CN201666482U - Self-assembled LED lamp - Google Patents

Abstract

The utility model relates to a Light Emitting Diode (LED) lamp, including a heat dissipation module, a circuit board and a wire bonding ring piece, this circuit board combines with this heat dissipation module, it is equipped with an at least epitaxial wafer and connects in the two electrode contact of this epitaxial wafer in electricity, this wire bonding ring piece combines in the peripheral no epitaxial wafer part in the surface of this circuit board, and the surface of this wire bonding ring piece again corresponding to the two electrode contact of this circuit board and be equipped with these electrode contact two lead the contact and lead the circuit that connects that extends by this lead the contact. Therefore, each element in the utility model can be replaced independently, and the utility model can be assembled by the user, which is very convenient for the user.

Description

Self-assembled LED lamps

technical field

The utility model relates to a light-emitting diode (LED) lamp, in particular to an LED lamp which can replace parts and is easy for users to assemble by themselves.

Background technique

As the technology of light-emitting diode (LED) is becoming more and more mature, it can be used as lighting or light-emitting components or devices for various daily necessities and high-tech products. Generally, the most common light-emitting diode (LED) lamps not only have high-efficiency luminous power , It also has the advantages of high lighting brightness and long service life, so LED lamps are the most practical and developmental type of lighting devices at present.

A general LED lamp includes a heat dissipation module, a circuit board and a lampshade. The heat dissipation module includes a heat conduction substrate and a plurality of heat dissipation fins arranged on one side of the heat conduction substrate. The other surface of the light-emitting LED epitaxial wafer is bonded to the heat dissipation module, and the lampshade is fixed on the heat-conducting substrate and covers the LED epitaxial wafers.

Further, before bonding the heat-conducting substrate and the circuit board, two wires are first bonded to the two electrode contacts on the circuit board, so that the circuit board is supplied with power through the wires during use, and the heat conduction When bonding the substrate and the circuit board, screen print the solder paste on the side of the thermally conductive substrate facing the circuit board, then place the circuit board on the side, heat and melt the solder paste, and then complete the thermally conductive substrate and circuit board after cooling. Bonding steps for circuit boards.

However, this method of directly bonding the heat-conducting substrate and the circuit board makes it necessary to replace the entire set of heat-conducting substrate and circuit board at the same time when one of the heat-dissipating module or the circuit board is damaged, thus causing economic burden to the user. .

Contents of the invention

In view of the fact that the existing light-emitting diode (LED) lamps cannot replace the circuit board or the heat dissipation module alone, once one of them is damaged, both components must be replaced at the same time, causing a burden on the user. Therefore, after continuous research and After continuous experimentation, the utility model finally came out with a self-assembled LED lamp.

The purpose of the utility model is to provide an LED lamp with replaceable parts and easy for users to assemble by themselves.

In order to achieve the above-mentioned purpose, the light-emitting diode (LED) lamp of the present utility model comprises:

A cooling module;

A circuit board, which is combined with the heat dissipation module, and includes a near surface and a far surface, the near surface faces the heat dissipation module, and the far surface is provided with at least one epitaxial wafer and is electrically connected to the epitaxial wafer The two electrode contacts of the chip;

A wire bonding ring, which is bonded to the far surface of the circuit board where there is no epitaxial wafer, and the surface of the wire bonding ring corresponds to the two electrode contacts of the circuit board and is provided with the electrode contacts. The two conducting points and the conducting lines extended from the conducting points.

Wherein, the LED lamp still includes two wires, which are respectively connected to the conducting lines of the wire bonding ring piece.

Preferably, the wire bonding ring is transparent.

Preferably, the circuit board is provided with at least one foolproof hole, and the wire bonding ring piece is also provided with a corresponding foolproof hole matching the foolproof hole of the circuit board.

Preferably, the through-holes of the heat dissipation module are arranged at intervals, and the intervals are not equal, and the positions of the through-holes of the circuit board, the through-holes of the wire bonding ring piece and the screw holes of the lampshade are all aligned. The perforation of the module should be dissipated to achieve a fool-proof effect.

