CN201716708U - Touch panel - Google Patents

Abstract

The utility model discloses a touch panel, its one end that mainly makes each wire in the touch panel be used for the connecting circuit board is formed with the test point that the size is greater than the line footpath of wire, and this test point can supply test instrument's probe to insert when conducting the conduction test to establish, because the size of this test point is greater than the line footpath of wire, even consequently after diameter and wire, last wire and the close probe in line footpath of wire down are inserted and establish, this test point also can not suffer the probe and cut apart into two sections situations and take place, consequently the utility model discloses a touch panel can not have the situation emergence of unable normal action because of the wire fracture after the test finishes.

Description

touch panel

technical field

The utility model relates to an input interface, in particular to a touch panel.

Background technique

Touch panels can be divided into capacitive, resistive, sonic, infrared, etc. based on technical principles. Among them, capacitive and resistive touch panels have the highest market share. Capacitive and resistive touch panels are the same Conductive glass such as indium tin oxide (ITO) is used as the sensing unit, but the difference is that when the user touches the touch panel, the capacitance change will occur at the conductive glass in the capacitive touch panel, while the resistive touch panel The conductive glass in the touch panel generates a voltage change. Whether it is a signal of capacitance or voltage change, it is output to a controller through a plurality of wires connected to the conductive glass. The controller can calculate the pressing point based on the changed signal s position.

After the above-mentioned capacitive touch panel and resistive touch panel are manufactured, it is necessary to test whether each wire is connected to the conductive glass. However, the test instrument currently used is a probe type, that is, the instrument is equipped with a plurality of Probes, during the test, these probes are respectively needled and contacted on the wires, so that the instrument can be electrically connected to the wires, so as to determine whether the signal of the conductive glass is transmitted to the wires.

However, since the wires of the aforementioned touch panel are quite small in diameter, and the diameter of the probes is similar to that of the wires, some wires are often broken by the probes of the instrument during the conduction test, resulting in touch Although the test results of the control panel show that it can be turned on normally, it may fail to operate normally when it is used in the future because the signal cannot be transmitted to the controller through the wire.

Contents of the invention

In view of the aforementioned disadvantages of the touch panel in the prior art that the wires are easily pierced by the probes during the conduction test, the present invention aims to solve the problem by improving the structure of the wires.

In order to achieve the above object, the technical means used in the present utility model is to provide a touch panel, which includes a substrate, the substrate has a top surface and a bottom surface, and an induction unit is arranged on the top surface, which is characterized in that:

The substrate is provided with a plurality of conducting wires, one end of these conducting wires is respectively connected to the sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the conducting wire.

Preferably, one end of the wire formed with the test point can be extended to be located on the top surface or the bottom surface of the substrate.

Preferably, the sensing unit may include a plurality of first conductive layers and a plurality of second conductive layers arranged in a staggered manner, the first conductive layers are arranged in parallel and share an axial direction, and each first conductive layer has a plurality of Inductive areas connected in series, and the second conductive layers are located at positions where the first conductive layer is not provided, the second conductive layers are arranged in parallel and share another axial direction, and each second conductive layer has a plurality of phases In the sensing area connected in series, a connection port is respectively provided at the edge of an sensing area on the axially upper side of each first conductive layer and each second conductive layer, and the number of wires arranged on the substrate corresponds to the first The number of connection ports in the conductive layer and the second conductive layer, and one end of the wires connected to the sensing unit is respectively connected to a connection port.

The utility model further provides a touch panel, which includes a lower substrate and an upper substrate, the lower substrate and the upper substrate respectively have a top surface and a bottom surface, the bottom surface of the upper substrate faces the top surface of the lower substrate, and The top surface of the lower substrate is provided with a lower induction unit, and the bottom surface of the upper substrate is provided with an upper induction unit, which is characterized in that:

The lower substrate is provided with at least one lower wire made of conductive material, one end of the lower wire is respectively connected to the lower sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the lower wire;

The upper substrate is provided with at least one upper wire made of conductive material, one end of the upper wire is respectively connected to the upper sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the upper wire.

Preferably, the structure of the aforementioned touch panel can be:

The test point ends of the upper wire and the lower wire both extend to the bottom surface of the lower substrate.

