CN201516579U - Precision grinding tools - Google Patents

Abstract

The utility model provides a precision grinding tool, include: a substrate; a plurality of grinding particles regularly arranged on the substrate; a plurality of first fixed bases formed on the substrate, wherein each grinding particle is regularly fixed on the substrate by the corresponding first fixed base; and a second fixed layer covering the first fixed bases and the surface of the substrate, and exposing the abrasive particles to form an abrasive surface. The utility model discloses do not utilize high temperature technology such as sintering to be fixed in the abrasive grain on the base plate surface to avoid the easy cracked problem that takes place of abrasive grain. On the other hand, the utility model discloses the aspect of adjustable above-mentioned holding portion, or with holding portion with regional mode shaping on this base plate surface to make the abrasive particle can have the change of distribution density, the change of granule size when forming the grinding face, or form the combination in grinding district and naked dead zone, consequently, the utility model discloses have the grinding ability of preferred.

Description

Precision grinding tools

technical field

The utility model relates to a precision grinding tool, in particular to a grinding tool with better grinding properties.

Background technique

With the development of semiconductor technology, it has been widely used in the process of semiconductor manufacturing. For example: because the surface of the wafer must be smooth to facilitate the subsequent process, therefore, in the wafer process of the semiconductor industry, grinding tools It is widely used in chemical mechanical polishing (CMP) to perform grinding and polishing operations on wafers. During the chemical mechanical polishing process, the wafer is covered by a disk and pressed down on a rotating polishing pad, and an acidic or alkaline polishing liquid is injected on the polishing pad to perform polishing and grinding operations.

In the chemical mechanical polishing process, it is necessary to use an abrasive tool for polishing pad dressing. The polishing pad dresser is to set diamond particles on a disc-shaped or ring-shaped metal substrate, and the abrasive tool is used for polishing. Pad dressing, the grinding tool is also called "Diamond Disk", the function of the diamond disk is to make it modify the surface of the polishing pad, improve the efficiency of silicon wafer polishing and the quality of flattening operations, and can also perform Eliminates debris buildup after chemical mechanical polishing processes.

Please refer to Fig. 1, which is a schematic diagram of an existing grinding tool 1a, which uses an alloy brazing method to combine diamond particles 11a in the solder layer 12a on the metal substrate 10a, although this method can be used The diamond particles 11a are fixed on the metal substrate 10a, but the arrangement of the diamond particles 11a is disordered and unevenly distributed.

In another traditional grinding tool, a fixed net with a mesh is erected on a substrate, and the diamond particles are regularly positioned on the substrate according to the mesh arrangement, and then the diamond particles are fixed on the substrate by the sintering process of the alloy powder. . Although the above-mentioned method can achieve the regular arrangement of diamond particles, the mesh size of the fixed net has certain physical limitations. Therefore, the method of using the fixed net cannot be applied to small-sized diamond particles; on the other hand, the above-mentioned process must After the sintering process, the sintering temperature (about 1050° C.) causes the diamond particles to be carbonized, which causes the problem that the diamond particles are prone to fracture. Furthermore, the mesh arrangement of the fixed net is fixed, and the meshes are all rectangular. Therefore, the size distribution, arrangement pattern, or distribution density of diamond particles only have a single form, and cannot follow the application. face to adjust.

Utility model content

The purpose of this utility model is to provide a precision grinding tool, which is made by low-temperature technology, which can avoid the problem of high-temperature carbonization of diamond particles for grinding due to high-temperature sintering. Therefore, the precision grinding tool of the utility model The tool may have better grinding capabilities.

In order to achieve the above object, the utility model provides a precision grinding tool, comprising: a substrate; a plurality of abrasive particles regularly arranged on the substrate; a plurality of first fixed bases formed on the substrate, each of these Abrasive particles are regularly fixed on the substrate by their corresponding first fixed bases; and a second fixed layer covers the first fixed bases and the surface of the substrate, and makes the abrasive particles exposed to form a grinding surface.

The utility model has the following beneficial effects:

The precision grinding tool proposed by the utility model fixes the grinding particles on the surface of the substrate by using the alignment method of the diamond implanted pattern array, and then uses the second fixed layer to strengthen the bonding force between the grinding particles and the substrate. Therefore, the utility model does not The abrasive particles are not fixed on the surface of the substrate by high-temperature processes such as sintering, so as to avoid the problem that the abrasive particles are prone to breakage. On the other hand, the utility model can adjust the appearance of the above-mentioned accommodating part, such as the density of the distribution, the difference in the opening size of the accommodating part, or the accommodating part is formed on the surface of the substrate in a regional manner, so that Abrasive particles can have a change in distribution density, a change in particle size, or a combination of a grinding area and a bare area when forming the grinding surface, and the above changes cannot be achieved by traditional manufacturing methods. Therefore, the utility model proposes The precision grinding tool has better grinding ability.

