CN201699185U - A double-layer SIM card connector - Google Patents
A double-layer SIM card connector Download PDFInfo
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- CN201699185U CN201699185U CN2010201670489U CN201020167048U CN201699185U CN 201699185 U CN201699185 U CN 201699185U CN 2010201670489 U CN2010201670489 U CN 2010201670489U CN 201020167048 U CN201020167048 U CN 201020167048U CN 201699185 U CN201699185 U CN 201699185U
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- 239000010410 layer Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 7
- 239000002355 dual-layer Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
一种双层SIM卡连接器,所述SIM卡连接器包括壳体(3)、框架(1)和多个端子(14,15,16,17),所述框架包括一用于嵌设所述多个端子的安装板(18),所述壳体(3)和所述框架(1)之间形成两个容纳SIM卡的空间,所述多个端子(14,15,16,17)包括用于嵌入所述安装板的基部和用于接触SIM卡的折弯部,且朝上折弯的多个端子(14,15)和朝下的折弯的多个端子(16,17)以彼此间隔的方式置于所述安装板上,当将两个SIM卡分别正向或反向地插入所述连接器时,位于上层的SIM卡底面的端子与所述朝上折弯的多个端子(14,15)接触,而位于下层的SIM卡顶面的端子与所述朝下的折弯的多个端子(16,17)接触。
A double-layer SIM card connector, the SIM card connector includes a housing (3), a frame (1) and a plurality of terminals (14, 15, 16, 17), the frame includes a The mounting plate (18) of the plurality of terminals, two spaces for accommodating SIM cards are formed between the housing (3) and the frame (1), and the plurality of terminals (14, 15, 16, 17) Comprising a base portion for embedding the mounting board and a bent portion for contacting the SIM card, and a plurality of terminals (14, 15) bent upwards and a plurality of terminals (16, 17) bent downwards Placed on the mounting plate in a manner spaced apart from each other, when the two SIM cards are respectively inserted into the connector forwardly or reversely, the terminals on the bottom surface of the upper SIM card and the upwardly bent multiple The terminals (14, 15) are in contact with each other, while the terminals on the top surface of the SIM card on the lower layer are in contact with the downwardly bent terminals (16, 17).
Description
技术领域technical field
本实用新型涉及一种电子连接器,具体的涉及一种双层SIM卡连接器。The utility model relates to an electronic connector, in particular to a double-layer SIM card connector.
背景技术Background technique
随着通信技术的发展,双卡双待手机得到了广泛的应用,市场占有率也不断提高。现有技术中的双卡双待手机有些是通过2个SIM连接器来实现双卡双待,有些是通过双层SIM连接器来实现双卡双待。With the development of communication technology, dual-card dual-standby mobile phones have been widely used, and the market share has also continued to increase. Some dual-card dual-standby mobile phones in the prior art realize dual-card dual-standby through two SIM connectors, and some realize dual-card dual-standby through double-layer SIM connectors.
一些双层SIM连接器是将SIM卡平行的一起插入连接器,而连接器是上下层组装在一起,上下层分别用镶嵌模塑(insert molding)成型,然后再组装其他部件。在上述制造工艺中,需要进行2次镶嵌模塑,因此需要2套镶嵌模具和2套端子模具,而且还比较废料;此外,上下层组装在一起会引起端子焊脚平面度的问题。Some double-layer SIM connectors insert SIM cards into the connector in parallel, while the connector is assembled from the upper and lower layers, and the upper and lower layers are respectively molded by insert molding, and then other components are assembled. In the above-mentioned manufacturing process, insert molding needs to be performed twice, so two sets of insert molds and two sets of terminal molds are required, and it is relatively waste; in addition, the assembly of the upper and lower layers will cause the problem of the flatness of the terminal solder feet.
实用新型内容Utility model content
鉴于上述背景技术中提到的技术问题,本实用新型的目的在于克服现有技术中的缺陷和问题的至少一方面。In view of the technical problems mentioned in the background art above, the purpose of this utility model is to overcome at least one aspect of the defects and problems in the prior art.
