CN201574207U - Electroplating bath with uniform distribution of power lines - Google Patents
Electroplating bath with uniform distribution of power lines Download PDFInfo
- Publication number
- CN201574207U CN201574207U CN2009202861279U CN200920286127U CN201574207U CN 201574207 U CN201574207 U CN 201574207U CN 2009202861279 U CN2009202861279 U CN 2009202861279U CN 200920286127 U CN200920286127 U CN 200920286127U CN 201574207 U CN201574207 U CN 201574207U
- Authority
- CN
- China
- Prior art keywords
- anode
- negative electrode
- power lines
- uniform distribution
- electroplating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title abstract description 8
- 238000009827 uniform distribution Methods 0.000 title abstract 3
- 238000007747 plating Methods 0.000 claims description 12
- 210000005056 cell body Anatomy 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 abstract description 7
- 239000003792 electrolyte Substances 0.000 abstract 1
- 238000009828 non-uniform distribution Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating bath with uniform distribution of power lines, which comprises a bath body, wherein two parallel anodes are arranged in the bath body, a cathode is arranged between the two anodes which are mutually parallel, and the electroplating bath is characterized in that the lower end of the cathode is lower than that of the anode, and the upper end of the cathode is higher than that of the anode along the depth direction of electrolyte. Due to the use of the electroplating bath with uniform distribution of the power lines, the upper end and the lower end of a workpiece can avoid form generating burning phenomenon. The distribution of the power lines is uniform. The current density difference between the upper end and the lower end of the workpiece and the middle part is small, thereby preventing a non-uniform plated layer due to non-uniform distribution of the power lines. The error in any place of the plated layer of the workpiece is small.
Description
Technical field
The utility model relates to a kind of equally distributed plating tank of power line that has.
Background technology
In the semicon industry, need carry out electroplating surface to electronic component and handle.Often comprise hundreds of thousands of even up to a million electronic components in the unicircuit, therefore, very high to the accuracy requirement of electronic component.Connection between the electronic component is to realize by its surperficial electrolytic coating, and is therefore, also very high to the accuracy requirement of the electrolytic coating of electronic component.The electronic component that volume is more little requires accurate more to thickness of coating.
When electroplating, utilize the electric current in the electroplate liquid to realize electroplating.In the prior art, place two anode networks that be arranged in parallel in plating tank, anode network generally adopts the titanium basket.Workpiece hangs on the negative electrode, is positioned between two parallel anode networks.After the energising,, metal ion realizes electroplating thereby accumulating in workpiece surface.But plating tank of the prior art, electric force lines distribution is also inhomogeneous, and promptly the density distribution of electric current is inhomogeneous.The place that current density is big, coating is thick; The place that current density is little, coating is thin.The inhomogeneous coating of electronical elements surface that causes of electric force lines distribution is also inhomogeneous, has influenced the quality of electronic component.When negative electrode than anode in short-term, burn easily the workpiece top and bottom that are hung on the negative electrode, this be since current density excessive (just power line is overstocked) cause.
The utility model content
The purpose of this utility model is in order to overcome deficiency of the prior art, a kind of uniform plating tank of electric force lines distribution that guarantees to be provided.
For realizing above purpose, the utility model is achieved through the following technical solutions:
The equally distributed plating tank of power line comprises cell body, is provided with two parallel anodes in the cell body, be provided with negative electrode between two anodes that are parallel to each other, it is characterized in that, along the electroplate liquid depth direction, the negative electrode lower end is lower than the anode lower end, and the negative electrode upper end is higher than the anode upper end.
Preferably, be provided with shielding slab above the described negative electrode.
Preferably, along the cell body width, the shielding slab two ends are than the more close anode of negative electrode both ends of the surface.
The equally distributed plating tank of power line in the utility model, workpiece top and bottom can not produce and burn phenomenon.Electric force lines distribution is even.Workpiece top and bottom and center current density differ little, can prevent that electric force lines distribution is inhomogeneous and the uneven coating that causes is even.The coating error is little everywhere for workpiece.
Description of drawings
Fig. 1 is the utility model sectional structure matters figure.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail:
As shown in Figure 1, the equally distributed plating tank of power line comprises cell body 1, and cell body 1 is that four cell walls and a bottom land surround the rectangle cavity, holds electroplate liquid in the cavity.
Be provided with the anode 21 and the anode 22 that are parallel to each other in the cell body 1, anode 21 and anode 22 all can adopt the titanium basket.During use, anode is electrically connected with power supply.
