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CN201532944U - Wafer Suspension - Google Patents

Wafer Suspension Download PDF

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Publication number
CN201532944U
CN201532944U CN2009201785174U CN200920178517U CN201532944U CN 201532944 U CN201532944 U CN 201532944U CN 2009201785174 U CN2009201785174 U CN 2009201785174U CN 200920178517 U CN200920178517 U CN 200920178517U CN 201532944 U CN201532944 U CN 201532944U
Authority
CN
China
Prior art keywords
wafer
hole
barricade
wafer holder
tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201785174U
Other languages
Chinese (zh)
Inventor
罗郁南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanya Technology Corp
Original Assignee
Chenzhou Plastic Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chenzhou Plastic Industry Co ltd filed Critical Chenzhou Plastic Industry Co ltd
Priority to CN2009201785174U priority Critical patent/CN201532944U/en
Application granted granted Critical
Publication of CN201532944U publication Critical patent/CN201532944U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a wafer bearing disc, this wafer bearing disc have a plurality of flat plate-shaped supporting parts for bearing a plurality of wafers, and the supporting part periphery sets up the barricade and restricts the wafer and slide, and sets up the through-hole on the barricade so that wafer bearing disc hydrofuge and ventilation, so make this wafer bearing disc provide the wafer steadily bear the weight of and can fully keep the wafer dry.

