CN201521815U - Lighting integrated packaging light-emitting unit of aluminium plate LED - Google Patents
Lighting integrated packaging light-emitting unit of aluminium plate LED Download PDFInfo
- Publication number
- CN201521815U CN201521815U CN2009201276085U CN200920127608U CN201521815U CN 201521815 U CN201521815 U CN 201521815U CN 2009201276085 U CN2009201276085 U CN 2009201276085U CN 200920127608 U CN200920127608 U CN 200920127608U CN 201521815 U CN201521815 U CN 201521815U
- Authority
- CN
- China
- Prior art keywords
- led
- emitting unit
- bowl
- aluminium base
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 32
- 239000004411 aluminium Substances 0.000 title claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000005022 packaging material Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 150000001398 aluminium Chemical class 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model applies to protect a lighting integrated packaging light-emitting unit of an aluminium plate LED, comprising LED chips and an aluminium substrate printed circuit board; a plurality of bowl-shaped conical dents are processed and formed at space positions of a printed circuit on the aluminium substrate printed circuit board; the LED chips are directly fixed at the bottom part of each bowl-shaped conical dent; P electrodes and N electrodes of the LED chips are circuit-connected by welding gold lines; and the surfaces of the bowl-shaped conical dents are packaged by an LED packaging material. The bowl-shaped conical dents are distributed on the aluminium substrate printed circuit board in a dot matrix manner. The lighting integrated packaging light-emitting unit adopts a brand new mode, packages the LED chips on the aluminium substrate printed circuit board directly by combining the LED packaging technology, saves the technical process and manufacturing cost for manufacturing direct-inserting type or paster-type elements and welding the elements on the PCB, and leads the radiating effect to be better, thus reducing the manufacturing cost of LED fluorescent lamps by 30 percent to 50 percent and being more beneficial to application and promotion of the LED fluorescent lamps.
Description
Technical field
The utility model belongs to encapsulation of LED element and led light source lighting technical field.
Background technology
The LED fluorescent lamp has begun to be used in a large number lighting field as a kind of new type light source efficient, environmental protection and has substituted traditional fluorescent tube.Present LED fluorescent tube generally adopts direct insertion or adopting surface mounted LED element to be welded on mode on the PCB wiring board, and then is installed in and makes the LED fluorescent lamp on PC organic optical materials lamp housing or the metal shell.And traditional LED encapsulation generally also is several below adopting: the single lamp encapsulation of LED (LED LAMP); LED nixie display, matrix display, flat-panel screens encapsulation (LEDDISPLAY); The LED of surface-mount type (SMD); Modes such as multicore sheet or single-chip high-power LED encapsulation.But this LED fluorescent lamp also has many weak points at aspects such as cost of manufacture, radiating treatment, processing technologys.
The present invention adopts a kind of brand-new mode, in conjunction with the LED encapsulation technology, led chip directly is encapsulated on the aluminium base printed circuit board (PCB) of specially treated.
Summary of the invention
The utility model begins to improve from LED element packaging technology at the deficiency that prior art exists, and it is simpler that purpose provides a kind of structure, has better heat conductivility, the aluminium base LED that cost the is lower integrated encapsulating light emitting unit that throws light on.
The technical solution of the utility model is as follows:
A kind of aluminium base LED integrated encapsulating light emitting unit that throws light on, it comprises led chip and aluminium base printed substrate, printed circuit null position on described aluminium base printed substrate is processed to form a plurality of bowl-shape tapered depressions, described led chip directly is fixed on the bottom of each bowl-shape tapered depression, carry out circuit by the welding gold thread between the P of led chip, the N utmost point and the printed circuit and be connected, bowl-shape tapered sunk surface is encapsulated by the LED encapsulating material.
Described bowl-shape tapered being recessed on the aluminium base printed substrate distributes by dot matrix.
Described LED encapsulating material is epoxy resin, silica gel and/or fluorescent material.
Described integrated encapsulating light emitting unit is long strip type, square, round or special-shaped.
Advantage of the present utility model is as follows:
1, the utility model adopts a kind of brand-new mode, in conjunction with the LED encapsulation technology, direct packaging LED chips on the aluminium base printed circuit board (PCB), save and make direct insertion and SMD element and again element is welded on technical process and manufacturing cost on the pcb board, thereby make the cost of manufacture of LED fluorescent lamp reduce 30%-50%, help the application of LED fluorescent lamp more.
2, led chip directly is encapsulated on the aluminium base printed circuit board (PCB), shortened from the led chip to the aluminium base and the lamp body shell between heat conduction path, make radiating effect better, the light decay that makes LED make light fixture can be effectively controlled, thereby prolongs LED light fixture service life.
3, the manufacture craft of having simplified the LED fluorescent lamp will more help carrying out large-scale production.
4, can make the LED luminescence unit of different shape easily, after-sale service and maintenance, replacing are all convenient.
