CN201724467U - Cold-heat fluid supply mechanism - Google Patents
Cold-heat fluid supply mechanism Download PDFInfo
- Publication number
- CN201724467U CN201724467U CN2010202749426U CN201020274942U CN201724467U CN 201724467 U CN201724467 U CN 201724467U CN 2010202749426 U CN2010202749426 U CN 2010202749426U CN 201020274942 U CN201020274942 U CN 201020274942U CN 201724467 U CN201724467 U CN 201724467U
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- China
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- heat
- cold
- fluid
- heat conduction
- hot
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
- Y02A30/274—Relating to heating, ventilation or air conditioning [HVAC] technologies using waste energy, e.g. from internal combustion engine
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- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model discloses a cold-heat fluid supply mechanism, which is provided with a plurality of semiconductor cold-heat tablets connected with direct current and fixed between a first insulating heat conduction base and a second insulating heat conduction base. The first insulating heat conduction base and the second insulating heat conduction base are respectively fixed with a first heat conduction pipe and a second heat conduction pipe, the first heat conduction pipe and the second heat conduction pipe respectively closely contact with the first insulating heat conduction base and the second insulating heat conduction base, one end of the first heat conduction pipe is provided with a first fluid inlet while the other end is provided with a hot fluid outlet, one end of the second heat conduction pipe is provided with a second fluid inlet while the other end is provided with a cold fluid outlet, the semiconductor cold-heat tablets can respectively produce a cold source and a hot source on the two surfaces at once after being connected with a direct current power supply, the hot and cold sources are respectively transferred to the first and second heat conduction pipes through the first and second insulating heat conduction bases, so that the first heat conduction pipe generates hot fluid, the second heat conduction pipe generates cold fluid, and the cold and the hot fluid are respectively output through the cold fluid outlet and the hot fluid output and are used to cool or heat target bodies.
Description
Technical field
The utility model relates to a kind of device that possesses refrigeration simultaneously and heat effect, specifically a kind of mechanism that cold and hot fluid is provided for the container that relies on fluid to cool off or heat.
Background technology
Concerning mould for plastics and other rely on fluid to cool off and the container that heat, all need heat and feed cold fluid at different stage feeding hot fluids and cool off with the form of heat exchange.Therefore be necessary to needs rely on fluid come the container of heating and cooling provide a kind of safe and reliable, energy consumption is low and free of contamination cold fluid and hot fluid supply equipment.
The semiconductor cold-hot sheet also is thermoelectric module, utilize the Peltier effect (paltie effect) of semi-conducting material, when galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, can absorb heat at the two ends of galvanic couple respectively and emit heat, can realize the purpose that the end refrigeration and the other end heat, be characterized in movement-less part, reliability is also than higher, and no cold-producing medium pollutes.
Summary of the invention
In order to address the above problem, the utility model provides a kind of cold fluid and hot fluid organization of supply, this cold fluid and hot fluid organization of supply can rely on fluid to cool off and the container that heats provides cold and hot fluid to mould for plastics and other, and volume is little, energy consumption is low, safety non-pollution.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of cold fluid and hot fluid organization of supply, has cold and hot of several semiconductor, cold and hot of several semiconductor connects direct current, cold and hot of several semiconductor is fixed between first and second insulating heat-conductive pedestal, be fixed with first and second heat pipe respectively on described first and second insulating heat-conductive pedestal, and first and second heat pipe closely contacts with first and second insulating heat-conductive pedestal respectively, described first heat pipe, one end is that the first fluid import and the other end are the hot fluid outlet, and described second heat pipe, one end is that second fluid inlet and the other end are the cold fluid outlet.After the semiconductor cold-hot sheet is connected dc source, can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that enters first and second heat pipe produce variations in temperature, make the fluid temperature (F.T.) that enters first heat pipe raise, promptly produce hot fluid, and the fluid temperature (F.T.) that enters second heat pipe reduces, promptly produce cold fluid, cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Further technical scheme of the present utility model is:
Be provided with first and second heat-insulating shield that is used for heat-insulation and heat-preservation, described first heat pipe is positioned between described first heat-insulating shield and the described first insulating heat-conductive pedestal, and described second heat pipe is positioned between described second heat-insulating shield and the described second insulating heat-conductive pedestal.First and second heat-insulating shield is used to lower external environment condition convection cell Temperature Influence.