Description of drawings

Fig. 1 is a schematic diagram of an existing grinding tool.

Fig. 2 is a schematic diagram of the precision grinding tool of the present invention.

FIG. 3 is a three-dimensional schematic view of the precision grinding tool according to the first embodiment of the present invention.

FIG. 4 is a three-dimensional schematic diagram of a precision grinding tool according to a second embodiment of the present invention.

[Description of main component symbols]

【existing】

1a Abrasive tools

10a Metal substrate

11a diamond particles

12a Solder layer

【This utility model】

1 precision grinding tool

10 Substrate

20 abrasive particles

200 grinding surface

201 Grinding area

202 bare space

30 The first fixed base

40 second fixed layer

Detailed ways

Please refer to Figure 2 and Figure 4, the utility model provides a precision grinding tool 1, which has a plurality of grinding particles 20 regularly fixed on the surface of the substrate 10, so that it can be used for high-precision grinding operations, and the precision grinding tool 1. Manufactured by a low-temperature process to avoid deterioration of the abrasive particles 20 due to high-temperature sintering. The precision grinding tool 1 includes: a substrate 10 , abrasive particles 20 , a first fixing base 30 and a second fixing layer 40 . The structure of the precision grinding tool 1 of the present invention will be described in detail below.

In a specific embodiment, the substrate 10 is made of stainless steel, but not limited to the above. For example, the substrate 10 can be made of metal such as aluminum alloy, titanium alloy or alloy steel, or oxide ceramics, carbide ceramics or Ceramic materials such as nitride ceramics, or high-hardness plastic materials. In other words, the material of the substrate 10 is not limited, but the substrate 10 must have a certain hardness so as to resist the relative positive pressure generated by the polishing object during the polishing operation.

Next, the abrasive particles 20 such as diamonds are fixed on the surface of the substrate 10 with a specific arrangement structure by using the diamond implantation pattern alignment method (DIAMAP). The above-mentioned diamond implant pattern alignment method includes the following steps: forming a plurality of accommodating parts on the surface of the substrate 10. Low-temperature processing methods such as dot ink, laser processing, or electric discharge machining methods form a plurality of regularly arranged accommodation parts, so that the abrasive particles 20 are placed in the above-mentioned accommodation parts, thereby achieving a regular arrangement of the abrasive particles 20; or, these The receiving portion can be formed on an auxiliary layer on the surface of the substrate 10 . The above-mentioned accommodating parts can be formed on the surface of the substrate 10 to be regularly arranged, the shape can be adjusted freely, or the spacing is small. For example, the opening size of each accommodating part can be adjusted according to the application surface. In the novel invention, the opening size of the accommodating portion is generally 10 to 500um; and these accommodating portions may have different opening sizes.

The abrasive particles 20 are then implanted into these accommodating parts. This step mainly places the abrasive grains 20 regularly in these accommodating parts. The size of the abrasive grains 20 is selected according to the opening size of the accommodating parts in the previous step. In this specific embodiment, the abrasive grains 20 are It is diamond particles of micro (micro) level or nano (nano) level, and the abrasive particles 20 are placed in these accommodating parts by means of diamond implantation pattern alignment method, etc., and each accommodating part is At least one abrasive particle 20 is accommodated. The above-mentioned abrasive particles 20 can be diamond, carbide ceramic powder, oxide ceramic powder or nitride ceramic powder, and the particle size of these abrasive particles 20 ranges from 100 nanometers (nm) to 500 micrometers (μm).

Next, a first fixing base 30 is formed on these accommodating parts to fix the abrasive particles 20 on the surface of the substrate 10 . In other words, this step mainly uses the first fixing base 30 to fix the abrasive particles 20 on the surface of the substrate 10 . In this specific embodiment, a nickel base is formed by electroforming at the contact position between the diamond particles (ie abrasive particles 20) and the substrate 10, and the nickel base is used to coat the lower bottom of the diamond particles, and the Its connections are fixed on the substrate 10 , and the electrical isolation steps that must be performed during the electroforming process are common knowledge and will not be repeated here. But the utility model is not limited to the above method, other such as: electroplating method, chemical plating method, physical vapor deposition method (PVD) or chemical vapor deposition method (CVD) and other low temperature processes can be used to implement the utility model, and According to various practical applications, the first fixing bases 30 can be made of metal (such as titanium, copper, aluminum, etc.), ceramics, composite materials, or diamonds. These receptacles are then removed in a suitable manner.

