CN201474615U - Wedge diamond hard alloy composite slice - Google Patents
Wedge diamond hard alloy composite slice Download PDFInfo
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- CN201474615U CN201474615U CN2009202234022U CN200920223402U CN201474615U CN 201474615 U CN201474615 U CN 201474615U CN 2009202234022 U CN2009202234022 U CN 2009202234022U CN 200920223402 U CN200920223402 U CN 200920223402U CN 201474615 U CN201474615 U CN 201474615U
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- hard alloy
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- wedge shape
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Abstract
The utility model discloses a wedge diamond hard alloy composite slice which comprises a hard alloy base body layer and a diamond layer sintered on the surface at the upper part of the hard alloy base body layer under the conditions of high temperature and high pressure, wherein the diamond layer is embedded on the surface at the upper part of the hard alloy base body layer in a wedge shape. By adopting the technical scheme, because the diamond layer is embedded on the hard alloy base body layer in the wedge shape, the edge of the diamond layer, namely the thickness of an effective working position is thicker than other positions, so that the abrasion resistance can be increased. In addition, a plane and a wedge-shaped boss can be selected as a joint surface of the diamond layer and the hard alloy base body layer, wherein the wedge-shaped boss can better improve the impact resistance strength.
Description
Technical field
The utility model belongs to superhard material and makes the field, specifically relates to a kind of diamond hard alloy complex sheet.
Background technology
Diamond hard alloy complex sheet is after being added certain binding material and hard alloy substrate and fitted together by diamond dust, at the composite superhard material that sintering forms under the high pressure high temperature environment on the special diamond hydraulic press, it is made of one deck polycrystalline diamond layer and hard alloy substrate layer.Because polycrystalline diamond layer hardness high-wearing feature is good, add the excellent toughness and the solderability of hard alloy substrate, make its premium properties that has diamond and carbide alloy concurrently, be widely used as the cutting element-brill tooth on the oil bit.
Because the brill tooth during drilling well on the drill bit will bear the powerful cutting resistance in stratum, frictional resistance and impact force, therefore require diamond hard alloy complex sheet to have very high hardness, abrasion resistance, heat resistance and impact resilience.The diamond end face of diamond compact brill tooth mostly is the plane greatly at present, bore tooth with these diamond compacts and make drill bit, at the drilling well initial stage because to bore the origin of force of tooth little, the rate of penetration of drill bit produces strong wearing and tearing even fragmentation than very fast along with boring increment face working portion, and the contact area of boring tooth and rock is also strengthening, it is more and more blunt to show as drill bit, the rate of penetration of drill bit is slack-off, thereby influences the drilling depth of drill bit, drilling efficiency and the scope of application.
The utility model content
To be solved in the utility modelly be: drill bit in use influences the technical problem of drilling efficiency owing to serious wear, therefore, the purpose of this utility model provides a kind of thickness that can increase diamond layer edge, the effective operating position of composite sheet, improves the wedge shape diamond hard alloy complex sheet of shock resistance and wear resistance.
For achieving the above object, the utility model is by the following technical solutions:
The utility model comprises the hard alloy substrate layer and sintering is at the diamond layer of hard alloy substrate layer upper face under HTHP, and above-mentioned diamond layer is the upper face that wedge shape is embedded in the hard alloy substrate layer.
The bonding surface of above-mentioned diamond layer and hard alloy substrate layer is the plane.
The height of above-mentioned diamond layer is smaller or equal to the bottom surface radius of hard alloy layer.
The thickness of above-mentioned diamond layer is 0.2~1.2mm.
The junction of above-mentioned diamond layer and hard alloy substrate layer is provided with the carbide alloy boss, and the carbide alloy boss embeds in the diamond layer.
Above-mentioned carbide alloy boss is a wedge shape.
The radius of above-mentioned carbide alloy boss is smaller or equal to the bottom surface radius of hard alloy substrate layer.
The radius of above-mentioned carbide alloy boss is 3~5mm.
Adopt the utility model of technique scheme, diamond layer is wedge shape and is embedded on the hard alloy substrate layer, and the diamond layer edge is that the thickness of effective operating position is thicker than other positions like this, thereby can increase wear resistance.In addition, the bonding surface of diamond layer and hard alloy substrate layer has plane and wedge shape boss to select, and wherein the wedge shape boss can better improve impact strength.
