CN201478685U - Array microchip laser structure - Google Patents
Array microchip laser structure Download PDFInfo
- Publication number
- CN201478685U CN201478685U CN2009201826225U CN200920182622U CN201478685U CN 201478685 U CN201478685 U CN 201478685U CN 2009201826225 U CN2009201826225 U CN 2009201826225U CN 200920182622 U CN200920182622 U CN 200920182622U CN 201478685 U CN201478685 U CN 201478685U
- Authority
- CN
- China
- Prior art keywords
- array
- micro
- laser
- slice laser
- slice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 claims description 39
- 238000005086 pumping Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Images
Landscapes
- Lasers (AREA)
- Semiconductor Lasers (AREA)
Abstract
The utility model relates to a microchip laser structure, in particular to an array microchip laser structure, which can obtain a group of microchip laser outputs and solves the problem that the heat dissipation of the microchip laser of high-power output is poor. The array microchip laser structure adopts a single-lens or lens-combination collimating array LD laser. Different light emitting chips in an array LD form collimating output light at different angles and the light is separated in a space. Moreover, a group of independent converging lenses is used to respectively collect collimating light at different light emitting points to pump the respective microchip lasers to obtain a group of microchip laser outputs. By adopting the technical scheme, the utility model solves the problem of the prior art that the heat dissipation structure is complex or the output power is not high, and has the advantages that the structure is simple and reasonable and the output power is large.
Description
Technical field
The utility model relates to the micro-slice laser structure, relates in particular to a kind of micro-slice laser structure of array, can obtain one group of microchip laser output, has solved the heat dissipation problem of the high-power output of micro-slice laser.
Background technology
Powerful laser has application market widely in many fields such as communication, information record, printing, demonstration, materials processing and medical treatment.The common method that obtains high power laser output is to adopt photoflash lamp or LD array laser pumping laser gain media.This mode exists system bulk bigger usually, and structure is than problems such as complexity.Another acquisition methods is to adopt high-power semiconductor diode laser, but also limits its application because of its heat dissipation problem and beam quality problem.
Perhaps use and adopt the structure of LD array pumping array micro-slice laser to realize.As U.S. Patent number is the scheme of the specification proposition employing LD array pumping array micro-slice laser of US5115445.But its power output is still lower, and its radiator structure is also too simple, is difficult to obtain practical application.And for example the technical scheme of Chinese patent application numbers 200620069122.7 propose between the array micro-slice laser, to be provided with can be by cooling water or cooling air the hole or the groove structure with timely heat radiation, but this structure is still comparatively complicated, is unfavorable for saving production cost.
The utility model content
Therefore,, the utility model proposes a kind of structure advantages of simple more, and solve the micro-slice laser structure of the array of high-power output at above-mentioned deficiency.
The technical solution adopted in the utility model is:
Array micro-slice laser structure of the present utility model, comprise: laser pumping source, the optical alignment system, array optical convergence yoke and array micro-slice laser, the luminous point of described laser pumping source is arranged on the described optical alignment system focal plane, each converged optical lens (1031 of described array optical convergence yoke, 1032, ..., 103N) be distributed in described optical alignment system outgoing disperse on the light path each micro-slice laser (1041 of described array micro-slice laser, 1042, ..., 104N) be arranged at each corresponding converged optical lens (1031,1032, ..., 103N).
Further, described laser pumping source is semiconductor laser array (101).
Further, described optical alignment system is single cylindrical lens (102).Perhaps, described optical alignment system is the combination of a cylindrical lens (102A) and a globe lens or post lens (102B).
Further, described array optical convergence yoke and array micro-slice laser are the array structure that is fixed as one or the array structure of space independent distribution.
Further, described micro-slice laser (1041,1042 ..., 104N) be fundamental wave micro-slice laser or frequency doubled light micro-slice laser or high order harmonic component micro-slice laser.
The utility model adopts as above technical scheme, has solved radiator structure complexity or the not high problem of power output in the prior art, proposes a kind of simple and reasonable and solve the micro-slice laser structure of the array of high-power output.
