can quick heat radiating, and led chip 33 is preferably worked at a lower temperature.
Owing to adopt dispensing technology, technology is very simple, and the glue of fusion can cover whole LED chip 33 in the distortion of gravity effect current downflow on dropping in led chip 33 time automatically, and form the photic zone 37 of incline structure naturally at led chip 33 sides, easy to make, cost is extremely low.
Wherein, described photic zone 37 is silica gel or resin, or the suitable material of other printing opacities.
Consult Fig. 1, Fig. 2 and Fig. 3, the utility model led light source embodiment two comprises:
Described bearing substrate 31 comprises mounting groove 32, and described led chip 33 is arranged at the bottom land of described mounting groove 32, and described fluorescence wafer 34 horizontal fixed are on described mounting groove 32;
The cell wall of described mounting groove 32 is provided with and extraneous air-vent or the groove (present embodiment is a groove 35) that communicates; Described led chip 33 is wrapped up by photic zone.
The foregoing description design fluorescence wafer 34 is fixed on the described mounting groove 32, has spacing between the led chip 33, makes to have heat-dissipating space between led chip 33 and the fluorescence wafer 34, for the gaseous exchange heat radiation provides necessary condition; Simultaneously, cell wall at mounting groove 32 is provided with and extraneous air-vent or the groove 35 that communicates, space in the mounting groove 32 is communicated with space outerpace, the heat that makes led chip 33 send is directed at the outside by air or inert gas, this structure is beneficial to heat and distributes efficiently, can significantly improve radiating effect, led chip 33 is preferably worked at a lower temperature.
Described photic zone can be anti oxidation layer or waterproof and dustproof coating etc.
Because therefore the scheme that present embodiment design fluorescence wafer replaces adding fluorescent material in the existing resin and coats led chip only need haggle over thin transparent substance at the led chip peripheral hardware, handles to carry out anti-oxidant treatment or waterproof and dustproof.The heat that thin transparent substance helps led chip comes out as early as possible, and can not cause the heat radiation difficulty as the thick potting resin parcel of prior art.
As described above, when specific design, be filled with air or inert gas in the space by interval between fluorescence wafer 34 and the bottom land in the described mounting groove 32, the heat that makes led chip 33 send is directed at the outside by air or inert gas.
After the heat that led chip 33 sends was directed at the outside, the heat radiation that can circulate in enclosure space also can be led directly to ambient atmosphere, and hot-air is dispersed in the atmosphere.
In one embodiment, the cell wall around the described mounting groove 32 is provided with ladder, is arranged on the described ladder around the described fluorescence wafer 34.Certainly, it is also passable not establish ladder, can allow fluorescence wafer 34 be overlapped on the groove of mounting groove 32 along last.
In one embodiment, the heat conduction pressing plate 36 of windowing in the middle of comprising, described heat conduction pressing plate 36 is fixed in described mounting groove 32 groove edges, and compresses described fluorescence wafer 34.
Wherein, described heat conduction pressing plate 36 is copper sheets.
In one embodiment, described led chip 33 quantity are a plurality of, arrange at described mounting groove 32 bottom land matrixes.
In one embodiment, described led chip 33 is LED blue chips, and described fluorescence wafer 34 is gold-tinted fluorescence wafers 34.Wherein, described gold-tinted fluorescence wafer 34 is that yttrium aluminium garnet YAG wafer or the surface-coated that contains multiple rare earth element has gold-tinted fluorescent material.
Wherein, described transparent substance is silica gel or resin, prevents that led chip 33 from making moist or oxidation by air.
Consult Fig. 4, in the utility model led light source embodiment two, comprise bearing substrate 31 ', led chip 33 ' and fluorescence wafer 34 '.Described bearing substrate 31 ' is a temperature-uniforming plate, and it comprises mounting groove 32 ', and described led chip 33 ' is arranged at the bottom land of described mounting groove 32 ', and described fluorescence wafer 34 ' is stuck on the cell wall of described mounting groove 32 '.And led chip 33 ' is similar to putting a plastic structure with aforementioned first embodiment by one deck silica gel or resin or other photic zones parcel, and the photic zone of led chip 33 ' side is the incline structure that horizontal emergent light is up reflected.Because temperature-uniforming plate itself has higher heat dispersion and bigger surface area, so this structure is beneficial to heat and distributes efficiently, can not need to add in addition simultaneously special radiator.
Scheme for a plurality of led chips 33 ' shown in Figure 4 gather together can add lens in the top of led chip 33 '.
See also Fig. 5, in other embodiment of the utility model led light source, described bearing substrate 31 " be temperature-uniforming plate, temperature-uniforming plate is provided with mounting groove 32 ".And being included in two sliver transvers sections that the temperature-uniforming plate surface is oppositely arranged is the reflector support 321 of L type ".Described fluorescence wafer 34 " be embedded in two L type reflector supports 321 " constitute in the cell body described mounting groove 32 " at reflector support 321 " the open-ended of distolateral position be described air-vent or groove.
Such structure goes for utilizing mounting groove 32 in the lensless led light source product " at reflector support 321 " distolateral position open-ended, making led chip 33 " heat that distributes of front distributes; Simultaneously because described bearing substrate 31 " be high-performance heat radiation sam plate, make led chip 33 " back side while can the amount of loosing, radiating effect significantly promotes.