Described first and second heat pipe is all copper pipe.
Described first and second heat pipe all is the bending that crawls.First and second heat pipe is designed to the intensive bending that crawls can improve pipe range on unit are, promptly improved heat exchange area, can improve heat exchanger effectiveness.
Offer the groove that is complementary with first and second heat pipe respectively on described first and second insulating heat-conductive pedestal, described first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.Can not only play positioning action like this to first and second heat pipe, can also increase first and second heat pipe respectively with the contact area of first and second insulating heat-conductive pedestal, improve pyroconductivity.
The beneficial effects of the utility model are: cold fluid and hot fluid organization of supply of the present utility model has utilized the paltie effect of semi-conducting material and has designed, after the semiconductor cold-hot sheet is connected dc source, can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are respectively through first, two insulating heat-conductive pedestals are passed to first, two heat pipes, make and enter first, the fluid that is in environment temperature of two heat pipes produces variations in temperature, make the fluid temperature (F.T.) that enters first heat pipe raise, promptly produce hot fluid, and the fluid temperature (F.T.) that enters second heat pipe reduces, promptly produce cold fluid, cold fluid and hot fluid are respectively through cold fluid outlet and hot fluid outlet output, and be used for cooling or heat objective body, cold fluid and hot fluid organization of supply collection supply cold fluid therefore of the present utility model and supply hot fluid are one, can rely on fluid to cool off and the container that heats provides cold fluid and hot fluid to mould for plastics and other, and volume be little, energy consumption is low, safety non-pollution.
Description of drawings
Fig. 1 is a decomposition texture schematic diagram of the present utility model;
Fig. 2 is an overall structure schematic diagram of the present utility model.
The specific embodiment
Embodiment: a kind of cold fluid and hot fluid organization of supply, has several semiconductor cold and hot 1, cold and hot of several semiconductor connects direct current, cold and hot of several semiconductor is fixed in first, two insulating heat-conductive pedestals 2,3, described first, be fixed with first respectively on the two insulating heat-conductive pedestals, two heat pipes 4,5, and first, two heat pipes are respectively with first, two insulating heat-conductive pedestals closely contact, described first heat pipe, 4 one ends are that the first fluid import 41 and the other end are hot fluid outlet 42, and described second heat pipe, 5 one ends are that second fluid inlet 51 and the other end are cold fluid outlet 52.After the semiconductor cold-hot sheet is connected dc source, can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that enters first and second heat pipe produce variations in temperature, make the fluid temperature (F.T.) that enters first heat pipe raise, promptly produce hot fluid, and the fluid temperature (F.T.) that enters second heat pipe reduces, promptly produce cold fluid, cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Be provided with first and second heat-insulating shield 6,7 that is used for heat-insulation and heat-preservation, described first heat pipe 4 is positioned at 2 of described first heat-insulating shield 6 and the described first insulating heat-conductive pedestals, and described second heat pipe 5 is positioned at 3 of described second heat-insulating shield 7 and the described second insulating heat-conductive pedestals.First and second heat-insulating shield is used to lower external environment condition convection cell Temperature Influence.
Described first and second heat pipe 4,5 is all copper pipe.
Described first and second heat pipe 4,5 all is the bending that crawls.First and second heat pipe is designed to the intensive bending that crawls can improve pipe range on unit are, promptly improved heat exchange area, can improve heat exchanger effectiveness.
Offer the groove that is complementary with first and second heat pipe respectively on described first and second insulating heat-conductive pedestal, described first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.Can not only play positioning action like this to first and second heat pipe, can also increase first and second heat pipe respectively with the contact area of first and second insulating heat-conductive pedestal, improve pyroconductivity.