Between anode 21 and the anode 22 negative electrode 3 is set.Along the electroplate liquid depth direction, the upper end 31 of negative electrode 3 is higher than the upper end 211 of anode 21, is higher than the upper end 221 of anode 22.Negative electrode 3 lower ends 32 are lower than the lower end 212 of anode 21, are lower than the lower end 222 of anode 22.
The top of negative electrode 3 is provided with shielding slab 4.Along cell body 1 width, an end 41 of shielding slab 4 is than an end face 33 more close anodes 21 of negative electrode 3; One end 42 of shielding slab 4 is than an end face 34 more close anodes 22 of negative electrode 3.
During use, need make in all whole immersion plating liquid of anode and negative electrode.
Shielding slab 4 in the utility model adopts insulating corrosion resistant material such as PVC material to make.
Embodiment in the utility model only is used for the utility model is described, and does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in the utility model protection domain.
Claims (3)
1. the equally distributed plating tank of power line comprises cell body, is provided with two parallel anodes in the cell body, be provided with negative electrode between two anodes that are parallel to each other, it is characterized in that, along the electroplate liquid depth direction, the negative electrode lower end is lower than the anode lower end, and the negative electrode upper end is higher than the anode upper end.
2. the equally distributed plating tank of power line according to claim 1 is characterized in that, described negative electrode top is provided with shielding slab.
3. the equally distributed plating tank of power line according to claim 1 is characterized in that, along the cell body width, the shielding slab two ends are than the more close anode of negative electrode both ends of the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202861279U CN201574207U (en) | 2009-12-23 | 2009-12-23 | Electroplating bath with uniform distribution of power lines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202861279U CN201574207U (en) | 2009-12-23 | 2009-12-23 | Electroplating bath with uniform distribution of power lines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201574207U true CN201574207U (en) | 2010-09-08 |
Family
ID=42694083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202861279U Expired - Lifetime CN201574207U (en) | 2009-12-23 | 2009-12-23 | Electroplating bath with uniform distribution of power lines |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201574207U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230207A (en) * | 2011-06-21 | 2011-11-02 | 华映光电股份有限公司 | Electrophoretic deposition apparatus and electrophoretic deposition method |
| CN103966649A (en) * | 2014-05-16 | 2014-08-06 | 昆山东威电镀设备技术有限公司 | Electroplating guide device and system |
| CN104302815A (en) * | 2014-08-11 | 2015-01-21 | 深圳崇达多层线路板有限公司 | Plating slot and plating device |
| CN105140313A (en) * | 2015-09-10 | 2015-12-09 | 国电新能源技术研究院 | electroplating bath body of crystalline silicon cell |
| CN105628755A (en) * | 2015-12-30 | 2016-06-01 | 上海新阳半导体材料股份有限公司 | Method for detecting plating uniformity of plating solution in double-anode mode |
| CN106011988A (en) * | 2016-07-07 | 2016-10-12 | 成都乾瑞科技有限公司 | Adjustable electronic component electroplating bath capable of achieving uniform thickness and colour heights |
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
-
2009
- 2009-12-23 CN CN2009202861279U patent/CN201574207U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230207A (en) * | 2011-06-21 | 2011-11-02 | 华映光电股份有限公司 | Electrophoretic deposition apparatus and electrophoretic deposition method |
| CN103966649A (en) * | 2014-05-16 | 2014-08-06 | 昆山东威电镀设备技术有限公司 | Electroplating guide device and system |
| CN104302815A (en) * | 2014-08-11 | 2015-01-21 | 深圳崇达多层线路板有限公司 | Plating slot and plating device |
| CN105140313A (en) * | 2015-09-10 | 2015-12-09 | 国电新能源技术研究院 | electroplating bath body of crystalline silicon cell |
| CN105628755A (en) * | 2015-12-30 | 2016-06-01 | 上海新阳半导体材料股份有限公司 | Method for detecting plating uniformity of plating solution in double-anode mode |
| CN105628755B (en) * | 2015-12-30 | 2018-05-08 | 上海新阳半导体材料股份有限公司 | A kind of method of double anode detection plating solution plating property |
| CN106011988A (en) * | 2016-07-07 | 2016-10-12 | 成都乾瑞科技有限公司 | Adjustable electronic component electroplating bath capable of achieving uniform thickness and colour heights |
| CN106011988B (en) * | 2016-07-07 | 2018-06-26 | 成都乾瑞科技有限公司 | The adjustable electric subcomponent electroplating bath of thickness and color high uniformity |
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100908 |
|
| CX01 | Expiry of patent term |