CN201751855U - Testing device and testing control device of transmission chip - Google Patents
Testing device and testing control device of transmission chip Download PDFInfo
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- CN201751855U CN201751855U CN2009202620179U CN200920262017U CN201751855U CN 201751855 U CN201751855 U CN 201751855U CN 2009202620179 U CN2009202620179 U CN 2009202620179U CN 200920262017 U CN200920262017 U CN 200920262017U CN 201751855 U CN201751855 U CN 201751855U
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Abstract
Description
技术领域technical field
本实用新型涉及测试技术,尤其涉及一种传输芯片的测试装置和测试控制装置。 The utility model relates to testing technology, in particular to a testing device and a testing control device for a transmission chip. the
背景技术Background technique
验证和测试在芯片开发中发挥了重要作用,并已经成为开发流程中必不可少的环节。当前,芯片的设计、测试和制造等方面的困难与问题正在逐步增加,有些还变得日益尖锐。随着当前芯片性能及复杂程度的不断提高,各种之前不曾出现的缺陷对传统测试方法提出了新的挑战,制造商需要制定新的测试策略;同时由于集成电路器件平均价格的持续降低,利润率也在不断下降,制造商们必须充分考虑测试成本与经济性。 Verification and testing play an important role in chip development and have become an integral part of the development process. At present, the difficulties and problems in chip design, testing and manufacturing are gradually increasing, and some are becoming increasingly acute. With the continuous improvement of the performance and complexity of current chips, various defects that have never appeared before pose new challenges to traditional testing methods, and manufacturers need to formulate new testing strategies; at the same time, due to the continuous decline in the average price of integrated circuit devices, profits Rates are also declining, manufacturers must fully consider the test cost and economics. the
现有技术中,测试信号由具体的设备、仪表产生,结果的验证也往往依赖于仪表,或仅仅是通过可编程器件转换为测试芯片所需要的信号,这种测试装置通用性较低,一种测试装置对应一种仪表,仅能测试一种芯片,这样就造成测试成本加大,测试的灵活性较差。 In the prior art, the test signal is generated by specific equipment and instruments, and the verification of the results often depends on the instrument, or is only converted into the signal required by the test chip through the programmable device. This test device has low versatility. One test device corresponds to one instrument and can only test one chip, which increases the test cost and makes the test less flexible. the
实用新型内容Utility model content
本实用新型要解决的主要技术问题是,提供一种通用的传输芯片的测试装置; The main technical problem to be solved by the utility model is to provide a general testing device for transmission chips;
本实用新型还要解决的技术问题是,提供一种自动化的测试控制装置。 The technical problem to be solved by the utility model is to provide an automatic test control device. the
为解决上述技术问题,本实用新型提供一种传输芯片的测试装置,包括: In order to solve the above technical problems, the utility model provides a test device for transmission chips, including:
可编程设备,用于产生根据测试用例构造发送给待测芯片的测试数据,根据待测芯片对所述测试数据处理并返回的结果给出测试报告。 The programmable device is used to generate test data sent to the chip under test according to the test case configuration, and give a test report according to the result of the chip under test processing the test data and returning it. the
其中所述测试用例包括可编程设备的配置项、待测试芯片的工作配置参数、测试功能项、所述待测试芯片测试功能项对应的输出预期值。 The test case includes configuration items of the programmable device, working configuration parameters of the chip to be tested, test function items, and expected output values corresponding to the test function items of the chip to be tested. the
其中所述可编程设备包括FPGA,所述FPGA用于接收测试数据并根 据测试用例对所述测试数据进行转化。 Wherein the programmable device includes FPGA, and the FPGA is used to receive test data and convert the test data according to test cases. the