Description

The wafer tray
Technical field
The utility model relates to a kind of device of bearing semiconductor, is specifically related to a kind of wafer tray.
Background technology
Along with the prosperity of scientific and technological industry, the wafer of a precision all can be arranged in many electronic products, and wafer is being produced after encapsulation finishes, and wafer can be taken up in a tray to make things convenient for carrying.
Existing tray as shown in Figure 1 and Figure 2, tray A has a plurality of supporting part A1 and is arranged, the periphery of supporting part A1 has four barricade A2, wafer X is placed in the supporting part A1 and is subjected to those barricades A2 spacing, and offer a through hole A3 on the supporting part A1, through hole A3 provides the moisture in the tray A to discharge, and keeps being installed in the drying of the wafer X in tray.Yet wafer X bottom side has a plurality of tin ball X1, and when wafer X puts on supporting part A1, those tin balls X1 can touch the through hole A3 of supporting part A1, and the edge of through hole A3 just probably produces scratch or damage to tin ball X1.
Another kind of tray commonly used as shown in Figure 3, the supporting part of tray B is the funnel-form that is made of four inclined-plane B1, and supporting part also has a through hole B2, so not only has the effect of ventilation, and wafer X also can not touch the edge of through hole B2, reduces the situation generation that scratch damages.Yet, because supporting part is to be funnel-form, therefore wafer X is placed on on-plane surface, the funnelform supporting part, so wafer X just can not be placed on the supporting part very reposefully, when putting or take out wafer, also just must very accurately carefully this wafer X can be placed on the supporting part restfully, otherwise that wafer X just is easy to produce is crooked, if it is crooked that wafer X produces, then therefore the tin ball X1 of wafer X just might produce the situation generation of damaged in collision.
The utility model content
Technical problem to be solved in the utility model provides a kind of wafer tray, and it can keep the drying of wafer for wafer provides carrying stably and hydrofuge can be provided.
For solving the problems of the technologies described above, the technical solution of the utility model wafer tray is:
Comprise a plurality of supporting parts, those supporting parts are arranged, this each supporting part is provided with carrying a wafer respectively, and this supporting part periphery is provided with two relative first barricade, second barricades relative with two, those first barricades and second barricade are provided with at interval, and should offer a through hole more respectively by each second barricade.
Described supporting part is the rectangular flat shape.
Described through hole is to offer along the direction of vertical this supporting part.
Described through hole is to offer along the direction of parallel this supporting part.
The height of described first barricade is higher than the height of this second barricade.
Form an open-work between described interconnective four supporting parts.
Described wafer tray outer rim is moulding one base more, and this base bottom has a stacked space.
Described a plurality of wafer tray is stacked, and has a ventilation space between the adjacent wafer tray.
Described chassis side more protrudes out moulding one ear.
The technique effect that the utility model can reach is:
The utility model is by the supporting part bearing wafer, and those barricades are placed restrictions on the wafer slippage, and the through hole on this barricade then provides the pipeline of this wafer tray hydrofuge, keeps the drying of wafer in the wafer tray.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the three-dimensional appearance schematic diagram of existing wafer tray;
Fig. 2 is the side sectional view of existing wafer tray;
Fig. 3 is the side sectional view of another kind of existing wafer tray;
Fig. 4 is the three-dimensional appearance schematic diagram of the utility model wafer tray;
Fig. 5 is the side sectional view of the utility model wafer tray bearing wafer;
Fig. 6 is that the another kind of the utility model wafer tray through hole is offered the mode schematic diagram;
Fig. 7 is the user mode schematic diagram of the stacked placement of the utility model wafer tray;
Fig. 8 is the side sectional view that the utility model wafer tray cooperates a base to use;
Fig. 9 is that the utility model wafer tray cooperates base to use the also user mode schematic diagram of stacked placement.
Description of reference numerals among the figure:
Among Fig. 1 to Fig. 3:
A is a tray, and A1 is a supporting part,
A2 is a barricade, and A3 is a through hole,
B is a tray, and B1 is the inclined-plane,
B2 is a through hole, and X is a wafer,
X1 is the tin ball;
Among Fig. 4 to Fig. 9:
100 is the wafer tray, and 10 is supporting part,
20 is first barricade, and 30 is second barricade,
31 is through hole, and 40 is open-work,
50 is base, and 51 is stacked space,
D1 is the gap, and D2 is a ventilation space,
X is a wafer.
Embodiment
As Fig. 4 to the preferred embodiment that Figure 7 shows that the utility model wafer tray 100, wafer tray 100 comprises a plurality of supporting parts 10, those supporting parts 10 are arranged, these each supporting part 10 rectangular tabulars also are provided with carrying a wafer X respectively, and these each supporting part 10 peripheries are provided with two relative first barricade 20, second barricades 30 relative with two, those first barricades 20 are provided with at interval with those second barricades 30, and respectively the height of first barricade 20 is higher than the height of this each second barricade 30, and should offer a through hole 31 along the direction of vertical this supporting part 10 again by each second barricade 30, and form an open-work 40 between interconnective four supporting parts 10.
Wafer tray 100 is provided with carrying a plurality of wafer X, flat supporting part 10 is put setting reposefully for this each wafer X, and this each barricade 20,30 is placed restrictions on this each wafer X side direction slippage in supporting part 10, be somebody's turn to do through hole 31 of each second barricade 30 and the pipeline that the open-work 40 between each supporting part 10 then provides circulation of air, and can allow moisture discharge by this each through hole 31 and open-work 40, keep the drying of this each wafer X.
As shown in Figure 6, respectively the through hole 31 of second barricade 30 also can be to offer along the direction of parallel this each supporting part 10, the same effect that also can reach ventilation, hydrofuge.
In the time will delivering those wafers X, can be with a plurality of wafer tray 100 ranked and stacked piles, as shown in Figure 7, when a plurality of wafer tray 100 ranked and stacked piles, because the height of first barricade 20 is higher than the height of this second barricade 30, therefore can produce a clearance D 1 between this each wafer tray 100 after stacked, clearance D 1 is exactly the difference in height between first barricade 20 and second barricade 30, so those wafer trays 100 stacked after, the clearance D 1 that first barricade 20 and second barricade, 30 height falls form, respectively through hole 31 of second barricade 30 and the open-work 40 between this each supporting part 10 provide moisture sufficient discharge line, even the 100 stacked storings of a plurality of wafer tray also can keep the drying of those wafers X.
As Fig. 8, shown in Figure 9, first barricade 20 of wafer tray 100 and the height of second barricade 30 are contour, and wafer tray 100 outer peripheral edges reshapings one base 50, and base 50 bottoms have a stacked space 51, when a plurality of wafer tray 100 stacked storings, adjacent wafer tray 100 can partly receive in the stacked space 51 of this base 50, and make and have a ventilation space D2 between the adjacent wafer tray 100, the pipeline that ventilation space D2 also just can provide these wafer tray 100 hydrofuges to ventilate fully, and maintenance wafer X drying, and base 50 sides protrude out moulding one ear, and this ear makes things convenient for the user to move wafer tray 100.

