CN201645323U - 化学机械研磨用金刚石修整器 - Google Patents
化学机械研磨用金刚石修整器 Download PDFInfo
- Publication number
- CN201645323U CN201645323U CN201020149837XU CN201020149837U CN201645323U CN 201645323 U CN201645323 U CN 201645323U CN 201020149837X U CN201020149837X U CN 201020149837XU CN 201020149837 U CN201020149837 U CN 201020149837U CN 201645323 U CN201645323 U CN 201645323U
- Authority
- CN
- China
- Prior art keywords
- diamond
- ring surface
- grinding
- emery wheel
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 47
- 239000010432 diamond Substances 0.000 title claims abstract description 47
- 239000000126 substance Substances 0.000 title abstract description 3
- 229910001651 emery Inorganic materials 0.000 claims description 22
- 239000000843 powder Substances 0.000 abstract description 6
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 230000003031 feeding effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020149837XU CN201645323U (zh) | 2010-04-02 | 2010-04-02 | 化学机械研磨用金刚石修整器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020149837XU CN201645323U (zh) | 2010-04-02 | 2010-04-02 | 化学机械研磨用金刚石修整器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201645323U true CN201645323U (zh) | 2010-11-24 |
Family
ID=43110533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201020149837XU Expired - Lifetime CN201645323U (zh) | 2010-04-02 | 2010-04-02 | 化学机械研磨用金刚石修整器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201645323U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105345665A (zh) * | 2015-11-30 | 2016-02-24 | 郑州磨料磨具磨削研究所有限公司 | 一种平面磨削用超硬砂轮修整工具及修整方法 |
CN105473283A (zh) * | 2013-08-19 | 2016-04-06 | 圣戈班金刚石工具有限责任两合公司 | 整形辊子 |
CN113714935A (zh) * | 2021-08-16 | 2021-11-30 | 蚌埠高华电子股份有限公司 | 一种研磨垫自动修正设备及其使用方法 |
-
2010
- 2010-04-02 CN CN201020149837XU patent/CN201645323U/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105473283A (zh) * | 2013-08-19 | 2016-04-06 | 圣戈班金刚石工具有限责任两合公司 | 整形辊子 |
US9956665B2 (en) | 2013-08-19 | 2018-05-01 | Saint-Gobain Diamantwerkzeuge Gmbh | Form dressing roller |
CN105345665A (zh) * | 2015-11-30 | 2016-02-24 | 郑州磨料磨具磨削研究所有限公司 | 一种平面磨削用超硬砂轮修整工具及修整方法 |
CN113714935A (zh) * | 2021-08-16 | 2021-11-30 | 蚌埠高华电子股份有限公司 | 一种研磨垫自动修正设备及其使用方法 |
CN113714935B (zh) * | 2021-08-16 | 2022-07-12 | 蚌埠高华电子股份有限公司 | 一种研磨垫自动修正设备及其使用方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI228066B (en) | Abrasive cloth dresser and method for dressing an abrasive cloth with the same | |
JP5516051B2 (ja) | 研磨パッドを用いた研磨装置及びガラス板の製造方法 | |
JP2009289925A (ja) | 半導体ウェーハの研削方法、研削用定盤および研削装置 | |
JP2008062367A (ja) | 研磨装置、研磨パッド、研磨方法 | |
CN102049737B (zh) | 抛光垫修整器 | |
CN201645323U (zh) | 化学机械研磨用金刚石修整器 | |
CN103269831A (zh) | Cmp垫整修工具 | |
JP6032155B2 (ja) | ウェーハの両面研磨方法 | |
CN101450512A (zh) | 一种化学机械抛光方法及其专用设备以及该设备制备方法 | |
Li et al. | Simultaneous double side grinding of silicon wafers: a literature review | |
CN101327577A (zh) | 带自修整功能的磨损均匀性好的固结磨料抛光垫 | |
CN202952160U (zh) | 一种化学机械抛光修整器 | |
CN202462207U (zh) | 研磨垫及研磨装置 | |
CN212683552U (zh) | 一种化学机械抛光垫及抛光装置 | |
CN201677232U (zh) | 研磨片 | |
CN102044408B (zh) | 用于动态调整化学机械抛光速率的方法 | |
CN211073244U (zh) | 一种圆形环装区域递进式打磨砂纸 | |
CN111993295A (zh) | 一种带有一粗四精沟槽的砂轮及其应用 | |
JP4241164B2 (ja) | 半導体ウェハ研磨機 | |
JP2012130995A (ja) | ドレッサ | |
CN207771568U (zh) | 新型研磨盘 | |
CN221834139U (zh) | 一种双磨层的打磨砂轮 | |
CN213164883U (zh) | 一种修整结构 | |
CN202196765U (zh) | 晶片夹持装置 | |
CN110871407A (zh) | 抛光垫修整器及化学机械平坦化的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NANJING SANCHAO ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: NANJING SANCHAO DIAMOND TOOLS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 211124, Jiangning Road, Chunhua District, Jiangsu City, Nanjing Province, Ze Cheng Road, No. 77 Patentee after: NANJING SANCHAO ADVANCED MATERIALS CO., LTD. Address before: 211124 tea street, Chunhua street, Jiangning District, Jiangsu, Nanjing Patentee before: Nanjing Sanchao Diamond Tools Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20101124 |