Preferably, the structure of the aforementioned touch panel can also be:

The area of the lower substrate is larger than that of the upper substrate and one side protrudes from the edge of the upper substrate, and the test point ends of the upper and lower leads extend to the side of the lower substrate protruding from the upper substrate. top surface.

In addition, the aforementioned touch panels have different structures depending on the touch principle. If the touch panel is resistive, the touch panel further has an insulating adhesive layer and a gap sublayer, and:

The lower sensing unit on the top surface of the lower substrate includes a lower conductive layer, and one end of the lower wire connected to the lower sensing unit is located on the top surface of the lower conductive layer;

The upper sensing unit on the bottom surface of the upper substrate includes an upper conductive layer, and one end of the upper wire connected to the upper sensing unit is arranged on the bottom surface of the upper conductive layer;

The insulating adhesive layer is frame-shaped and has a size corresponding to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate;

The gap sublayer is arranged between the upper substrate and the lower substrate and is located in the insulating adhesive layer.

If the aforementioned touch panel is a projected capacitive type, then the touch panel further has an insulating adhesive layer, and:

The lower sensing unit on the top surface of the lower substrate includes a plurality of lower conductive layers arranged in parallel and having an axial direction in common. Each lower conductive layer has a plurality of sensing areas connected in series. The edges of each sensing area on one side are respectively provided with a connection port, and the number of the bottom wires provided on the lower substrate corresponds to the number of the bottom connection ports, and one end of each bottom wire connected to the lower sensing unit is connected to the on the following ports;

The upper induction unit on the bottom surface of the upper substrate includes a plurality of parallel arrangements and has another axial upper conductive layer. These upper conductive layers correspond to the positions where the lower conductive layer is not provided on the upper surface of the lower substrate. The conductive layer has a plurality of sensing areas connected in series, and an upper connection port is respectively provided at the edge of each sensing area on one side of the upper conductive layer in the axial direction, and the number of upper wires arranged on the upper substrate corresponds to The number of upper connection ports, and one end of each upper wire connected to the upper sensing unit is respectively connected to an upper connection port;

The size of the insulating adhesive layer corresponds to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate.

If the aforementioned touch panel is a matrix capacitive type, the touch panel further has an insulating adhesive layer, and:

The lower sensing unit on the top surface of the lower substrate includes a plurality of lower conductive layers arranged side by side. The number of wires corresponds to the number of the lower connection ports, and one end of each lower wire connected to the lower sensing unit is respectively connected to the lower connection ports;

The upper sensing unit on the bottom surface of the upper substrate includes a plurality of upper conductive layers arranged side by side. These upper conductive layers are elongated and intersect with the plurality of lower conductive layers of the lower substrate in a matrix. The lengthwise ends of each upper conductive layer are respectively An upper connection port is provided, and the number of upper wires provided on the upper substrate corresponds to the number of the upper connection ports, and one end of each upper wire connected to the upper sensing unit is respectively connected to an upper connection port;

The size of the insulating adhesive layer corresponds to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate.

In the touch panel of the present invention, a test point is formed at one end of the wire, the upper wire and the lower wire, and the test point is used for inserting the probe of the testing instrument. , the wire diameter of the upper wire and the lower wire, so even if a probe with a diameter similar to the diameter of the wire, upper wire, and lower wire is inserted, the test point will not be divided into two sections by the probe Therefore, it can be seen that the present invention can indeed prevent the situation that the touch panel in the prior art cannot operate normally due to the breakage of the wire after the test is completed.

Moreover, using the structure of the test point, it can be combined with the layout of the machine (such as touch TV, mobile phone, e-book, etc.) after the test is completed, and there is no need to find space for the layout of the circuit board to place and combine.

Description of drawings

FIG. 1 is an exploded perspective view of the present invention applied to a projected capacitive touch panel with a single substrate.

FIG. 2 is a three-dimensional appearance view of another embodiment of the present invention applied to a single-substrate projected capacitive touch panel.

FIG. 3 is a three-dimensional exploded view of the present invention applied to a dual-substrate resistive touch panel.