本实用新型的一个方面提供一种双层SIM卡连接器,所述SIM卡连接器包括壳体、框架和多个端子,所述框架包括一用于嵌设所述多个端子的安装板,所述壳体和所述框架之间形成两个容纳SIM卡的空间,所述多个端子包括用于嵌入所述安装板的基部和用于接触SIM卡的折弯部,且朝上折弯的多个端子和朝下的折弯的多个端子以彼此间隔的方式置于所述安装板上,当将两个SIM卡分别正向或反向地插入所述连接器时,位于上层的SIM卡底面的端子与所述朝上折弯的多个端子接触,而位于下层的SIM卡顶面的端子与所述朝下的折弯的多个端子接触。One aspect of the present utility model provides a double-layer SIM card connector, the SIM card connector includes a housing, a frame and a plurality of terminals, the frame includes a mounting plate for embedding the plurality of terminals, Two spaces for accommodating SIM cards are formed between the housing and the frame, and the plurality of terminals include a base for embedding the mounting board and a bent portion for contacting the SIM card, and are bent upward A plurality of terminals and a plurality of downwardly bent terminals are placed on the mounting board in a manner spaced from each other. When two SIM cards are respectively inserted into the connector forwardly or reversely, the upper-layer The terminals on the bottom surface of the SIM card are in contact with the plurality of upwardly bent terminals, while the terminals on the top surface of the lower SIM card are in contact with the plurality of downwardly bent terminals.
根据本实用新型之一实施例,所述框架两侧的中间部位具有至少一个凸部,所述壳体上具有与凸部卡接配合的安装孔。According to an embodiment of the present invention, at least one protrusion is provided in the middle of the two sides of the frame, and the housing has an installation hole snap-fitted with the protrusion.
优选的,所述多个端子沿所述框架的纵向方向分成两排,每一排分别具有三个朝上折弯的端子和三个朝下折弯的端子。Preferably, the plurality of terminals are divided into two rows along the longitudinal direction of the frame, and each row has three upwardly bent terminals and three downwardly bent terminals.
优选的,所述框架的构成材料为塑胶。Preferably, the frame is made of plastic.
优选的,所述壳体的构成材料为金属。Preferably, the constituent material of the housing is metal.
本实用新型的另外一个方面,提供一种上述的双层SIM卡连接器的制造方法,其包括下述步骤:Another aspect of the present utility model provides a kind of manufacturing method of above-mentioned dual-layer SIM card connector, and it comprises the following steps:
利用连续模具对金属带料进行正反冲压,从而形成彼此间隔的朝上折弯的多个端子和朝下折弯的多个端子;Front and back stamping of the metal strip using a continuous die to form a plurality of upwardly bent terminals and downwardly bent terminals spaced apart from each other;
将包括所述多个端子的金属带料放入模具中,与塑胶绝缘体一起注塑成型,从而形成具有多个端子的框架;putting the metal strip including the plurality of terminals into a mold, and injection molding together with the plastic insulator, thereby forming a frame with a plurality of terminals;
切除端子之间的连接处,使每个端子保持独立;以及cut away the junctions between the terminals, leaving each terminal separate; and
将壳体装配到所述框架上,在所述壳体和框架之间形成容纳SIM卡的空间。The casing is assembled on the frame, and a space for accommodating the SIM card is formed between the casing and the frame.
本实用新型的至少一个方面的技术效果在于:本实用新型的连接器是使用1次镶嵌模塑成型而成,然后再组装其他部件。因此,制造该连接器只要1套镶嵌模具和1套端子模具,并且制造过程节省原料,从而节约了成本;另外还简化了产品的组装流程;更为重要的是,由于采用1次镶嵌模塑,从而保证端子焊脚平面度,提高了产品的质量。The technical effect of at least one aspect of the present invention is that the connector of the present invention is formed by insert molding once, and then other components are assembled. Therefore, only one set of insert mold and one set of terminal mold are needed to manufacture the connector, and the manufacturing process saves raw materials, thereby saving costs; in addition, the assembly process of the product is simplified; more importantly, due to the use of one insert molding , so as to ensure the flatness of the terminal solder feet and improve the quality of the product.
附图说明Description of drawings
从随后结合附图对实施例的描述中,本实用新型的示例性实施例的这些和/或其他方面和优点将变得显而易见并更容易理解,在附图中:These and/or other aspects and advantages of the exemplary embodiments of the present invention will become apparent and easier to understand from the following description of the embodiments in conjunction with the accompanying drawings, in which:
图1是本实用新型所述的双层SIM卡连接器分解的示意图;Fig. 1 is the schematic diagram of the decomposition of double-layer SIM card connector described in the utility model;
图2是将图1中所示的部件水平旋转180度的示意图;Fig. 2 is a schematic diagram of horizontally rotating the components shown in Fig. 1 by 180 degrees;
图3是将本实用新型的双层SIM卡连接器与两个SIM装配在一起的示意图。Fig. 3 is a schematic diagram of assembling the dual-layer SIM card connector of the present invention with two SIMs.