Description of drawings
Fig. 1 is the sectional view on plane for the bonding surface of the utility model diamond layer and hard alloy substrate layer;
Fig. 2 is the stereogram of Fig. 1;
Fig. 3 is provided with the sectional view of wedge shape carbide alloy boss for the junction of the utility model diamond layer and hard alloy substrate layer.
The specific embodiment
As shown in Figure 1 and Figure 2, the utility model comprise hard alloy substrate layer 2 and under HTHP sintering at the diamond layer 1 of hard alloy substrate layer 2 upper face, for increasing the thickness of diamond layer 1 effective operating position, diamond layer 1 is wedge shape and is embedded on the hard alloy substrate layer 2, can improve the abrasion resistance of composite sheet like this.
In the present embodiment, diamond layer 1 is the plane with the bonding surface of hard alloy substrate layer 2, in this case, the height of diamond layer 1 should be less than or equal to the bottom surface radius of hard alloy layer 2, the height that is diamond layer 1 can be 0.2~1.2mm, that is to say, can be among 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, the 1.2mm any one.
As shown in Figure 3, what present embodiment and embodiment 1 were inequality is, in the present embodiment, for improving the impact strength of composite sheet, diamond layer 1 is provided with wedge shape carbide alloy boss 3 with the junction of hard alloy substrate layer 2, and carbide alloy boss 3 embeds in the diamond layer 1, as shown in Figure 3.
In this case, the radius of wedge shape carbide alloy boss 3 should be less than or equal to the bottom surface radius of hard alloy substrate layer 2, and promptly the radius of wedge shape carbide alloy boss 3 is 3~5mm, that is to say, can be among 3mm, 4mm, the 5mm any one.
Need to prove that carbide alloy boss 3 can also be shapes such as halfpace, square platform, but be preferred forms with the wedge shape boss.
Claims (8)
1. wedge shape diamond hard alloy complex sheet, it comprise hard alloy substrate layer (2) and under HTHP sintering it is characterized in that at the diamond layer (1) of hard alloy substrate layer (2) upper face: described diamond layer (1) is the upper face that wedge shape is embedded in hard alloy substrate layer (2).
2. wedge shape diamond hard alloy complex sheet according to claim 1 is characterized in that: described diamond layer (1) is the plane with the bonding surface of hard alloy substrate layer (2).
3. wedge shape diamond hard alloy complex sheet according to claim 2 is characterized in that: the height of described diamond layer (1) is smaller or equal to the bottom surface radius of hard alloy layer (2).
4. wedge shape diamond hard alloy complex sheet according to claim 3 is characterized in that: the thickness of described diamond layer (1) is 0.2~1.2mm.
5. wedge shape diamond hard alloy complex sheet according to claim 1, it is characterized in that: described diamond layer (1) is provided with carbide alloy boss (3) with the junction of hard alloy substrate layer (2), and carbide alloy boss (3) embeds in the diamond layer (1).
6. wedge shape diamond hard alloy complex sheet according to claim 5 is characterized in that: described carbide alloy boss (3) is a wedge shape.
7. wedge shape diamond hard alloy complex sheet according to claim 6 is characterized in that: the radius of described carbide alloy boss (3) is smaller or equal to the bottom surface radius of hard alloy substrate layer (2).
8. wedge shape diamond hard alloy complex sheet according to claim 7 is characterized in that: the radius of described carbide alloy boss (3) is 3~5mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202234022U CN201474615U (en) | 2009-09-11 | 2009-09-11 | Wedge diamond hard alloy composite slice |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009202234022U CN201474615U (en) | 2009-09-11 | 2009-09-11 | Wedge diamond hard alloy composite slice |
Publications (1)
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CN201474615U true CN201474615U (en) | 2010-05-19 |
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Family Applications (1)
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CN2009202234022U Expired - Fee Related CN201474615U (en) | 2009-09-11 | 2009-09-11 | Wedge diamond hard alloy composite slice |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103726792A (en) * | 2013-12-03 | 2014-04-16 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
CN107737935A (en) * | 2017-10-25 | 2018-02-27 | 福建省万龙新材料科技有限公司 | A kind of cambered surface composite polycrystal-diamond and preparation method thereof |
-
2009
- 2009-09-11 CN CN2009202234022U patent/CN201474615U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103726792A (en) * | 2013-12-03 | 2014-04-16 | 常州深倍超硬材料有限公司 | Abrasion-resistant tool |
CN107737935A (en) * | 2017-10-25 | 2018-02-27 | 福建省万龙新材料科技有限公司 | A kind of cambered surface composite polycrystal-diamond and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20130911 |