其中所述可编程设备还包括处理器,用于根据所述测试用例中的可编程设备的配置项配置所述FPGA;所述FPGA还用于接收所述处理器的配置并根据所述测试用例中的待测芯片的工作配置参数、测试功能项构造所述测试数据。 Wherein the programmable device also includes a processor, configured to configure the FPGA according to the configuration items of the programmable device in the test case; the FPGA is also used to receive the configuration of the processor and perform The working configuration parameters and test function items of the chip under test construct the test data. the
所述装置,还包括与待测芯片连接的拉偏时钟信号单元,用于测试待测芯片时钟拉偏性能。 The device also includes a pull-off clock signal unit connected to the chip under test for testing the clock pull-off performance of the chip under test. the
所述拉偏时钟信号单元还用于给待测芯片输入拉偏的时钟信号,所述装置还用于通过所述可编程设备测试待测芯片业务运行是否正常,如果正常,则继续加大时钟信号的频偏,直到待测芯片业务运行不正常为止。 The bias-pull clock signal unit is also used to input a bias-pull clock signal to the chip under test, and the device is also used to test whether the service operation of the chip to be tested is normal through the programmable device, and if it is normal, continue to increase the clock The frequency deviation of the signal until the operation of the chip under test is abnormal. the
所述装置,还包括与所述待测芯片连接的可调压电源模块,用于向待测芯片提供所需的电压,所述可编程设备还用于根据所述电压对应的测试到的电流,获得所述待测芯片的功耗。 The device also includes an adjustable voltage power supply module connected to the chip under test for providing the required voltage to the chip under test, and the programmable device is also used for testing the current corresponding to the voltage , to obtain the power consumption of the chip under test. the
所述装置,还用于测试待测芯片与处理器接口能力。 The device is also used for testing the interface capability between the chip under test and the processor. the
所述处理器的控制接口通过所述FPGA与待测芯片对接,所述FPGA还用于根据待测试芯片的接口时序,对处理器的接口时序进行构造/转化,所述处理器还用于对待测芯片的寄存器完成反复读写,验证待测芯片与所述处理器接口的时序是否正常。 The control interface of the processor is docked with the chip to be tested through the FPGA, and the FPGA is also used to construct/convert the interface timing of the processor according to the interface timing of the chip to be tested, and the processor is also used to The registers of the chip under test are read and written repeatedly, and it is verified whether the timing of the interface between the chip under test and the processor is normal. the
为解决上述技术问题,本实用新型还提供一种传输芯片的测试控制装置,用于根据测试用例采用上述测试装置自动完成测试; In order to solve the above technical problems, the utility model also provides a test control device for transmission chips, which is used to automatically complete the test according to the test case using the above test device;
读取测试用例,所述测试用例包括可编程设备的配置项、待测试芯片的工作配置参数、测试功能项、所述待测试芯片测试功能项对应的输出预期值; Read the test case, the test case includes the configuration item of the programmable device, the working configuration parameters of the chip to be tested, the test function item, the output expected value corresponding to the test function item of the chip to be tested;
根据测试用例中的可编程设备的配置项配置所述可编程设备; Configure the programmable device according to the configuration items of the programmable device in the test case;
下发待测试芯片的工作配置参数、测试功能项; Issue the working configuration parameters and test function items of the chip to be tested;
根据获得测试芯片的工作配置参数对待测芯片进行配置; Configure the chip to be tested according to the working configuration parameters of the obtained test chip;
根据测试功能项启动测试; Start the test according to the test function item;
生成测试用例测试报告。 Generate test case test report. the