具体实施方式Detailed ways
以下是根据特定的具体实例说明本实用新型的具体实施方式,熟悉本领域的技术人员可由以下实施例中所揭示的内容轻易地了解本实用新型的构造、优点与功效。The following is a description of the specific implementation of the utility model based on specific examples. Those skilled in the art can easily understand the structure, advantages and effects of the utility model from the content disclosed in the following examples.
本实用新型亦可藉由其它不同的具体实例加以施行或应用,本说明书中的各项细节亦可基于不同观点与应用,在不悖离总体实用新型构思下进行各种修饰与变更。The utility model can also be implemented or applied by other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the overall concept of the utility model.
再者,以下图式均为简化的示意图式,而仅以示意方式说明本实用新型的基本构想,故图式中仅显示与本实用新型有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可作随意的变更,且其组件布局型态可能更为复杂。Furthermore, the following drawings are all simplified schematic diagrams, and only illustrate the basic idea of the utility model in a schematic manner, so only the components related to the utility model are shown in the drawings rather than the number and shape of components in actual implementation. and size drawing, the type, quantity and proportion of each component can be changed at will during actual implementation, and the layout of the components may be more complex.
参见附图1和图2,附图1示出了根据本实用新型的一个实施例的双层SIM卡连接器的示意图,附图2示出了将图1中所示的部件水平旋转180度的示意图。如附图1和2所示,SIM卡连接器包括壳体3、框架1和多个端子14、15、16、17,框架包括一用于嵌设多个端子的安装板18,壳体3和框架1之间形成两个容纳SIM卡的空间,多个端子14、15、16、17包括用于嵌入所述安装板的基部和用于接触SIM卡的折弯部,且朝上折弯的多个端子14、15和朝下的折弯的多个端子16、17以彼此间隔的方式置于安装板上。Referring to accompanying
如附图3所示,当将两个SIM卡12、13分别正向或反向地插入连接器时,位于上层的SIM卡底面的端子与朝上折弯的多个端子14、15接触,而位于下层的SIM卡顶面的端子与朝下的折弯的多个端子16、17接触。As shown in Figure 3, when two
在优选的实施方式中,参见附图1和2,框架1两侧的中间部位分别具有两个凸部4、5和两个凸部8、9,壳体3的两侧分别上具有与凸部4、5、8、9卡接配合的安装孔6、7、10、11。利用凸部4、5、8、9与安装孔6、7、10、11相配合,从而使框架1与壳体3固定连接。In a preferred embodiment, referring to accompanying
根据本实用新型,上述的凸部以及与之配合的安装孔还可以设置成一个或多个。According to the present invention, the above-mentioned protrusions and the mounting holes matched therewith can also be provided in one or more.
多个端子14、15、16、17沿所述框架的纵向方向分成两排,每一排分别具有三个朝上折弯的端子和三个朝下折弯的端子。框架的构成材料为塑胶,壳体的构成材料为金属。A plurality of
另外,本实用新型提供了双层SIM卡连接器的制造方法,根据优选的实施方式,该制造方法包括如下步骤,利用1套连续模具对金属带料2进行正反冲压,从而形成彼此间隔的朝上折弯的多个端子14、15和朝下折弯的多个端子16、17;将包括所述多个端子的金属带料2放入模具中,与塑胶绝缘体一起注塑成型,从而形成具有多个端子的框架;切除端子之间的连接处,使每个端子保持独立;将壳体装配到所述框架上,在所述壳体和框架之间形成容纳SIM卡的空间。从而,完成双层SIM卡连接器的制造。In addition, the utility model provides a manufacturing method of a double-layer SIM card connector. According to a preferred embodiment, the manufacturing method includes the following steps: using a set of continuous molds to carry out positive and negative stamping on the
尽管已经示出并描述了本实用新型的实施例,然而本领域的技术人员可以了解,在不脱离本实用新型的原理和精髓的情况下可以对所述实施例作出变化,本实用新型的保护范围限定在权利要求及其等同物中。Although the embodiment of the utility model has been shown and described, those skilled in the art can understand that the embodiment can be changed without departing from the principle and essence of the utility model, and the protection of the utility model The scope is defined in the claims and their equivalents.
Claims (5)
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CN2010201670489U CN201699185U (en) | 2010-04-20 | 2010-04-20 | A double-layer SIM card connector |
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CN2010201670489U CN201699185U (en) | 2010-04-20 | 2010-04-20 | A double-layer SIM card connector |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102237585A (en) * | 2010-04-20 | 2011-11-09 | 泰科电子(上海)有限公司 | Double-layer SIM (subscriber identity module) card connector |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102237585A (en) * | 2010-04-20 | 2011-11-09 | 泰科电子(上海)有限公司 | Double-layer SIM (subscriber identity module) card connector |
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