A second fixing layer 40 is then formed on the surface of the substrate 10 . In this step, the second fixed layer 40 is molded to cover the surfaces of the first fixed bases 30 and the substrate 10 and expose the abrasive grains 20 to form a grinding surface 200, and the second fixed layer 40 The purpose is to strengthen the bonding force between these abrasive particles 20 and the substrate 10, so that these abrasive particles 20 can resist the shear force during the grinding operation; and the same as the first fixed base 30, the second fixed layer 40 can Formed by electroplating or electroless plating or physical vapor deposition or chemical vapor deposition, the second fixed layer 40 can be a metal layer or a ceramic layer or a composite material layer or a vapor grown diamond layer. Therefore, the first fixing base 30 and the second fixing layer 40 can be used to firmly attach the abrasive particles 20 to the substrate 10 .

After the above steps, the utility model can obtain a precision grinding tool 1, as shown in Figure 4, the precision grinding tool 1 includes: a substrate 10 and a plurality of abrasive particles 20 regularly arranged on the surface of the substrate 10, The contact position of each abrasive particle 20 and the substrate 10 is coated with a first fixed base 30, and a second fixed layer 40 is formed on the first fixed base 30 and the surface of the substrate 10, wherein the grinding The particles 20 are regularly fixed on the surface of the substrate 10 to form a grinding surface 200 for convenient grinding operation. The materials of the substrate 10 , the abrasive grains 20 , the first fixing base 30 and the second fixing layer 40 are the same as those described above, and will not be repeated here.

Furthermore, the present invention can adjust the appearance of the grinding surface, for example, adjust the arrangement of these accommodation parts on the substrate 10, so that some areas of the substrate 10 do not have accommodation parts, by accommodating The grinding surface 200 can include a grinding area 201 and a bare area 202, and these abrasive particles 20 are regularly fixed on the grinding area 201, and there is no grinding area on the substrate surface of these bare areas 202. Particles 20; during the operation of the grinding operation, these bare areas 202 can be used to improve the chip removal ability of the grinding. On the other hand, the accommodating portions can be formed on the substrate 10 with different densities, so that the abrasive grains 20 are also fixed on the substrate 10 with different densities.

In summary, the utility model has the following advantages:

1. Since the process steps used in the utility model all belong to the category of low-temperature technology, the utility model can avoid the influence of high-temperature sintering on the carbonization of abrasive particles (grinding particles), and then can make the precision grinding tool of the utility model have better grinding properties.

2. On the other hand, the utility model can produce different types of precision grinding tools according to the actual application surface, for example, the distance between the abrasive particles can be adjusted, and the abrasive particles with smaller sizes can be fixed on the substrate or Various abrasive particle distributions are available to enhance the grinding ability.

3. Since the utility model can control the arrangement and exposure of abrasive particles, its grinding efficiency and speed can be accurately predicted; for mass production, the quality of each batch of output can also be effectively controlled .

The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. These improvements and modifications It should also be regarded as the protection scope of the present utility model.

Claims (9)

1. a precise finiss instrument is characterized in that, comprising:

One substrate;

A plurality of abrasive grains that are ordered on this substrate;

A plurality of first fixed pedestals that take shape on this substrate, each these abrasive grains is fixedly arranged on this substrate regularly by its pairing first fixed pedestal; And

One second fixed bed, the surface of these first fixed pedestals of its coating and this substrate, and make these abrasive grains expose out and form an abradant surface.

2. precise finiss instrument as claimed in claim 1 is characterized in that, this substrate is metal material or ceramic material or high rigidity plastic material.

3. precise finiss instrument as claimed in claim 2 is characterized in that, this ceramic material is oxide ceramics or carbide ceramics or nitride ceramics; This metal material is stainless steel or aluminium alloy or titanium alloy or steel alloy.

4. precise finiss instrument as claimed in claim 1 is characterized in that, these first fixed pedestals are metal or pottery or composite or diamond material.

5. precise finiss instrument as claimed in claim 4, it is characterized in that these first fixed pedestals are with electrocasting method or electro-plating method or chemical plating method or method is amassed in physical vapor Shen or the contact position that method takes shape in abrasive grains and this substrate is amassed in chemical gaseous phase Shen.

6. precise finiss instrument as claimed in claim 1 is characterized in that, this second fixed bed is metal or pottery or composite or diamond material.

7. precise finiss instrument as claimed in claim 6, it is characterized in that, this second fixed bed is with electro-plating method or chemical plating method or method is amassed in physical vapor Shen or the surface that method takes shape in this substrate is amassed in chemical gaseous phase Shen, with the surface of these first fixed pedestals of coating and this substrate.

8. precise finiss instrument as claimed in claim 1 is characterized in that, this abradant surface comprises a naked dead zone and a milling zone, and these abrasive grains are fixedly arranged on this milling zone regularly, and are not provided with abrasive grains on the substrate surface of these naked dead zones.

9. precise finiss instrument as claimed in claim 8, it is characterized in that, these abrasive grains are fixed on this substrate with the arrangement mode of different densities, and these abrasive grains are diamond or carbide ceramics powder or oxide ceramic powder or nitride ceramics powder, the particle size range of these abrasive grains between 100 nanometers (nm) to 500 microns (μ m).

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