本实用新型的有益效果是: The beneficial effects of the utility model are:
(1)本实用新型可以在不依赖仪表的条件下,由可编程设备根据测试用例构造测试数据,测试结果回传到可编程设备,由其判断结果的正确性,从而实现对芯片的通用测试。 (1) The utility model can construct the test data according to the test case by the programmable device without relying on the instrument, and the test result is sent back to the programmable device to judge the correctness of the result, thereby realizing the universal test of the chip . the
(2)本实用新型采用FPGA,可进一步提高测试的灵活性。 (2) The utility model adopts FPGA, which can further improve the flexibility of testing. the
(3)本实用新型通过对芯片电压工作范围、功耗、时钟的偏移的测试,实现了对芯片性能的测试,从而提高了测试的全面性。 (3) The utility model realizes the test of the chip performance through the test of the working range of the chip voltage, the power consumption and the offset of the clock, thereby improving the comprehensiveness of the test. the
(4)本实用新型对测试过程的控制使得测试执行得以全面自动化,提高了测试效率,降低了测试成本。 (4) The control of the test process by the utility model makes the test execution fully automatic, improves the test efficiency, and reduces the test cost. the
(5)本实用新型易于实施,扩展方便。 (5) The utility model is easy to implement and convenient to expand. the
附图说明Description of drawings
图1为根据本实用新型测试装置一个实施例的测试装置结构示意图; Fig. 1 is a schematic structural view of the testing device according to an embodiment of the utility model testing device;
图2为根据本实用新型测试装置另一个实施例的测试装置结构示意图; Fig. 2 is the structural representation of the testing device according to another embodiment of the utility model testing device;
图3为根据本实用新型测试装置又一个实施例的测试装置结构示意图; Fig. 3 is a schematic structural view of the testing device according to another embodiment of the testing device of the present invention;
图4为根据本实用新型测试装置再一个实施例的测试装置结构示意图; Fig. 4 is a schematic structural view of the test device according to another embodiment of the test device of the present invention;
图5为基于本实用新型测试装置一个实施例进行性能测试的流程图; Fig. 5 is the flow chart that carries out performance test based on an embodiment of the utility model test device;
图6为根据本实用新型测试装置又再一个实施例的测试装置结构示意图; Fig. 6 is a schematic structural view of the testing device according to yet another embodiment of the testing device of the present invention;
图7为基于本实用新型测试装置另一个实施例进行功能测试的流程图; Fig. 7 is the flow chart that carries out function test based on another embodiment of the utility model test device;
图8为基于本实用新型测试装置进行测试的流程图; Fig. 8 is the flow chart that tests based on the utility model testing device;
图9为根据本实用新型测试控制装置的一个实施例的结构示意图; Fig. 9 is a schematic structural view according to an embodiment of the utility model test control device;
图10为基于本实用新型测试控制装置的另一个实施例的进行测试的流程图。 Fig. 10 is a flow chart of testing based on another embodiment of the test control device of the present invention. the
具体实施方式Detailed ways
下面通过具体实施方式结合附图对本实用新型作进一步详细说明。 The utility model will be described in further detail below through specific embodiments in conjunction with the accompanying drawings. the
本实用新型将改进传统的验证测试流程作为突破口,通过设计一种全方位测试传输芯片的方法和装置,制定一个完备、详尽的测试方案,设计有效的测试用例,使其成为传输类芯片的通用测试环境平台,用测试环境平台的通用性来保证传输类芯片在各种应用环境下的自动化验证和测试。 The utility model takes the improvement of the traditional verification test process as a breakthrough, and by designing a method and device for testing transmission chips in an all-round way, a complete and detailed test plan is formulated, and effective test cases are designed to make it a universal tester for transmission chips. The test environment platform uses the versatility of the test environment platform to ensure the automatic verification and testing of transmission chips in various application environments. the