Description of drawings
Fig. 1: be the throw light on sectional structure chart of integrated encapsulating light emitting unit of this aluminium base LED;
Fig. 2: be the throw light on outline drawing of integrated encapsulating light emitting unit of bar shaped aluminium base LED;
Fig. 3: be the throw light on outline drawing of integrated encapsulating light emitting unit of square aluminum substrate LED;
Fig. 4: be the throw light on outline drawing of integrated encapsulating light emitting unit of circular aluminium base LED;
The specific embodiment
Further specify structure of the present utility model below in conjunction with accompanying drawing:
Referring to Fig. 1, this integrated encapsulating light emitting unit is directly to utilize the aluminium base printed substrate of making, and the aluminium base printed substrate has the aluminium base 1 of lower floor, the middle insulating barrier 7 and the printed circuit 6 on upper strata from structure.The processing mode of luminescence unit be earlier with aluminium base printed substrate 1 through PROCESS FOR TREATMENT such as punching presses, circuit (covering copper wire) null position at printed circuit 6 forms the bowl-shape tapered depression 3 of dot matrix, again at the direct fixed L ED chip 3 in the bottom of the bowl-shape tapered depression 2 of these dot matrixs, then at the P of led chip 3, welding gold thread 4 between the N utmost point and the printed circuit 6, realize being electrically connected, at last with epoxy resin, silica gel, encapsulating materials such as fluorescent material 5 directly are encapsulated in 2 li of the bowl-shape tapered depressions of dot matrix, make luminescence unit thus, this luminescence unit is that a kind of integrated packaged LED element is again a kind of led light source body that can be directly installed on the light fixture.
This aluminium base LED can make long strip type, square, round and special-shaped at the integrated encapsulating light emitting unit that throws light on, as Fig. 2, Fig. 3 and shown in Figure 4.
Claims (4)
1. an aluminium base LED integrated encapsulating light emitting unit that throws light on, it comprises led chip and aluminium base printed substrate, it is characterized in that: the circuit null position of the printed circuit on described aluminium base printed substrate is processed to form a plurality of bowl-shape tapered depressions, described led chip directly is fixed on the bottom of each bowl-shape tapered depression, carry out circuit by the welding gold thread between the P of led chip, the N utmost point and the printed circuit and be connected, bowl-shape tapered sunk surface is encapsulated by the LED encapsulating material.
2. the aluminium base LED according to claim 1 integrated encapsulating light emitting unit that throws light on, it is characterized in that: described bowl-shape tapered being recessed on the aluminium base printed substrate distributes by dot matrix.
3. the aluminium base LED according to claim 1 and 2 integrated encapsulating light emitting unit that throws light on, it is characterized in that: described LED encapsulating material is epoxy resin, silica gel and/or fluorescent material.
4. the aluminium base LED according to claim 3 integrated encapsulating light emitting unit that throws light on, it is characterized in that: described integrated encapsulating light emitting unit is long strip type, square or round.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201276085U CN201521815U (en) | 2009-06-10 | 2009-06-10 | Lighting integrated packaging light-emitting unit of aluminium plate LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201276085U CN201521815U (en) | 2009-06-10 | 2009-06-10 | Lighting integrated packaging light-emitting unit of aluminium plate LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201521815U true CN201521815U (en) | 2010-07-07 |
Family
ID=42507990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201276085U Expired - Fee Related CN201521815U (en) | 2009-06-10 | 2009-06-10 | Lighting integrated packaging light-emitting unit of aluminium plate LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201521815U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174999A (en) * | 2011-02-25 | 2011-09-07 | 江苏永兴多媒体有限公司 | Method for producing LED lamp panel |
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | A kind of LED module and its manufacturing process |
| CN103649634A (en) * | 2011-06-28 | 2014-03-19 | 株式会社小糸制作所 | Light-emitting module |
| CN104599603A (en) * | 2015-02-06 | 2015-05-06 | 长沙信元电子科技有限公司 | Heat radiating type LED (Light Emitting Diode) display unit |
| CN108615723A (en) * | 2018-05-30 | 2018-10-02 | 太龙（福建）商业照明股份有限公司 | A kind of novel C OB structure lamp plates |
-
2009
- 2009-06-10 CN CN2009201276085U patent/CN201521815U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174999A (en) * | 2011-02-25 | 2011-09-07 | 江苏永兴多媒体有限公司 | Method for producing LED lamp panel |
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | A kind of LED module and its manufacturing process |
| CN102364684B (en) * | 2011-06-17 | 2017-02-08 | 杭州华普永明光电股份有限公司 | LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN103649634A (en) * | 2011-06-28 | 2014-03-19 | 株式会社小糸制作所 | Light-emitting module |
| CN103649634B (en) * | 2011-06-28 | 2016-08-17 | 株式会社小糸制作所 | Light emitting module |
| CN104599603A (en) * | 2015-02-06 | 2015-05-06 | 长沙信元电子科技有限公司 | Heat radiating type LED (Light Emitting Diode) display unit |
| CN108615723A (en) * | 2018-05-30 | 2018-10-02 | 太龙（福建）商业照明股份有限公司 | A kind of novel C OB structure lamp plates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100707 Termination date: 20140610 |