In one aspect, the LED lamp further includes a lampshade, which is fixed on the surface of the wire bonding ring to expose the epitaxial wafer of the circuit board.

Wherein, the heat dissipation module forms a plurality of through holes; the circuit board is pierced with a plurality of through holes corresponding to the through holes of the heat dissipation module; A plurality of penetration holes are pierced through the holes; the lampshade is provided with a plurality of screw holes for screwing in a plurality of screws to fix the heat dissipation module, the circuit board, the wire bonding ring piece and the lampshade.

Wherein, each screw penetrates through the through hole of the heat dissipation module, passes through the through hole of the circuit board and the penetration hole of the wire bonding ring piece, and then screws into the screw hole of the lampshade, thereby fixing the heat dissipation module , circuit boards, wire bond rings, and lamp housings.

Wherein, the heat dissipation module forms a plurality of through holes; the circuit board is pierced with a plurality of through holes corresponding to the through holes of the heat dissipation module; The lampshade is provided with a plurality of penetration holes protruding and penetrating into the wire bonding ring piece, the penetration hole of the circuit board and the projection of the penetration hole of the heat dissipation module, and each A screw hole is provided in the protruding block for a plurality of screws to be screwed in to fix the heat dissipation module, the circuit board, the wire bonding ring piece and the lampshade.

In another aspect, the LED lamp further includes a fixing ring piece corresponding to and fixed on the surface of the wire bonding ring piece to expose the epitaxial wafer of the circuit board.

Wherein, the heat dissipation module forms a plurality of screw holes; the circuit board is pierced with a plurality of piercing holes corresponding to the screw holes of the heat dissipation module; the wire bonding ring piece corresponds to the screw holes of the heat dissipation module and the circuit board The piercing holes of the fixed ring are provided with a plurality of through holes; the fixed ring piece is provided with a plurality of through holes corresponding to the through holes of the wire bonding ring piece, so that a plurality of screws can penetrate through the through holes of the fixed ring piece, and pass through The penetration hole of the wire bonding ring piece and the through hole of the circuit board are screwed into the screw holes of the cooling module, thereby fixing the cooling module, circuit board, wire bonding ring piece and the fixing ring piece.

The advantages of the utility model can be roughly summarized in the following points:

A. Each component can be disassembled, so if one component is damaged, the single component can be replaced without replacing the whole group, so it can save costs.

B. Each component is fixed by screws, so users can disassemble and assemble by themselves, which is quite simple and convenient.

C. Through the fool-proof device, the speed of user assembly can be accelerated.

Description of drawings

Fig. 1 is the perspective view of an embodiment of the utility model light-emitting diode (LED) lamp;

Fig. 2 is a partial three-dimensional exploded view of the utility model;

Fig. 3 is a partial side sectional view of the utility model;

Fig. 4 is a top view of a state in which the wire bonding ring of the present invention presents a fool-proof effect;

Fig. 5 is a top view of another state in which the wire bonding ring piece of the present invention presents a fool-proof effect;

Fig. 6 is a perspective view of another embodiment of the light emitting diode (LED) lamp of the present invention.

Detailed ways

Please refer to shown in Fig. 1 to Fig. 3, it is an embodiment of the light-emitting diode (LED) lamp of the present utility model, comprises:

A heat dissipation module 10, which includes a heat dissipation base 11 and a plurality of heat dissipation fins 12 arranged on the heat dissipation base 11, the heat dissipation base 11 forms a plurality of through holes 13, in this embodiment, three through holes 13 are formed, And the heat dissipation fins 12 can present various structures to achieve different degrees of heat dissipation effects, and it can be known by those with ordinary knowledge in the technical field;

A circuit board 20, which is combined with the heat dissipation base 11 of the heat dissipation module 10, and includes a near surface and a far surface, the near surface faces a surface of the heat dissipation base 11 of the heat dissipation module 10, and the The far surface is provided with at least one epitaxial wafer 21 and two electrode contacts 23 electrically connected to the epitaxial wafer 21, and the circuit board 20 is provided with a plurality of through holes 22 corresponding to the through holes 13 of the heat dissipation module;