Description of drawings
Fig. 1 is the structural representation of embodiment 1 of the present utility model;
Fig. 2 is the structural representation of embodiment 2 of the present utility model.
Embodiment
Now with embodiment the utility model is further specified in conjunction with the accompanying drawings.
The utility model adopts single lens or combination of lenses collimation array LD laser.Different luminescence chips form different angles collimation output light and realize separating in the space among the array LD.Adopt collimated light that one group of separate convergent lens assembles different luminous points respectively with pumping micro-slice laser separately simultaneously, thereby obtain one group of microchip laser output.
Embodiment 1:
Consult shown in Figure 1, array micro-slice laser structure of the present utility model, comprise: the laser pumping source of semiconductor laser array 101, the optical alignment system that single cylindrical lens 102 constitutes, array optical convergence yoke and array micro-slice laser, the luminous point of described laser pumping source is arranged on the described optical alignment system focal plane, each converged optical lens 1031 of described array optical convergence yoke, 1032, ..., 103N be distributed in described optical alignment system outgoing disperse on the light path each micro-slice laser 1041 of described array micro-slice laser, 1042, ..., 104N is arranged at each corresponding converged optical lens 1031,1032, ..., behind the 103N.
Wherein be spaced apart Δ L1 between each LD chip of semiconductor laser array 101, be spaced apart Δ L2 between each convergent lens of array optical convergence yoke.LD array light-emitting point places the convergence plane of optical alignment system cylindrical lens 102, makes each LD chip output light collimated for parallel or near collimated light beam.Because each luminous point place focal plane position difference, so each luminous point collimated light shooting angle difference, like this behind cylindrical lens 102, each light beam will spatially separate, adopt converged optical lens 1031,1032 ..., 103N respectively to each light beam assemble with the corresponding micro-slice laser 1041,1042 of pumping ..., 104N, thereby realize array laser output beam I
1, I
2..., I
N, can obtain higher gross output I,
Because each micro-slice laser 1041,1042 ..., 104N spatially separates, and obtains preferable power output thereby can regulate alone, more help heat radiation simultaneously and obtain firm power.
Embodiment 2:
Consult shown in Figure 2, array micro-slice laser structure of the present utility model, comprise: the laser pumping source of semiconductor laser array 101, the optical alignment system that constitutes of one a cylindrical lens 102A and a globe lens or post lens 102B, array optical convergence yoke and array micro-slice laser, the luminous point of described laser pumping source is arranged on the described optical alignment system focal plane, each converged optical lens 1031 of described array optical convergence yoke, 1032, ..., 103N be distributed in described optical alignment system outgoing disperse on the light path each micro-slice laser 1041 of described array micro-slice laser, 1042, ..., 104N is arranged at each corresponding converged optical lens 1031,1032, ..., behind the 103N.The present embodiment structure adopts the optical alignment system that constitutes of a cylindrical lens 102A and a globe lens or post lens 102B, because of the big direction of the cylindrical lens collimation angle of divergence, this helps to reduce spot diameter, adopts more cheap, common ball (or post) collimated output light simultaneously.
Described array optical convergence yoke and array micro-slice laser are the array structures that is fixed as one, and promptly are fixed into one by fixed support, the convenient installation.Perhaps directly be the array structure of space independent distribution, the convenient adjustment debugged.Described micro-slice laser 1041,1042 ..., 104N is fundamental wave micro-slice laser or frequency doubled light micro-slice laser or high order harmonic component micro-slice laser.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present utility model that do not break away from appended claims and limited; can make various variations to the utility model in the form and details, be protection range of the present utility model.
Claims (6)
1. the micro-slice laser structure of an array, it is characterized in that, comprise: laser pumping source, the optical alignment system, array optical convergence yoke and array micro-slice laser, the luminous point of described laser pumping source is arranged on the described optical alignment system focal plane, each converged optical lens (1031 of described array optical convergence yoke, 1032, ..., 103N) be distributed in described optical alignment system outgoing disperse on the light path each micro-slice laser (1041 of described array micro-slice laser, 1042, ..., 104N) be arranged at each corresponding converged optical lens (1031,1032, ..., 103N).