FIG. 4 is a three-dimensional appearance view of the present invention applied to a dual-substrate resistive touch panel.

FIG. 5 is a three-dimensional appearance view of another embodiment of the present invention applied to a dual-substrate resistive touch panel.

FIG. 6 is a three-dimensional exploded view of the present invention applied to a projected capacitive touch panel with double substrates.

FIG. 7 is a three-dimensional exploded view of the present invention applied to a matrix capacitive touch panel with double substrates.

[Description of main component symbols]

10 substrate 11 top surface

12 Bottom

20 induction unit 21 first conductive layer

211 induction zone 212 connection port

22 Second conductive layer 221 Induction area

222 port

30 wires 31 test points

40, 40A, 40B lower substrate

50, 50A, 50B upper substrate

411, 411A, 411B, 511, 511A, 511B top surface

412, 412A, 412B, 512, 512A, 512B Bottom

60, 60A, 60B lower induction unit

61, 62, 63 lower conductive layer 621 induction area

Port 622 Port 631

70, 70A, 70B upper induction unit

71, 72, 73 upper conductive layer 721 induction area

722 Upper Port 731 Upper Port

81, 81A, 81B down wire

811 test points

82, 82A, 82B upper wire

821 test points

91, 91A, 91B insulating adhesive layer 92 gap sublayer

Detailed ways

The touch panel of the present utility model is characterized in that a test point is formed at one end of the wire for transmitting signals, and this feature can be applied to touch panels with various touch principles, for example: a single substrate type projected capacitive touch panel , or dual-substrate-type resistive, projected capacitive, and matrix-type capacitive touch panels, the following examples are respectively listed for illustration.

Referring to FIG. 1, when the touch panel is a single-substrate projected capacitive type, it includes a substrate 10, the substrate 10 has a top surface 11 and a bottom surface 12, and a sensing unit is arranged on the top surface 11. 20, and a plurality of wires 30 are provided on the substrate 10, wherein:

The induction unit 20 includes a plurality of first conductive layers 21 and a plurality of second conductive layers 22, wherein the first conductive layers 21 are arranged in parallel and share an axial direction, and each first conductive layer 21 has a plurality of serially connected The sensing area 211, these sensing areas 211 can be made of indium tin oxide, in this embodiment, the sensing area 211 is in the shape of a rhombus, and the edge of a sensing area 211 on the axial side of the first conductive layer 21 is provided with a conductive material A connection port 212, and these second conductive layers 22 are located at the position where the first conductive layer 21 is not provided on the top surface of the substrate 10, and are arranged in parallel and share another axial direction. Each second conductive layer 22 has a plurality of phases Sensing regions 221 connected in series, these sensing regions 211 can also be made of indium tin oxide and are diamond-shaped in this embodiment, and the edge of a sensing region 221 on the axial side of each second conductive layer 22 is provided with a conductive A port 222 of the material;

These wires 30 are conductive materials, and their number corresponds to the number of connection ports 212, 222 in the first conductive layer 21 and the second conductive layer 22, and one end of these wires 30 is respectively connected to a connection port 212, 222, The other end is extended on the top surface 11 of the substrate 10 , and the end is respectively formed with a test point 31 whose size is larger than the wire diameter of the wire 30 .

In addition, as shown in FIG. 2 , in other embodiments of the aforementioned single-substrate type projected capacitive touch panel, one end of the wire 30 formed with the test point 31 can further extend through the side of the substrate 10 and be located on the side of the substrate 10. bottom surface.

When the touch panel is a double-substrate type, no matter its touch principle is resistive (see Figure 3), projected capacitive (see Figure 6) or matrix capacitive (see Figure 7), its common Both are characterized by including a lower substrate 40, 40A, 40B and an upper substrate 50, 50A, 50B, and the lower substrate 40, 40A, 40B and the upper substrate 50, 50A, 50B respectively have a top surface 411, 411A, 411B, 511 . A lower sensing unit 60, 60A, 60B is provided on the top surface 411, 411A, 411B of the lower substrate 40, 40A, 40B, and an upper sensing unit 70 is provided on the bottom surface 512, 512A, 512B of the upper substrate 50, 50A, 50B. , 70A, 70B, and the lower substrates 40, 40A, 40B are provided with at least one lower conductor 81, 81A, 81B, and the upper substrates 50, 50A, 50B are provided with at least one upper conductor 82, 82A, 82B. Formula, projected capacitive and matrix capacitive to illustrate its structure.