本实用新型传输芯片的测试装置的一种具体实施方式,如图1所示,包括可编程设备101,用于产生根据测试用例构造发送给待测芯片的测试数据,根据待测芯片对所述测试数据处理并返回的结果给出测试报告。 A kind of specific implementation of the test device of the utility model transmission chip, as shown in Figure 1, comprises
根据本实用新型测试装置的一个实施例,测试用例包括可编程设备的配置项、待测试芯片的工作配置参数、测试功能项、待测试芯片测试功能项对应的输出预期值。 According to an embodiment of the test device of the present invention, the test case includes configuration items of the programmable device, working configuration parameters of the chip to be tested, test function items, and expected output values corresponding to the test function items of the chip to be tested. the
根据本实用新型测试装置的一个实施例,如图2所示,可编程设备201包括FPGA202和存储器203;其中,FPGA202用于接收测试用例并构造所述测试数据;存储器203用于存储大容量数据。根据本实用新型的一个备选实施例,可编程设备可包括其他的可编程器件。 According to an embodiment of the utility model testing device, as shown in Figure 2,
根据本实用新型测试装置的一个实施例,可编程设备还包括处理器204,用于根据测试用例中的可编程设备的配置项配置FPGA202;FPGA202还用于接收处理器204的配置并根据测试用例中的待测芯片207的工作配置参数、测试功能项构造测试数据。 According to an embodiment of the utility model testing device, the programmable device also includes a
根据本实用新型测试装置的一个实施例,还包括与待测芯片207连接的拉偏时钟信号单元205,用于给待测芯片输入拉偏的时钟信号,该装置200还用于通过可编程设备201测试待测芯片207运行是否正常,如果正常,则继续加大时钟信号的频偏,直到待测芯片207运行不正常为止。 According to an embodiment of the utility model testing device, it also includes a pull-off
根据本实用新型测试装置的一个实施例,还包括与待测芯片207连接的可调压电源模块206,用于单独向待测芯片提供所需的电压,可编程设备201还用于根据该电压对应的测试到的电流,获得待测芯片的功耗。在本实施例中,可由可调电压源206向待测芯片输出的多种可调电压,如1V、1.2V、1.8V、2.5V和3.3V,或其它任何所需的电压值。 According to one embodiment of the utility model testing device, it also includes an adjustable voltage
根据本实用新型测试装置的一个实施例,处理器204的控制接口通过FPGA202与待测芯片207对接,FPGA202还用于根据待测试芯片207的接口时序,对处理器的时序进行构造/转化,处理器204还用于对待测芯片207的寄存器完成反复读写,验证待测芯片207与处理器接口的时序是否正常。 According to an embodiment of the utility model testing device, the control interface of the
图3示出根据本实用新型一个实施例的测试装置300的模块示意图,其中包括:待测芯片311所需的可拉偏时钟模块302,该模块可实现对芯片时钟的拉偏测试;待测芯片311所需的可调电源模块301,其可实现对芯片电源电压工作范围、功耗的测试;整个装置其它芯片所需的时钟/复位模块304;整个装置其它芯片所需的电源303;307为可能用到的数据信号源;对307进行管理和驱动的PC305;FPGA(现场可编程逻辑阵列)309;FPGA309下挂的存储单元310;CPU最小系统306,其中的处理器可以是能与待测试芯片接口适配的多个同类型或不同类型的处理器。FPGA309与 待测芯片300相关接口连接,对待测芯片各接口时序进行测试,另外通过FPGA309完成对待测芯片311的功能进行测试。 Fig. 3 shows the module schematic diagram of the test device 300 according to an embodiment of the present utility model, which comprises: the pull-bias clock module 302 required by the chip 311 to be tested, which can realize the pull-bias test of the chip clock; The adjustable power supply module 301 required by the chip 311, which can realize the test of the working range and power consumption of the chip power supply voltage; the clock/reset module 304 required by other chips of the entire device; the power supply 303; 307 required by other chips of the entire device The data signal source that may be used; 307 is managed and driven PC305; FPGA (field programmable logic array) 309; the storage unit 310 that hangs under FPGA309; Multiple processors of the same type or different types adapted to the test chip interface. The FPGA309 is connected to the relevant interface of the chip to be tested 300, and the timing of each interface of the chip to be tested is tested. In addition, the function of the chip to be tested 311 is tested by the FPGA309. the