A wire bonding ring piece 30, which is transparent, is bonded to the far surface periphery of the circuit board 20 where there is no epitaxial wafer 21, so as to avoid covering the epitaxial wafers 21, and the surface of the wire bonding ring piece 30 is Corresponding to the two electrode contacts 23 of the circuit board 20, there are two conducting points 31 in contact with the electrode contacts 23 and a conducting line 32 extending from the conducting points 31. The wire bonding ring 30 corresponds to the heat dissipation The through hole 13 of the module 10 and the through hole 22 of the circuit board 20 are perforated with a plurality of through holes 33;

Two wires 40, which are respectively connected to the conducting lines 32 of the wire bonding ring piece 30;

A lampshade 50, which is fixed on the surface of the wire bonding ring piece 30 to expose the epitaxial wafer 21 of the circuit board 20, the lampshade is provided with a plurality of screw holes for screwing in a plurality of screws 60 to screw the heat dissipation module 10 , the circuit board 20, the wire bonding ring 30 and the lampshade 50 are fixed, each screw 60 is penetrated by the through hole 13 of the heat dissipation module 10, and penetrates through the through hole 22 of the circuit board 20 and the wire bonding ring 30 The holes 33 are screwed into the screw holes 51 of the lampshade 50 , thereby fixing the heat dissipation module 10 , the circuit board 20 , the wire bonding ring piece 30 and the lampshade 50 .

In this embodiment, the lampshade 50 is provided with a plurality of penetration holes 33 that protrude and penetrate the wire bonding ring 30 , the penetration holes 22 of the circuit board 20 and the protrusions of the penetration holes 13 of the heat dissipation module 10 52 , and each protrusion 52 is provided with a screw hole 51 for a plurality of screws 60 to be screwed in to fix the heat dissipation module 10 , the circuit board 20 , the wire bonding ring 30 and the lampshade 50 .

Please refer to Fig. 2 and shown in Fig. 4, this circuit board 20 is provided with at least one fool-proof hole 24, has two fool-proof holes 24 in this embodiment, and this wire bonding ring piece 30 is also provided with this circuit The foolproof holes 34 of the board 20 correspond to the foolproof holes 24 .

Please refer to Fig. 2, Fig. 3 and Fig. 5, the through holes 13 of the cooling module 10 are arranged at intervals, and the intervals are not equal, and the through holes 22 of the circuit board 20, the through holes of the wire bonding ring 30 The positions of the through holes 33 ′ and the screw holes 51 of the lampshade 50 are both corresponding to the through holes 13 of the heat dissipation module 10 , so as to achieve a fool-proof effect.

Please refer to FIG. 6, which is another embodiment of the light-emitting diode LED lamp of the present invention, which includes a heat dissipation module 10', a circuit board 20' and a wire bonding ring piece 30', and its structure is the same as that of the above-mentioned The embodiment is substantially the same, the difference is that the LED lamp of this embodiment does not have a lampshade, but includes a fixing ring piece 70 ′, which corresponds to and is fixed on the surface of the wire bonding ring piece 30 ′, so as to expose the circuit Epitaxial wafer 21' of plate 20'. The heat dissipation module 10' forms a plurality of screw holes; the circuit board 20' is pierced with a plurality of through holes 22' corresponding to the screw holes of the heat dissipation module 10'; the wire bonding ring piece 30 corresponds to the heat dissipation module 10' screw hole and the through hole 22' of the circuit board 20' are pierced with a plurality of through holes 33'; A plurality of through holes 71' are used for a plurality of screws 60 to penetrate through the through holes 71' of the fixing ring piece 70', and pass through the through hole 33' of the wire bonding ring piece 30' and the through hole of the circuit board 20' 22', and then screwed into the screw holes of the heat dissipation module 10', thereby fixing the heat dissipation module 10', the circuit board 20', the wire bonding ring piece 30' and the fixing ring piece 70'.