3 and 4, when the touch panel is resistive, it further has an insulating adhesive layer 91 and a gap sublayer 92, and:

The area of the lower substrate 40 is larger than that of the upper substrate 50 and one side protrudes from the edge of the upper substrate 50. The lower sensing unit 60 on the top surface of the lower substrate 40 includes a lower conductive layer 61, which can be made of indium tin oxide. , this figure is an example of a five-wire resistive touch panel, so there are four lower wires 81 on the lower substrate 40, one end of these lower wires 81 is located on the top surface of the lower conductive layer 61, and the other end extends It is located on the top surface 511 of one side of the lower substrate 40 protruding from the upper substrate 50, and a test point 811 with a size larger than the wire diameter of the lower wire 81 is formed on the end;

The insulating adhesive layer 91 is frame-shaped and has a size corresponding to the upper substrate 50, and the insulating adhesive layer 91 is arranged between the upper substrate 50 and the lower substrate 40 and laminated on the upper substrate 50;

The gap sublayer 92 is disposed between the upper substrate 50 and the lower substrate 40 and is located in the insulating glue layer 91 ;

The upper sensing unit 70 on the bottom surface of the upper substrate 50 includes an upper conductive layer 71, which can be made of indium tin oxide. In addition, this figure is an example of a five-wire resistive touch panel, so only An upper wire 82 is provided, one end of the upper wire 82 is located on the bottom surface of the upper conductive layer 71, and the other end extends through the side of the insulating adhesive layer 91 and is located on the top of the side of the lower substrate 40 protruding from the upper substrate 50. On the surface 511 , a test point 821 with a size larger than the diameter of the upper wire 82 is formed on the end respectively.

As shown in FIG. 5 , in other embodiments of the aforementioned dual-substrate type resistive touch panel, the size of the lower substrate 40 may be corresponding to that of the upper substrate 50 , and the upper wire 82 is formed with test points 821. One end extends through the insulating layer 91, the lower conductive layer 61 and the side of the lower substrate 40 to be located on the bottom surface of the lower substrate 40, and the end of the lower conductive layer 81 formed with the test point 811 extends through the lower conductive layer 61 and the lower substrate 40. The side is located on the bottom surface of the lower substrate 40 .

Referring to FIG. 6, when the touch panel is a projected capacitive touch panel, it further has an insulating adhesive layer 91A, and its structure can be the same as that of the aforementioned double-substrate resistive touch panel. The size of the lower substrate is larger than that of the upper substrate. In the embodiment in which the upper wire and the lower wire form one end of the detection point extending on the top surface of the lower substrate protruding from the side of the upper substrate, and the size of the lower substrate is corresponding to the upper substrate, and the upper wire and the lower wire One end of the wire formed with test points extends to the bottom surface of the lower substrate, but the difference is that the structure of the upper sensing unit 70A and the lower sensing unit 60A are different from the resistive type, so only the upper sensing unit is used in this embodiment. Unit 70A and lower induction unit 60A are described:

The lower sensing unit 60A includes a plurality of lower conductive layers 62 arranged in parallel and having an axial direction in common. Each lower conductive layer 62 has a plurality of sensing regions 621 connected in series. These sensing regions 621 can be made of indium tin oxide. In this embodiment, the sensing area 621 is diamond-shaped, and the edge of each sensing area 621 located on the axial side of each lower conductive layer 62 is respectively provided with a lower connecting port 622 of conductive material, and these connecting ports 622 are respectively connected to the lower One end of the wire 81A is connected;

The upper sensing unit 70A includes a plurality of upper conductive layers 72 arranged in parallel and having another axial direction. These upper conductive layers 72 correspond to the positions where the lower conductive layer 62 is not provided on the top surface of the lower substrate 40. The conductive layer 72 has a plurality of sensing regions 721 connected in series. These sensing regions 721 can be made of indium tin oxide. In this embodiment, the sensing regions 721 are rhombus-shaped. An upper connection port 722 is respectively provided at the edge of the area 721, and these upper connection ports 722 are respectively connected to one end of an upper wire 82A;

The insulating glue layer 91A is disposed between the upper substrate 50A and the lower substrate 40A.