根据本实用新型的一个实施例,可利用测试装置300对传输芯片进行全方位测试,其中包括性能测试。本实施例中的性能测试包括精确测试待侧芯片的电压工作范围、功耗;灵活测试待测芯片的时钟偏移范围;准确测试芯片的接口时序。 According to an embodiment of the present invention, the testing device 300 can be used to perform comprehensive testing on the transmission chip, including performance testing. The performance test in this embodiment includes accurately testing the voltage working range and power consumption of the chip to be tested; flexibly testing the clock offset range of the chip to be tested; and accurately testing the interface timing of the chip. the
图4示出根据本实用新型一个实施例的测试装置400对性能测试的模块示意图。精密时钟源可选用压控恒温晶体振荡器,标称频率77.76MHZ,初始频率偏差±0.1ppm;时钟倍频/抖动衰减器404选用SI5326,可实现2k-945M任意频率输出;通过411实现控制,411为处理器MPC8321E;在本实施例中,时钟需要在76.76M到78.76M间拉偏,颗粒度为100Hz。本实施例中1V(406)、1.2V(407)、1.8V(408)、2.5V(409)DC-DC电源模块选用AXH016A0X3-SRZ//BSM16A-3SXG,输入电压3.0~5.5V,输出电压0.75~3.3V,输出电流16A,3.3V(410)DC-DC电源模块选用PMM4218TWP//PTH04040WAD,输入电压2.95~5.5VDC,输出电压0.8~2.5VDC,输出电流60A,功率电感(413-417)选用DHC-5121-R33R-LF1,额定电流16A。通过调节DC-DC电源模块的分压电阻,可以实现对电压的拉偏,通过在功率电感处测量电流,可以精确地得到芯片各电压的功耗。 Fig. 4 shows a block diagram of a
图5示出根据本实用新型一个实施例基于测试装置400的性能测试的流程图,包括: Fig. 5 shows the flow chart based on the performance test of
步骤502:根据测试需求,确定恰当的测试用例,测试用例中需要规定如下内容:待测芯片418的工作配置参数及测试过程中可能的参数更新等、配套的数据流、待测芯片418输出的参考结果、待测芯片418输出的预期值在实施测试之前准备好,测试用例中指定各项内容; Step 502: Determine the appropriate test case according to the test requirements. The following content needs to be specified in the test case: working configuration parameters of the
步骤504:施加性能试验条件,开始性能测试; Step 504: apply performance test conditions, start performance test;
步骤506:根据目前芯片设计向低电压方向发展的特点,如模块401所示:1V,1.2V,1.8V,2.5V,3.3V覆盖了目前传输芯片工作所需的全部工作电压,为了准确测试芯片的电压工作范围、功耗,采用对待测芯片单独供电的方式;针对目前传输芯片功耗大的特点,在可调电压模块选型上特别注意输出电流指标,并在电路上做了兼容设计,既可选择可调电压模块,又可选择稳压电源,待测芯片的各供电电压设定到典型值; Step 506: According to the characteristics of the current chip design in the direction of low voltage development, as shown in module 401: 1V, 1.2V, 1.8V, 2.5V, 3.3V cover all the working voltages required for the current transmission chip work, in order to accurately test The voltage working range and power consumption of the chip adopts the way of power supply for the chip under test; in view of the characteristics of high power consumption of the current transmission chip, special attention is paid to the output current index in the selection of the adjustable voltage module, and a compatible design is made on the circuit , both the adjustable voltage module and the regulated power supply can be selected, and each power supply voltage of the chip to be tested is set to a typical value;
步骤508:为了测试待测芯片与多个同类型或不同类型处理器的接口能力,板上处理器的控制接口通过FPGA402与待测芯片对接,FPGA402 根据待测试芯片给出的接口时序,通过FPGA内部模块412进行时序的构造/转化,处理器对待测芯片的寄存器完成反复读写,验证待测芯片与不同类型处理器接口的时序是否正常; Step 508: In order to test the interface capability between the chip to be tested and multiple processors of the same type or different types, the control interface of the processor on the board is connected to the chip to be tested through the FPGA402, and the FPGA402 is connected to the chip to be tested according to the interface timing given by the chip to be tested through the FPGA The
步骤510:处理器419配置可编程逻辑阵列FPGA402,FPGA402按测试用例完全构造数据流给待测芯片418,待测芯片418根据配置参数和输入的数据流进行处理,输出处理结果回传到FPGA402,FPGA402根据测试用例产生预期的参考结果,验证模块比较回传结果与预期值,判定结果正确,转步骤506;否则芯片不能正常工作,转步骤518; Step 510: the
步骤512:在测试功耗节点分别测试出各供电电压的电流,从而精确得到各供电电压的功耗; Step 512: Test the current of each power supply voltage at the test power consumption node, so as to accurately obtain the power consumption of each power supply voltage;
步骤514:针对传输芯片对时钟精度要求高的特点,选用了压控恒温晶体振荡器403,时钟的拉偏通过多速率时钟倍频/抖动衰减器404实现,通过时钟拉偏控制模块411,可实现2k-945M任意频率输出,精度在100Hz;将时钟信号源拉偏,察看业务运行是否正常,运行一段时间后,如果仍正常,则继续加大频偏,按这种方法可以找到芯片时钟频偏的边界值; Step 514: A voltage-controlled constant