The utility model does not directly bond the circuit board and the heat dissipation module, but detachably combines them together, and connects the wires through the set wire bonding ring piece, so the easily damaged circuit board can be replaced independently , and other components can also be replaced separately, so it can save the user's expenses; and the utility model only uses screws to assemble the components, and the user can easily assemble it by itself through the fool-proof device. It is very convenient for the reader.

Claims (10)

1. a light emitting diode (LED) light fixture is characterized in that comprising:

One heat radiation module;

One circuit board, it combines with this heat radiation module, and comprises a nearly surface and a surface far away, and this nearly surface is in the face of this heat radiation module, and two electrode contacts that this surface far away is provided with at least one Jingjing sheet of heap of stone and is electrically connected on this Jingjing sheet of heap of stone;

One lead engages ring plate, its surface perimeter far away that is incorporated into this circuit board does not have Jingjing sheet part of heap of stone, and this lead surface of engaging ring plate is provided with two connecting a little and connect circuit by what this connected a little to be extended of contacting with these electrode contacts again corresponding to two electrode contacts of this circuit board.

2. led lamp as claimed in claim 1 is characterized in that this LED light fixture still comprises two leads, and it is connected to the circuit that connects that this lead engages ring plate.

3. led lamp as claimed in claim 1 is characterized in that this lead engages ring plate and is transparent.

4. as each described led lamp in the claim 1 to 3, it is characterized in that this circuit board is provided with at least one fool proof hole, and this lead engages the corresponding fool proof hole that ring plate also is provided with the fool proof hole that is matched with this circuit board.

5. as each described led lamp in the claim 1 to 3, the perforation that it is characterized in that this heat radiation module is provided with at interval, and each is also unequal at interval, and the position of the screw of the through hole of the perforating of this circuit board, this lead joint ring plate and this lampshade is all the perforation to the module that should dispel the heat.

6. as each described led lamp in the claim 1 to 3, it is characterized in that comprising a lampshade, it is fixed in the surface that this lead engages ring plate, to expose the Jingjing sheet of heap of stone of this circuit board.

7. led lamp as claimed in claim 6 is characterized in that this heat radiation module forms plurality of through holes; This circuit board is equipped with plural perforating corresponding to the perforation of this heat radiation module; This lead engages ring plate and is equipped with plural through hole corresponding to the perforating of the perforation of this heat radiation module and this circuit board; This lampshade is provided with plural screw, be screwed into for plural screw, each screw is penetrated by the perforation of this heat radiation module, and via the perforating of this circuit board and the through hole of lead joint ring plate, be screwed into again in the screw of this lampshade, and the module that should dispel the heat, circuit board, lead joint ring plate and lampshade are fixed.

8. led lamp as claimed in claim 6 is characterized in that this heat radiation module forms plurality of through holes; This circuit board is equipped with plural perforating corresponding to the perforation of this heat radiation module; This lead engages ring plate and is equipped with plural through hole corresponding to the perforating of the perforation of this heat radiation module and this circuit board; It is outstanding and penetrate the projection of the perforation of the perforating of through hole that this lead engages ring plate, this circuit board and this this heat radiation module that this lampshade is provided with plural number, and be provided with a screw in each projection, the module that should dispel the heat, circuit board, lead joint ring plate and lampshade are fixed for plural screw is screwed into.

9. as each described led lamp in the claim 1 to 3, it is characterized in that comprising a fixed ring piece, it is corresponding and be fixed in the surface that this lead engages ring plate, to expose the Jingjing sheet of heap of stone of this circuit board.

10. led lamp as claimed in claim 9 is characterized in that this heat radiation module forms plural screw; This circuit board is equipped with plural perforating corresponding to the screw of this heat radiation module; This lead engages ring plate and is equipped with plural through hole corresponding to the perforating of the screw of this heat radiation module and this circuit board; This fixed ring piece is provided with plural open-work to the through hole that should lead engages ring plate, penetrate for the open-work of plural screw by this fixed ring piece, and via the through hole of this lead joint ring plate and the perforating of circuit board, be screwed into again in the screw of this heat radiation module, fix this heat radiation module, circuit board, lead joint ring plate and fixed ring piece whereby.

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