Referring to FIG. 7, when the touch panel is a matrix capacitive touch panel, it further has an insulating adhesive layer 91B, and its structure can have the same size of the lower substrate as the aforementioned double-substrate resistive and projected capacitive touch panels. is larger than the upper substrate, and the upper wire and the lower wire form one end of the detection point extending on the top surface of the lower substrate protruding from the side of the upper substrate, and the size of the lower substrate is corresponding to the upper substrate, and The embodiment in which the test point ends of the upper wire and the lower wire extend to the bottom of the lower substrate, but the difference is that the structures of the upper sensing unit 70B and the lower sensing unit 60B are different from those of the resistive type and the projected capacitive type, so in this embodiment In the embodiment, only the upper sensing unit 70B and the lower sensing unit 60B are described:

The top surface of the lower sensing unit 60B is provided with a plurality of lower conductive layers 63 arranged side by side. These lower conductive layers 63 are elongated and may be made of indium tin oxide, and one end of the long direction is respectively provided with a lower connection port of a conductive material. 631, these connecting ports 631 are respectively connected with one end of the lower wire 81B;

The bottom surface of the upper sensing unit 70B is provided with a plurality of upper conductive layers 73 arranged side by side. These upper conductive layers 73 are elongated and may be made of indium tin oxide, and intersect with the plurality of lower conductive layers 63 of the lower substrate 40B in a matrix. One end of each upper conductive layer 73 is provided with an upper connection port 731 of conductive material, and these upper connection ports 731 are respectively connected to one end of the upper wire 82B;

The insulating glue layer 91B is disposed between the upper substrate 50B and the lower substrate 40B.

It can be seen from the above that in the touch panel of the present invention, test points are formed at one end of the wire, the upper wire and the lower wire, and these test points can be inserted and contacted by the probes of the testing instrument, and due to these test The size of the point is larger than the wire diameter of the wire, upper wire, and lower wire, so even after a probe with a diameter similar to the wire diameter of the wire, upper wire, and lower wire is inserted, these test points will not be divided by the probe It can be seen that the present utility model can indeed prevent the situation that the touch panel in the prior art cannot operate normally due to the breakage of the wire after the test is completed. In addition, in the embodiment of the double-substrate type In the present invention, the test points are arranged on the bottom surface of the lower substrate, or the test points are arranged on the top surface of the lower substrate and the test points are exposed by making the lower substrate have a larger size, so that when these test points When further connecting a circuit board for output signals, the circuit board does not need to be sandwiched between the upper substrate and the lower substrate, so the upper substrate and the lower substrate can be tightly bonded, thereby preventing air from passing through the circuit board and the upper and lower substrates. The intrusion of the gap between them causes the touch sensitivity to decrease.

Moreover, using the structure of the test point, it can be combined with the layout of the machine (such as touch TV, mobile phone, e-book, etc.) after the test is completed, and there is no need to find space for the layout of the circuit board to place and combine.

Claims (10)