Certainly, the position of described air-vent or groove and structure are not limited to above-mentioned form, every can be with extraneous and led chip 33 " the superjacent air space air-vent or the groove that are communicated with all be fine.
See also Fig. 6, in one embodiment, the utility model led light source is applied on the LED street lamp, can certainly be applied to scenes such as indoor light source or motor device illuminating lamp, Tunnel Lamp, venue high power searchlight, light source of projector.
Described street lamp is a slab construction, comprises tabular lamp body, heat pipe 20 and the utility model led light source.Described tabular lamp body is a radiator, and described LED is arranged at described tabular lamp body 10 lower surfaces.Described heat pipe 20 is built in the described tabular lamp body, be parallel to described tabular lamp body 10, and an end connects described led light source.
Described lamp body comprises plate-shaped frame and radiating module 13.In one embodiment, described heat pipe 20 is one-body molded with described radiating module 13, and is such as adopting FMT, that heat pipe, the pressing of the used powder material of radiating module is one-body molded; Or comprising pipeline 70 in the described radiating module 13, described heat pipe 20 is arranged in described pipeline 70, is filled with heat conduction with phase change glue 60 between heat pipe 20 and the pipeline 70.Described heat conduction with phase change glue 60 is higher than in temperature and becomes liquid when a certain critical value is spent such as 45, plays heat transfer, buffering, supporting role.
Lamp body can comprise trough 40 among Fig. 6, the electric wire of outside or control line can be connected to led chip in the led light source by this trough 40, and air-vent on the mounting groove or groove in the led light source, this trough 40 and led chip are communicated with space between the fluorescence wafer, and the heat that led chip is sent is circulated to this trough by air or inert gas and dispels the heat.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (8)
1. a led light source is characterized in that, comprising:
Bearing substrate, fluorescence wafer and led chip;
The bottom surface of described led chip is fixed on the bearing substrate, and the led chip outside coats one deck photic zone;
Described photic zone is the some glue that is formed on the led chip, and wherein the photic zone of led chip end face is a thin layer, and the photic zone of led chip side is the incline structure that horizontal emergent light is up reflected;
Described fluorescence wafer is pressed on the led chip end face photic zone.
2. led light source according to claim 1 is characterized in that: described photic zone is silica gel or resin.
3. led light source according to claim 2 is characterized in that: described bearing substrate is a temperature-uniforming plate.
4. led light source according to claim 3, it is characterized in that: being included in two sliver transvers sections that the temperature-uniforming plate surface is oppositely arranged is the reflector support of L type, described fluorescence wafer is embedded in two L type reflector supports and constitutes in the cell body, and described mounting groove is open-ended reflector bracket end side position.
5. led light source according to claim 2, it is characterized in that: the heat conduction pressing plate of windowing in the middle of comprising, described bearing substrate comprises mounting groove, described led chip is arranged at the bottom land of described mounting groove, described fluorescence wafer presses solidly on described led chip end face photic zone by the heat conduction pressing plate of top, and the cell wall of described mounting groove is provided with and extraneous air-vent or the groove that communicates.
6. led light source according to claim 5 is characterized in that: be filled with air or inert gas in the described mounting groove.
7. according to each described led light source of claim 1 to 6, it is characterized in that: described led chip quantity is a plurality of, and the matrix arrangement, and described led chip is the LED blue chip, and described fluorescence wafer is a gold-tinted fluorescence wafer.
8. led light source according to claim 7 is characterized in that: described gold-tinted fluorescence wafer is that yttrium aluminium garnet YAG wafer or surface-coated have gold-tinted fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020542205XU CN201779526U (en) | 2010-09-26 | 2010-09-26 | Led light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020542205XU CN201779526U (en) | 2010-09-26 | 2010-09-26 | Led light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201779526U true CN201779526U (en) | 2011-03-30 |
Family
ID=43792737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020542205XU Expired - Fee Related CN201779526U (en) | 2010-09-26 | 2010-09-26 | Led light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201779526U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013121347A1 (en) | 2012-02-16 | 2013-08-22 | Koninklijke Philips N.V. | Optical element for uniform lighting |
| CN103943755A (en) * | 2014-03-20 | 2014-07-23 | 昆山开威电子有限公司 | White light LED packaging structure and packaging method |
| WO2019148647A1 (en) * | 2018-02-01 | 2019-08-08 | 陈广明 | Low-cost lamp cup |
-
2010
- 2010-09-26 CN CN201020542205XU patent/CN201779526U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013121347A1 (en) | 2012-02-16 | 2013-08-22 | Koninklijke Philips N.V. | Optical element for uniform lighting |
| US9458973B2 (en) | 2012-02-16 | 2016-10-04 | Koninklijke Philips N.V. | Optical element for uniform lighting |
| CN103943755A (en) * | 2014-03-20 | 2014-07-23 | 昆山开威电子有限公司 | White light LED packaging structure and packaging method |
| WO2019148647A1 (en) * | 2018-02-01 | 2019-08-08 | 陈广明 | Low-cost lamp cup |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20110926 |