步骤516:时钟设置到典型值,依次调节各电源工作在最小值、典型值、最大值。察看业务是否运行正常,长时间运行,察看在测试时间内业务运行是否稳定; Step 516: The clock is set to a typical value, and each power supply is sequentially adjusted to work at a minimum value, a typical value, and a maximum value. Check whether the business is running normally, run for a long time, and check whether the business is running stably within the test time;
步骤518:结束。 Step 518: end. the
本实施例可准确地测试芯片的工作电压范围,各电压功耗;还可精确地测试时钟的偏移,以确认芯片对时钟偏移量的要求。 This embodiment can accurately test the operating voltage range of the chip and the power consumption of each voltage; it can also accurately test the clock offset to confirm the chip's requirement on the clock offset. the
图6示出根据本实用新型实施例的测试装置600的模块图,其中FPGA601可选用Xilinx的Virtex-5系列XC5VTX240T,实现控制信号的产生,LocalBus接口时序的转化,SDH数据源的完全构造/转化,输出结果的自动验证;待测芯片618,该芯片单片实现20G支路处理(指针下泄和支路开销处理)和时分交叉,4片堆叠实现80G容量,支持2.5G总线1+1和AU4级别2:4保护,并提供支路1+1自动保护倒换功能;处理器615采用FREESCALE新推出的一款性价比极高的高集成度的通讯用处理器MPC8321E,用以实现FPGA601、待测芯片618工作参数配置、测试结果的自动获取,生成。图7示出根据本实用新型实施例基于测试装置600的功能测试的流程图,包括: Fig. 6 shows the block diagram according to the
步骤702:根据测试需求,确定恰当的测试用例; Step 702: Determine the appropriate test case according to the test requirement;
步骤704:施加功能试验条件,开始功能测试; Step 704: apply functional test conditions, start functional test;
步骤706:处理器615配置可编程逻辑阵列FPGA601,由FPGA601完全构造数据源,按测试用例产生数据流给待测芯片618; Step 706: The
步骤708:处理器615根据测试用例指定的工作参数,正确配置待测芯片618; Step 708: The
步骤710:待测试芯片618根据配置参数和输入的数据流进行处理,输出处理结果回传到FPGA601; Step 710: The
步骤712:待测试芯片618输出的处理结果回传到FPGA601、由FPGA601内部的验证模块自动进行处理,验证模块比较回传结果与预期值,判定结果的正确性。 Step 712: The processing result output by the chip to be tested 618 is sent back to
FPGA601可以完全构造测试信号,并由FPGA601对结果进行验证,而现有的测试装置局限于用仪表产生测试信号并进行验证。 The FPGA601 can completely construct the test signal, and the result can be verified by the FPGA601, while the existing test device is limited to using an instrument to generate the test signal and verify it. the
利用本实用新型传输芯片的测试控制装置进行测试的流程,如图8所示,包括: Utilize the testing process of the test control device of the transmission chip of the present invention, as shown in Figure 8, including:
步骤802:读取测试用例,所述测试用例包括可编程设备的配置项、待测试芯片的工作配置参数、测试功能项; Step 802: read the test case, the test case includes the configuration item of the programmable device, the work configuration parameter of the chip to be tested, and the test function item;
步骤804:根据测试用例中的可编程设备的配置项配置所述可编程设备; Step 804: configure the programmable device according to the configuration items of the programmable device in the test case;
步骤806:下发待测试芯片的工作配置参数、测试功能项; Step 806: Issue the work configuration parameters and test function items of the chip to be tested;
步骤808:根据获得测试芯片的工作配置参数对待测芯片进行配置; Step 808: Configure the chip to be tested according to the obtained working configuration parameters of the test chip;
步骤810:根据测试功能项启动测试; Step 810: start the test according to the test function item;
步骤812:生成测试用例测试报告。 Step 812: Generate a test case test report. the
根据本实用新型的一个实施例,810进一步包括:控制所述可编程设备构造测试数据流;通过芯片告警中断、误码监测来监测芯片的状态;统计处理所述监测状态。 According to an embodiment of the present invention, 810 further includes: controlling the programmable device to construct a test data flow; monitoring the status of the chip through chip alarm interruption and bit error monitoring; and statistically processing the monitoring status. the