Use of the present utility model is as follows:
After the semiconductor cold-hot sheet is connected dc source, can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that enters first and second heat pipe produce variations in temperature, make the fluid temperature (F.T.) that enters first heat pipe raise, promptly produce hot fluid, and the fluid temperature (F.T.) that enters second heat pipe reduces, promptly produce cold fluid, cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Claims (5)
1. cold fluid and hot fluid organization of supply, it is characterized in that: have cold and hot of several semiconductor (1), cold and hot of several semiconductor connects direct current, cold and hot of several semiconductor is fixed in first, two insulating heat-conductive pedestals (2,3) between, described first, be fixed with first respectively on the two insulating heat-conductive pedestals, two heat pipes (4,5), and first, two heat pipes are respectively with first, two insulating heat-conductive pedestals closely contact, described first heat pipe (4) one ends are that the first fluid import (41) and the other end are hot fluid outlet (42), and described second heat pipe (5) one ends are that second fluid inlet (51) and the other end are cold fluid outlet (52).
2. cold fluid and hot fluid organization of supply according to claim 1, it is characterized in that: be provided with first and second heat-insulating shield (6,7) that is used for heat-insulation and heat-preservation, described first heat pipe (4) is positioned between described first heat-insulating shield (6) and the described first insulating heat-conductive pedestal (2), and described second heat pipe (5) is positioned between described second heat-insulating shield (7) and the described second insulating heat-conductive pedestal (3).
3. cold fluid and hot fluid organization of supply according to claim 1 is characterized in that: described first and second heat pipe (4,5) is all copper pipe.
4. cold fluid and hot fluid organization of supply according to claim 1 is characterized in that: described first and second heat pipe (4,5) all is the bending that crawls.
5. cold fluid and hot fluid organization of supply according to claim 4, it is characterized in that: offer the groove that is complementary with first and second heat pipe respectively on described first and second insulating heat-conductive pedestal, described first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202749426U CN201724467U (en) | 2010-07-28 | 2010-07-28 | Cold-heat fluid supply mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202749426U CN201724467U (en) | 2010-07-28 | 2010-07-28 | Cold-heat fluid supply mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201724467U true CN201724467U (en) | 2011-01-26 |
Family
ID=43492804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202749426U Expired - Fee Related CN201724467U (en) | 2010-07-28 | 2010-07-28 | Cold-heat fluid supply mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201724467U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338502A (en) * | 2010-07-28 | 2012-02-01 | 日进教学器材(昆山)有限公司 | Cold and hot fluid supply mechanism |
| CN105470222A (en) * | 2015-12-25 | 2016-04-06 | 珠海格力电器股份有限公司 | Cooling device for electronic component |
| WO2016049773A1 (en) * | 2014-10-03 | 2016-04-07 | Sunwell Engineering Company Limited | Multilayer thermal shield comprising an integrated fluid circuit |
| US10773879B2 (en) | 2014-10-03 | 2020-09-15 | Sunwell Engineering Company Limited | Thermal shield for maintaining a generally constant temperature |
-
2010
- 2010-07-28 CN CN2010202749426U patent/CN201724467U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338502A (en) * | 2010-07-28 | 2012-02-01 | 日进教学器材(昆山)有限公司 | Cold and hot fluid supply mechanism |
| WO2016049773A1 (en) * | 2014-10-03 | 2016-04-07 | Sunwell Engineering Company Limited | Multilayer thermal shield comprising an integrated fluid circuit |
| US10093078B2 (en) | 2014-10-03 | 2018-10-09 | Sunwell Engineering Company Limited | Multilayer thermal shield comprising an integrated fluid circuit |
| US10773879B2 (en) | 2014-10-03 | 2020-09-15 | Sunwell Engineering Company Limited | Thermal shield for maintaining a generally constant temperature |
| CN105470222A (en) * | 2015-12-25 | 2016-04-06 | 珠海格力电器股份有限公司 | Cooling device for electronic component |
| CN105470222B (en) * | 2015-12-25 | 2018-09-18 | 珠海格力电器股份有限公司 | Cooling device for electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20140728 |
|
| EXPY | Termination of patent right or utility model |