1. A touch panel, comprising a substrate, the substrate has a top surface and a bottom surface, and an induction unit is provided on the top surface, characterized in that: The substrate is provided with a plurality of conducting wires, one end of these conducting wires is respectively connected to the sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the conducting wire. 2. The touch panel according to claim 1, wherein one end of the wire formed with the test point extends on the top surface of the substrate. 3. The touch panel according to claim 1, wherein one end of the wire formed with the test point extends on the bottom surface of the substrate. 4. The touch panel according to any one of claims 1 to 3, wherein the sensing unit comprises a plurality of first conductive layers and a plurality of second conductive layers arranged in a staggered manner, and the first conductive layers are arranged in parallel and have an axial direction in common, each first conductive layer has a plurality of sensing areas connected in series, and these second conductive layers are located at positions where no first conductive layer is provided, these second conductive layers are arranged in parallel and share a common has another axial direction, each second conductive layer has a plurality of sensing areas connected in series, each first conductive layer and each second conductive layer are respectively provided with a connecting port at the edge of a sensing area on the axial side, The number of wires arranged on the substrate corresponds to the number of connection ports in the first conductive layer and the second conductive layer, and one end of the wires connected to the sensing unit is respectively connected to a connection port. 5. A touch panel, comprising a lower substrate and an upper substrate, the lower substrate and the upper substrate respectively have a top surface and a bottom surface, the bottom surface of the upper substrate faces the top surface of the lower substrate, and the top surface of the lower substrate A lower induction unit is provided on the surface, and an upper induction unit is provided on the bottom surface of the upper substrate, which is characterized in that: The lower substrate is provided with at least one lower wire made of conductive material, one end of the lower wire is respectively connected to the lower sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the lower wire; The upper substrate is provided with at least one upper wire made of conductive material, one end of the upper wire is respectively connected to the upper sensing unit, and the other end is respectively formed with a test point whose size is larger than the wire diameter of the upper wire. 6 . The touch panel according to claim 5 , wherein the test point ends of the upper wire and the lower wire both extend to the bottom surface of the lower substrate. 7 . 7. The touch panel according to claim 5, wherein the area of the lower substrate is larger than that of the upper substrate and one side protrudes from the edge of the upper substrate, and the upper and lower leads form one end of a test point Both extend to the top surface of the lower substrate protruding from one side of the upper substrate. 8. The touch panel according to any one of claims 5 to 7, further comprising an insulating adhesive layer and a gap sublayer, and: The lower sensing unit on the top surface of the lower substrate includes a lower conductive layer, and one end of the lower wire connected to the lower sensing unit is located on the top surface of the lower conductive layer; The upper sensing unit on the bottom surface of the upper substrate includes an upper conductive layer, and one end of the upper wire connected to the upper sensing unit is arranged on the bottom surface of the upper conductive layer; The insulating adhesive layer is frame-shaped and has a size corresponding to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate; The gap sublayer is arranged between the upper substrate and the lower substrate and is located in the insulating adhesive layer. 9. The touch panel according to any one of claims 5 to 7, further comprising an insulating adhesive layer, and: The lower sensing unit on the top surface of the lower substrate includes a plurality of lower conductive layers arranged in parallel and sharing an axial direction. Each lower conductive layer has a plurality of sensing areas connected in series. The edges of each sensing area on one side are respectively provided with a connecting port, and the number of the lower wires provided on the lower substrate corresponds to the number of the lower connecting ports, and one end of each lower wire connected to the lower sensing unit is respectively connected to the on the following ports; The upper induction unit on the bottom surface of the upper substrate includes a plurality of parallel arrangements and has another axial upper conductive layer. These upper conductive layers correspond to the positions where the lower conductive layer is not provided on the upper surface of the lower substrate. The conductive layer has a plurality of sensing areas connected in series, and an upper connection port is respectively provided at the edge of each sensing area on one side of the upper conductive layer in the axial direction, and the number of upper wires arranged on the upper substrate corresponds to The number of upper connection ports, and one end of each upper wire connected to the upper sensing unit is respectively connected to an upper connection port; The size of the insulating adhesive layer corresponds to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate. 10. The touch panel according to any one of claims 5 to 7, further comprising an insulating adhesive layer, and: The lower sensing unit on the top surface of the lower substrate includes a plurality of lower conductive layers arranged side by side. The number of wires corresponds to the number of the lower connection ports, and one end of each lower wire connected to the lower sensing unit is respectively connected to the lower connection port; The upper sensing unit on the bottom surface of the upper substrate includes a plurality of upper conductive layers arranged side by side. These upper conductive layers are elongated and intersect with the plurality of lower conductive layers of the lower substrate in a matrix. The lengthwise ends of each upper conductive layer are respectively An upper connection port is provided, and the number of upper wires provided on the upper substrate corresponds to the number of the upper connection ports, and one end of each upper wire connected to the upper sensing unit is respectively connected to an upper connection port; The size of the insulating adhesive layer corresponds to the upper substrate, and the insulating adhesive layer is arranged between the upper substrate and the lower substrate and laminated on the upper substrate.

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