Claims (9)

1.一种晶片承盘,其特征在于:包含多个承载部,该些承载部呈矩阵排列,该各承载部分别供以承载一晶片,且该承载部周缘设置二相对的第一挡墙与二相对的第二挡墙,该些第一挡墙与第二挡墙间隔设置,且该各第二挡墙再分别开设一通孔。1. A wafer carrier, characterized in that: it comprises a plurality of carrying parts arranged in a matrix, each carrying part is respectively used to carry a wafer, and two opposite first retaining walls are arranged on the periphery of the carrying part As for the second retaining wall opposite to the two, the first retaining wall and the second retaining wall are arranged at intervals, and each second retaining wall further defines a through hole. 2.根据权利要求1所述的晶片承盘,其特征在于:所述承载部为矩形平板状。2 . The wafer holder according to claim 1 , wherein the carrying portion is in the shape of a rectangular flat plate. 3 . 3.根据权利要求1所述的晶片承盘,其特征在于:所述通孔是沿垂直该承载部的方向开设。3. The wafer holder according to claim 1, wherein the through hole is opened along a direction perpendicular to the carrying portion. 4.根据权利要求1所述的晶片承盘,其特征在于:所述通孔是沿平行该承载部的方向开设。4. The wafer holder according to claim 1, wherein the through hole is opened along a direction parallel to the carrying portion. 5.根据权利要求1所述的晶片承盘,其特征在于:所述第一挡墙的高度高于该第二挡墙的高度。5. The wafer holder according to claim 1, wherein the height of the first retaining wall is higher than that of the second retaining wall. 6.根据权利要求1所述的晶片承盘,其特征在于:所述相互连接的四个承载部之间形成一透孔。6. The wafer holder according to claim 1, wherein a through hole is formed between the four interconnected bearing parts. 7.根据权利要求1所述的晶片承盘,其特征在于:所述晶片承盘外缘更成型一底座,该底座底部具有一层叠空间。7 . The wafer holder according to claim 1 , wherein the outer edge of the wafer holder is further shaped into a base, and the bottom of the base has a stacking space. 7 . 8.根据权利要求7所述的晶片承盘,其特征在于:所述多个晶片承盘层叠,且相邻的晶片承盘之间具有一透气空间。8 . The wafer holder according to claim 7 , wherein the plurality of wafer holders are stacked, and there is an air-permeable space between adjacent wafer holders. 9.根据权利要求7所述的晶片承盘,其特征在于:所述底座侧边更凸伸成型一耳部。9 . The wafer holder as claimed in claim 7 , wherein an ear portion protrudes from the side of the base. 10 .
CN2009201785174U 2009-09-29 2009-09-29 Wafer Suspension Expired - Lifetime CN201532944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201785174U CN201532944U (en) 2009-09-29 2009-09-29 Wafer Suspension

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201785174U CN201532944U (en) 2009-09-29 2009-09-29 Wafer Suspension

Publications (1)

Publication Number Publication Date
CN201532944U true CN201532944U (en) 2010-07-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201785174U Expired - Lifetime CN201532944U (en) 2009-09-29 2009-09-29 Wafer Suspension

Country Status (1)

Country Link
CN (1) CN201532944U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103518258A (en) * 2011-07-29 2014-01-15 库拉米克电子学有限公司 Packaging for substrates and packaging unit having such packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103518258A (en) * 2011-07-29 2014-01-15 库拉米克电子学有限公司 Packaging for substrates and packaging unit having such packaging
CN103518258B (en) * 2011-07-29 2016-08-31 库拉米克电子学有限公司 For the packaging of substrate and have the packaging unit of this packaging

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NANYA SCI. + TECH. CO., LTD.

Free format text: FORMER OWNER: SURISE PLASTIC INDUSTRIAL CO., LTD.

Effective date: 20100926

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20100926

Address after: Three, Fuxing Road, Fuxing Culture Village, Taoyuan County, Taiwan, China 669

Patentee after: Nanya Sci. & Tech. Co., Ltd.

Address before: Taiwan, China

Patentee before: Chenzhou Plastic Industry Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20100721