本实用新型传输芯片的测试控制装置的一种具体实施方式,用于根据测试用例自动完成测试;读取测试用例,所述测试用例包括可编程设备的配置项、待测试芯片的工作配置参数、测试功能项、待测试芯片测试功能项对应的输出预期值;根据测试用例中的可编程设备的配置项配置所述可编程设备;下发待测试芯片的工作配置参数、测试功能项; A specific implementation of the test control device of the transmission chip of the utility model is used to automatically complete the test according to the test case; read the test case, and the test case includes configuration items of the programmable device, working configuration parameters of the chip to be tested, Test function items, expected output values corresponding to the test function items of the chip to be tested; configure the programmable device according to the configuration items of the programmable device in the test case; issue the working configuration parameters and test function items of the chip to be tested;
根据获得测试芯片的工作配置参数对待测芯片进行配置;根据测试功能项启动测试;生成测试用例测试报告。 Configure the chip to be tested according to the obtained working configuration parameters of the test chip; start the test according to the test function item; generate a test case test report. the
图9示出根据本实用新型一个实施例的测试控制装置900的模块图,图10示出根据本实用新型一个实施例基于测试控制装置900的流程图,其 包括: Figure 9 shows a block diagram of a test control device 900 according to an embodiment of the present invention, and Figure 10 shows a flow chart based on a test control device 900 according to an embodiment of the present invention, which includes:
步骤1002:测试用例开始执行,从测试用例配置文件901中读取仪表902的配置项和待测芯片914测试功能项和配置参数,该仪表902可以是现有技术的测量仪表也可以是前述测试装置; Step 1002: The test case starts to execute, and the configuration items of the
步骤1004:自动化协同控制部分905根据仪表配置项调用仪表驱动903配置仪表设置项; Step 1004: The automation
步骤1006:自动化协同控制部分905根据待测功能项和配置参数通过命令下发907给测试单板; Step 1006: The automated
步骤1008;测试单板接收到命令后,通过命令解析项910获得测试功能项和参数; Step 1008; After the test single board receives the command, obtain the test function item and parameters through the
步骤1010:测试功能配置部分912根据获得的参数对待测芯片914进行配置; Step 1010: the test
步骤1012:自动化协同控制部分905启动测试; Step 1012: the automatic
步骤1014:测试过程中,自动化协同控制部分905可以调用仪表驱动903构造各种测试数据流; Step 1014: During the test process, the automated
步骤1016:测试过程中,测试板通过芯片告警中断、误码监测和统计处理部分913监测芯片的状态; Step 1016: During the test, the test board monitors the state of the chip through the chip alarm interruption, bit error monitoring and
步骤1018:通过告警和误码统计信息上报部分911可以将芯片的状态上报给控制台的自动化系统控制部分905; Step 1018: The state of the chip can be reported to the automation system control
步骤1020:测试完成后,由测试结果报告自动生成部分906自动生成测试用例执行结果报告。 Step 1020: After the test is completed, the test result report
这样可实现功能测试的全面自动化:构造源数据的自动化,被测芯片配置的自动化,被测芯片状态信息获取的自动化,测试结果的自动化获取,测试报告的自动化生成,测试用例的自动切换。 In this way, the comprehensive automation of functional testing can be realized: the automation of constructing source data, the automation of the configuration of the chip under test, the automation of obtaining state information of the chip under test, the automatic obtaining of test results, the automatic generation of test reports, and the automatic switching of test cases. the
以上内容是结合具体的实施方式对本实用新型所作的进一步详细说明,不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说,在不脱离本实用新型构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本实用新型的保护范围。 The above content is a further detailed description of the utility model in conjunction with specific implementation methods, and it cannot be determined that the specific implementation of the utility model is only limited to these descriptions. For a person of ordinary skill in the technical field to which the utility model belongs, without departing from the concept of the utility model, some simple deduction or substitutions can also be made, which should be regarded as belonging to the protection scope of the utility model. the
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