2. the micro-slice laser structure of array according to claim 1, it is characterized in that: described laser pumping source is semiconductor laser array (101).
3. the micro-slice laser structure of array according to claim 1 is characterized in that: described optical alignment system is single cylindrical lens (102).
4. the micro-slice laser structure of array according to claim 1 is characterized in that: described optical alignment system is the combination of a cylindrical lens (102A) and a globe lens or post lens (102B).
5. the micro-slice laser structure of array according to claim 1 is characterized in that: described array optical convergence yoke and array micro-slice laser are the array structure that is fixed as one or the array structure of space independent distribution.
6. the micro-slice laser structure of array according to claim 1 is characterized in that: described micro-slice laser (1041,1042 ..., 104N) be fundamental wave micro-slice laser or frequency doubled light micro-slice laser or high order harmonic component micro-slice laser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201826225U CN201478685U (en) | 2009-08-17 | 2009-08-17 | Array microchip laser structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201826225U CN201478685U (en) | 2009-08-17 | 2009-08-17 | Array microchip laser structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201478685U true CN201478685U (en) | 2010-05-19 |
Family
ID=42414941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009201826225U Expired - Fee Related CN201478685U (en) | 2009-08-17 | 2009-08-17 | Array microchip laser structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201478685U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106111985A (en) * | 2015-05-07 | 2016-11-16 | 吴小平 | Group scan laser selective sintering or curing and 3D forming machine thereof |
CN107442929A (en) * | 2013-12-13 | 2017-12-08 | 应用材料公司 | Fiber array circuit generator |
-
2009
- 2009-08-17 CN CN2009201826225U patent/CN201478685U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442929A (en) * | 2013-12-13 | 2017-12-08 | 应用材料公司 | Fiber array circuit generator |
CN107442929B (en) * | 2013-12-13 | 2019-12-31 | 应用材料公司 | Optical fiber array line generator |
US10537965B2 (en) | 2013-12-13 | 2020-01-21 | Applied Materials, Inc. | Fiber array line generator |
CN106111985A (en) * | 2015-05-07 | 2016-11-16 | 吴小平 | Group scan laser selective sintering or curing and 3D forming machine thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103368066B (en) | A kind of ramp type multitube semiconductor laser coupling device and method | |
CN202720390U (en) | Beam shaping structure of array semiconductor laser | |
WO2019128232A1 (en) | Spatial coupling structure for multiple to packaged semiconductor lasers | |
CN102255238B (en) | Packaging structure of semiconductor laser device and application device thereof | |
CN102297389A (en) | Laser array composite light module | |
CN104037616A (en) | High-brightness optical fiber coupling output device and method of semiconductor laser device | |
CN106785898A (en) | A kind of semiconductor laser fiber coupling system | |
CN106939983A (en) | A kind of new pattern laser street lamp | |
CN208206801U (en) | A kind of laser physical evidence instrument | |
CN105071224A (en) | Laser | |
CN203909406U (en) | Polarization beam-combining device of semiconductor laser | |
CN201478685U (en) | Array microchip laser structure | |
US20100218804A1 (en) | Method for aligning a lens array to a cell array | |
CN201654281U (en) | Fiber-Coupled Modules for Diode Lasers | |
CN203398519U (en) | Inclined-surface type multi-diode semiconductor laser coupling device | |
CN204144672U (en) | Based on the tail optical fiber output semiconductor laser of array core chip COS | |
CN110488429A (en) | A kind of multikilowatt semiconductor laser fiber coupling module | |
CN105720462A (en) | Multi-circuit coupling laser | |
CN203455547U (en) | Multipath merging coupled system of fiber laser | |
CN205122992U (en) | Semiconductor laser structure of bi -polar fiber optic coupling output | |
CN201135961Y (en) | Curing mechanism using ultraviolet luminous diode | |
CN104793292A (en) | Optical fiber coupling system based on hybrid parabolic condenser | |
TWI384178B (en) | Light accumulation device | |
CN203415814U (en) | Large power laser module | |
CN103293694A (en) | Multiple semiconductor laser beam combining system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20120817 |